EPM5032DC - 32-Macrocell MAX 5000 EPLD | Altera DIP-24
MPN: EPM5032DC β End of Life| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $18.5 | $18.50 |
| 10 | $16.2 | $162.00 |
| 100 | $13.85 | $1,385.00 |
| 500 | $11.95 | $5,975.00 |
| 1,000 | $10.4 | $10,400.00 |
Drop-in alternatives for EPM5032DC β same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Quick Comparison Tool β Select alternative parts for side-by-side comparison:
EPM5032DC-20
β Drop-Inβ In Stock
$5.05 / Unit
View Datasheet βEPM5032DC-25
β Drop-Inβ In Stock
$3.55 / Unit
View Datasheet βEPM5032DC-SE
β Drop-Inπ Reference alternative (not in catalog)
EPM5032DC-2
β Drop-Inβ In Stock
$8.75 / Unit
View Datasheet βEPM5032DC-1
β Drop-Inπ Reference alternative (not in catalog)
EPM5032PC
β Drop-Inπ Reference alternative (not in catalog)
EPM5032DC Maximum Ratings & Electrical Characteristics
| Family | MAX 5000 |
| Device Type | EPLD (Erasable Programmable Logic Device) |
| Macrocells | 32 |
| Logic Array Blocks (LABs) | 1 |
| Package | DIP-24 (ceramic, windowed) |
| Speed Grade | DC (commercial) |
| Operating Temperature | 0C to +70C |
| Technology | Bipolar EPROM, UV-erasable |
| Programmable Logic Elements | AND array + fixed OR array per macrocell |
| Configuration Memory | EPROM (UV-erasable via package window) |
| Mounting Type | Through-hole (DIP) |
| Pin Count | 24 |
| Programming Tool | Altera MAX+PLUS II / A+PLUS legacy |
| Lifecycle Status | Obsolete (mature legacy) |
EPM5032DC dip-24 (ceramic, windowed) Pin Configuration Guide
Complete pinout information for EPM5032DC (dip-24 (ceramic, windowed) package) with 24 pins. This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for EPM5032DC.
Refer to the datasheet for full pin configuration.
Estimated pin count: 24 pins (digital package)
Safe Operating Area (SOA) & Thermal Characteristics
No official SOA curve available for this digital IC. Always operate within absolute maximum ratings specified in the datasheet. Ensure adequate cooling and derate as needed.
Typical Applications
EPM5032DC is suitable for 6 applications: Legacy Bus-Interface Glue Logic, Industrial Control Replacement Boards, Telecommunications Backplane Controllers, Prototyping and Field Reprogramming, Military and Aerospace Legacy Avionics, Educational and University Lab Use.
Legacy Bus-Interface Glue Logic
The EPM5032DC replaces multiple discrete 22V10 PALs and 74-series glue logic on legacy ISA, VME, and proprietary backplane buses. With 32 macrocells in a single LAB, it consolidates address decoding, chip-select generation, wait-state insertion, and bus arbitration into one part. The bipolar EPROM architecture delivers deterministic pin-to-pin propagation delays, ensuring predictable bus-timing margins for legacy microprocessors. Compared to discrete PAL solutions, the EPM5032DC reduces board area by approximately 60-70% and simplifies BOM. Engineers should validate timing with the datasheet's tPD parameter against their bus-clock cycle.
Recommended
Industrial Control Replacement Boards
The EPM5032DC serves as a drop-in replacement on long-lifecycle industrial control boards where the original Altera part has failed or been obsoleted. The ceramic DIP-24 windowed package supports field UV erasure for board-revive workflows in factory maintenance. With 32 macrocells, it handles encoder interfacing, motor-step sequencing, and discrete I/O conditioning in PLC backplanes. Operating temperature of 0C to +70C covers most indoor industrial cabinet environments. Engineers should order safety stock given the 8-16 week lead times typical of obsolete parts as of 2026-09-12.
Recommended
Telecommunications Backplane Controllers
In legacy telecom backplane designs (T1/E1 framers, channel banks, central-office line cards), the EPM5032DC implements framing, alarm monitoring, and time-slot assignment logic. The single-LAB architecture provides deterministic logic suitable for synchronous TDM streams, and the ceramic DIP package has proven reliability over decades in CO equipment. The 32-macrocell capacity accommodates multi-channel alarm aggregation. Replacement of EPM5032DC in telecom applications requires careful timing analysis because downstream line-card timing chains depend on its propagation delay tier.
Recommended
Prototyping and Field Reprogramming
The EPM5032DC's ceramic UV-erasable window supports field reprogramming during prototyping and iterative design cycles. Engineers can erase the device with a UV eraser (typically 30 minutes at 254 nm) and reprogram it via MAX+PLUS II, enabling hardware-debug cycles without discarding parts. This is valuable for low-volume aerospace and defense prototypes where windowed parts are preferred for in-field updates. The DIP-24 through-hole package is well-suited to socketed prototyping boards and adapter PCBs for legacy architectures.
Recommended
Military and Aerospace Legacy Avionics
The EPM5032DC is used in mature military and aerospace avionics programs where the original Altera part has decades of in-service history and where redesign qualification costs are prohibitive. The ceramic DIP-24 package meets the through-hole and hermeticity requirements of MIL-STD-883 programs. SE (special/extended) screening variants exist for higher reliability tiers. Engineers should verify part authenticity and traceability through authorized channels when sourcing for military programs, given the elevated counterfeit risk on obsolete parts.
Recommended
Educational and University Lab Use
Universities and technical colleges use the EPM5032DC in digital-logic and computer-architecture laboratories to teach programmable logic concepts and legacy bus design. The DIP-24 through-hole package is breadboard-compatible and socket-friendly for student kits, and the UV-erasable window allows repeated reprogramming across lab sessions. With 32 macrocells, the device is large enough for meaningful class projects (small CPUs, state machines, UARTs) but small enough to be fully understood in a single semester. The MAX+PLUS II toolchain runs on legacy Windows systems still common in university labs.
Recommended
Recommended Products Summary
Engineering reference data for EPM5032DC β comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | EPM5032DC-20 | EPM5032DC-25 | EPM5032DC-SE | EPM5032DC-2 | EPM5032DC-1 | EPM5032PC |
|---|---|---|---|---|---|---|---|
| Brand | Altera | Altera | Altera | Altera | Altera | Altera | Altera |
| Package | DIP-24 (ceramic, windowed) | DIP-24 (ceramic, windowed) - same | DIP-24 (ceramic, windowed) - same | DIP-24 (ceramic, windowed) - same | DIP-24 (ceramic, windowed) - same | DIP-24 (ceramic, windowed) - same | DIP-24 (plastic, OTP) - same pinout |
| Macrocells | 32 | 32 | 32 | 32 | 32 | 32 | 32 |
| Speed Grade Suffix | DC (standard) | DC-20 (faster) | DC-25 (slower) | DC-SE (extended screening) | DC-2 (speed grade) | DC-1 (speed grade) | PC (plastic OTP) |
| UV-Erasable Window | Yes (ceramic) | Yes | Yes | Yes | Yes | Yes | No (OTP) |
| Operating Temperature | 0C to +70C | 0C to +70C | 0C to +70C | [DATA_NEEDED: extended range for SE] | 0C to +70C | 0C to +70C | 0C to +70C |
| Lifecycle Status | Obsolete | Obsolete | Obsolete | Obsolete | Obsolete | Obsolete | Obsolete |
| Programming Tool | MAX+PLUS II / A+PLUS | MAX+PLUS II / A+PLUS | MAX+PLUS II / A+PLUS | MAX+PLUS II / A+PLUS | MAX+PLUS II / A+PLUS | MAX+PLUS II / A+PLUS | MAX+PLUS II / A+PLUS (one-time) |
Key Differentiators
- Standard speed grade in windowed ceramic DIP (vs EPM5032DC-20)
- UV-erasable windowed ceramic package (vs EPM5032PC)
- Higher-density replacement target for 22V10 PALs (vs PALCE22V10)
Design Notes
Do not substitute the EPM5032DC with a MAX II, MAX V, or MAX 10 CPLD: these are modern flash-based devices in different packages (TQFP, BGA) with different pinouts and require JTAG programming. They are not drop-in compatible. The EPM5032DC is a legacy bipolar EPROM EPLD programmed via MAX+PLUS II legacy toolchain only - Quartus does not support MAX 5000. Engineers must keep legacy Windows tooling available for programming.
The ceramic DIP-24 package has higher thermal resistance than modern plastic packages, but the bipolar architecture dissipates noticeable quiescent power. Provide adequate ventilation around sockets, especially in sealed industrial enclosures. For SE-screened variants used in avionics, verify thermal derating against the military temperature range. [DATA_NEEDED: theta_JA value not available in provided web data]
Use machine-pin IC sockets (rather than leaf-spring sockets) for prototyping boards to ensure reliable UV-erasure cycles. Place decoupling capacitors (0.1uF ceramic) within 5mm of each power pin. Because the DIP-24 package has long leads, add guard traces or ground planes between I/O banks if the design handles high-speed signals. For windowed parts, install a socket that allows UV light access to the erasure window.
Compliance Information
RoHS/REACH compliance data not present in verified web sources. Ceramic DIP package is typically not RoHS-compliant (contains lead in ceramic and lead-bearing finish); SE-screened variants may have specific military compliance documentation. AEC-Q100 not applicable (programmable logic, not automotive-qualified IC).
