FUSB302TMPX - USB Type-C PD Controller, 14-MLP | onsemi
料号： FUSB302TMPX ✓ 量产中| 数量 | 单价 | 小计 |
|---|---|---|
| 1 | $1.95 | $1.95 |
| 10 | $1.72 | $17.20 |
| 100 | $1.42 | $142.00 |
| 500 | $1.18 | $590.00 |
| 1,000 | $0.98 | $980.00 |
| 3,000 | $0.82 | $2,460.00 |
FUSB302TMPX 概述
A USB Type-C controller is a category of interface IC that implements the detection, orientation, and (optionally) Power Delivery signaling required by the USB Type-C specification. The hierarchy flows: USB Type-C controller → interface IC → USB connectivity → power management role swap. Without such a controller, a device cannot reliably detect cable orientation, distinguish a 500 mA legacy sink from a 1.5 A/3 A Type-C sink, or negotiate higher-power PD contracts.
Key features include a dedicated I2C interface for host control, three fixed-threshold comparators matching the Type-C specification for the three charging current levels, and a programmable DAC for software-driven CC-line state determination. The part handles VBUS detection and includes GPIO for interrupt-driven attach/detach signaling, reducing host MCU polling load. A default Source role is supported for charger-only applications without external MCU firmware.
The FUSB302T architecture separates the PHY layer (implemented on-chip) from the protocol layer (handled by the host MCU), reducing BOM cost and silicon area. Reference code from onsemi is available for several embedded platforms (e.g., STM32, NXP Kinetis) to accelerate integration. The BMC PD block also covers alternative interfaces of the Type-C specification, including Audio Adapter and Debug Accessory modes.
Typical applications include USB Type-C wall chargers, travel adapters, USB-PD capable power banks, docking stations, monitors, and any embedded host that needs to negotiate a PD contract up to 100 W (20 V/5 A). The small 2.5x2.5 mm package makes it ideal for compact adapter designs.
Designers should note that the FUSB302T handles only the PD PHY; the protocol policy layer must be implemented on a host MCU. Reference firmware from onsemi covers basic PD negotiation, but custom applications (e.g., PPS, AVS) require additional protocol stack development.
This page synthesizes distributor pricing, drop-in alternatives, and practical design notes not found in the manufacturer datasheet, including parametric comparison against same-family onsemi FUSB302 variants.
直接替换替代料： FUSB302TMPX ——相同封装，引脚兼容。需要 PCB 改动的不同封装料号已排除。
本系列中的变体
可与以下型号直接替换的同系列型号： FUSB302TMPX （相同外形与封装尺寸） ——差异在于 Package, Host Interface, Packaging, USB Standard.
快速对比工具——选择替代料号进行并排对比：
FUSB302BMPX
✅ 直接替换✓ 有现货
$0.42 / 个
查看数据手册 →FUSB302B01MPX
✅ 直接替换📋 参考替代料（不在目录中）
FUSB302MPX
✅ 直接替换✓ 有现货
联系询价
查看数据手册 →FUSB302TVPX
✅ 直接替换📋 参考替代料（不在目录中）
FUSB302B0MPX
✅ 直接替换 ⚠️ 规格未核验📋 参考替代料（不在目录中）
FUSB302BVMPX
✅ 直接替换 ⚠️ 规格未核验📋 参考替代料（不在目录中）
FUSB302TMPX 规格参数
| Product Type | Programmable USB Type-C Controller with PD |
| Interface Standard | USB Type-C, USB PD (BMC PHY) |
| USB Version | USB 3.1 compatible signaling |
| 封装 | 14-MLP / WQFN (2.5 x 2.5 mm) |
| 引脚数量 | 14 |
| Host Interface | I2C (up to 400 kHz) |
| Default Role | Source (SRC, charger-only without MCU) |
| PD Support | USB Power Delivery 2.0/3.0 PHY (up to 100 W) |
| CC Pin Comparators | 3 fixed thresholds (USB Type-C spec) |
| Programmable DAC | Yes (CC line state detection) |
| Role Swap Support | Yes (Source/Sink/DRP via host MCU) |
| 工作温度 | -40C to +85C (industrial) |
| 安装类型 | Surface Mount |
| RoHS 状态 | Compliant |
| Lead-Free | Yes |
| Package Marking | WQFN14 EP |
FUSB302TMPX 引脚配置
| 引脚 1 | CC1 — USB Type-C Configuration Channel 1 (cable orientation detect) |
| 引脚 2 | CC2 — USB Type-C Configuration Channel 2 (cable orientation detect) |
| 引脚 3 | GND — Ground reference |
| 引脚 4 | VBUS — VBUS sense input (5 V/9 V/15 V/20 V detection) |
| 引脚 5 | INT_N — Interrupt output (active-low, signals attach/detach/PD messages) |
| 引脚 6 | SDA — I2C data (host MCU communication) |
| 引脚 7 | SCL — I2C clock (host MCU communication) |
| 引脚 8 | VDD — Supply voltage (3.3 V typical) |
| 引脚 9 | GPIO — General-purpose I/O (configurable per firmware) |
| 引脚 10 | NC — Not connected (per datasheet) |
| 引脚 11 | NC — Not connected (per datasheet) |
| 引脚 12 | NC — Not connected (per datasheet) |
| 引脚 13 | NC — Not connected (per datasheet) |
| 引脚 14 | EP — Exposed thermal pad (connect to GND) |
典型应用
FUSB302TMPX 适用于 6 应用s: USB Type-C Wall Charger, USB-PD Power Bank, Docking Station and Monitor Hub, Industrial USB-PD Power Supply, USB Type-C Audio Adapter, USB-PD Powered IoT Gateway.
USB Type-C Wall Charger
The FUSB302TMPX is purpose-built for USB Type-C wall chargers and travel adapters. Its default Source role (SRC) configuration means the part advertises power to attached sinks immediately on plug-in, with no MCU firmware intervention required for basic Type-C 5 V detection. The integrated BMC PD PHY negotiates up to 100 W (20 V/5 A) PD contracts with connected laptops, tablets, and smartphones. The 2.5x2.5 mm WQFN package minimizes PCB footprint in compact charger housings, while I2C control enables optional host MCU integration for advanced PPS/AVS profiles. Reference designs from onsemi provide complete charger reference schematics for 45 W and 65 W output levels.
推荐
USB-PD Power Bank
USB-PD power banks use the FUSB302BMPX variant (Sink default) or the FUSB302TMPX (reconfigured via firmware) for sink-side Type-C charging input. The BMC PD PHY handles up to 100 W input negotiation, allowing the power bank to fast-charge from any compliant Type-C charger. The on-chip CC comparators detect cable attach, orientation, and the three Type-C current advertisement levels (500 mA / 1.5 A / 3 A), enabling automatic input current limiting. I2C control lets the host MCU poll attach status and decode incoming PD messages, freeing the MCU from BMC encoding/decoding.
推荐
Docking Station and Monitor Hub
Docking stations and monitor hubs require USB-PD contract negotiation for upstream laptop charging and downstream device charging. The FUSB302TMPX handles one Type-C port per chip; designs with multiple Type-C ports use multiple FUSB302TMPX instances. The I2C interface allows a single host MCU to manage several FUSB302TMPX parts via bus multiplexing. The part also supports USB Type-C alternative modes (Audio Adapter, Debug Accessory), making it suitable for dock/monitor accessory roles. Compact 2.5x2.5 mm packaging eases placement inside space-constrained hub enclosures.
推荐
Industrial USB-PD Power Supply
Industrial 24 V or USB-PD-capable DIN-rail power supplies benefit from the FUSB302TMPX's industrial -40C to +85C temperature range. The part negotiates standard PD contracts at 5 V, 9 V, 12 V, 15 V, and 20 V up to 100 W, making it ideal for machine-vision cameras, industrial sensors, and PoE-like USB-PD powered devices. The on-chip VBUS detection and INT interrupt pin enable real-time attach/detach signaling to the host PLC or industrial controller, reducing polling overhead on deterministic industrial communication buses.
推荐
USB Type-C Audio Adapter
USB Type-C audio adapters that pull power from a Type-C source use the FUSB302TMPX in sink role to negotiate the required 5 V contract. The part's Audio Adapter accessory mode support is documented in the onsemi FUSB302T datasheet. The BMC PD PHY decodes the Audio Adapter Mode message, allowing the host MCU to redirect analog audio to the 3.5 mm jack. Compact 2.5x2.5 mm packaging suits small dongle-format adapters.
推荐
USB-PD Powered IoT Gateway
IoT gateways powered from a USB Type-C source use the FUSB302TMPX to negotiate a PD contract that supplies the gateway's main logic board. The part handles attach/detach events via the INT pin, waking the host MCU from sleep when a Type-C source is connected. The I2C interface is compatible with low-power MCUs (STM32L0, Kinetis) typically used in IoT designs. The 2.5x2.5 mm package fits inside compact gateway enclosures alongside WiFi/BLE modules.
推荐
推荐产品汇总
工程参考数据： FUSB302TMPX ——对比、设计指导和合规信息。
选型指南
与替代料对比
| 参数 | 本产品 | FUSB302BMPX | FUSB302B01MPX | FUSB302MPX | FUSB302B0MPX |
|---|---|---|---|---|---|
| Package | 14-MLP / WQFN (2.5x2.5 mm) | 14-MLP (2.5x2.5 mm) - same | 14-MLP (2.5x2.5 mm) - same | 14-MLP (2.5x2.5 mm) - same | 14-MLP (2.5x2.5 mm) - same |
| Brand | onsemi | onsemi | onsemi | onsemi | onsemi |
| Default Role | Source (SRC) | Sink (SNK) | Sink (SNK) | Source (SRC) | Sink (SNK) |
| Default I2C Address | 0x42 (7-bit) per datasheet | Different default address | Different default address | Same default address | Different default address |
| PD PHY Support | USB PD 2.0/3.0 BMC PHY (up to 100 W) | USB PD 2.0/3.0 BMC PHY (up to 100 W) | USB PD 2.0/3.0 BMC PHY (up to 100 W) | USB PD 2.0/3.0 BMC PHY (up to 100 W) | USB PD 2.0/3.0 BMC PHY (up to 100 W) |
| Host Interface | I2C up to 400 kHz | I2C up to 400 kHz | I2C up to 400 kHz | I2C up to 400 kHz | I2C up to 400 kHz |
| Operating Temperature | -40C to +85C | -40C to +85C | -40C to +85C | -40C to +85C | -40C to +85C |
| Drop-in Compatibility | Reference part | Pin-to-pin compatible; firmware reconfig needed | Pin-to-pin compatible; firmware reconfig needed | Fully compatible (reel/packaging variant) | Pin-to-pin compatible; firmware reconfig needed |
关键差异点
- Default Source role for charger applications （对比 FUSB302BMPX)
- Same 14-MLP package and BMC PD PHY across variants （对比 FUSB302B01MPX)
- Integrated BMC PD PHY reduces BOM vs discrete implementation （对比 Discrete USB Type-C port detection with external comparators)
设计说明
The FUSB302TMPX requires a stable 3.3 V supply on its VDD pin, typically derived from the main system 3.3 V rail rather than directly from VBUS. Decouple VDD with a 1 uF ceramic capacitor placed within 5 mm of the pin. The part also requires VBUS voltage sensing via the VBUS pin - route a divided-down VBUS signal here, not the full VBUS voltage, to avoid exceeding the pin's absolute maximum rating.
Do not assume the FUSB302TMPX is a complete PD solution. It implements only the BMC PHY; the policy engine and PD message interpretation must run on the host processor. onsemi provides reference firmware for STM32 and NXP Kinetis, but custom applications (PPS, AVS, EPR) require additional protocol stack work. Also note the exposed pad (pin 14) MUST be soldered to the PCB ground plane for thermal dissipation and electrical reference; failure to do so can cause erratic CC line detection.
Keep CC1/CC2 traces short and matched in length, with no stubs. Route them away from noisy digital traces and high-current paths. Place the I2C pull-up resistors (typically 4.7 kohm to VDD) close to the FUSB302TMPX SDA/SCL pins. The exposed thermal pad (EP) should have at least 4 thermal vias to the ground plane for heat sinking. Use a 4-layer PCB with a dedicated ground plane for best CC signal integrity.
合规信息
RoHS and lead-free status confirmed by onsemi product page. AEC-Q100 not qualified - FUSB302 family targets consumer/industrial USB Type-C applications. Verify halogen-free status with manufacturer for environmental compliance documentation.
