FUSB302TMPX - USB Type-C PD Controller, 14-MLP | onsemi
MPN: FUSB302TMPX ✓ Active| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $1.95 | $1.95 |
| 10 | $1.72 | $17.20 |
| 100 | $1.42 | $142.00 |
| 500 | $1.18 | $590.00 |
| 1,000 | $0.98 | $980.00 |
| 3,000 | $0.82 | $2,460.00 |
FUSB302TMPX Overview
A USB Type-C controller is a category of interface IC that implements the detection, orientation, and (optionally) Power Delivery signaling required by the USB Type-C specification. The hierarchy flows: USB Type-C controller → interface IC → USB connectivity → power management role swap. Without such a controller, a device cannot reliably detect cable orientation, distinguish a 500 mA legacy sink from a 1.5 A/3 A Type-C sink, or negotiate higher-power PD contracts.
Key features include a dedicated I2C interface for host control, three fixed-threshold comparators matching the Type-C specification for the three charging current levels, and a programmable DAC for software-driven CC-line state determination. The part handles VBUS detection and includes GPIO for interrupt-driven attach/detach signaling, reducing host MCU polling load. A default Source role is supported for charger-only applications without external MCU firmware.
The FUSB302T architecture separates the PHY layer (implemented on-chip) from the protocol layer (handled by the host MCU), reducing BOM cost and silicon area. Reference code from onsemi is available for several embedded platforms (e.g., STM32, NXP Kinetis) to accelerate integration. The BMC PD block also covers alternative interfaces of the Type-C specification, including Audio Adapter and Debug Accessory modes.
Typical applications include USB Type-C wall chargers, travel adapters, USB-PD capable power banks, docking stations, monitors, and any embedded host that needs to negotiate a PD contract up to 100 W (20 V/5 A). The small 2.5x2.5 mm package makes it ideal for compact adapter designs.
Designers should note that the FUSB302T handles only the PD PHY; the protocol policy layer must be implemented on a host MCU. Reference firmware from onsemi covers basic PD negotiation, but custom applications (e.g., PPS, AVS) require additional protocol stack development.
This page synthesizes distributor pricing, drop-in alternatives, and practical design notes not found in the manufacturer datasheet, including parametric comparison against same-family onsemi FUSB302 variants.
Drop-in alternatives for FUSB302TMPX — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Variants in this series
Same-series models that are drop-in compatible with FUSB302TMPX (same form factor and footprint) — differing in Package, Host Interface, Packaging, USB Standard.
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
FUSB302BMPX
✅ Drop-In✓ In Stock
$0.42 / Unit
View Datasheet →FUSB302B01MPX
✅ Drop-In📋 Reference alternative (not in catalog)
FUSB302MPX
✅ Drop-In✓ In Stock
Contact for price
View Datasheet →FUSB302TVPX
✅ Drop-In📋 Reference alternative (not in catalog)
FUSB302B0MPX
✅ Drop-In ⚠️ Specs Unverified📋 Reference alternative (not in catalog)
FUSB302BVMPX
✅ Drop-In ⚠️ Specs Unverified📋 Reference alternative (not in catalog)
FUSB302TMPX Specifications
| Product Type | Programmable USB Type-C Controller with PD |
| Interface Standard | USB Type-C, USB PD (BMC PHY) |
| USB Version | USB 3.1 compatible signaling |
| Package | 14-MLP / WQFN (2.5 x 2.5 mm) |
| Pin Count | 14 |
| Host Interface | I2C (up to 400 kHz) |
| Default Role | Source (SRC, charger-only without MCU) |
| PD Support | USB Power Delivery 2.0/3.0 PHY (up to 100 W) |
| CC Pin Comparators | 3 fixed thresholds (USB Type-C spec) |
| Programmable DAC | Yes (CC line state detection) |
| Role Swap Support | Yes (Source/Sink/DRP via host MCU) |
| Operating Temperature | -40C to +85C (industrial) |
| Mounting Type | Surface Mount |
| RoHS Status | Compliant |
| Lead-Free | Yes |
| Package Marking | WQFN14 EP |
FUSB302TMPX Pin Configuration
| Pin 1 | CC1 — USB Type-C Configuration Channel 1 (cable orientation detect) |
| Pin 2 | CC2 — USB Type-C Configuration Channel 2 (cable orientation detect) |
| Pin 3 | GND — Ground reference |
| Pin 4 | VBUS — VBUS sense input (5 V/9 V/15 V/20 V detection) |
| Pin 5 | INT_N — Interrupt output (active-low, signals attach/detach/PD messages) |
| Pin 6 | SDA — I2C data (host MCU communication) |
| Pin 7 | SCL — I2C clock (host MCU communication) |
| Pin 8 | VDD — Supply voltage (3.3 V typical) |
| Pin 9 | GPIO — General-purpose I/O (configurable per firmware) |
| Pin 10 | NC — Not connected (per datasheet) |
| Pin 11 | NC — Not connected (per datasheet) |
| Pin 12 | NC — Not connected (per datasheet) |
| Pin 13 | NC — Not connected (per datasheet) |
| Pin 14 | EP — Exposed thermal pad (connect to GND) |
Typical Applications
FUSB302TMPX is suitable for 6 applications: USB Type-C Wall Charger, USB-PD Power Bank, Docking Station and Monitor Hub, Industrial USB-PD Power Supply, USB Type-C Audio Adapter, USB-PD Powered IoT Gateway.
USB Type-C Wall Charger
The FUSB302TMPX is purpose-built for USB Type-C wall chargers and travel adapters. Its default Source role (SRC) configuration means the part advertises power to attached sinks immediately on plug-in, with no MCU firmware intervention required for basic Type-C 5 V detection. The integrated BMC PD PHY negotiates up to 100 W (20 V/5 A) PD contracts with connected laptops, tablets, and smartphones. The 2.5x2.5 mm WQFN package minimizes PCB footprint in compact charger housings, while I2C control enables optional host MCU integration for advanced PPS/AVS profiles. Reference designs from onsemi provide complete charger reference schematics for 45 W and 65 W output levels.
Recommended
USB-PD Power Bank
USB-PD power banks use the FUSB302BMPX variant (Sink default) or the FUSB302TMPX (reconfigured via firmware) for sink-side Type-C charging input. The BMC PD PHY handles up to 100 W input negotiation, allowing the power bank to fast-charge from any compliant Type-C charger. The on-chip CC comparators detect cable attach, orientation, and the three Type-C current advertisement levels (500 mA / 1.5 A / 3 A), enabling automatic input current limiting. I2C control lets the host MCU poll attach status and decode incoming PD messages, freeing the MCU from BMC encoding/decoding.
Recommended
Docking Station and Monitor Hub
Docking stations and monitor hubs require USB-PD contract negotiation for upstream laptop charging and downstream device charging. The FUSB302TMPX handles one Type-C port per chip; designs with multiple Type-C ports use multiple FUSB302TMPX instances. The I2C interface allows a single host MCU to manage several FUSB302TMPX parts via bus multiplexing. The part also supports USB Type-C alternative modes (Audio Adapter, Debug Accessory), making it suitable for dock/monitor accessory roles. Compact 2.5x2.5 mm packaging eases placement inside space-constrained hub enclosures.
Recommended
Industrial USB-PD Power Supply
Industrial 24 V or USB-PD-capable DIN-rail power supplies benefit from the FUSB302TMPX's industrial -40C to +85C temperature range. The part negotiates standard PD contracts at 5 V, 9 V, 12 V, 15 V, and 20 V up to 100 W, making it ideal for machine-vision cameras, industrial sensors, and PoE-like USB-PD powered devices. The on-chip VBUS detection and INT interrupt pin enable real-time attach/detach signaling to the host PLC or industrial controller, reducing polling overhead on deterministic industrial communication buses.
Recommended
USB Type-C Audio Adapter
USB Type-C audio adapters that pull power from a Type-C source use the FUSB302TMPX in sink role to negotiate the required 5 V contract. The part's Audio Adapter accessory mode support is documented in the onsemi FUSB302T datasheet. The BMC PD PHY decodes the Audio Adapter Mode message, allowing the host MCU to redirect analog audio to the 3.5 mm jack. Compact 2.5x2.5 mm packaging suits small dongle-format adapters.
Recommended
USB-PD Powered IoT Gateway
IoT gateways powered from a USB Type-C source use the FUSB302TMPX to negotiate a PD contract that supplies the gateway's main logic board. The part handles attach/detach events via the INT pin, waking the host MCU from sleep when a Type-C source is connected. The I2C interface is compatible with low-power MCUs (STM32L0, Kinetis) typically used in IoT designs. The 2.5x2.5 mm package fits inside compact gateway enclosures alongside WiFi/BLE modules.
Recommended
Recommended Products Summary
Engineering reference data for FUSB302TMPX — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | FUSB302BMPX | FUSB302B01MPX | FUSB302MPX | FUSB302B0MPX |
|---|---|---|---|---|---|
| Package | 14-MLP / WQFN (2.5x2.5 mm) | 14-MLP (2.5x2.5 mm) - same | 14-MLP (2.5x2.5 mm) - same | 14-MLP (2.5x2.5 mm) - same | 14-MLP (2.5x2.5 mm) - same |
| Brand | onsemi | onsemi | onsemi | onsemi | onsemi |
| Default Role | Source (SRC) | Sink (SNK) | Sink (SNK) | Source (SRC) | Sink (SNK) |
| Default I2C Address | 0x42 (7-bit) per datasheet | Different default address | Different default address | Same default address | Different default address |
| PD PHY Support | USB PD 2.0/3.0 BMC PHY (up to 100 W) | USB PD 2.0/3.0 BMC PHY (up to 100 W) | USB PD 2.0/3.0 BMC PHY (up to 100 W) | USB PD 2.0/3.0 BMC PHY (up to 100 W) | USB PD 2.0/3.0 BMC PHY (up to 100 W) |
| Host Interface | I2C up to 400 kHz | I2C up to 400 kHz | I2C up to 400 kHz | I2C up to 400 kHz | I2C up to 400 kHz |
| Operating Temperature | -40C to +85C | -40C to +85C | -40C to +85C | -40C to +85C | -40C to +85C |
| Drop-in Compatibility | Reference part | Pin-to-pin compatible; firmware reconfig needed | Pin-to-pin compatible; firmware reconfig needed | Fully compatible (reel/packaging variant) | Pin-to-pin compatible; firmware reconfig needed |
Key Differentiators
- Default Source role for charger applications (vs FUSB302BMPX)
- Same 14-MLP package and BMC PD PHY across variants (vs FUSB302B01MPX)
- Integrated BMC PD PHY reduces BOM vs discrete implementation (vs Discrete USB Type-C port detection with external comparators)
Design Notes
The FUSB302TMPX requires a stable 3.3 V supply on its VDD pin, typically derived from the main system 3.3 V rail rather than directly from VBUS. Decouple VDD with a 1 uF ceramic capacitor placed within 5 mm of the pin. The part also requires VBUS voltage sensing via the VBUS pin - route a divided-down VBUS signal here, not the full VBUS voltage, to avoid exceeding the pin's absolute maximum rating.
Do not assume the FUSB302TMPX is a complete PD solution. It implements only the BMC PHY; the policy engine and PD message interpretation must run on the host processor. onsemi provides reference firmware for STM32 and NXP Kinetis, but custom applications (PPS, AVS, EPR) require additional protocol stack work. Also note the exposed pad (pin 14) MUST be soldered to the PCB ground plane for thermal dissipation and electrical reference; failure to do so can cause erratic CC line detection.
Keep CC1/CC2 traces short and matched in length, with no stubs. Route them away from noisy digital traces and high-current paths. Place the I2C pull-up resistors (typically 4.7 kohm to VDD) close to the FUSB302TMPX SDA/SCL pins. The exposed thermal pad (EP) should have at least 4 thermal vias to the ground plane for heat sinking. Use a 4-layer PCB with a dedicated ground plane for best CC signal integrity.
Compliance Information
RoHS and lead-free status confirmed by onsemi product page. AEC-Q100 not qualified - FUSB302 family targets consumer/industrial USB Type-C applications. Verify halogen-free status with manufacturer for environmental compliance documentation.
