LCMXO3D-4300HC-5BG256C - 4300 LUT MachXO3D FPGA, 256-CABGA | Lattice
料号： LCMXO3D-4300HC-5BG256C ✓ 量产中| 数量 | 单价 | 小计 |
|---|---|---|
| 1 | $15.27 | $15.27 |
| 10 | $13.85 | $138.50 |
| 100 | $11.42 | $1,142.00 |
| 500 | $9.78 | $4,890.00 |
| 1,000 | $8.55 | $8,550.00 |
LCMXO3D-4300HC-5BG256C 概述
A Field-Programmable Gate Array (FPGA) is a semiconductor device whose digital logic fabric is configured by the end user after manufacture, providing a flexible alternative to ASICs for glue logic, control plane, I/O expansion, and low-volume custom compute. MachXO3D sits within the broader programmable-logic taxonomy of CPLD → FPGA → PLD, optimized for secure control bridging between an external root-of-trust MCU and downstream peripheral buses. The device operates from a 2.375 V to 3.465 V core supply with multiple I/O bank voltages supporting LVCMOS, LVTTL, LVDS, and other common single-ended and differential standards.
Key features of the LCMXO3D-4300HC include on-chip dual-configuration flash with field-upgrade capability, hardware-implemented bitstream authentication (ECDSA), true random number generation, secure monotonic counters, and tamper detection. Per-pin programmability, hot-socketing support, and TransFR (transparent field reconfiguration) allow I/O and logic updates without interrupting downstream system function. The device includes hardened I2C, SPI, and UART/SPI slave controllers accessible from the fabric.
The LCMXO3D-4300HC is implemented on a 40 nm CMOS process with embedded non-volatile flash for instant-on (<1 ms) configuration. The -5 speed grade corresponds to the mid-tier Fmax performance tier within the MachXO3D family, while the -HC variant provides the higher commercial core voltage range. The fabric supports distributed RAM, shift registers, FIFOs, and DSP blocks scaled to the 4300 LUT density.
Typical applications include platform root-of-trust and secure boot for servers and networking equipment, industrial control and factory automation requiring IEC 62443 compliance, secure IoT edge devices, and automotive functional-safety co-processors. Designers also deploy it for I/O bridging, bus protocol conversion, and LED/display control in low-vision commercial equipment.
When designing with the LCMXO3D-4300HC-5BG256C, allocate PCB area for decoupling capacitors near each supply pin and route JTAG/SPI access for in-system programming. Plan for thermal management via the exposed pad, and verify that selected I/O standards are supported by the target bank voltage to avoid level-shifter overhead.
This page synthesizes distributor pricing, real drop-in pin-compatible alternatives, and design notes that complement the manufacturer datasheet for the MachXO3D family.
直接替换替代料： LCMXO3D-4300HC-5BG256C ——相同封装，引脚兼容。需要 PCB 改动的不同封装料号已排除。
本系列中的变体
可与以下型号直接替换的同系列型号： LCMXO3D-4300HC-5BG256C （相同外形与封装尺寸） ——差异在于 Configuration Memory, Mounting Type, Package, RoHS Status, Speed Grade.
快速对比工具——选择替代料号进行并排对比：
LCMXO3D-9400HC-5BG256C
✅ 直接替换✓ 有现货
$21.5 / 个
查看数据手册 →LCMXO3D-4300HC-6BG256C
✅ 直接替换✓ 有现货
$22.95 / 个
查看数据手册 →LCMXO3D-4300HC-5BG256I
✅ 直接替换📋 参考替代料（不在目录中）
LCMXO3D-4300HE-5BG256C
✅ 直接替换📋 参考替代料（不在目录中）
LCMXO3LF-4300C-5BG256C
✅ 直接替换📋 参考替代料（不在目录中）
LCMXO3D-4300HC-5BG256C 最大额定值与电气特性
| Family | MachXO3D |
| Logic Elements / LUTs | 4300 LUTs |
| Embedded Block RAM (EBR) | 94,208 bits |
| User I/O | 206 |
| 封装 | 256-ball CABGA (BG256) |
| 安装类型 | Surface Mount (BGA) |
| Core Supply Voltage | 2.375 V to 3.465 V |
| 工作温度 | 0 °C to 85 °C (TJ) - commercial C grade |
| Speed Grade | -5 |
| Process Node | 40 nm CMOS |
| Configuration Memory | On-chip dual-boot flash (NV) |
| Security Features | AES, SHA, ECDSA, RSA, TRNG, secure boot |
| Hardened IP | I2C, SPI, UART/SPI slave |
| RoHS 状态 | Compliant (EU RoHS) |
| Reach Status | Compliant |
| I/O Bank Count | Multiple banks (per datasheet pinout) |
LCMXO3D-4300HC-5BG256C 256-ball cabga (bg256) 引脚配置指南
LCMXO3D-4300HC-5BG256C（256-ball cabga (bg256) 封装）的引脚配置。 该数字 IC 包含 GPIO、通信接口（UART、SPI、I2C）和电源引脚。请参阅制造商数据手册以了解复用引脚功能和配置选项。对嵌入式系统设计和 PCB 布局至关重要。
暂无详细引脚数据： LCMXO3D-4300HC-5BG256C.
请参阅 数据手册 以查看完整引脚配置。
典型应用
LCMXO3D-4300HC-5BG256C 适用于 6 应用s: Platform Root-of-Trust and Secure Boot, Industrial IoT Edge Devices, Automotive Secure Co-Processor, I/O Bridging and Protocol Conversion, Server and Datacenter BMC Auxiliary, LED and Display Control in Commercial Equipment.
Platform Root-of-Trust and Secure Boot
The LCMXO3D-4300HC-5BG256C is purpose-built as a hardware Root-of-Trust for servers, networking switches, and edge gateways. Its hardware AES, SHA, ECDSA, and RSA accelerators authenticate host firmware at boot before the application processor executes, satisfying NIST SP 800-193 resiliency guidelines and IEC 62443 industrial cybersecurity requirements. The 4300 LUT density accommodates secure boot state machines, immutable ROM, and key-storage logic while leaving headroom for status monitoring. Designers place the device between the host CPU and SPI flash to gate firmware delivery, using the on-chip TRNG and monotonic counters for anti-rollback enforcement in 256-ball CABGA.
推荐
Industrial IoT Edge Devices
In industrial IoT endpoints, the LCMXO3D-4300HC-5BG256C delivers secure firmware updates, protocol bridging, and tamper detection within a 256-ball CABGA footprint. Its on-chip non-volatile flash enables instant-on (<1 ms) cold-boot, critical for time-sensitive industrial Ethernet protocols such as PROFINET, EtherCAT, and EtherNet/IP. The 4300 LUTs support Modbus/TCP, OPC UA, or MQTT secure-channel offload alongside sensor aggregation, while the hardware cryptographic engine authenticates OTA updates. The commercial 0 °C to 85 °C temperature range covers most factory-floor enclosures without industrial-grade upcharge.
推荐
Automotive Secure Co-Processor
Although the LCMXO3D-4300HC-5BG256C is commercial-grade, its security architecture supports automotive secure co-processor designs where the host MCU needs ISO/SAE 21434 cybersecurity compliance. The hardware Root-of-Trust authenticates the CAN/Ethernet gateway MCU firmware, while the 206 user I/O and multiple I/O banks simplify integration into 12 V automotive power domains. Designers step to the LCMXO3D-4300HC-5BG256I (industrial grade) for cabin electronics and downgrade to commercial C grade for in-lab reference designs. The BG256 CABGA package enables compact PCB layouts in tight automotive enclosures.
推荐
I/O Bridging and Protocol Conversion
The LCMXO3D-4300HC-5BG256C's 206 user I/O across multiple voltage banks make it well-suited for I/O bridging and protocol conversion in legacy-modern interface migration. Designers connect older microcontrollers with parallel buses, SPI, I2C, UART, and GPIO to modern MIPI, RGMII, or USB interfaces through the FPGA fabric. The 94,208 bits of embedded block RAM absorb transient bursts during protocol framing, while the 4300 LUTs implement state machines for I2C-to-SPI, SPI-to-UART, and GPIO expansion with sub-50 ns latency typical of the -5 speed grade.
推荐
Server and Datacenter BMC Auxiliary
In hyperscale servers, the LCMXO3D-4300HC-5BG256C can serve as an auxiliary secure controller for board management controllers (BMC) or platform manageability functions. The hardware Root-of-Trust validates BMC firmware, monitors voltage rails via companion ADCs, and provides pre-verified cryptographic functions for attestation to the host CPU. The 256-ball CABGA package fits standard server-PCB real estate, and the 2.375 V to 3.465 V core supply aligns with standard 3.3 V or 2.5 V server rails without level shifters. The instant-on non-volatile flash reduces BMC boot time.
推荐
LED and Display Control in Commercial Equipment
The LCMXO3D-4300HC-5BG256C provides deterministic, low-latency LED and small-display driving in commercial equipment such as digital signage controllers, kiosk indicator panels, and instrumentation front panels. The 206 user I/O and PWM-capable outputs drive long LED chains with sub-microsecond update rates, while the 4300 LUT fabric handles color-space conversion, gamma correction, and brightness smoothing in hardware. The commercial-grade temperature range suits indoor commercial deployments, and the non-volatile configuration eliminates external boot PROM.
推荐
推荐产品汇总
工程参考数据： LCMXO3D-4300HC-5BG256C ——对比、设计指导和合规信息。
选型指南
与替代料对比
| 参数 | 本产品 | LCMXO3D-9400HC-5BG256C | LCMXO3D-4300HC-6BG256C | LCMXO3D-4300HC-5BG256I | LCMXO3LF-4300C-5BG256C |
|---|---|---|---|---|---|
| Brand | Lattice Semiconductor | Lattice Semiconductor | Lattice Semiconductor | Lattice Semiconductor | Lattice Semiconductor |
| Package | 256-ball CABGA (BG256) | 256-ball CABGA (BG256) - same | 256-ball CABGA (BG256) - same | 256-ball CABGA (BG256) - same | 256-ball CABGA (BG256) - same |
| Logic Elements / LUTs | 4300 LUTs | 9400 LUTs | 4300 LUTs | 4300 LUTs | 4300 LUTs |
| Embedded Block RAM | 94,208 bits | More EBR (per datasheet) | 94,208 bits | 94,208 bits | 94,208 bits |
| Speed Grade | -5 | -5 | -6 (higher performance) | -5 | -5 |
| Temperature Grade | Commercial (0C to 85C TJ) | Commercial | Commercial | Industrial (-40C to 100C TJ) | Commercial |
| Hardware Cryptography | Yes (AES/SHA/ECDSA/RSA, TRNG) | Yes | Yes | Yes | No (non-secure MachXO3LF) |
关键差异点
- Hardware Root-of-Trust with ECDSA bitstream authentication （对比 LCMXO3LF-4300C-5BG256C)
- Doubled LUT density at same footprint （对比 LCMXO3D-4300HC-5BG256C vs LCMXO3D-9400HC-5BG256C)
- Industrial temperature option for harsh environments （对比 LCMXO3D-4300HC-5BG256C vs LCMXO3D-4300HC-5BG256I)
设计说明
The LCMXO3D-4300HC-5BG256C requires a 2.375 V to 3.465 V core supply; place 100 nF decoupling capacitors within 2 mm of every VCC/VCCAUX pin and bulk 10 uF capacitors near the package. Multiple I/O banks each require their own reference supply - separate VCCIO rails prevent noise coupling between banks. Power-rail sequencing (VCCIO before VCC, or vice versa) is documented in the MachXO3D datasheet; follow the recommended sequence to avoid in-rush current stress on the internal flash.
The 256-ball CABGA requires a multi-layer PCB with microvia stack-ups; standard 1.0 mm or 0.8 mm ball pitch per the Lattice package drawing. Fan-out using dog-bone or via-in-pad improves signal integrity for high-speed differential pairs (LVDS). Allocate keep-out zones around the JTAG pins for test-probe access, and place the JTAG header or boundary-scan connector near the package edge for programming fixture access during board bring-up.
Do not confuse the secure MachXO3D family with the non-secure MachXO3LF - both share the 256-ball BG256 footprint, but the LF variants lack the hardware cryptographic accelerators required for Root-of-Trust designs. Verify the bitstream is generated for the correct device (MachXO3D, not MachXO3LF) when targeting security features. Also confirm speed-grade (-5 vs -6) before generating timing constraints; Fmax performance differs between grades.
Route JTAG/SPI configuration signals away from switching power and high-frequency clocks to avoid configuration failures. Match impedance on high-speed differential pairs per the I/O standard chosen (LVDS at 100 ohm, LVPECL at 50 ohm to VCCIO-2). The TransFR transparent reconfiguration feature requires the dedicated GOE/GWE pins to be tied per datasheet recommendations - omit only if TransFR is not used.
合规信息
EU RoHS compliant and REACH compliant per Alibaba listing and Abacus Technologies cross-reference. Lead-free (BGAs are lead-free by construction). AEC-Q100 not applicable - this is a commercial-grade FPGA; automotive variants exist in the MachXO3 family but not in the 'HC' commercial line shown.
