Lattice Semiconductor

LCMXO3D-4300HC-5BG256C - 4300 LUT MachXO3D FPGA, 256-CABGA | Lattice

Teilenummer: LCMXO3D-4300HC-5BG256C ✓ Aktiv
Auf Lager Versand in 1–3 Werktagen
2.375 V to 3.465 V Vdss 256-ball CABGA (BG256) Package -5 Speed On-chip dual-boot flash (NV) Memory
Ab $8.55 USD / Stück
MOQ: 1 |
Preis aktualisiert: 2026-10-13
Mengenpreise
Menge Stückpreis Gesamt
1 $15.27 $15,27
10 $13.85 $138,50
100 $11.42 $1.142,00
500 $9.78 $4.890,00
1.000 $8.55 $8.550,00
ℹ️ Alle Preise sind in USD

LCMXO3D-4300HC-5BG256C Übersicht

The Lattice Semiconductor LCMXO3D-4300HC-5BG256C is a member of the MachXO3D family of non-volatile, instant-on Field-Programmable Gate Arrays (FPGAs) that integrates 4300 Look-Up Tables (LUTs), 94,208 bits of embedded block RAM (EBR), and 206 user I/O in a 256-ball chip-array BGA (CABGA) package. It is designed for hardware Root-of-Trust secure control applications, combining on-chip dual-boot flash, immutable security features, and pre-verified cryptographic accelerators (AES, SHA, ECDSA, RSA) on a low-power 40 nm process node.

A Field-Programmable Gate Array (FPGA) is a semiconductor device whose digital logic fabric is configured by the end user after manufacture, providing a flexible alternative to ASICs for glue logic, control plane, I/O expansion, and low-volume custom compute. MachXO3D sits within the broader programmable-logic taxonomy of CPLD → FPGA → PLD, optimized for secure control bridging between an external root-of-trust MCU and downstream peripheral buses. The device operates from a 2.375 V to 3.465 V core supply with multiple I/O bank voltages supporting LVCMOS, LVTTL, LVDS, and other common single-ended and differential standards.

Key features of the LCMXO3D-4300HC include on-chip dual-configuration flash with field-upgrade capability, hardware-implemented bitstream authentication (ECDSA), true random number generation, secure monotonic counters, and tamper detection. Per-pin programmability, hot-socketing support, and TransFR (transparent field reconfiguration) allow I/O and logic updates without interrupting downstream system function. The device includes hardened I2C, SPI, and UART/SPI slave controllers accessible from the fabric.

The LCMXO3D-4300HC is implemented on a 40 nm CMOS process with embedded non-volatile flash for instant-on (<1 ms) configuration. The -5 speed grade corresponds to the mid-tier Fmax performance tier within the MachXO3D family, while the -HC variant provides the higher commercial core voltage range. The fabric supports distributed RAM, shift registers, FIFOs, and DSP blocks scaled to the 4300 LUT density.

Typical applications include platform root-of-trust and secure boot for servers and networking equipment, industrial control and factory automation requiring IEC 62443 compliance, secure IoT edge devices, and automotive functional-safety co-processors. Designers also deploy it for I/O bridging, bus protocol conversion, and LED/display control in low-vision commercial equipment.

When designing with the LCMXO3D-4300HC-5BG256C, allocate PCB area for decoupling capacitors near each supply pin and route JTAG/SPI access for in-system programming. Plan for thermal management via the exposed pad, and verify that selected I/O standards are supported by the target bank voltage to avoid level-shifter overhead.

This page synthesizes distributor pricing, real drop-in pin-compatible alternatives, and design notes that complement the manufacturer datasheet for the MachXO3D family.

Drop-in-Alternativen für LCMXO3D-4300HC-5BG256C – gleiches Gehäuse, Pin-kompatibel. Bauteile mit anderem Gehäuse, die eine PCB-Überarbeitung erfordern, sind ausgeschlossen.

Varianten dieser Serie

Modelle derselben Serie, die drop-in-kompatibel sind mit LCMXO3D-4300HC-5BG256C (gleiche Bauform und Footprint) – abweichend in Configuration Memory, Logic Elements / LUTs, Mounting Type, Operating Temperature, RoHS Status.

Lattice Semiconductor
Configuration Memory: Internal non-volatile Flash
Logic Elements / LUTs: 4300
Mounting Type: Surface Mount
Vergleichen mit LCMXO3D-4300HC-5BG256C →

Schnellvergleichstool – Wählen Sie Alternativbauteile für den Direktvergleich:

Für dieses Produkt sind keine Drop-in-Alternativen verfügbar.

Alternativen anfordern

LCMXO3D-4300HC-5BG256C Grenzwerte & elektrische Eigenschaften

Family MachXO3D
Logic Elements / LUTs 4300 LUTs
Embedded Block RAM (EBR) 94,208 bits
User I/O 206
Gehäuse 256-ball CABGA (BG256)
Montageart Surface Mount (BGA)
Core Supply Voltage 2.375 V to 3.465 V
Betriebstemperatur 0 °C to 85 °C (TJ) - commercial C grade
Speed Grade -5
Process Node 40 nm CMOS
Configuration Memory On-chip dual-boot flash (NV)
Security Features AES, SHA, ECDSA, RSA, TRNG, secure boot
Hardened IP I2C, SPI, UART/SPI slave
RoHS-Status Compliant (EU RoHS)
Reach Status Compliant
I/O Bank Count Multiple banks (per datasheet pinout)

LCMXO3D-4300HC-5BG256C 256-ball cabga (bg256) Pinbelegungsleitfaden

Pinbelegung für LCMXO3D-4300HC-5BG256C (256-ball cabga (bg256)-Gehäuse). Dieser digitale IC umfasst GPIO, Kommunikationsschnittstellen (UART, SPI, I2C) und Versorgungspins. Alternative Pin-Funktionen und Konfigurationsoptionen entnehmen Sie dem Herstellerdatenblatt. Unverzichtbar für Embedded-System-Design und PCB-Layout.

Pinbelegungsdiagramm für LCMXO3D-4300HC-5BG256C im 256-ball cabga (bg256)-Gehäuse

Keine detaillierten Pinbelegungsdaten verfügbar für LCMXO3D-4300HC-5BG256C.

Siehe die Datenblatt für die vollständige Pin-Konfiguration.

Typische Anwendungen

LCMXO3D-4300HC-5BG256C ist geeignet für 6 Anwendungs: Platform Root-of-Trust and Secure Boot, Industrial IoT Edge Devices, Automotive Secure Co-Processor, I/O Bridging and Protocol Conversion, Server and Datacenter BMC Auxiliary, LED and Display Control in Commercial Equipment.

🔒

Platform Root-of-Trust and Secure Boot

The LCMXO3D-4300HC-5BG256C is purpose-built as a hardware Root-of-Trust for servers, networking switches, and edge gateways. Its hardware AES, SHA, ECDSA, and RSA accelerators authenticate host firmware at boot before the application processor executes, satisfying NIST SP 800-193 resiliency guidelines and IEC 62443 industrial cybersecurity requirements. The 4300 LUT density accommodates secure boot state machines, immutable ROM, and key-storage logic while leaving headroom for status monitoring. Designers place the device between the host CPU and SPI flash to gate firmware delivery, using the on-chip TRNG and monotonic counters for anti-rollback enforcement in 256-ball CABGA.

🏭

Industrial IoT Edge Devices

In industrial IoT endpoints, the LCMXO3D-4300HC-5BG256C delivers secure firmware updates, protocol bridging, and tamper detection within a 256-ball CABGA footprint. Its on-chip non-volatile flash enables instant-on (<1 ms) cold-boot, critical for time-sensitive industrial Ethernet protocols such as PROFINET, EtherCAT, and EtherNet/IP. The 4300 LUTs support Modbus/TCP, OPC UA, or MQTT secure-channel offload alongside sensor aggregation, while the hardware cryptographic engine authenticates OTA updates. The commercial 0 °C to 85 °C temperature range covers most factory-floor enclosures without industrial-grade upcharge.

🚗

Automotive Secure Co-Processor

Although the LCMXO3D-4300HC-5BG256C is commercial-grade, its security architecture supports automotive secure co-processor designs where the host MCU needs ISO/SAE 21434 cybersecurity compliance. The hardware Root-of-Trust authenticates the CAN/Ethernet gateway MCU firmware, while the 206 user I/O and multiple I/O banks simplify integration into 12 V automotive power domains. Designers step to the LCMXO3D-4300HC-5BG256I (industrial grade) for cabin electronics and downgrade to commercial C grade for in-lab reference designs. The BG256 CABGA package enables compact PCB layouts in tight automotive enclosures.

🔌

I/O Bridging and Protocol Conversion

The LCMXO3D-4300HC-5BG256C's 206 user I/O across multiple voltage banks make it well-suited for I/O bridging and protocol conversion in legacy-modern interface migration. Designers connect older microcontrollers with parallel buses, SPI, I2C, UART, and GPIO to modern MIPI, RGMII, or USB interfaces through the FPGA fabric. The 94,208 bits of embedded block RAM absorb transient bursts during protocol framing, while the 4300 LUTs implement state machines for I2C-to-SPI, SPI-to-UART, and GPIO expansion with sub-50 ns latency typical of the -5 speed grade.

🖥️

Server and Datacenter BMC Auxiliary

In hyperscale servers, the LCMXO3D-4300HC-5BG256C can serve as an auxiliary secure controller for board management controllers (BMC) or platform manageability functions. The hardware Root-of-Trust validates BMC firmware, monitors voltage rails via companion ADCs, and provides pre-verified cryptographic functions for attestation to the host CPU. The 256-ball CABGA package fits standard server-PCB real estate, and the 2.375 V to 3.465 V core supply aligns with standard 3.3 V or 2.5 V server rails without level shifters. The instant-on non-volatile flash reduces BMC boot time.

📺

LED and Display Control in Commercial Equipment

The LCMXO3D-4300HC-5BG256C provides deterministic, low-latency LED and small-display driving in commercial equipment such as digital signage controllers, kiosk indicator panels, and instrumentation front panels. The 206 user I/O and PWM-capable outputs drive long LED chains with sub-microsecond update rates, while the 4300 LUT fabric handles color-space conversion, gamma correction, and brightness smoothing in hardware. The commercial-grade temperature range suits indoor commercial deployments, and the non-volatile configuration eliminates external boot PROM.

Zusammenfassung der empfohlenen Produkte

LFE5U-25F-8BG256C Companion Lattice ECP5 FPGA for downstream logic Verwendet in: Platform Root-of-Trust and Secure Boot MAX1068AEEG+ Analog Devices Verwendet in: Platform Root-of-Trust and Secure Boot, Server and Datacenter BMC Auxiliary MAX11120ATI+T Maxim Integrated Verwendet in: Industrial IoT Edge Devices LTC2486IDE#TR Analog Devices Verwendet in: Industrial IoT Edge Devices MAX1085ACSA+T Maxim Integrated Verwendet in: Automotive Secure Co-Processor MAX1030BETI+ Analog Devices Verwendet in: Automotive Secure Co-Processor MAX3109ETJ+ UART companion for legacy serial bridging Verwendet in: I/O Bridging and Protocol Conversion MAX7325ATG+ I2C I/O expander companion for GPIO bridging Verwendet in: I/O Bridging and Protocol Conversion LTC2335ILX-16 Analog Devices Verwendet in: Server and Datacenter BMC Auxiliary MAX6971ATJ+ Companion LED driver for high-channel-count panels Verwendet in: LED and Display Control in Commercial Equipment MAX1093BEEG Analog Devices Verwendet in: LED and Display Control in Commercial Equipment
What is the LCMXO3D-4300HC-5BG256C?
The LCMXO3D-4300HC-5BG256C is a Lattice Semiconductor MachXO3D non-volatile FPGA with 4300 LUTs, 94,208 bits of embedded block RAM, and 206 user I/O in a 256-ball CABGA package. It integrates on-chip dual-boot flash and hardware cryptography for hardware Root-of-Trust applications.
How much does the LCMXO3D-4300HC-5BG256C cost?
Pricing for the LCMXO3D-4300HC-5BG256C is approximately $15.27 at qty 1 and $8.55 at qty 1000 from major distributors as of 2026-10-14. LCSC lists a unit price of $7.4418 in cut-tape quantities. Volume quotes through authorized Lattice distributors will differ from spot distributor pricing.
What is the package of the LCMXO3D-4300HC-5BG256C?
The LCMXO3D-4300HC-5BG256C ships in a 256-ball Chip-Array BGA (CABGA) package designated BG256 per the Lattice MachXO3D datasheet. The BGA grid, ball pitch, and ball-matrix dimensions are documented in the package mechanical drawing; verify against the datasheet before PCB footprint design.
Where can I download the LCMXO3D-4300HC-5BG256C datasheet?
The official LCMXO3D-4300HC-5BG256C datasheet is available from Lattice Semiconductor's product page for the MachXO3D family. LCSC also distributes a datasheet PDF (https://www.lcsc.com/datasheet/C1235950.pdf). Distributor DigiKey provides the datasheet on its product detail page for registered users.
Where can I find the pinout for the LCMXO3D-4300HC-5BG256C?
The BG256 pinout, including user I/O mapping, supply pins, JTAG pins, and bank assignments, is published in the Lattice MachXO3D family datasheet under the 'Pinout Information' section. The exact ball coordinates for this specific package (BG256) must be read directly from that datasheet; XAIPART does not redistribute the pinout image.
What are the key differences between LCMXO3D-4300HC-5BG256C and LCMXO3D-9400HC-5BG256C?
The LCMXO3D-9400HC-5BG256C contains 9400 LUTs (vs 4300), more embedded block RAM, and more user I/O, while sharing the same BG256 CABGA footprint as the LCMXO3D-4300HC-5BG256C. The -4300 and -9400 are pin-compatible within the BG256 package, so designers can step up density without PCB rework.
Is the LCMXO3D-4300HC-5BG256C in stock?
As of 2026-10-14, DigiKey lists the LCMXO3D-4300HC-5BG256C as in stock with same-day shipping. Mouser and Arrow.com also report stock availability, and LCSC lists in-stock components at cut-tape pricing. Confirm current stock with the chosen distributor before placing volume orders.
What is the lead time for LCMXO3D-4300HC-5BG256C orders?
Standard distributor lead time for the LCMXO3D-4300HC-5BG256C is typically 6-10 weeks from the manufacturer when not stocked at distributors, but distributors such as DigiKey, Mouser, Arrow, and LCSC currently show immediate availability as of 2026-10-14. For volume orders above distributor stock, request a factory quote directly from Lattice.
What are the operating conditions of the LCMXO3D-4300HC-5BG256C?
The LCMXO3D-4300HC-5BG256C operates from a 2.375 V to 3.465 V core supply and supports a 0 °C to 85 °C commercial junction temperature range per the 'C' (commercial) suffix. For industrial temperature (-40 °C to 100 °C TJ), choose the LCMXO3D-4300HC-5BG256I variant instead.
What security features does the MachXO3D family provide?
The MachXO3D family integrates AES, SHA, ECDSA, and RSA hardware accelerators, a true random number generator, secure monotonic counters, tamper detection, immutable boot code, and ECDSA bitstream authentication. These features enable hardware Root-of-Trust implementations for secure boot, firmware authentication, and IEC 62443 industrial cybersecurity compliance.
What design tools support the LCMXO3D-4300HC-5BG256C?
Lattice Diamond FPGA design software (LDS) is the primary development environment for the MachXO3D family, supporting Verilog/VHDL synthesis, simulation, place-and-route, bitstream generation, and the Lattice Diamond Programmer for JTAG/SPI device programming. The Lattice Radiant tool also supports certain MachXO3D variants; check the tool compatibility matrix for the specific -5 speed grade.
What is the best drop-in replacement for the LCMXO3D-4300HC-5BG256C?
The LCMXO3D-9400HC-5BG256C is the densest same-footprint drop-in replacement, offering 9400 LUTs in the same 256-ball CABGA package. The LCMXO3D-4300HC-6BG256C is the -6 speed-grade drop-in alternative offering higher Fmax in the same BG256 footprint. The LCMXO3D-4300HE-5BG256C extends temperature range but changes the part suffix.
Can LCMXO3D-4300HC-5BG256I replace LCMXO3D-4300HC-5BG256C?
Yes, the LCMXO3D-4300HC-5BG256I is the industrial-temperature (-40 °C to 100 °C TJ) variant of the same die in the same BG256 CABGA package. It is a functional drop-in replacement when the wider temperature range is acceptable; the 'I' suffix denotes industrial grade, while the 'C' suffix denotes commercial grade (0 °C to 85 °C TJ).
What is the best cross-brand equivalent for the LCMXO3D-4300HC-5BG256C?
Cross-brand 256-ball BGA low-density FPGAs include Microchip PolarFire SoC, Intel Cyclone 10 LP, and Xilinx Artix-7 in similar density tiers. However, no cross-brand part is pin-compatible with the MachXO3D BG256 ball map, so substitution requires PCB layout rework and migration of the bitstream to the new architecture.
What are the key specifications engineers should know about the LCMXO3D-4300HC-5BG256C?
The LCMXO3D-4300HC-5BG256C delivers 4300 LUTs, 94,208 bits of embedded block RAM, 206 user I/O, hardware AES/SHA/ECDSA/RSA cryptography, on-chip dual-boot flash, and a 2.375 V to 3.465 V core supply in a 256-ball CABGA. It supports the commercial 0 °C to 85 °C junction temperature range and the -5 speed grade for mid-tier Fmax performance in the MachXO3D family.

Technische Referenzdaten für LCMXO3D-4300HC-5BG256C – Vergleich, Designhinweise und Compliance-Informationen.

Auswahlhilfe

Choose the LCMXO3D-4300HC-5BG256C when designing a hardware Root-of-Trust, secure boot controller, or protocol bridge that fits within 4300 LUTs and operates within commercial temperature (0-85C TJ). Step to the LCMXO3D-9400HC-5BG256C if the design needs additional logic capacity in the same BG256 footprint. Step to the LCMXO3D-4300HC-6BG256C when higher Fmax performance is needed. Step to the LCMXO3D-4300HC-5BG256I for industrial (-40 to 100C TJ) deployments. Avoid the non-secure LCMXO3LF-4300C-5BG256C if hardware cryptography is required.

Vergleich mit Alternativen

Parameter Dieses Produkt LCMXO3D-9400HC-5BG256C LCMXO3D-4300HC-6BG256C LCMXO3D-4300HC-5BG256I LCMXO3LF-4300C-5BG256C
Brand Lattice Semiconductor Lattice Semiconductor Lattice Semiconductor Lattice Semiconductor Lattice Semiconductor
Package 256-ball CABGA (BG256) 256-ball CABGA (BG256) - same 256-ball CABGA (BG256) - same 256-ball CABGA (BG256) - same 256-ball CABGA (BG256) - same
Logic Elements / LUTs 4300 LUTs 9400 LUTs 4300 LUTs 4300 LUTs 4300 LUTs
Embedded Block RAM 94,208 bits More EBR (per datasheet) 94,208 bits 94,208 bits 94,208 bits
Speed Grade -5 -5 -6 (higher performance) -5 -5
Temperature Grade Commercial (0C to 85C TJ) Commercial Commercial Industrial (-40C to 100C TJ) Commercial
Hardware Cryptography Yes (AES/SHA/ECDSA/RSA, TRNG) Yes Yes Yes No (non-secure MachXO3LF)

Wichtigste Unterscheidungsmerkmale

  • Hardware Root-of-Trust with ECDSA bitstream authentication (vs. LCMXO3LF-4300C-5BG256C)
  • Doubled LUT density at same footprint (vs. LCMXO3D-4300HC-5BG256C vs LCMXO3D-9400HC-5BG256C)
  • Industrial temperature option for harsh environments (vs. LCMXO3D-4300HC-5BG256C vs LCMXO3D-4300HC-5BG256I)

Designhinweise

The LCMXO3D-4300HC-5BG256C requires a 2.375 V to 3.465 V core supply; place 100 nF decoupling capacitors within 2 mm of every VCC/VCCAUX pin and bulk 10 uF capacitors near the package. Multiple I/O banks each require their own reference supply - separate VCCIO rails prevent noise coupling between banks. Power-rail sequencing (VCCIO before VCC, or vice versa) is documented in the MachXO3D datasheet; follow the recommended sequence to avoid in-rush current stress on the internal flash.

The 256-ball CABGA requires a multi-layer PCB with microvia stack-ups; standard 1.0 mm or 0.8 mm ball pitch per the Lattice package drawing. Fan-out using dog-bone or via-in-pad improves signal integrity for high-speed differential pairs (LVDS). Allocate keep-out zones around the JTAG pins for test-probe access, and place the JTAG header or boundary-scan connector near the package edge for programming fixture access during board bring-up.

Do not confuse the secure MachXO3D family with the non-secure MachXO3LF - both share the 256-ball BG256 footprint, but the LF variants lack the hardware cryptographic accelerators required for Root-of-Trust designs. Verify the bitstream is generated for the correct device (MachXO3D, not MachXO3LF) when targeting security features. Also confirm speed-grade (-5 vs -6) before generating timing constraints; Fmax performance differs between grades.

Route JTAG/SPI configuration signals away from switching power and high-frequency clocks to avoid configuration failures. Match impedance on high-speed differential pairs per the I/O standard chosen (LVDS at 100 ohm, LVPECL at 50 ohm to VCCIO-2). The TransFR transparent reconfiguration feature requires the dedicated GOE/GWE pins to be tied per datasheet recommendations - omit only if TransFR is not used.

Compliance-Informationen

RoHS
Compliant
REACH
Compliant
AEC-Q100
Not Applicable
Bleifrei
Yes
Halogenfrei
Unknown
Konfliktmineralien
Compliant

EU RoHS compliant and REACH compliant per Alibaba listing and Abacus Technologies cross-reference. Lead-free (BGAs are lead-free by construction). AEC-Q100 not applicable - this is a commercial-grade FPGA; automotive variants exist in the MachXO3 family but not in the 'HC' commercial line shown.

Daten verifiziert am: 2026-10-14 – Daten geprüft und kuratiert vom Bauteil-Engineering-Team von XAIPART

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Verwandte Bauteile & Begriffe

Lattice Semiconductor LCMXO3D-4300HC-5BG256C LCMXO3D-9400HC-5BG256C LCMXO3D-4300HC-6BG256C LCMXO3D-4300HC-5BG256I LCMXO3LF-4300C-5BG256C FPGA Field-Programmable Gate Array PLD CPLD CABGA BG256 BGA MachXO3D Look-Up Table LUT Embedded Block RAM EBR ECDSA AES SHA RSA Root-of-Trust secure boot RoHS REACH JTAG SPI Lattice Diamond
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