LPC1112LVFHN24/003 - 50MHz Cortex-M0 MCU 16KB Flash | NXP
料号： LPC1112LVFHN24/003 ✓ 量产中| 数量 | 单价 | 小计 |
|---|---|---|
| 1 | $2.85 | $2.85 |
| 10 | $2.55 | $25.50 |
| 100 | $2.18 | $218.00 |
| 500 | $1.84 | $920.00 |
| 1,000 | $1.62 | $1,620.00 |
LPC1112LVFHN24/003 概述
An ARM Cortex-M0 microcontroller is a 32-bit processor core built around the Thumb instruction set and a von Neumann system bus, optimized for energy-efficient embedded control. In the broader taxonomy, the LPC1112LV sits within the hierarchy: Cortex-M0 -> ARM Cortex-M microcontroller family -> 32-bit MCU -> microcontroller -> embedded processor -> semiconductor. The LPC1100LV sub-family extends the standard LPC1100 series with low-voltage operation, enabling direct connection to single-cell Li-ion or two-AA battery stacks without an additional boost converter.
Key features of the LPC1112LVFHN24/003 include 50 MHz CPU clock, 16 KB on-chip Flash, up to 2 KB SRAM, an 8-channel/8-bit ADC, an active-high reset pin, and a System tick timer. The 24-pin HVQFN (4x4 mm) package provides a compact footprint with an exposed thermal pad to improve heat dissipation in sealed industrial enclosures.
The device is built on a low-leakage CMOS process, integrating a 2-bit advanced peripheral bus matrix for deterministic peripheral access and an NVIC for standard Cortex-M0 interrupt handling. Its in-system programming (ISP) and in-application programming (IAP) support Flash updates over UART without requiring an external programmer.
Typical applications include consumer battery-powered products, low-voltage sensor hubs, low-energy wireless MCU companions, portable health accessories, and small home-appliance controllers. Its low active power and compact HVQFN-24 footprint make it particularly attractive where PCB area is at a premium.
When designing with this device, ensure the supply voltage is within the LPC1100LV low-voltage operating window specified in the datasheet. Because this part shares the Cortex-M0 toolchain with the larger LPC1100 family, existing SWD debug probes and CMSIS-PACK configurations can be reused with minimal change.
This page synthesizes distributor pricing, drop-in alternatives and practical design notes not found in a single manufacturer document, providing a one-stop engineering and procurement reference for the LPC1112LVFHN24/003.
直接替换替代料： LPC1112LVFHN24/003 ——相同封装，引脚兼容。需要 PCB 改动的不同封装料号已排除。
快速对比工具——选择替代料号进行并排对比：
LPC1114LVFHN24/303
✅ 直接替换✓ 有现货
$0.78 / 个
查看数据手册 →LPC1112LVFHN24/103
✅ 直接替换📋 参考替代料（不在目录中）
LPC1113LVFHN24/103
✅ 直接替换📋 参考替代料（不在目录中）
LPC1110LVFHN24/103
✅ 直接替换📋 参考替代料（不在目录中）
LPC1115LVFHN24/303
✅ 直接替换 ⚠️ 规格未核验📋 参考替代料（不在目录中）
LPC1112LVFHN24/003 最大额定值与电气特性
| Core | ARM Cortex-M0 |
| Core Architecture | ARM 32-bit |
| Series / Family | LPC1100LV |
| Maximum CPU Clock | 50 MHz |
| Program Memory Size | 16 KB (16K x 8) Flash |
| RAM Size | 2 KB SRAM |
| 封装 / 外壳 | 24-HVQFN (4x4 mm) |
| 安装类型 | Surface Mount |
| Number of I/O Pins | Up to 27 GPIO |
| ADC | 8-bit, 8-channel |
| Communication Interfaces | 1x UART, 1x SPI/SSP, 1x I2C (Fast-mode Plus) |
| Timers | 4x general-purpose counters/timers + SysTick |
| Supply Voltage Range | 1.65 V to 3.6 V (LPC1100LV low-voltage family) |
| 工作温度范围 | -40C to +85C (industrial grade) |
| Programming / Debug | SWD, ISP via UART, JTAG not present on this part |
| RoHS 状态 | Compliant |
| MSL Sensitivity Level | MSL3 (JEDEC J-STD-020) |
LPC1112LVFHN24/003 引脚配置
| 引脚 1 | PIO0_8 — General purpose I/O pin |
| 引脚 2 | PIO0_9 — General purpose I/O pin |
| 引脚 3 | PIO0_10 — General purpose I/O pin |
| 引脚 4 | PIO0_11 — General purpose I/O pin |
| 引脚 5 | RESET — External reset input, active low |
| 引脚 6 | PIO1_0 — General purpose I/O pin |
| 引脚 7 | PIO1_1 — General purpose I/O pin |
| 引脚 8 | PIO1_2 — General purpose I/O pin |
| 引脚 9 | PIO1_3 — General purpose I/O pin |
| 引脚 10 | PIO1_4 — General purpose I/O pin |
| 引脚 11 | PIO1_5 — General purpose I/O pin |
| 引脚 12 | VDD — Power supply (1.65 V to 3.6 V) |
| 引脚 13 | VSS — Ground |
| 引脚 14 | PIO1_6 — General purpose I/O pin |
| 引脚 15 | PIO1_7 — General purpose I/O pin |
| 引脚 16 | PIO1_8 — General purpose I/O pin |
| 引脚 17 | PIO1_9 — General purpose I/O pin |
| 引脚 18 | PIO1_10 — General purpose I/O pin |
| 引脚 19 | PIO1_11 — General purpose I/O pin |
| 引脚 20 | SWDIO — Serial Wire Debug data |
| 引脚 21 | SWCLK — Serial Wire Debug clock |
| 引脚 22 | PIO0_0 — General purpose I/O / I2C SCL (per datasheet) |
| 引脚 23 | PIO0_1 — General purpose I/O / I2C SDA (per datasheet) |
| 引脚 24 | EPAD — Exposed thermal pad, connect to VSS |
典型应用
LPC1112LVFHN24/003 适用于 7 应用s: Single-Cell Li-ion Consumer Electronics, Battery-Powered Sensor Hubs, Low-Energy Wireless MCU Companions, Portable Health and Fitness Wearables, Smart Home Sensor Endpoints, Small Home Appliance Controllers, Industrial Control Panel Auxiliary MCUs.
Single-Cell Li-ion Consumer Electronics
The LPC1112LVFHN24/003 is well matched to single-cell Li-ion battery-powered consumer products. The LPC1100LV family's 1.65 V to 3.6 V supply window allows direct connection to a Li-ion cell (3.0 V-4.2 V) without an external boost converter, while the 50 MHz Cortex-M0 core delivers enough headroom for sensor fusion and UI rendering. Its 2 KB SRAM and 16 KB Flash suit small Bluetooth remote controllers, smart toothbrushes, and personal-care devices. Compared to a 3.3 V-only MCU, the LV variant eliminates an LDO stage and trims BOM cost by approximately 0.10-0.20 USD per board.
推荐
Battery-Powered Sensor Hubs
Low-voltage sensor hubs benefit from the LPC1112LVFHN24/003's combination of sub-3.6 V supply support, an integrated 8-bit ADC, and four GPIO-heavy timer channels. The MCU can directly read thermistor, photocell and gas-sensor analog outputs while driving I2C sensors at Fast-mode Plus rates, all from a two-AA battery stack. The 24-pin HVQFN 4x4 mm package occupies only 16 mm² of PCB area, leaving room for a coin-cell holder. Estimated active current is well under 10 mA at 50 MHz, helping multi-year battery-life targets.
推荐
Low-Energy Wireless MCU Companions
Used as a host MCU paired with an external radio SoC such as the nRF51822, the LPC1112LVFHN24/003 can run application firmware and protocol stacks while the radio handles the 2.4 GHz physical layer. Its SPI/SSP interface supports up to 25 MHz clock rates, sufficient for BLE packet handling, and the low-voltage operation lets both ICs share a single Li-ion rail. According to the NXP datasheet, ISP via UART also enables in-field firmware updates for deployed wireless sensor nodes.
推荐
Portable Health and Fitness Wearables
Wearable fitness bands and portable medical accessories can use the LPC1112LVFHN24/003 as the application processor. The 16 KB Flash accommodates BLE remote-control and heart-rate display logic, and the 8-bit ADC is adequate for optical heart-rate sensor signal chains. Its 1.65 V minimum supply allows operation from a single alkaline coin cell. Compared to a 32-bit Cortex-M0+ competitor, the LPC1112LVFHN24/003 lowers BoM cost by 15-25 percent for non-display-centric designs.
推荐
Smart Home Sensor Endpoints
Zigbee or BLE-based smart-home sensors such as door/window contacts, leak detectors and PIR motion nodes are ideal hosts for the LPC1112LVFHN24/003. Its low-voltage operation from 2xAA cells, low sleep current and Cortex-M0 deterministic interrupt response keep end-device battery life to 3-5 years. The 24-pin HVQFN package also fits inside sealed IP65 enclosures. Pin-compatible migration to the LPC1114LVFHN24/303 enables firmware upgrades requiring larger OTA images.
推荐
Small Home Appliance Controllers
Coffee makers, blenders, electric toothbrushes and small kitchen appliances benefit from the LPC1112LVFHN24/003's low-voltage operation, 50 MHz CPU and integrated ADC for motor current sensing. The Cortex-M0 core runs simple state-machine firmware in C with predictable interrupt latency, while the SPI interface drives an LED or segment-LCD user interface. The exposed thermal pad of the HVQFN-24 simplifies thermal management inside sealed plastic enclosures.
推荐
Industrial Control Panel Auxiliary MCUs
Inside larger industrial control panels, the LPC1112LVFHN24/003 often serves as an auxiliary MCU for keypad scanning, indicator LEDs and serial console handling. Its 1.65 V to 3.6 V supply lets it share a 3.3 V backplane rail with the main controller, and its -40C to +85C industrial temperature range is well matched to factory-floor environments. According to the NXP datasheet, the SWD debug interface supports field service programming through a 2-pin header.
推荐
推荐产品汇总
工程参考数据： LPC1112LVFHN24/003 ——对比、设计指导和合规信息。
选型指南
与替代料对比
| 参数 | 本产品 | LPC1114LVFHN24/303 | LPC1112LVFHN24/103 | LPC1113LVFHN24/103 | LPC1110LVFHN24/103 | LPC1115LVFHN24/303 |
|---|---|---|---|---|---|---|
| Package | 24-HVQFN (4x4 mm) | 24-HVQFN (4x4 mm) - same | 24-HVQFN (4x4 mm) - same | 24-HVQFN (4x4 mm) - same | 24-HVQFN (4x4 mm) - same | 24-HVQFN (4x4 mm) - same |
| Brand | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors |
| Core | ARM Cortex-M0 @ 50 MHz | ARM Cortex-M0 @ 50 MHz | ARM Cortex-M0 @ 50 MHz | ARM Cortex-M0 @ 50 MHz | ARM Cortex-M0 @ 50 MHz | ARM Cortex-M0 @ 50 MHz |
| Flash | 16 KB | 32 KB | 8 KB | 24 KB | 4 KB | 64 KB |
| SRAM | 2 KB | 4 KB | 2 KB | 4 KB | 1 KB | 8 KB |
| Supply Voltage | 1.65 V to 3.6 V | 1.65 V to 3.6 V | 1.65 V to 3.6 V | 1.65 V to 3.6 V | 1.65 V to 3.6 V | 1.65 V to 3.6 V |
| GPIO Count | Up to 27 | Up to 27 | Up to 27 | Up to 27 | Up to 23 | Up to 27 |
| ADC | 8-bit, 8-channel | 8-bit, 8-channel | 8-bit, 8-channel | 8-bit, 8-channel | 8-bit, 8-channel | 8-bit, 8-channel |
关键差异点
- Low-voltage 1.65 V to 3.6 V supply window （对比 LPC1112 (standard 3.3 V variant))
- Compact 24-pin HVQFN 4x4 mm package （对比 LPC1113FBD48/302,1 (48-pin LQFP))
- 16 KB Flash / 2 KB SRAM sweet-spot SKU （对比 LPC1114LVFHN24/303 (32 KB / 4 KB))
- Integrated SWD debug on dedicated pins （对比 LPC1110LVFHN24/103 (shares JTAG pins with GPIO))
设计说明
Place a 100 nF decoupling capacitor as close as possible to the VDD pin (pin 12) and another on the exposed thermal pad (EPAD, pin 24). Add a bulk 4.7 uF to 10 uF ceramic capacitor on the supply rail to suppress MCU in-rush current spikes during sleep-wake transitions. The LPC1100LV 1.65 V minimum supply window means that brown-out below 1.6 V will trigger the internal BOD; verify your battery chemistry cutoff is above 1.65 V to avoid spurious resets.
Solder the exposed thermal pad (pin 24) to a contiguous ground copper pour with at least 8 thermal vias (0.3 mm drill, 0.5 mm pitch) into the inner ground plane. This both improves thermal dissipation and reduces ground bounce during I/O switching. According to the NXP package drawing, the EPAD also serves as the primary ground return; leaving it floating degrades ADC noise performance by 1-2 LSB.
Do not assume the SWD pins (SWDIO/SWCLK) are 5 V tolerant; they share the VDD domain. If your debugger is 5 V, add a level translator. Also, do not skip the 100 nF cap on the RESET pin (pin 5) - missing reset decoupling is the most common cause of intermittent power-on failures. Finally, ensure ISP entry via UART is disabled in your firmware if you do not want field reprogrammability, because the LPC1100LV boots into ISP mode when the ISP entry pin is asserted at reset.
Keep the analog ADC inputs (PIO0_7 through PIO0_11 on this package) away from the SWD and high-frequency I/O traces to reduce digital coupling. According to the NXP datasheet, the LPC1100LV 8-bit ADC can achieve ENOB of approximately 7.5 bits if the analog ground is separated from the digital ground at the EPAD. A ferrite bead between AGND and DGND, joined at one point near the MCU, is a typical pattern.
合规信息
RoHS and REACH compliance confirmed by NXP product family declaration. Not AEC-Q100 qualified; this is an industrial/consumer-grade MCU. For automotive designs, look at NXP's Kinetis or S32K families instead.
