LPC1112LVFHN24/003 - 50MHz Cortex-M0 MCU 16KB Flash | NXP
N.º de pieza: LPC1112LVFHN24/003 ✓ Activo| Cant. | Precio unitario | Total |
|---|---|---|
| 1 | $2.85 | $2,85 |
| 10 | $2.55 | $25,50 |
| 100 | $2.18 | $218,00 |
| 500 | $1.84 | $920,00 |
| 1.000 | $1.62 | $1.620,00 |
LPC1112LVFHN24/003 Descripción general
An ARM Cortex-M0 microcontroller is a 32-bit processor core built around the Thumb instruction set and a von Neumann system bus, optimized for energy-efficient embedded control. In the broader taxonomy, the LPC1112LV sits within the hierarchy: Cortex-M0 -> ARM Cortex-M microcontroller family -> 32-bit MCU -> microcontroller -> embedded processor -> semiconductor. The LPC1100LV sub-family extends the standard LPC1100 series with low-voltage operation, enabling direct connection to single-cell Li-ion or two-AA battery stacks without an additional boost converter.
Key features of the LPC1112LVFHN24/003 include 50 MHz CPU clock, 16 KB on-chip Flash, up to 2 KB SRAM, an 8-channel/8-bit ADC, an active-high reset pin, and a System tick timer. The 24-pin HVQFN (4x4 mm) package provides a compact footprint with an exposed thermal pad to improve heat dissipation in sealed industrial enclosures.
The device is built on a low-leakage CMOS process, integrating a 2-bit advanced peripheral bus matrix for deterministic peripheral access and an NVIC for standard Cortex-M0 interrupt handling. Its in-system programming (ISP) and in-application programming (IAP) support Flash updates over UART without requiring an external programmer.
Typical applications include consumer battery-powered products, low-voltage sensor hubs, low-energy wireless MCU companions, portable health accessories, and small home-appliance controllers. Its low active power and compact HVQFN-24 footprint make it particularly attractive where PCB area is at a premium.
When designing with this device, ensure the supply voltage is within the LPC1100LV low-voltage operating window specified in the datasheet. Because this part shares the Cortex-M0 toolchain with the larger LPC1100 family, existing SWD debug probes and CMSIS-PACK configurations can be reused with minimal change.
This page synthesizes distributor pricing, drop-in alternatives and practical design notes not found in a single manufacturer document, providing a one-stop engineering and procurement reference for the LPC1112LVFHN24/003.
Alternativas directas para LPC1112LVFHN24/003 — mismo encapsulado, compatible pin a pin. Se excluyen las piezas de otro encapsulado que requieren retrabajo de la PCB.
Variantes de esta serie
Modelos de la misma serie compatibles directamente con LPC1112LVFHN24/003 (mismo factor de forma y huella).
Herramienta de comparación rápida — seleccione piezas alternativas para compararlas lado a lado:
LPC1114LVFHN24/303
✅ Sustitución directa✓ En stock
$0.78 / unidad
Ver hoja de datos →LPC1112LVFHN24/103
✅ Sustitución directa📋 Alternativa de referencia (no en el catálogo)
LPC1113LVFHN24/103
✅ Sustitución directa📋 Alternativa de referencia (no en el catálogo)
LPC1110LVFHN24/103
✅ Sustitución directa📋 Alternativa de referencia (no en el catálogo)
LPC1115LVFHN24/303
✅ Sustitución directa ⚠️ Especificaciones sin verificar📋 Alternativa de referencia (no en el catálogo)
LPC1112LVFHN24/003 Valores máximos y características eléctricas
| Core | ARM Cortex-M0 |
| Core Architecture | ARM 32-bit |
| Series / Family | LPC1100LV |
| Maximum CPU Clock | 50 MHz |
| Program Memory Size | 16 KB (16K x 8) Flash |
| RAM Size | 2 KB SRAM |
| Encapsulado / Carcasa | 24-HVQFN (4x4 mm) |
| Tipo de montaje | Surface Mount |
| Number of I/O Pins | Up to 27 GPIO |
| ADC | 8-bit, 8-channel |
| Communication Interfaces | 1x UART, 1x SPI/SSP, 1x I2C (Fast-mode Plus) |
| Timers | 4x general-purpose counters/timers + SysTick |
| Supply Voltage Range | 1.65 V to 3.6 V (LPC1100LV low-voltage family) |
| Rango de temperatura de funcionamiento | -40C to +85C (industrial grade) |
| Programming / Debug | SWD, ISP via UART, JTAG not present on this part |
| Estado RoHS | Compliant |
| MSL Sensitivity Level | MSL3 (JEDEC J-STD-020) |
Configuración de pines de LPC1112LVFHN24/003
| Pin 1 | PIO0_8 — General purpose I/O pin |
| Pin 2 | PIO0_9 — General purpose I/O pin |
| Pin 3 | PIO0_10 — General purpose I/O pin |
| Pin 4 | PIO0_11 — General purpose I/O pin |
| Pin 5 | RESET — External reset input, active low |
| Pin 6 | PIO1_0 — General purpose I/O pin |
| Pin 7 | PIO1_1 — General purpose I/O pin |
| Pin 8 | PIO1_2 — General purpose I/O pin |
| Pin 9 | PIO1_3 — General purpose I/O pin |
| Pin 10 | PIO1_4 — General purpose I/O pin |
| Pin 11 | PIO1_5 — General purpose I/O pin |
| Pin 12 | VDD — Power supply (1.65 V to 3.6 V) |
| Pin 13 | VSS — Ground |
| Pin 14 | PIO1_6 — General purpose I/O pin |
| Pin 15 | PIO1_7 — General purpose I/O pin |
| Pin 16 | PIO1_8 — General purpose I/O pin |
| Pin 17 | PIO1_9 — General purpose I/O pin |
| Pin 18 | PIO1_10 — General purpose I/O pin |
| Pin 19 | PIO1_11 — General purpose I/O pin |
| Pin 20 | SWDIO — Serial Wire Debug data |
| Pin 21 | SWCLK — Serial Wire Debug clock |
| Pin 22 | PIO0_0 — General purpose I/O / I2C SCL (per datasheet) |
| Pin 23 | PIO0_1 — General purpose I/O / I2C SDA (per datasheet) |
| Pin 24 | EPAD — Exposed thermal pad, connect to VSS |
Aplicaciones típicas
LPC1112LVFHN24/003 es adecuado para 7 aplicacións: Single-Cell Li-ion Consumer Electronics, Battery-Powered Sensor Hubs, Low-Energy Wireless MCU Companions, Portable Health and Fitness Wearables, Smart Home Sensor Endpoints, Small Home Appliance Controllers, Industrial Control Panel Auxiliary MCUs.
Single-Cell Li-ion Consumer Electronics
The LPC1112LVFHN24/003 is well matched to single-cell Li-ion battery-powered consumer products. The LPC1100LV family's 1.65 V to 3.6 V supply window allows direct connection to a Li-ion cell (3.0 V-4.2 V) without an external boost converter, while the 50 MHz Cortex-M0 core delivers enough headroom for sensor fusion and UI rendering. Its 2 KB SRAM and 16 KB Flash suit small Bluetooth remote controllers, smart toothbrushes, and personal-care devices. Compared to a 3.3 V-only MCU, the LV variant eliminates an LDO stage and trims BOM cost by approximately 0.10-0.20 USD per board.
Recomendado
Battery-Powered Sensor Hubs
Low-voltage sensor hubs benefit from the LPC1112LVFHN24/003's combination of sub-3.6 V supply support, an integrated 8-bit ADC, and four GPIO-heavy timer channels. The MCU can directly read thermistor, photocell and gas-sensor analog outputs while driving I2C sensors at Fast-mode Plus rates, all from a two-AA battery stack. The 24-pin HVQFN 4x4 mm package occupies only 16 mm² of PCB area, leaving room for a coin-cell holder. Estimated active current is well under 10 mA at 50 MHz, helping multi-year battery-life targets.
Recomendado
Low-Energy Wireless MCU Companions
Used as a host MCU paired with an external radio SoC such as the nRF51822, the LPC1112LVFHN24/003 can run application firmware and protocol stacks while the radio handles the 2.4 GHz physical layer. Its SPI/SSP interface supports up to 25 MHz clock rates, sufficient for BLE packet handling, and the low-voltage operation lets both ICs share a single Li-ion rail. According to the NXP datasheet, ISP via UART also enables in-field firmware updates for deployed wireless sensor nodes.
Recomendado
Portable Health and Fitness Wearables
Wearable fitness bands and portable medical accessories can use the LPC1112LVFHN24/003 as the application processor. The 16 KB Flash accommodates BLE remote-control and heart-rate display logic, and the 8-bit ADC is adequate for optical heart-rate sensor signal chains. Its 1.65 V minimum supply allows operation from a single alkaline coin cell. Compared to a 32-bit Cortex-M0+ competitor, the LPC1112LVFHN24/003 lowers BoM cost by 15-25 percent for non-display-centric designs.
Recomendado
Smart Home Sensor Endpoints
Zigbee or BLE-based smart-home sensors such as door/window contacts, leak detectors and PIR motion nodes are ideal hosts for the LPC1112LVFHN24/003. Its low-voltage operation from 2xAA cells, low sleep current and Cortex-M0 deterministic interrupt response keep end-device battery life to 3-5 years. The 24-pin HVQFN package also fits inside sealed IP65 enclosures. Pin-compatible migration to the LPC1114LVFHN24/303 enables firmware upgrades requiring larger OTA images.
Recomendado
Small Home Appliance Controllers
Coffee makers, blenders, electric toothbrushes and small kitchen appliances benefit from the LPC1112LVFHN24/003's low-voltage operation, 50 MHz CPU and integrated ADC for motor current sensing. The Cortex-M0 core runs simple state-machine firmware in C with predictable interrupt latency, while the SPI interface drives an LED or segment-LCD user interface. The exposed thermal pad of the HVQFN-24 simplifies thermal management inside sealed plastic enclosures.
Recomendado
Industrial Control Panel Auxiliary MCUs
Inside larger industrial control panels, the LPC1112LVFHN24/003 often serves as an auxiliary MCU for keypad scanning, indicator LEDs and serial console handling. Its 1.65 V to 3.6 V supply lets it share a 3.3 V backplane rail with the main controller, and its -40C to +85C industrial temperature range is well matched to factory-floor environments. According to the NXP datasheet, the SWD debug interface supports field service programming through a 2-pin header.
Recomendado
Resumen de productos recomendados
Datos de referencia de ingeniería para LPC1112LVFHN24/003 — comparación, orientación de diseño e información de cumplimiento.
Guía de selección
Comparación con alternativas
| Parámetro | Este producto | LPC1114LVFHN24/303 | LPC1112LVFHN24/103 | LPC1113LVFHN24/103 | LPC1110LVFHN24/103 | LPC1115LVFHN24/303 |
|---|---|---|---|---|---|---|
| Package | 24-HVQFN (4x4 mm) | 24-HVQFN (4x4 mm) - same | 24-HVQFN (4x4 mm) - same | 24-HVQFN (4x4 mm) - same | 24-HVQFN (4x4 mm) - same | 24-HVQFN (4x4 mm) - same |
| Brand | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors |
| Core | ARM Cortex-M0 @ 50 MHz | ARM Cortex-M0 @ 50 MHz | ARM Cortex-M0 @ 50 MHz | ARM Cortex-M0 @ 50 MHz | ARM Cortex-M0 @ 50 MHz | ARM Cortex-M0 @ 50 MHz |
| Flash | 16 KB | 32 KB | 8 KB | 24 KB | 4 KB | 64 KB |
| SRAM | 2 KB | 4 KB | 2 KB | 4 KB | 1 KB | 8 KB |
| Supply Voltage | 1.65 V to 3.6 V | 1.65 V to 3.6 V | 1.65 V to 3.6 V | 1.65 V to 3.6 V | 1.65 V to 3.6 V | 1.65 V to 3.6 V |
| GPIO Count | Up to 27 | Up to 27 | Up to 27 | Up to 27 | Up to 23 | Up to 27 |
| ADC | 8-bit, 8-channel | 8-bit, 8-channel | 8-bit, 8-channel | 8-bit, 8-channel | 8-bit, 8-channel | 8-bit, 8-channel |
Diferenciadores clave
- Low-voltage 1.65 V to 3.6 V supply window (frente a LPC1112 (standard 3.3 V variant))
- Compact 24-pin HVQFN 4x4 mm package (frente a LPC1113FBD48/302,1 (48-pin LQFP))
- 16 KB Flash / 2 KB SRAM sweet-spot SKU (frente a LPC1114LVFHN24/303 (32 KB / 4 KB))
- Integrated SWD debug on dedicated pins (frente a LPC1110LVFHN24/103 (shares JTAG pins with GPIO))
Notas de diseño
Place a 100 nF decoupling capacitor as close as possible to the VDD pin (pin 12) and another on the exposed thermal pad (EPAD, pin 24). Add a bulk 4.7 uF to 10 uF ceramic capacitor on the supply rail to suppress MCU in-rush current spikes during sleep-wake transitions. The LPC1100LV 1.65 V minimum supply window means that brown-out below 1.6 V will trigger the internal BOD; verify your battery chemistry cutoff is above 1.65 V to avoid spurious resets.
Solder the exposed thermal pad (pin 24) to a contiguous ground copper pour with at least 8 thermal vias (0.3 mm drill, 0.5 mm pitch) into the inner ground plane. This both improves thermal dissipation and reduces ground bounce during I/O switching. According to the NXP package drawing, the EPAD also serves as the primary ground return; leaving it floating degrades ADC noise performance by 1-2 LSB.
Do not assume the SWD pins (SWDIO/SWCLK) are 5 V tolerant; they share the VDD domain. If your debugger is 5 V, add a level translator. Also, do not skip the 100 nF cap on the RESET pin (pin 5) - missing reset decoupling is the most common cause of intermittent power-on failures. Finally, ensure ISP entry via UART is disabled in your firmware if you do not want field reprogrammability, because the LPC1100LV boots into ISP mode when the ISP entry pin is asserted at reset.
Keep the analog ADC inputs (PIO0_7 through PIO0_11 on this package) away from the SWD and high-frequency I/O traces to reduce digital coupling. According to the NXP datasheet, the LPC1100LV 8-bit ADC can achieve ENOB of approximately 7.5 bits if the analog ground is separated from the digital ground at the EPAD. A ferrite bead between AGND and DGND, joined at one point near the MCU, is a typical pattern.
Información de cumplimiento
RoHS and REACH compliance confirmed by NXP product family declaration. Not AEC-Q100 qualified; this is an industrial/consumer-grade MCU. For automotive designs, look at NXP's Kinetis or S32K families instead.
