LPC1316FHN33,551 - Cortex-M3 72MHz MCU 48KB Flash | NXP
料号： LPC1316FHN33,551 ✓ 量产中| 数量 | 单价 | 小计 |
|---|---|---|
| 1 | $1.18 | $1.18 |
| 10 | $1.06 | $10.60 |
| 100 | $0.95 | $95.00 |
| 500 | $0.88 | $440.00 |
| 1,000 | $0.82 | $820.00 |
LPC1316FHN33,551 概述
An entry-level 32-bit MCU is an integrated circuit that combines a processor core, program flash, SRAM, and mixed-signal peripherals on a single die, sitting in the product hierarchy between 8-bit MCUs and high-performance Cortex-M4/M7 devices. The LPC1316 belongs to the NXP LPC1300 family, which targets embedded applications requiring a high level of integration and low power consumption.
Key features include the Arm Cortex-M3 core with a 3-stage pipeline and Harvard architecture with separate instruction and data buses, CPU speeds up to 72 MHz, 48 KB flash, a USB 2.0 full-speed device controller, USART serial interfaces, and an internal prefetch unit supporting speculative branching for improved execution efficiency.
Technically, the Cortex-M3 core integrates an NVIC interrupt controller, SysTick timer, and enhanced debug features, while the LPC1300 peripheral set adds fast GPIO, 10-bit ADC, and serial connectivity on a single 3.3 V supply rail (2.5 V to 3.3 V operating range per distributor data).
Typical applications include USB-connected embedded devices, industrial control nodes, consumer appliances, and battery-powered instrumentation where 8-bit MCUs lack headroom but full Cortex-M4 performance is unnecessary.
Design consideration: the 32-HVQFN exposed pad must be soldered to a ground plane for both thermal dissipation and signal integrity; verify the 2.5 V to 3.3 V supply window before reusing a 5 V-tolerant design.
This page synthesizes verified distributor pricing, pin-compatible LPC13xx family alternatives, and practical design notes not consolidated in the manufacturer datasheet.
直接替换替代料： LPC1316FHN33,551 ——相同封装，引脚兼容。需要 PCB 改动的不同封装料号已排除。
本系列中的变体
可与以下型号直接替换的同系列型号： LPC1316FHN33,551 （相同外形与封装尺寸） ——差异在于 Flash Memory, Supply Voltage Range.
快速对比工具——选择替代料号进行并排对比：
LPC1317FHN33,551
✅ 直接替换 ⚠️ 规格未核验📋 参考替代料（不在目录中）
LPC1315FHN33,551
✅ 直接替换 ⚠️ 规格未核验📋 参考替代料（不在目录中）
LPC1343FHN33,551
✅ 直接替换 ⚠️ 规格未核验📋 参考替代料（不在目录中）
LPC1342FHN33,551
✅ 直接替换 ⚠️ 规格未核验📋 参考替代料（不在目录中）
LPC1313FHN33,551
✅ 直接替换 ⚠️ 规格未核验📋 参考替代料（不在目录中）
LPC1316FHN33,551 最大额定值与电气特性
| Core Processor | ARM Cortex-M3 |
| Core Size | 32-Bit |
| Max CPU Frequency | 72 MHz |
| Flash Memory | 48 KB (48K x 8) |
| Supply Voltage Range | 2.5 V to 3.3 V |
| 封装 | 32-HVQFN (7x7 mm) Exposed Pad |
| 安装类型 | Surface Mount |
| Series | LPC13xx (LPC1316) |
| USB Controller | USB device |
| Serial Interfaces | USART |
| Pipeline | 3-stage |
| Architecture | Harvard, with separate instruction and data buses |
| EEPROM Emulation | Yes (per LPC1316 family datasheet) |
| Packaging | Tray |
LPC1316FHN33,551 32-hvqfn (7x7 mm) exposed pad 引脚配置指南
LPC1316FHN33,551（32-hvqfn (7x7 mm) exposed pad 封装）的引脚配置。 该数字 IC 包含 GPIO、通信接口（UART、SPI、I2C）和电源引脚。请参阅制造商数据手册以了解复用引脚功能和配置选项。对嵌入式系统设计和 PCB 布局至关重要。
暂无详细引脚数据： LPC1316FHN33,551.
请参阅 数据手册 以查看完整引脚配置。
典型应用
LPC1316FHN33,551 适用于 6 应用s: USB Embedded Devices, Industrial Control Nodes, Battery-Powered Instrumentation, Consumer Appliance Control, Sensor Hubs and IoT Edge Nodes, Test and Measurement Accessories.
USB Embedded Devices
The LPC1316FHN33,551 fits USB-connected peripherals because it integrates a USB 2.0 full-speed device controller alongside the 72 MHz Cortex-M3 core, enabling HID, CDC, and vendor-class enumeration without an external PHY. Typical roles include USB sensors, dongles, and configuration interfaces where the 48 KB flash accommodates USB stack plus application firmware. The 3-stage pipeline and Harvard bus architecture sustain the throughput needed for bulk transfers, while the 32-HVQFN (7x7) exposed-pad package keeps the BOM and board area compact for handheld form factors.
推荐
Industrial Control Nodes
In factory automation nodes, the LPC1316FHN33,551 provides deterministic Cortex-M3 execution at 72 MHz with USART links to PLC peripherals and sensor buses. The 48 KB flash holds protocol handlers such as Modbus RTU with margin for OTA feature updates, and the entry-level peripheral integration reduces external component count on dense I/O boards. Operating from a 2.5 V to 3.3 V rail, it pairs cleanly with 3.3 V industrial logic; the exposed-pad HVQFN improves thermal margin inside sealed control cabinets where passive cooling only is available.
推荐
Battery-Powered Instrumentation
Portable instruments benefit from the LPC1300 family's low power consumption and high integration: one chip supplies the 72 MHz processing core, flash, SRAM, ADC, and serial interfaces, minimizing quiescent overhead versus multi-chip solutions. The 48 KB flash supports data-logging tables and calibration constants in firmware, while the Cortex-M3 sleep modes permit long battery life in handheld meters and environmental loggers. Designers should budget current for the USB block when enabled and leverage clock-gating of unused peripherals to reach the lowest standby figures cited in the NXP datasheet.
推荐
Consumer Appliance Control
White-goods and small-appliance controllers use the LPC1316FHN33,551 as a cost-effective 32-bit upgrade path from 8-bit MCUs: the 72 MHz Cortex-M3 core runs PID motor-control loops with headroom, and the on-chip USART communicates with display and touch-front-end boards. The 32-HVQFN (7x7) surface-mount package supports automated assembly and compact main-board layouts. The 48 KB flash accommodates multiple operating modes and localization variants, and NXP's long-lifecycle industrial MCUs simplify repeated production builds over multi-year appliance programs.
推荐
Sensor Hubs and IoT Edge Nodes
As a sensor aggregation node, the LPC1316FHN33,551 collects I2C/SPI sensor streams through its GPIO and USART peripherals while executing local filtering on the 72 MHz core, reducing upstream data volume. The 48 KB flash holds protocol stacks and buffering routines, and the 2.5 V to 3.3 V supply range matches common Li-ion-regulated rails. Although it lacks on-chip radio, pairing it with a BLE or sub-GHz module yields a low-cost edge node; the HVQFN exposed pad supports dense multi-chip layouts typical of module-style IoT boards.
推荐
Test and Measurement Accessories
USB bench accessories such as data-acquisition dongles and programmer pods map well to the LPC1316FHN33,551: the full-speed USB device controller streams samples to host software, the 72 MHz Cortex-M3 handles packetization and timing, and 48 KB flash stores calibration and firmware-update bootloaders. The 32-HVQFN (7x7) package suits compact probe-body enclosures, and the exposed pad simplifies grounding to the analog front end. The 3-stage pipeline delivers consistent latency for trigger and timestamp functions required in measurement firmware.
推荐
推荐产品汇总
工程参考数据： LPC1316FHN33,551 ——对比、设计指导和合规信息。
选型指南
与替代料对比
| 参数 | 本产品 | LPC1317FHN33,551 | LPC1315FHN33,551 | LPC1343FHN33,551 |
|---|---|---|---|---|
| Package | 32-HVQFN (7x7) | 32-HVQFN (7x7) - same | 32-HVQFN (7x7) - same | 32-HVQFN (7x7) - same |
| Brand | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors |
| Core | ARM Cortex-M3 | ARM Cortex-M3 | ARM Cortex-M3 | ARM Cortex-M3 |
| Max CPU Frequency | 72 MHz | 72 MHz | 72 MHz | 72 MHz |
| Flash | 48 KB | 64 KB | 32 KB | 64 KB |
| USB | USB device | USB device | USB device | USB device |
| Pin Compatibility | Reference | Pin-to-pin | Pin-to-pin | Pin-to-pin |
关键差异点
- Balanced 48 KB flash capacity （对比 LPC1315FHN33,551)
- Lower cost than 64 KB siblings （对比 LPC1343FHN33,551)
- Footprint upgrade path （对比 LPC1317FHN33,551)
设计说明
Solder the HVQFN exposed pad to a PCB ground pad with a 3x3 (or larger) via array to the internal ground plane. The exposed pad is the primary ground return for the die; an unsoldered or cold-soldered pad commonly causes erratic USB operation and elevated ground bounce even though the peripheral ring pins appear properly connected. Follow NXP's HVQFN application soldering guidance for stencil aperture design.
Decouple every VDD pin with a 100 nF ceramic capacitor placed within 3 mm of the pin, plus one bulk 4.7 uF to 10 uF capacitor near the supply entry. The LPC1300 operates from 2.5 V to 3.3 V, so verify that upstream regulator accuracy plus IR drop keeps the rail inside this window under peak USB-transmit load. Do not power the part from a 5 V rail without level shifting and a 3.3 V LDO.
Pin-compatible LPC13xx family swaps (LPC1315/1316/1317/1343) still require firmware updates: change the device header in your build, review the linker script for differing flash/SRAM sizes, and re-check the flash configuration word. Assuming a binary compiled for the LPC1316 runs unchanged on a larger-flash sibling is a common source of boot failures on first power-up after a BOM substitution.
合规信息
RoHS/lead-free per NXP standard product flow for the ,551 ordering code; formal REACH and conflict-minerals declarations should be obtained from NXP's compliance portal.
