LPC1316FHN33,551 - Cortex-M3 72MHz MCU 48KB Flash | NXP
部品番号: LPC1316FHN33,551 ✓ 生産中| 数量 | 単価 | 小計 |
|---|---|---|
| 1 | $1.18 | $1.18 |
| 10 | $1.06 | $10.60 |
| 100 | $0.95 | $95.00 |
| 500 | $0.88 | $440.00 |
| 1,000 | $0.82 | $820.00 |
LPC1316FHN33,551 概要
An entry-level 32-bit MCU is an integrated circuit that combines a processor core, program flash, SRAM, and mixed-signal peripherals on a single die, sitting in the product hierarchy between 8-bit MCUs and high-performance Cortex-M4/M7 devices. The LPC1316 belongs to the NXP LPC1300 family, which targets embedded applications requiring a high level of integration and low power consumption.
Key features include the Arm Cortex-M3 core with a 3-stage pipeline and Harvard architecture with separate instruction and data buses, CPU speeds up to 72 MHz, 48 KB flash, a USB 2.0 full-speed device controller, USART serial interfaces, and an internal prefetch unit supporting speculative branching for improved execution efficiency.
Technically, the Cortex-M3 core integrates an NVIC interrupt controller, SysTick timer, and enhanced debug features, while the LPC1300 peripheral set adds fast GPIO, 10-bit ADC, and serial connectivity on a single 3.3 V supply rail (2.5 V to 3.3 V operating range per distributor data).
Typical applications include USB-connected embedded devices, industrial control nodes, consumer appliances, and battery-powered instrumentation where 8-bit MCUs lack headroom but full Cortex-M4 performance is unnecessary.
Design consideration: the 32-HVQFN exposed pad must be soldered to a ground plane for both thermal dissipation and signal integrity; verify the 2.5 V to 3.3 V supply window before reusing a 5 V-tolerant design.
This page synthesizes verified distributor pricing, pin-compatible LPC13xx family alternatives, and practical design notes not consolidated in the manufacturer datasheet.
ドロップイン代替品: LPC1316FHN33,551 — 同一パッケージでピン互換。PCBの作り直しが必要な異なるパッケージの部品は除外されています。
このシリーズのバリエーション
同一シリーズでドロップイン互換のモデル: LPC1316FHN33,551 （同一形状・フットプリント） — 相違点: Flash Memory, Supply Voltage Range.
クイック比較ツール — 並列比較する代替部品を選択:
LPC1317FHN33,551
✅ ドロップイン ⚠️ 仕様未検証📋 参考代替品（カタログ未掲載）
LPC1315FHN33,551
✅ ドロップイン ⚠️ 仕様未検証📋 参考代替品（カタログ未掲載）
LPC1343FHN33,551
✅ ドロップイン ⚠️ 仕様未検証📋 参考代替品（カタログ未掲載）
LPC1342FHN33,551
✅ ドロップイン ⚠️ 仕様未検証📋 参考代替品（カタログ未掲載）
LPC1313FHN33,551
✅ ドロップイン ⚠️ 仕様未検証📋 参考代替品（カタログ未掲載）
LPC1316FHN33,551 最大定格＆電気的特性
| Core Processor | ARM Cortex-M3 |
| Core Size | 32-Bit |
| Max CPU Frequency | 72 MHz |
| Flash Memory | 48 KB (48K x 8) |
| Supply Voltage Range | 2.5 V to 3.3 V |
| パッケージ | 32-HVQFN (7x7 mm) Exposed Pad |
| 実装タイプ | Surface Mount |
| Series | LPC13xx (LPC1316) |
| USB Controller | USB device |
| Serial Interfaces | USART |
| Pipeline | 3-stage |
| Architecture | Harvard, with separate instruction and data buses |
| EEPROM Emulation | Yes (per LPC1316 family datasheet) |
| Packaging | Tray |
LPC1316FHN33,551 32-hvqfn (7x7 mm) exposed pad ピン配置ガイド
LPC1316FHN33,551 (32-hvqfn (7x7 mm) exposed pad パッケージ) のピン配置。 このデジタルICには、GPIO、通信インターフェース (UART、SPI、I2C)、および電源ピンが含まれています。代替ピン機能と設定オプションについては、メーカーのデータシートを参照してください。組み込みシステム設計とPCBレイアウトに不可欠です。
詳細なピン配置データはありません: LPC1316FHN33,551.
詳細は データシート をご参照ください。
主な用途
LPC1316FHN33,551 の用途: 6 件s: USB Embedded Devices, Industrial Control Nodes, Battery-Powered Instrumentation, Consumer Appliance Control, Sensor Hubs and IoT Edge Nodes, Test and Measurement Accessories.
USB Embedded Devices
The LPC1316FHN33,551 fits USB-connected peripherals because it integrates a USB 2.0 full-speed device controller alongside the 72 MHz Cortex-M3 core, enabling HID, CDC, and vendor-class enumeration without an external PHY. Typical roles include USB sensors, dongles, and configuration interfaces where the 48 KB flash accommodates USB stack plus application firmware. The 3-stage pipeline and Harvard bus architecture sustain the throughput needed for bulk transfers, while the 32-HVQFN (7x7) exposed-pad package keeps the BOM and board area compact for handheld form factors.
おすすめ
Industrial Control Nodes
In factory automation nodes, the LPC1316FHN33,551 provides deterministic Cortex-M3 execution at 72 MHz with USART links to PLC peripherals and sensor buses. The 48 KB flash holds protocol handlers such as Modbus RTU with margin for OTA feature updates, and the entry-level peripheral integration reduces external component count on dense I/O boards. Operating from a 2.5 V to 3.3 V rail, it pairs cleanly with 3.3 V industrial logic; the exposed-pad HVQFN improves thermal margin inside sealed control cabinets where passive cooling only is available.
おすすめ
Battery-Powered Instrumentation
Portable instruments benefit from the LPC1300 family's low power consumption and high integration: one chip supplies the 72 MHz processing core, flash, SRAM, ADC, and serial interfaces, minimizing quiescent overhead versus multi-chip solutions. The 48 KB flash supports data-logging tables and calibration constants in firmware, while the Cortex-M3 sleep modes permit long battery life in handheld meters and environmental loggers. Designers should budget current for the USB block when enabled and leverage clock-gating of unused peripherals to reach the lowest standby figures cited in the NXP datasheet.
おすすめ
Consumer Appliance Control
White-goods and small-appliance controllers use the LPC1316FHN33,551 as a cost-effective 32-bit upgrade path from 8-bit MCUs: the 72 MHz Cortex-M3 core runs PID motor-control loops with headroom, and the on-chip USART communicates with display and touch-front-end boards. The 32-HVQFN (7x7) surface-mount package supports automated assembly and compact main-board layouts. The 48 KB flash accommodates multiple operating modes and localization variants, and NXP's long-lifecycle industrial MCUs simplify repeated production builds over multi-year appliance programs.
おすすめ
Sensor Hubs and IoT Edge Nodes
As a sensor aggregation node, the LPC1316FHN33,551 collects I2C/SPI sensor streams through its GPIO and USART peripherals while executing local filtering on the 72 MHz core, reducing upstream data volume. The 48 KB flash holds protocol stacks and buffering routines, and the 2.5 V to 3.3 V supply range matches common Li-ion-regulated rails. Although it lacks on-chip radio, pairing it with a BLE or sub-GHz module yields a low-cost edge node; the HVQFN exposed pad supports dense multi-chip layouts typical of module-style IoT boards.
おすすめ
Test and Measurement Accessories
USB bench accessories such as data-acquisition dongles and programmer pods map well to the LPC1316FHN33,551: the full-speed USB device controller streams samples to host software, the 72 MHz Cortex-M3 handles packetization and timing, and 48 KB flash stores calibration and firmware-update bootloaders. The 32-HVQFN (7x7) package suits compact probe-body enclosures, and the exposed pad simplifies grounding to the analog front end. The 3-stage pipeline delivers consistent latency for trigger and timestamp functions required in measurement firmware.
おすすめ
おすすめ製品の概要
エンジニアリング参考データ: LPC1316FHN33,551 — 比較、設計ガイダンス、コンプライアンス情報。
選定ガイド
代替品との比較
| パラメータ | この製品 | LPC1317FHN33,551 | LPC1315FHN33,551 | LPC1343FHN33,551 |
|---|---|---|---|---|
| Package | 32-HVQFN (7x7) | 32-HVQFN (7x7) - same | 32-HVQFN (7x7) - same | 32-HVQFN (7x7) - same |
| Brand | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors |
| Core | ARM Cortex-M3 | ARM Cortex-M3 | ARM Cortex-M3 | ARM Cortex-M3 |
| Max CPU Frequency | 72 MHz | 72 MHz | 72 MHz | 72 MHz |
| Flash | 48 KB | 64 KB | 32 KB | 64 KB |
| USB | USB device | USB device | USB device | USB device |
| Pin Compatibility | Reference | Pin-to-pin | Pin-to-pin | Pin-to-pin |
主な差別化要因
- Balanced 48 KB flash capacity （vs LPC1315FHN33,551)
- Lower cost than 64 KB siblings （vs LPC1343FHN33,551)
- Footprint upgrade path （vs LPC1317FHN33,551)
設計ノート
Solder the HVQFN exposed pad to a PCB ground pad with a 3x3 (or larger) via array to the internal ground plane. The exposed pad is the primary ground return for the die; an unsoldered or cold-soldered pad commonly causes erratic USB operation and elevated ground bounce even though the peripheral ring pins appear properly connected. Follow NXP's HVQFN application soldering guidance for stencil aperture design.
Decouple every VDD pin with a 100 nF ceramic capacitor placed within 3 mm of the pin, plus one bulk 4.7 uF to 10 uF capacitor near the supply entry. The LPC1300 operates from 2.5 V to 3.3 V, so verify that upstream regulator accuracy plus IR drop keeps the rail inside this window under peak USB-transmit load. Do not power the part from a 5 V rail without level shifting and a 3.3 V LDO.
Pin-compatible LPC13xx family swaps (LPC1315/1316/1317/1343) still require firmware updates: change the device header in your build, review the linker script for differing flash/SRAM sizes, and re-check the flash configuration word. Assuming a binary compiled for the LPC1316 runs unchanged on a larger-flash sibling is a common source of boot failures on first power-up after a BOM substitution.
コンプライアンス情報
RoHS/lead-free per NXP standard product flow for the ,551 ordering code; formal REACH and conflict-minerals declarations should be obtained from NXP's compliance portal.
