LPC18S30FET256 - 180MHz Cortex-M3 Flashless MCU, 256-LBGA | NXP
料号： LPC18S30FET256 ✓ 量产中| 数量 | 单价 | 小计 |
|---|---|---|
| 1 | $14.5 | $14.50 |
| 10 | $13.05 | $130.50 |
| 100 | $11.6 | $1,160.00 |
| 500 | $10.45 | $5,225.00 |
| 1,000 | $9.3 | $9,300.00 |
LPC18S30FET256 概述
A microcontroller (MCU) is an integrated circuit that combines a CPU core, volatile memory (SRAM), non-volatile memory (Flash/ROM or external), and programmable peripherals on a single chip. The Cortex-M3 is an ARM-designed 32-bit RISC core featuring Thumb-2 instruction set, deterministic interrupts, and a Nested Vectored Interrupt Controller (NVIC). LPC1800 MCUs sit in NXP's high-performance general-purpose MCU hierarchy (MCU -> Cortex-M3 -> LPC1800 series -> LPC18Sxx sub-family), providing more compute and peripherals than Cortex-M0/M0+ parts while remaining lower-cost than Cortex-M4 parts.
Key features include 200 kB SRAM, 4 kB EEPROM, AES hardware decryption accelerator, two HS-USB ports with on-chip PHY, 10/100 Ethernet MAC with MII/RMII interface, Quad-SPI Flash Interface (SPIFI), EMC supporting SRAM/SDRAM/NOR/NAND, up to 165 GPIO pins, four UARTs, three I2C, two CAN, two SSP/SPI controllers, and a 10-bit ADC with 8 channels. The LBGA256 (17x17 mm) package supports high-density I/O for graphics and external memory expansion.
The LPC18S30FET256 uses NXP's standard peripherals library and CMSIS support, enabling rapid firmware development. Its security subsystem (hardware AES + unique device ID + secure boot) makes it suitable for anti-counterfeiting and tamper-resistant designs. The ROMless architecture requires external SPIFI or EMC flash for code storage, giving designers flexibility in memory density and updateability.
Typical applications include industrial Human-Machine Interfaces (HMI), motor control and drives, factory automation controllers, secure POS terminals, and embedded networking gateways. When designing with the LPC18S30FET256, ensure proper decoupling (100 nF per VDD pin, 4.7 uF bulk), matched-impedance routing for HS-USB and Ethernet differential pairs, and a 12 MHz external crystal with correct load capacitance. The ROMless boot sequence must be validated using the boot ROM via the ISP/UART or SPIFI interface.
Choose LPC18S30FET256E for the industrial-grade variant with extended temperature range. This page synthesizes distributor pricing, drop-in alternatives, and practical design notes not found on a single manufacturer page.
直接替换替代料： LPC18S30FET256 ——相同封装，引脚兼容。需要 PCB 改动的不同封装料号已排除。
本系列中的变体
可与以下型号直接替换的同系列型号： LPC18S30FET256 （相同外形与封装尺寸） ——差异在于 Package, Core Architecture, LCD Controller, ADC, Mounting Type.
快速对比工具——选择替代料号进行并排对比：
LPC1833JET256
✅ 直接替换✓ 有现货
$9.72 / 个
查看数据手册 →LPC1857FET256
✅ 直接替换✓ 有现货
$12.3 / 个
查看数据手册 →LPC1833JBD144E
✅ 直接替换 ⚠️ 规格未核验✓ 有现货
$9.28 / 个
查看数据手册 →LPC1833JBD144
✅ 直接替换 ⚠️ 规格未核验✓ 有现货
$7.2 / 个
查看数据手册 →LPC4330FET256
✅ 直接替换✓ 有现货
$9.85 / 个
查看数据手册 →LPC1837FET256
✅ 直接替换📋 参考替代料（不在目录中）
LPC18S30FET256 最大额定值与电气特性
| Core Architecture | ARM Cortex-M3 |
| Core Width | 32-bit |
| 最大时钟频率 | 180 MHz |
| On-chip SRAM | 200 kB |
| On-chip EEPROM | 4 kB |
| On-chip Flash | ROMless (external memory required) |
| 封装 | 256-LBGA (17x17 mm) |
| Operating Voltage | 2.4 V to 3.6 V |
| 工作温度 | -40 C to +85 C |
| HS-USB Controllers | 2 (one Host/Peripheral, one Host-only) |
| Ethernet MAC | 10/100 Mbps with MII/RMII |
| External Memory Controller (EMC) | Yes (SRAM/SDRAM/NOR/NAND) |
| SPIFI (Quad-SPI Flash Interface) | Yes |
| Hardware AES Decryption | Yes |
| GPIO Count | Up to 165 |
| UART / I2C / CAN / SSP | 4 / 3 / 2 / 2 |
| ADC | 10-bit, 8 channels |
| MSL 等级 | 3 |
| 安装类型 | Surface Mount |
| RoHS 状态 | Compliant |
LPC18S30FET256 256-lbga (17x17 mm) 引脚配置指南
LPC18S30FET256（256-lbga (17x17 mm) 封装）的引脚配置。 该数字 IC 包含 GPIO、通信接口（UART、SPI、I2C）和电源引脚。请参阅制造商数据手册以了解复用引脚功能和配置选项。对嵌入式系统设计和 PCB 布局至关重要。
暂无详细引脚数据： LPC18S30FET256.
请参阅 数据手册 以查看完整引脚配置。
典型应用
LPC18S30FET256 适用于 6 应用s: Industrial Human-Machine Interface (HMI), Motor Control and Drive, Industrial Ethernet Gateway, Secure Point-of-Sale (POS) Terminal, Building Automation Controller, Embedded Networking Gateway.
Industrial Human-Machine Interface (HMI)
The LPC18S30FET256's Cortex-M3 core at 180 MHz, 200 kB SRAM, and large LBGA256 GPIO count make it well suited to drive TFT LCD panels with resistive or capacitive touch in industrial HMIs. The SPIFI interface streams pixel data directly from external Quad-SPI flash while the EMC attaches SDRAM for framebuffers. Hardware AES secures GUI assets against cloning, and the wide operating temperature range (-40 to +85 C) tolerates factory-floor environments.
推荐
Motor Control and Drive
The LPC18S30FET256's Cortex-M3 core delivers the deterministic interrupt response required for field-oriented control (FOC) of three-phase motors. The 10-bit ADC and PWM timers handle current sensing and switching signals; the 256-pin LBGA exposes enough GPIO for multi-axis drives. The 200 kB SRAM stores control loops without external memory pressure, while hardware AES protects proprietary motor-control firmware from reverse engineering in competitive markets.
推荐
Industrial Ethernet Gateway
The integrated 10/100 Ethernet MAC with MII/RMII and two HS-USB controllers let the LPC18S30FET256 bridge industrial fieldbuses (PROFINET, EtherNet/IP) to USB peripherals or storage. Its 180 MHz performance handles TCP/IP stacks and real-time protocol processing, while the 200 kB SRAM accommodates multi-protocol buffering. Security features protect against unauthorised fieldbus access, important for OT/IT convergence in Industry 4.0 deployments.
推荐
Secure Point-of-Sale (POS) Terminal
Hardware AES decryption, secure boot, and a unique device ID make the LPC18S30FET256 a strong foundation for PCI-compliant POS terminals where firmware integrity is regulatory. Two HS-USB ports support payment peripherals (PIN pads, contactless readers) without external PHYs. The Cortex-M3 at 180 MHz processes EMV transactions in real time, while the LBGA256 footprint accommodates keypad matrix, printer interface, and Ethernet connectivity in compact form factors.
推荐
Building Automation Controller
The LPC18S30FET256's combination of Ethernet, two CAN buses, multiple UARTs, and security hardware fits building-automation gateways that bridge BACnet, Modbus, and KNX networks. The wide operating temperature range supports rooftop and basement installations, while the Cortex-M3 at 180 MHz handles concurrent protocol stacks. Hardware AES protects tenant privacy data transmitted over cloud uplinks.
推荐
Embedded Networking Gateway
For routers, protocol converters, and IoT aggregation nodes, the LPC18S30FET256 supplies 10/100 Ethernet plus dual High-Speed USB with on-chip PHY to avoid external components. The 200 kB SRAM supports multi-connection TCP/IP stacks, while SPIFI allows firmware updates over the air. Hardware AES secures VPN and TLS tunnels at line-rate, and the LBGA256 exposes all peripheral interfaces simultaneously for full gateway functionality.
推荐
推荐产品汇总
工程参考数据： LPC18S30FET256 ——对比、设计指导和合规信息。
选型指南
与替代料对比
| 参数 | 本产品 | LPC1833JET256 | LPC1857FET256 | LPC4330FET256 | LPC1837FET256 |
|---|---|---|---|---|---|
| Package | 256-LBGA (17x17 mm) | 256-LBGA (17x17 mm) - same | 256-LBGA (17x17 mm) - same | 256-LBGA (17x17 mm) - same | 256-LBGA (17x17 mm) - same |
| Brand | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors |
| Core Architecture | Cortex-M3 (single) | Cortex-M3 (single) | Cortex-M3 (single) | Cortex-M4 + Cortex-M0 (dual) | Cortex-M3 (single) |
| Maximum Clock Frequency | 180 MHz | 180 MHz | 180 MHz | 204 MHz (M4) | 180 MHz |
| On-chip SRAM | 200 kB | 200 kB | 200 kB | 264 kB | 200 kB |
| Hardware AES | Yes | No | Yes | Yes | No |
| Ethernet MAC | 10/100 Mbps | 10/100 Mbps | 10/100 Mbps | 10/100 Mbps | 10/100 Mbps (single MAC) |
| HS-USB Controllers | 2 (Host/Peripheral + Host) | 2 (Host/Peripheral + Host) | 2 + ULPI (external PHY) | 2 (Host/Peripheral + Host) | 2 (Host/Peripheral + Host) |
关键差异点
- Built-in hardware AES security subsystem （对比 LPC1833JET256)
- Dual-core upgrade path with same footprint （对比 LPC4330FET256)
- Single Ethernet MAC simplifies software stack （对比 LPC1837FET256)
设计说明
Estimated: total power dissipation at 180 MHz active, 3.3 V, all peripherals enabled is approximately 300-450 mW. The LBGA256 package requires a minimum 4-layer PCB with continuous ground plane and 100 nF ceramic decoupling on every VDD/VDDA pin pair, plus 4.7 uF bulk caps per supply rail. Power sequencing must follow NXP's recommended order (3.3 V analog before 3.3 V digital) to avoid latch-up. For battery-backed designs, retain VBAT to preserve the RTC domain.
The 256-LBGA at 1.0 mm pitch requires either microvia (laser-drilled) stack-up or via-in-pad technology for reliable assembly. Route HS-USB differential pairs (D+/D-) with 90 ohm differential impedance and Ethernet MII/RMII traces with 50 ohm single-ended impedance, keeping pair length matching within 150 mil. Place the 12 MHz crystal within 5 mm of XTAL1/XTAL2 pins and isolate it from switching signals with a guard ring tied to analog ground.
The LPC18S30FET256 is ROMless: it boots from external SPIFI flash, EMC NOR flash, or ISP over UART0. An unpopulated SPIFI flash or missing boot configuration will halt the part at reset. Verify boot source pins (PIO0_6 / PIO0_7 / PIO0_8 / PIO5_4) match your memory layout before PCB fab. Also, the AES peripheral requires key storage in a dedicated OTP region - burn keys once and lock the region to prevent accidental erasure.
合规信息
RoHS and REACH compliant per NXP product page. Not AEC-Q100 qualified; for automotive applications use S32K or LPC17xx automotive variants.
