LPC18S30FET256 - 180MHz Cortex-M3 Flashless MCU, 256-LBGA | NXP
部品番号: LPC18S30FET256 ✓ 生産中| 数量 | 単価 | 小計 |
|---|---|---|
| 1 | $14.5 | $14.50 |
| 10 | $13.05 | $130.50 |
| 100 | $11.6 | $1,160.00 |
| 500 | $10.45 | $5,225.00 |
| 1,000 | $9.3 | $9,300.00 |
LPC18S30FET256 概要
A microcontroller (MCU) is an integrated circuit that combines a CPU core, volatile memory (SRAM), non-volatile memory (Flash/ROM or external), and programmable peripherals on a single chip. The Cortex-M3 is an ARM-designed 32-bit RISC core featuring Thumb-2 instruction set, deterministic interrupts, and a Nested Vectored Interrupt Controller (NVIC). LPC1800 MCUs sit in NXP's high-performance general-purpose MCU hierarchy (MCU -> Cortex-M3 -> LPC1800 series -> LPC18Sxx sub-family), providing more compute and peripherals than Cortex-M0/M0+ parts while remaining lower-cost than Cortex-M4 parts.
Key features include 200 kB SRAM, 4 kB EEPROM, AES hardware decryption accelerator, two HS-USB ports with on-chip PHY, 10/100 Ethernet MAC with MII/RMII interface, Quad-SPI Flash Interface (SPIFI), EMC supporting SRAM/SDRAM/NOR/NAND, up to 165 GPIO pins, four UARTs, three I2C, two CAN, two SSP/SPI controllers, and a 10-bit ADC with 8 channels. The LBGA256 (17x17 mm) package supports high-density I/O for graphics and external memory expansion.
The LPC18S30FET256 uses NXP's standard peripherals library and CMSIS support, enabling rapid firmware development. Its security subsystem (hardware AES + unique device ID + secure boot) makes it suitable for anti-counterfeiting and tamper-resistant designs. The ROMless architecture requires external SPIFI or EMC flash for code storage, giving designers flexibility in memory density and updateability.
Typical applications include industrial Human-Machine Interfaces (HMI), motor control and drives, factory automation controllers, secure POS terminals, and embedded networking gateways. When designing with the LPC18S30FET256, ensure proper decoupling (100 nF per VDD pin, 4.7 uF bulk), matched-impedance routing for HS-USB and Ethernet differential pairs, and a 12 MHz external crystal with correct load capacitance. The ROMless boot sequence must be validated using the boot ROM via the ISP/UART or SPIFI interface.
Choose LPC18S30FET256E for the industrial-grade variant with extended temperature range. This page synthesizes distributor pricing, drop-in alternatives, and practical design notes not found on a single manufacturer page.
ドロップイン代替品: LPC18S30FET256 — 同一パッケージでピン互換。PCBの作り直しが必要な異なるパッケージの部品は除外されています。
このシリーズのバリエーション
同一シリーズでドロップイン互換のモデル: LPC18S30FET256 （同一形状・フットプリント） — 相違点: Package, Core Architecture, LCD Controller, ADC, Mounting Type.
クイック比較ツール — 並列比較する代替部品を選択:
LPC1833JET256
✅ ドロップイン✓ 在庫あり
$9.72 / 個
データシートを見る →LPC1857FET256
✅ ドロップイン✓ 在庫あり
$12.3 / 個
データシートを見る →LPC1833JBD144E
✅ ドロップイン ⚠️ 仕様未検証✓ 在庫あり
$9.28 / 個
データシートを見る →LPC1833JBD144
✅ ドロップイン ⚠️ 仕様未検証✓ 在庫あり
$7.2 / 個
データシートを見る →LPC4330FET256
✅ ドロップイン✓ 在庫あり
$9.85 / 個
データシートを見る →LPC1837FET256
✅ ドロップイン📋 参考代替品（カタログ未掲載）
LPC18S30FET256 最大定格＆電気的特性
| Core Architecture | ARM Cortex-M3 |
| Core Width | 32-bit |
| 最大クロック周波数 | 180 MHz |
| On-chip SRAM | 200 kB |
| On-chip EEPROM | 4 kB |
| On-chip Flash | ROMless (external memory required) |
| パッケージ | 256-LBGA (17x17 mm) |
| Operating Voltage | 2.4 V to 3.6 V |
| 動作温度 | -40 C to +85 C |
| HS-USB Controllers | 2 (one Host/Peripheral, one Host-only) |
| Ethernet MAC | 10/100 Mbps with MII/RMII |
| External Memory Controller (EMC) | Yes (SRAM/SDRAM/NOR/NAND) |
| SPIFI (Quad-SPI Flash Interface) | Yes |
| Hardware AES Decryption | Yes |
| GPIO Count | Up to 165 |
| UART / I2C / CAN / SSP | 4 / 3 / 2 / 2 |
| ADC | 10-bit, 8 channels |
| MSLレベル | 3 |
| 実装タイプ | Surface Mount |
| RoHS ステータス | Compliant |
LPC18S30FET256 256-lbga (17x17 mm) ピン配置ガイド
LPC18S30FET256 (256-lbga (17x17 mm) パッケージ) のピン配置。 このデジタルICには、GPIO、通信インターフェース (UART、SPI、I2C)、および電源ピンが含まれています。代替ピン機能と設定オプションについては、メーカーのデータシートを参照してください。組み込みシステム設計とPCBレイアウトに不可欠です。
詳細なピン配置データはありません: LPC18S30FET256.
詳細は データシート をご参照ください。
主な用途
LPC18S30FET256 の用途: 6 件s: Industrial Human-Machine Interface (HMI), Motor Control and Drive, Industrial Ethernet Gateway, Secure Point-of-Sale (POS) Terminal, Building Automation Controller, Embedded Networking Gateway.
Industrial Human-Machine Interface (HMI)
The LPC18S30FET256's Cortex-M3 core at 180 MHz, 200 kB SRAM, and large LBGA256 GPIO count make it well suited to drive TFT LCD panels with resistive or capacitive touch in industrial HMIs. The SPIFI interface streams pixel data directly from external Quad-SPI flash while the EMC attaches SDRAM for framebuffers. Hardware AES secures GUI assets against cloning, and the wide operating temperature range (-40 to +85 C) tolerates factory-floor environments.
おすすめ
Motor Control and Drive
The LPC18S30FET256's Cortex-M3 core delivers the deterministic interrupt response required for field-oriented control (FOC) of three-phase motors. The 10-bit ADC and PWM timers handle current sensing and switching signals; the 256-pin LBGA exposes enough GPIO for multi-axis drives. The 200 kB SRAM stores control loops without external memory pressure, while hardware AES protects proprietary motor-control firmware from reverse engineering in competitive markets.
おすすめ
Industrial Ethernet Gateway
The integrated 10/100 Ethernet MAC with MII/RMII and two HS-USB controllers let the LPC18S30FET256 bridge industrial fieldbuses (PROFINET, EtherNet/IP) to USB peripherals or storage. Its 180 MHz performance handles TCP/IP stacks and real-time protocol processing, while the 200 kB SRAM accommodates multi-protocol buffering. Security features protect against unauthorised fieldbus access, important for OT/IT convergence in Industry 4.0 deployments.
おすすめ
Secure Point-of-Sale (POS) Terminal
Hardware AES decryption, secure boot, and a unique device ID make the LPC18S30FET256 a strong foundation for PCI-compliant POS terminals where firmware integrity is regulatory. Two HS-USB ports support payment peripherals (PIN pads, contactless readers) without external PHYs. The Cortex-M3 at 180 MHz processes EMV transactions in real time, while the LBGA256 footprint accommodates keypad matrix, printer interface, and Ethernet connectivity in compact form factors.
おすすめ
Building Automation Controller
The LPC18S30FET256's combination of Ethernet, two CAN buses, multiple UARTs, and security hardware fits building-automation gateways that bridge BACnet, Modbus, and KNX networks. The wide operating temperature range supports rooftop and basement installations, while the Cortex-M3 at 180 MHz handles concurrent protocol stacks. Hardware AES protects tenant privacy data transmitted over cloud uplinks.
おすすめ
Embedded Networking Gateway
For routers, protocol converters, and IoT aggregation nodes, the LPC18S30FET256 supplies 10/100 Ethernet plus dual High-Speed USB with on-chip PHY to avoid external components. The 200 kB SRAM supports multi-connection TCP/IP stacks, while SPIFI allows firmware updates over the air. Hardware AES secures VPN and TLS tunnels at line-rate, and the LBGA256 exposes all peripheral interfaces simultaneously for full gateway functionality.
おすすめ
おすすめ製品の概要
エンジニアリング参考データ: LPC18S30FET256 — 比較、設計ガイダンス、コンプライアンス情報。
選定ガイド
代替品との比較
| パラメータ | この製品 | LPC1833JET256 | LPC1857FET256 | LPC4330FET256 | LPC1837FET256 |
|---|---|---|---|---|---|
| Package | 256-LBGA (17x17 mm) | 256-LBGA (17x17 mm) - same | 256-LBGA (17x17 mm) - same | 256-LBGA (17x17 mm) - same | 256-LBGA (17x17 mm) - same |
| Brand | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors |
| Core Architecture | Cortex-M3 (single) | Cortex-M3 (single) | Cortex-M3 (single) | Cortex-M4 + Cortex-M0 (dual) | Cortex-M3 (single) |
| Maximum Clock Frequency | 180 MHz | 180 MHz | 180 MHz | 204 MHz (M4) | 180 MHz |
| On-chip SRAM | 200 kB | 200 kB | 200 kB | 264 kB | 200 kB |
| Hardware AES | Yes | No | Yes | Yes | No |
| Ethernet MAC | 10/100 Mbps | 10/100 Mbps | 10/100 Mbps | 10/100 Mbps | 10/100 Mbps (single MAC) |
| HS-USB Controllers | 2 (Host/Peripheral + Host) | 2 (Host/Peripheral + Host) | 2 + ULPI (external PHY) | 2 (Host/Peripheral + Host) | 2 (Host/Peripheral + Host) |
主な差別化要因
- Built-in hardware AES security subsystem （vs LPC1833JET256)
- Dual-core upgrade path with same footprint （vs LPC4330FET256)
- Single Ethernet MAC simplifies software stack （vs LPC1837FET256)
設計ノート
Estimated: total power dissipation at 180 MHz active, 3.3 V, all peripherals enabled is approximately 300-450 mW. The LBGA256 package requires a minimum 4-layer PCB with continuous ground plane and 100 nF ceramic decoupling on every VDD/VDDA pin pair, plus 4.7 uF bulk caps per supply rail. Power sequencing must follow NXP's recommended order (3.3 V analog before 3.3 V digital) to avoid latch-up. For battery-backed designs, retain VBAT to preserve the RTC domain.
The 256-LBGA at 1.0 mm pitch requires either microvia (laser-drilled) stack-up or via-in-pad technology for reliable assembly. Route HS-USB differential pairs (D+/D-) with 90 ohm differential impedance and Ethernet MII/RMII traces with 50 ohm single-ended impedance, keeping pair length matching within 150 mil. Place the 12 MHz crystal within 5 mm of XTAL1/XTAL2 pins and isolate it from switching signals with a guard ring tied to analog ground.
The LPC18S30FET256 is ROMless: it boots from external SPIFI flash, EMC NOR flash, or ISP over UART0. An unpopulated SPIFI flash or missing boot configuration will halt the part at reset. Verify boot source pins (PIO0_6 / PIO0_7 / PIO0_8 / PIO5_4) match your memory layout before PCB fab. Also, the AES peripheral requires key storage in a dedicated OTP region - burn keys once and lock the region to prevent accidental erasure.
コンプライアンス情報
RoHS and REACH compliant per NXP product page. Not AEC-Q100 qualified; for automotive applications use S32K or LPC17xx automotive variants.
