LPC54606J256ET180551 - 180MHz Cortex-M4 MCU 256KB | NXP
料号： LPC54606J256ET180551 ✓ 量产中| 数量 | 单价 | 小计 |
|---|---|---|
| 1 | $4.53 | $4.53 |
| 10 | $4.22 | $42.20 |
| 100 | $3.85 | $385.00 |
| 500 | $3.21 | $1,605.00 |
| 1,000 | $2.65 | $2,650.00 |
LPC54606J256ET180551 概述
A microcontroller (MCU) is a single integrated circuit that combines a processor core, program memory, data memory, and peripherals such as timers, ADCs, and communication interfaces. Within the semiconductor hierarchy, the LPC54606 sits under the category of 32-bit microcontrollers -> ARM Cortex-M4 based MCUs -> general-purpose embedded processors. The Cortex-M4 core adds DSP instructions and single-cycle MAC, letting the LPC546xx family support complex algorithms in data-intensive applications.
Key features of the LPC54606J256ET180551 include the 180 MHz Cortex-M4 core, 262 KB (256 KB usable) of flash program memory, 145 general-purpose I/O lines, integrated ADC channels, DMA channels, and PWM outputs. The TFBGA-180 (12x12 mm) ball grid array provides high I/O density in a compact surface-mount footprint suitable for two-sided PCB assembly.
Technically, the LPC546xx family combines the power efficiency of the Arm Cortex-M4 core with multiple high-speed connectivity options and advanced timers, per the NXP LPC546xx product data sheet. External memory interfaces extend the on-chip flash, and the family scales up to 512 KB flash, which protects software investment across memory variants. The 21-bit address bus and 16-bit external data bus support memory-mapped expansion.
Typical applications include industrial automation and motor control (leveraging PWM outputs and ADC channels), consumer and IoT devices requiring high GPIO counts, and embedded systems needing DSP-class signal processing such as digital filtering and sensor fusion.
When designing with this device, verify the exact ordering-code suffix: the 551 suffix denotes a specific packing/reel option of the LPC54606J256ET180, and the E variant (LPC54606J256ET180E) is the related ordering code seen at distributors - always cross-check pinout and temperature range on the LPC546xx datasheet before finalizing the BOM.
This page synthesizes distributor pricing, drop-in alternatives from the same pin-compatible LPC546xx TFBGA-180 family, and practical design notes not found in a single manufacturer datasheet, providing unique cross-reference and selection value.
直接替换替代料： LPC54606J256ET180551 ——相同封装，引脚兼容。需要 PCB 改动的不同封装料号已排除。
快速对比工具——选择替代料号进行并排对比：
LPC54605J256ET180
✅ 直接替换 ⚠️ 规格未核验📋 参考替代料（不在目录中）
LPC54607J256ET180
✅ 直接替换 ⚠️ 规格未核验📋 参考替代料（不在目录中）
LPC54608J512ET180
✅ 直接替换 ⚠️ 规格未核验📋 参考替代料（不在目录中）
LPC54616J256ET180
✅ 直接替换 ⚠️ 规格未核验📋 参考替代料（不在目录中）
LPC54618J512ET180E
✅ 直接替换 ⚠️ 规格未核验📋 参考替代料（不在目录中）
LPC54628J512ET180
✅ 直接替换 ⚠️ 规格未核验📋 参考替代料（不在目录中）
LPC54606J256ET180E
✅ 直接替换📋 参考替代料（不在目录中）
LPC54606J256ET180551 最大额定值与电气特性
| Core Processor | ARM Cortex-M4 |
| Core Size | 32-Bit |
| 最大时钟频率 | 180 MHz |
| Flash Memory | 256 KB (262 KB program memory) |
| Number of I/O | 145 |
| Address Bus | 21-bit |
| External Data Bus | 16-bit |
| Peripherals | ADC, DMA, PWM |
| 封装 | TFBGA-180 (12 x 12 mm) |
| 安装类型 | Surface Mount |
| Program Memory Type | FLASH |
| RoHS 状态 | RoHS Compliant |
| Family | LPC546xx (LPC54606) |
| Supplier Device Package | 180-TFBGA |
LPC54606J256ET180551 180-tfbga 引脚配置指南
LPC54606J256ET180551（180-tfbga 封装）的引脚配置。 该数字 IC 包含 GPIO、通信接口（UART、SPI、I2C）和电源引脚。请参阅制造商数据手册以了解复用引脚功能和配置选项。对嵌入式系统设计和 PCB 布局至关重要。
暂无详细引脚数据： LPC54606J256ET180551.
请参阅 数据手册 以查看完整引脚配置。
典型应用
LPC54606J256ET180551 适用于 6 应用s: Industrial Automation and Motor Control, IoT and Smart Sensor Nodes, Human-Machine Interfaces and Displays, Embedded Signal Processing and Audio, Building and Access Control Systems, Test and Measurement Instrumentation.
Industrial Automation and Motor Control
The LPC54606J256ET180551 fits motor-control and factory-automation nodes because it pairs a 180 MHz Cortex-M4 core with PWM outputs for inverter timing, on-chip ADC channels for current and voltage feedback, and DMA channels that stream conversion results without CPU intervention. In a field-oriented-control drive, the DSP instructions of the Cortex-M4 execute the control loop efficiently while the 145 GPIO lines handle contactor, encoder, and safety I/O. The 256 KB flash accommodates a control stack plus communication firmware. Its TFBGA-180 (12x12 mm) package allows dense two-sided PCB assembly inside compact drive enclosures, and external memory interfaces leave room for datalogging expansion.
推荐
IoT and Smart Sensor Nodes
For IoT edge nodes, the LPC54606J256ET180551 provides the processing headroom needed for local sensor fusion and protocol handling on a single chip. The 180 MHz Cortex-M4 core runs a real-time operating system plus TLS stacks, while the integrated ADC channels digitize analog sensors and DMA keeps CPU load low during multi-channel acquisition. The 256 KB flash holds connectivity firmware, and low-power operating modes in the LPC546xx family extend battery life in duty-cycled designs. With 145 GPIOs in a 12x12 mm TFBGA-180, one MCU can drive displays, relays, and multiple sensor buses simultaneously, reducing board area and component count in smart-building and condition-monitoring products.
推荐
Human-Machine Interfaces and Displays
The LPC546xx family is frequently used in HMI and small-graphical-display products, and the LPC54606J256ET180551 suits this role through its combination of DSP-capable 180 MHz core performance and very high GPIO count. The 145 I/O lines support parallel RGB display interfaces, capacitive-touch sensing, rotary encoders, and backlight control from one package, while DMA channels move display data with minimal CPU loading. The 256 KB flash stores glyphs, UI assets, and communication firmware for Modbus or CAN fieldbus integration. The 12x12 mm TFBGA-180 footprint packs this connectivity into thin panel PCBs, and external memory interfaces allow frame-buffer expansion when larger displays are required.
推荐
Embedded Signal Processing and Audio
The single-cycle MAC and DSP instructions of the Cortex-M4 core make the LPC54606J256ET180551 a practical host for digital filtering, FFT analysis, and lightweight audio processing. On-chip ADC channels sample sensor or line-level inputs, and DMA streams data buffers to RAM while the 180 MHz core executes filter kernels. Typical uses include vibration analysis in predictive-maintenance probes, acoustic event detection, and sound-level instrumentation. The 256 KB flash retains coefficient tables and application code, while the low-power design of the LPC546xx family suits portable analyzers. The TFBGA-180 package, with 145 GPIOs and a 12x12 mm body, supports mixed analog-digital layouts with dedicated ground regions for clean signal acquisition.
推荐
Building and Access Control Systems
Door controllers, elevators, and building-automation panels benefit from the LPC54606J256ET180551's blend of processing power and I/O density. The 180 MHz Cortex-M4 core runs security-critical firmware with margin for cryptography and network stacks, while 145 GPIO lines interface keypads, readers, relays, and door sensors directly. ADC channels read tamper and power-monitoring circuits, and PWM outputs drive audible annunciators or lock actuators. The 256 KB flash supports event logging buffers, and external memory interfaces allow expansion for credential databases. The RoHS-compliant TFBGA-180 (12x12 mm) package supports reliable surface-mount assembly for long-life building infrastructure, and the LPC546xx debug features simplify field firmware updates.
推荐
Test and Measurement Instrumentation
Handheld and benchtop instruments use the LPC54606J256ET180551 as a main controller where the 180 MHz Cortex-M4 core handles measurement sequencing, math, and user interface simultaneously. On-chip ADC channels acquire auxiliary analog quantities such as temperature and supply rails, and DMA offloads multi-channel sampling so the CPU can run calibration algorithms. The 256 KB flash stores measurement routines and limit tables; 145 GPIOs drive keypads, indicator LEDs, and relay-switching arrays for signal routing. External memory interfaces support data-logging expansion, and the enhanced debug features of the LPC546xx family accelerate firmware development. The compact TFBGA-180 12x12 mm package keeps instrument main boards small and dense.
推荐
推荐产品汇总
工程参考数据： LPC54606J256ET180551 ——对比、设计指导和合规信息。
选型指南
与替代料对比
| 参数 | 本产品 | LPC54605J256ET180 | LPC54608J512ET180 | LPC54618J512ET180E | LPC54628J512ET180 |
|---|---|---|---|---|---|
| Package | TFBGA-180 (12x12 mm) | TFBGA-180 (12x12 mm) - same | TFBGA-180 (12x12 mm) - same | TFBGA-180 (12x12 mm) - same | TFBGA-180 (12x12 mm) - same |
| Brand | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors |
| Core / Frequency | ARM Cortex-M4, 180 MHz | ARM Cortex-M4, 180 MHz | ARM Cortex-M4, 180 MHz | ARM Cortex-M4, 180 MHz | ARM Cortex-M4, 180 MHz |
| Flash Memory | 256 KB | 256 KB | 512 KB | 512 KB | 512 KB |
| GPIO Count | 145 | 145 | 145 | 145 | 145 |
| Pin Compatibility | Reference (ET180 family) | Pin-for-pin per NXP Community | Pin-for-pin per NXP Community | Pin-for-pin per NXP Community | Drop-in per NXP Community |
关键差异点
- Lowest-cost entry to the pin-compatible TFBGA-180 LPC546xx family （对比 LPC54608J512ET180)
- Firmware headroom upgrade path without PCB change （对比 LPC54618J512ET180E)
- Availability across both 551 and E ordering codes （对比 LPC54606J256ET180E)
设计说明
The TFBGA-180 (12x12 mm) package uses a 0.8 mm ball pitch. Plan the PCB with via-in-pad or short dog-bone escapes on the outer two rows, and dedicate at least one full inner layer as a ground plane for the BGA region. NXP LPC546xx reference designs fan out power balls to a local decoupling network of 100 nF ceramics placed directly beneath the package on the opposite side. Verify the ball map against the LPC546XX datasheet for your exact ordering code before layout release, since suffix variants can differ in ball assignment.
The LPC546xx family uses multiple supply domains (core and I/O rails). Follow the power-supply architecture in the NXP LPC546xx product data sheet: sequence and decouple each rail per the datasheet schematic, and place bulk plus 100 nF decoupling at every supply ball group. Estimated: at 180 MHz core operation the active current is on the order of tens of milliamps - confirm exact figures in the datasheet power tables for your voltage configuration rather than relying on this estimate.
Ordering-code confusion is the most common procurement pitfall for this part: LPC54606J256ET180551, LPC54606J256ET180E, and LPC54606J256ET180,551 refer to closely related ordering codes of the same device but may differ in packing and temperature-suffix detail. Confirm the exact suffix against the NXP product page before BOM release. Also confirm that your flash budget fits 256 KB; firmware built for the 512 KB variants (LPC54618/54628) may not link for the LPC54606.
合规信息
RoHS compliance marked on LCSC listing (C5788098). Other environmental attributes: consult the NXP product-information page for LPC54606J256ET180 for official environmental quality documentation.
