MKL26Z128VMC4 - 48MHz Cortex-M0+ 128KB USB MCU | NXP
料号： MKL26Z128VMC4 ✓ 量产中| 数量 | 单价 | 小计 |
|---|---|---|
| 1 | $3.63 | $3.63 |
| 10 | $3.45 | $34.50 |
| 100 | $3.27 | $327.00 |
| 500 | $3.1 | $1,550.00 |
| 1,000 | $2.95 | $2,950.00 |
MKL26Z128VMC4 概述
A microcontroller unit (MCU) is a single integrated circuit that combines a processor core, memory, and peripherals to execute dedicated embedded control tasks. Within the power/efficiency hierarchy of embedded processors, the Kinetis KL2x family sits in the ultra-low-power MCU segment, extending the KL1x series with USB connectivity while remaining compatible with Kinetis K20 (Cortex-M4) and other KL-series devices, providing a clear migration path.
Key features include the 48 MHz Cortex-M0+ core optimized for low dynamic power, 128 KB of program flash, USB OTG plus crystal-less full-speed USB device operation, and 84 general-purpose I/O lines. Connectivity spans I2C, LINbus, SPI, UART/USART, and USB; system peripherals include DMA, I2S, PWM, brown-out detect/reset, low-voltage detect, power-on reset, and a watchdog timer.
Technically, the Cortex-M0+ architecture delivers ARM code density with a two-stage pipeline and low gate count, while the KL2x power architecture provides multiple low-power modes with fast wake-up, making it suitable for battery-powered USB peripherals. The mixed-signal integration (I2S, 12/16-bit ADC capability per family documentation) supports audio and sensor aggregation designs.
Typical applications include USB HID device peripherals, wearable and portable battery-powered products, sensor hubs, and small HMI systems. The 121-ball 8x8 mm MAPBGA keeps board area compact while exposing 84 I/Os.
Design consideration: the MAPBGA-121 footprint requires controlled-impedance fine-pitch BGA layout; plan an escape-routing layer strategy early. The USB OTG controller removes the need for an external crystal in device mode, saving BOM cost.
This page synthesizes distributor pricing, drop-in same-family alternatives, comparison tables, and practical design notes not found in the manufacturer datasheet.
直接替换替代料： MKL26Z128VMC4 ——相同封装，引脚兼容。需要 PCB 改动的不同封装料号已排除。
本系列中的变体
可与以下型号直接替换的同系列型号： MKL26Z128VMC4 （相同外形与封装尺寸） ——差异在于 Package, ADC, Connectivity, Series, Peripherals.
快速对比工具——选择替代料号进行并排对比：
MKL26Z256VMC4
✅ 直接替换 ⚠️ 规格未核验✓ 有现货
$4.12 / 个
查看数据手册 →MKL26Z64VMC4
✅ 直接替换 ⚠️ 规格未核验📋 参考替代料（不在目录中）
MKL25Z128VMC4
✅ 直接替换 ⚠️ 规格未核验📋 参考替代料（不在目录中）
MKL17Z128VMC4
✅ 直接替换 ⚠️ 规格未核验📋 参考替代料（不在目录中）
MK12DX128VMC5
✅ 直接替换✓ 有现货
联系询价
查看数据手册 →MKL26Z128VMC4 最大额定值与电气特性
| Core Processor | ARM Cortex-M0+ |
| Core Size | 32-bit |
| Maximum Clock Speed | 48 MHz |
| Flash Memory | 128 KB (128K x 8) |
| Connectivity | I2C, LINbus, SPI, UART/USART, USB, USB OTG |
| Peripherals | Brown-out Detect/Reset, DMA, I2S, LVD, POR, PWM, WDT |
| Number of I/O | 84 |
| 封装 | 121-MAPBGA (8x8 mm) |
| 安装类型 | Surface Mount |
| Series | Kinetis KL2 |
| USB Controller | Full-speed USB 2.0 OTG / crystal-less USB device |
| Part Status | Active |
MKL26Z128VMC4 121-mapbga (8x8 mm) 引脚配置指南
MKL26Z128VMC4（121-mapbga (8x8 mm) 封装）的引脚配置。 该数字 IC 包含 GPIO、通信接口（UART、SPI、I2C）和电源引脚。请参阅制造商数据手册以了解复用引脚功能和配置选项。对嵌入式系统设计和 PCB 布局至关重要。
暂无详细引脚数据： MKL26Z128VMC4.
请参阅 数据手册 以查看完整引脚配置。
典型应用
MKL26Z128VMC4 适用于 6 应用s: USB HID Device Peripherals, Wearable and Portable Battery-Powered Devices, Sensor Hubs and Data Aggregation, Audio Interfaces and USB Audio Class Devices, Industrial Control and Small HMI Systems, IoT Smart Home End Nodes.
USB HID Device Peripherals
The MKL26Z128VMC4 fits USB HID products - keyboards, mice, game controllers, and custom HID data loggers - because its full-speed USB 2.0 OTG controller plus crystal-less USB device capability eliminates the external crystal, cutting BOM cost and board area. The 48 MHz Cortex-M0+ easily sustains full-speed 12 Mbps USB traffic while servicing HID report generation over DMA. The 128 KB flash accommodates USB descriptor tables, HID class stacks, and application logic with room to spare, while 84 GPIOs handle matrix scanning or discrete interfaces. Battery-powered HID peripherals benefit further from the KL2x ultra-low-power architecture with multiple sleep modes between USB resume events, extending battery life substantially versus general-purpose MCUs.
推荐
Wearable and Portable Battery-Powered Devices
Wearables demand maximum energy efficiency in minimal board area, and the MKL26Z128VMC4 addresses both constraints: the 121-ball MAPBGA occupies only 8x8 mm while integrating a 48 MHz Cortex-M0+ optimized for low dynamic power. NXP characterizes the Kinetis KL2x as an ultra-low-power family designed for portable applications, with low-power modes and fast wake-up that let the MCU sleep between sensor reads. The 128 KB flash stores BLE-stack-free sensor aggregation or gesture firmware comfortably, and the 12-bit ADC (per family data) samples motion and biometric sensors. Integrated I2S also supports small audio interfaces in smart rings or hearing-adjacent form factors without an external codec controller.
推荐
Sensor Hubs and Data Aggregation
The MKL26Z128VMC4 serves as a sensor hub aggregating I2C and SPI sensor data using its multiple serial interfaces and DMA channels, offloading the main application processor in smartphones, tablets, and IoT gateways. The 48 MHz Cortex-M0+ handles sensor fusion math with deterministic latency, while DMA moves samples without CPU intervention, keeping power draw low. Its 84 GPIOs flexibly map to interrupt lines from multiple sensors, and the ultra-low-power design allows the hub to remain active when the host processor sleeps. Flash-resident calibration tables and the brown-out/low-voltage-detect peripherals protect data integrity in portable and industrial sensing deployments alike.
推荐
Audio Interfaces and USB Audio Class Devices
The integrated I2S peripheral makes the MKL26Z128VMC4 a natural fit for USB audio class devices such as microphones, headset adapters, and small DAC interfaces. USB OTG provides the data pipe while I2S clocks an external codec, and the 48 MHz core supports USB audio interrupt pacing with margin. Because USB device operation can run crystal-less, audio dongle designs save the crystal and its layout sensitivity. The KL26's low-noise power architecture and deterministic M0+ execution keep jitter low, and 128 KB flash holds the USB Audio Class 1.0/2.0 descriptor sets plus DSP primitives like volume and mute handling, all in a single compact 8x8 mm BGA.
推荐
Industrial Control and Small HMI Systems
For industrial nodes - motor control assist, relay logic, and character/graphical HMI panels - the MKL26Z128VMC4 provides 84 GPIOs, PWM timers, UART/LIN connectivity, and a watchdog timer with brown-out protection for robust operation. The 48 MHz M0+ core drives small TFT or segmented LCD interfaces via GPIO/SPI while running control loops, and LINbus support suits automotive-adjacent industrial buses. Its industrial temperature availability (confirm grade with NXP ordering data) and ultra-low-power modes support both mains-powered and battery-backed field devices. Firmware overhead is modest, and 128 KB flash leaves headroom for communication stacks plus OTA-style update staging.
推荐
IoT Smart Home End Nodes
Smart home end nodes - door/window sensors, thermostats, IR controllers, and Zigbee/Thread companion boards - benefit from the MKL26Z128VMC4's balance of low sleep current, 128 KB flash for network stacks, and rich peripherals. The M0+ core at 48 MHz executes protocol code efficiently, multiple USART/SPI/I2C ports connect radios and sensors, and DMA reduces active time. USB OTG simplifies commissioning and firmware updates when the node is docked to a USB host. Brown-out detect and POR peripherals guarantee safe reset behavior on battery sag, and the compact 121-MAPBGA footprint fits coin-cell-scale PCBs typical of smart home products.
推荐
推荐产品汇总
工程参考数据： MKL26Z128VMC4 ——对比、设计指导和合规信息。
选型指南
与替代料对比
| 参数 | 本产品 | MKL26Z256VMC4 | MKL26Z64VMC4 | MKL25Z128VMC4 | MKL17Z128VMC4 | MK12DX128VMC5 |
|---|---|---|---|---|---|---|
| Package | 121-MAPBGA (8x8 mm) | 121-MAPBGA (8x8 mm) - same | 121-MAPBGA (8x8 mm) - same | 121-MAPBGA (8x8 mm) - same | 121-MAPBGA (8x8 mm) - same | 121-MAPBGA (8x8 mm) - same |
| Brand | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors |
| Core | ARM Cortex-M0+ 32-bit | ARM Cortex-M0+ 32-bit | ARM Cortex-M0+ 32-bit | ARM Cortex-M0+ 32-bit | ARM Cortex-M0+ 32-bit | ARM Cortex-M4 32-bit |
| Core Speed | 48 MHz | 48 MHz | 48 MHz | 48 MHz | 48 MHz | 120 MHz |
| Flash Memory | 128 KB | 256 KB | 64 KB | 128 KB | 128 KB | 128 KB |
| Ultra-Low-Power Family | Yes (Kinetis KL2x) | Yes (Kinetis KL2x) | Yes (Kinetis KL2x) | Yes (Kinetis KL2x) | Yes (Kinetis KL1x) | No (Kinetis K12x, higher power) |
关键差异点
- Full-speed USB 2.0 OTG host/device support （对比 MKL25Z128VMC4)
- Ultra-low-power KL2x architecture at same cost tier （对比 MK12DX128VMC5)
- Flash headroom versus lowest-cost variant （对比 MKL26Z64VMC4)
设计说明
The 121-ball MAPBGA at 0.65 mm pitch (typical for the 8x8 mm Kinetis BGA) requires fanout planning before routing begins. Use via-in-pad or dog-bone escape patterns, and allocate at least one full inner layer as a ground plane for signal return and USB signal integrity. Verify the exact ball pitch and land pattern from the NXP datasheet mechanical drawing and IPC land-pattern guidance before generating your footprint. The 8x8 mm body requires reflow profiling per NXP's recommended MSL and reflow conditions.
NXP KL26 power architecture uses separate VDD and VOUT regulator balls; follow the datasheet's decoupling network exactly - typically 10 uF bulk plus 0.1 uF ceramics on each supply ball pair, placed within 2 mm of the balls. In USB device designs, ensure the 3.3 V rail can source the USB transceiver peak current during enumeration. Estimated: a full-speed USB device draw of ~10-20 mA plus core/I/O current should be budgeted against your regulator's rated output.
Do not assume USB OTG implies host-mode support on all KL2x variants - crystal-less operation applies to device mode; host mode typically requires an external clock source. Also confirm flash allocation early: if firmware plus USB stacks approach 100 KB, select the MKL26Z256VMC4 from the start, since same-footprint flash upgrades are free layout-wise but costly as mid-program BOM changes. Use NXP MCUXpresso SDK for validated USB stack integration rather than rolling your own descriptors.
合规信息
Compliance data was not included in the retrieved web data. Verify RoHS/REACH status on the NXP product page (nxp.com/part/MKL26Z128VMC4) under Environmental Quality before procurement.
