LPC55S26JBD64K - 150MHz Cortex-M33 MCU 256KB Flash | NXP
料号： LPC55S26JBD64K ✓ 量产中| 数量 | 单价 | 小计 |
|---|---|---|
| 1 | $5.04 | $5.04 |
| 10 | $4.79 | $47.90 |
| 100 | $4.49 | $449.00 |
| 500 | $4.19 | $2,095.00 |
| 1,000 | $3.89 | $3,890.00 |
LPC55S26JBD64K 概述
A microcontroller (MCU) is a single-chip computer combining a processor core, memory, and peripherals on one die. Within the embedded systems hierarchy, the LPC55S26 sits in the general-purpose Cortex-M class of microcontrollers, above entry-level Cortex-M0+ devices and below high-performance Cortex-M7/M55 parts, serving as the central control element in embedded electronic systems.
Key features include the world's-first general-purpose Cortex-M33 architecture, hardware TrustZone security, a Memory Protection Unit (MPU), and a Nested Vectored Interrupt Controller (NVIC). Pin-, software-, and peripheral-compatibility across the LPC552x/S2x family lets designers scale memory and security options without redesigning the PCB, accelerating time to market while controlling cost.
Technically, the device executes from dual-bank flash allowing code execution in parallel with erase/write operations, and the Cortex-M33 pipeline delivers deterministic real-time performance at 150 MHz. The S-series suffix denotes the security-enabled variant with TrustZone, crypto support, and secure boot capabilities compared with the non-secure LPC552x versions.
Typical applications include industrial automation and control, IoT edge nodes, access control and secure connectivity, motor control, and consumer appliances. The combination of security, performance, and -40C to +105C operation fits demanding industrial environments.
Design consideration: budget the 144 KB SRAM carefully between the two banks, and plan secure vs non-secure memory partitioning early, since TrustZone attribution affects flash and SRAM allocation at build time.
This page synthesizes distributor pricing (as of 2026-10-12), same-family drop-in alternatives, and practical design notes not found in the manufacturer datasheet.
直接替换替代料： LPC55S26JBD64K ——相同封装，引脚兼容。需要 PCB 改动的不同封装料号已排除。
本系列中的变体
可与以下型号直接替换的同系列型号： LPC55S26JBD64K （相同外形与封装尺寸） ——差异在于 Core Processor, Package, Flash Memory, Interrupt Controller, Mounting Type.
快速对比工具——选择替代料号进行并排对比：
LPC55S28JBD64K
✅ 直接替换✓ 有现货
$3.6 / 个
查看数据手册 →LPC5526JBD64K
✅ 直接替换✓ 有现货
$3.52 / 个
查看数据手册 →LPC5528JBD64K
✅ 直接替换✓ 有现货
$5.3 / 个
查看数据手册 →LPC55S16JBD64K
✅ 直接替换 ⚠️ 规格未核验📋 参考替代料（不在目录中）
LPC55S06JBD64K
✅ 直接替换 ⚠️ 规格未核验📋 参考替代料（不在目录中）
LPC55S26JBD64K 最大额定值与电气特性
| Core Processor | ARM Cortex-M33 |
| Core Size | 32-Bit |
| 最大时钟频率 | 150 MHz |
| Flash Memory Size | 256 KB (256K x 8) |
| RAM Size | 144 KB (144K x 8) |
| Security Features | ARM TrustZone (secure LPC55S2x variant) |
| Memory Protection Unit | Yes (MPU) |
| Interrupt Controller | NVIC with NMI input (selectable sources) |
| 封装 | 64-HTQFP (10 x 10 mm) |
| 安装类型 | Surface Mount |
| 工作温度 | -40C to +105C (TA) |
| Packaging | Tray |
| Series | LPC55S2x (EdgeVerse platform) |
LPC55S26JBD64K 64-htqfp (10 x 10 mm) 引脚配置指南
LPC55S26JBD64K（64-htqfp (10 x 10 mm) 封装）的引脚配置。 该数字 IC 包含 GPIO、通信接口（UART、SPI、I2C）和电源引脚。请参阅制造商数据手册以了解复用引脚功能和配置选项。对嵌入式系统设计和 PCB 布局至关重要。
暂无详细引脚数据： LPC55S26JBD64K.
请参阅 数据手册 以查看完整引脚配置。
典型应用
LPC55S26JBD64K 适用于 6 应用s: Industrial Automation and Control, IoT Edge Nodes, Access Control and Secure Authentication, Motor Control, Consumer Appliances, Test and Measurement Instruments.
Industrial Automation and Control
The LPC55S26JBD64K fits industrial control nodes that need deterministic real-time response and extended temperature tolerance. Its 150 MHz Cortex-M33 core with MPU handles PID loops, fieldbus stacks, and sensor fusion within tight timing budgets, while the -40C to +105C rating covers cabinet and floor-level environments without active cooling. The 144 KB SRAM supports protocol buffers and data logging, and 256 KB dual-bank flash allows field firmware updates while the application keeps running. TrustZone security authenticates the node against plant networks, and the pin-compatible family lets one PCB design serve both secure and cost-reduced variants across a product line.
推荐
IoT Edge Nodes
For battery-conscious IoT edge devices, the LPC55S26JBD64K combines a 150 MHz Cortex-M33 with TrustZone so that telemetry, connectivity stacks, and security agents coexist with hardware isolation of keys and credentials. The 256 KB flash stores BLE or LoRaWAN application code plus OTA staging, and 144 KB SRAM buffers TLS sessions without external memory. Dual-bank flash enables fail-safe firmware updates over the air, a mandatory feature for deployed fleets. Because the LPC55S2x family is peripheral-compatible with the rest of the LPC5500 series, sensor and radio interfaces designed once carry across cost tiers as deployment volume grows.
推荐
Access Control and Secure Authentication
Secure access terminals benefit directly from the S-variant security of the LPC55S26JBD64K. Arm TrustZone partitions credential handling and cryptographic operations from the user-facing firmware, and secure boot establishes a hardware root of trust at every power-up. The 150 MHz core performs biometric pre-processing or DES/AES transaction handling quickly, while 144 KB SRAM holds session keys away from non-secure code. The 64-pin HTQFP package provides enough GPIO for keypad matrices, displays, and reader interfaces on a single controller. The -40C to +105C range suits both indoor panels and outdoor gateways exposed to temperature extremes.
推荐
Motor Control
The LPC55S26JBD64K drives BLDC and PMSM motors using its 150 MHz Cortex-M33 core for field-oriented control mathematics within single PWM periods. Fast ADC sampling of phase currents, combined with the NVIC's deterministic interrupt latency, keeps current loops stable at high electrical speeds. The 144 KB SRAM accommodates sensorless observer state variables and fault logs, while the MPU enforces memory safety between the control loop and communication tasks. The extended -40C to +105C operating range matches drive environments near motors and power stages, and TrustZone can protect commissioned firmware and parameter sets from cloning in OEM equipment.
推荐
Consumer Appliances
In appliances such as dishwashers, air conditioners, and cooking devices, the LPC55S26JBD64K provides a single-chip solution for user interface, motor control, and connectivity. The 150 MHz performance headroom runs capacitive-touch handling, display refresh, and housekeeping concurrently, and the 256 KB flash holds localized UI assets and communication firmware. TrustZone supports emerging appliance security and grid-interaction requirements without a separate security IC, reducing BOM cost. The 10 x 10 mm HTQFP fits standard two-layer or four-layer appliance control boards, and the pin-compatible LPC552x non-secure versions allow a tiered product family sharing one PCB layout.
推荐
Test and Measurement Instruments
Benchtop and portable instruments use the LPC55S26JBD64K as a system controller managing front-panel interfaces, calibration data, and USB or UART communication with a host. The 150 MHz core executes command parsing and trigger timing with predictable latency, while the MPU isolates measurement-critical routines from UI code to prevent faults from propagating. Dual-bank 256 KB flash stores two firmware images for safe in-field upgrades of deployed instruments, and the 144 KB SRAM buffers captured waveforms and setup states. The -40C to +105C rating also permits use in environmental monitoring instrumentation installed in unconditioned enclosures.
推荐
推荐产品汇总
工程参考数据： LPC55S26JBD64K ——对比、设计指导和合规信息。
选型指南
与替代料对比
| 参数 | 本产品 | LPC55S28JBD64K | LPC5526JBD64K | LPC5528JBD64K | LPC55S16JBD64K |
|---|---|---|---|---|---|
| Package | 64-HTQFP (10 x 10 mm) | 64-HTQFP (10 x 10 mm) - same | 64-HTQFP (10 x 10 mm) - same | 64-HTQFP (10 x 10 mm) - same | 64-HTQFP (10 x 10 mm) - same |
| Brand | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors |
| Core / Frequency | Cortex-M33, 150 MHz | Cortex-M33, 150 MHz | Cortex-M33, 150 MHz | Cortex-M33, 150 MHz | Cortex-M33, 150 MHz |
| Flash Memory | 256 KB | 512 KB | 256 KB | 512 KB | 256 KB |
| SRAM | 144 KB | 144 KB | 144 KB | 144 KB | 96 KB |
| TrustZone Security | Yes (secure variant) | Yes | No | No | Yes |
| Operating Temperature | -40C to +105C | -40C to +105C | -40C to +105C | -40C to +105C | -40C to +105C |
| Typical Use Case | Mid-size secure firmware (256 KB) | Large secure firmware / OTA staging | Cost-reduced, non-secure designs | Large non-secure firmware | Secure designs with smaller RAM needs |
关键差异点
- Hardware TrustZone security at family-low cost （对比 LPC5526JBD64K)
- Lowest-cost secure option in the 64-HTQFP family （对比 LPC55S28JBD64K)
- More SRAM than reduced-memory secure siblings （对比 LPC55S16JBD64K)
设计说明
Estimated: provide clean 3.3V (or per datasheet VDD range) supply with local 100 nF decoupling on each VDD pin of the 64-HTQFP plus one bulk 4.7 uF-10 uF capacitor per supply domain. Place the decoupling network within 2 mm of the pins to minimize ground bounce at the 150 MHz core. Consult the NXP LPC55S2x hardware design guideline for exact supply-domain (VDD, VDDA, USB, VDDCORE via internal LDO) decoupling requirements before releasing the layout.
For the 64-HTQFP (0.5 mm pitch), use a standard 0.55-0.6 mm pad with solder-mask-defined or non-SMD apertures per IPC-7351 land patterns. Add thermal vias under the exposed center area where the die attach sits to improve heat spreading, even though a 150 MHz Cortex-M33 in this package is not thermally limiting at typical loads. Route crystal and USB differential pairs first with length control, then fill with GPIO routing.
Plan TrustZone memory partitioning early: with only 144 KB SRAM and 256 KB flash, allocating too much to the secure world starves the application. Also verify that any migration from LPC55S26JBD64K to LPC5526JBD64K (non-secure) removes or guards all security-dependent firmware calls, and that migration to LPC55S28JBD64K updates linker scripts for the 512 KB flash map - the parts are pin-identical but memory maps differ.
合规信息
NXP product page lists an Environmental Quality section for LPC55S26JBD64, but specific RoHS/REACH status was not captured in the retrieved data. Verify on the NXP part page before compliance sign-off.
