LPC55S26JBD64E - 150MHz Cortex-M33 MCU 256KB Flash | NXP
料号： LPC55S26JBD64E ✓ 量产中| 数量 | 单价 | 小计 |
|---|---|---|
| 1 | $4.62 | $4.62 |
| 10 | $4.2 | $42.00 |
| 100 | $3.71 | $371.00 |
| 500 | $3.35 | $1,675.00 |
| 1,000 | $3.02 | $3,020.00 |
LPC55S26JBD64E 概述
A microcontroller (MCU) is a single-chip computer that integrates a processor core, memory, and programmable peripherals onto one die, sitting at the center of embedded system hierarchies: microcontroller -> embedded processor -> system-on-chip -> semiconductor device. The LPC552x/S2x family belongs to the broader LPC5500 MCU series within NXP's EdgeVerse edge computing platform, and was the world's first general-purpose Cortex-M33-based MCU series, offered on a cost-effective 40-nm NVM process technology.
Key features of the LPC55S26 include the Arm Cortex-M33 core (r0p3) with a Memory Protection Unit (MPU), a built-in Nested Vectored Interrupt Controller (NVIC), and a non-maskable interrupt (NMI) input with selectable sources. The device integrates CASPER hardware cryptography co-processor, USB high-speed (USB HS), FlexComm serial interfaces, SDIO, 32-bit counter/timers, SCTimer/PWM, a Programmable Logic Unit (PLU), a 16-bit 1.0 Msamples/sec ADC, analog comparators, and an on-chip temperature sensor. Security is addressed through AES, PUF, SHA, CRC, and a true random number generator (RNG).
Architecturally, the FlexComm concept lets each serial block be configured as USART, SPI, I2C, or I2S, maximizing pin flexibility on the 64-pin package. The PLU allows combinational-logic custom peripherals without CPU load, a distinctive advantage over conventional MCUs.
Typical applications include industrial IoT nodes, general embedded control, secure connected devices, and motor-control or sensing front ends that leverage the 1 Msps ADC and PWM timers.
Design consideration: verify power sequencing and configure the FlexComm muxes early in firmware, since pin functions default per the UM at reset and the secure boot chain (PUF/AES) must be provisioned before locking the flash.
This page synthesizes distributor pricing, same-family drop-in alternatives, and practical design notes not found in the manufacturer datasheet alone.
直接替换替代料： LPC55S26JBD64E ——相同封装，引脚兼容。需要 PCB 改动的不同封装料号已排除。
本系列中的变体
可与以下型号直接替换的同系列型号： LPC55S26JBD64E （相同外形与封装尺寸） ——差异在于 Core Processor, Interrupt Controller, Package, Flash Memory, RoHS Status.
快速对比工具——选择替代料号进行并排对比：
LPC55S28JBD64E
✅ 直接替换 ⚠️ 规格未核验✓ 有现货
$3.44 / 个
查看数据手册 →LPC5526JBD64
✅ 直接替换 ⚠️ 规格未核验📋 参考替代料（不在目录中）
LPC5528JBD64
✅ 直接替换 ⚠️ 规格未核验📋 参考替代料（不在目录中）
LPC55S16JBD64
✅ 直接替换 ⚠️ 规格未核验📋 参考替代料（不在目录中）
LPC55S06JBD64
✅ 直接替换 ⚠️ 规格未核验📋 参考替代料（不在目录中）
LPC55S26JBD64E 最大额定值与电气特性
| Core Processor | ARM Cortex-M33 (r0p3) |
| Core Size | 32-bit |
| 最大时钟频率 | 150 MHz |
| Flash Memory | 256 KB |
| SRAM | 256 KB |
| Connectivity | USB HS, I2C, SPI, UART/USART, I2S, SDIO |
| Peripherals | CASPER crypto co-processor, PLU, SCTimer/PWM, DMA, Comparator, Temperature Sensor |
| ADC Resolution | 16 bit |
| ADC Conversion Rate | 1.0 Msamples/sec |
| Security Features | AES, PUF, SHA, CRC, RNG |
| Interrupt Controller | NVIC with NMI input (selectable sources) |
| Memory Protection | MPU (Memory Protection Unit) |
| 封装 | 64-HTQFP (10 x 10 mm) |
| 安装类型 | Surface Mount |
| Process Technology | 40 nm NVM |
| Peak Reflow Temperature | 260 C |
| 湿敏等级（MSL） | 3 |
| Terminal Finish | Tin (JESD-609 code e3) |
LPC55S26JBD64E 64-htqfp (10 x 10 mm) 引脚配置指南
LPC55S26JBD64E（64-htqfp (10 x 10 mm) 封装）的引脚配置。 该数字 IC 包含 GPIO、通信接口（UART、SPI、I2C）和电源引脚。请参阅制造商数据手册以了解复用引脚功能和配置选项。对嵌入式系统设计和 PCB 布局至关重要。
暂无详细引脚数据： LPC55S26JBD64E.
请参阅 数据手册 以查看完整引脚配置。
典型应用
LPC55S26JBD64E 适用于 6 应用s: Industrial IoT Nodes, Secure Connected Devices, USB High-Speed Peripherals, Motor Control and Power Conversion, Data Logging with SD Card Storage, General Embedded Control.
Industrial IoT Nodes
The LPC55S26JBD64E fits industrial IoT edge nodes because its 150 MHz Cortex-M33 core handles protocol stacks and local analytics while the PUF, AES, SHA, and RNG hardware establish device identity without a separate secure element, cutting bill-of-materials cost. The 256 KB flash / 256 KB SRAM balance accommodates MQTT or OPC UA clients plus buffers, and the FlexComm interface muxes adapt each serial port to the fieldbus in use. Power consumption can be managed through low-power modes for battery-backed sensors, while the 1.0 Msps 16-bit ADC captures analog process signals directly. Nodes benefit from OTA update capability secured by the on-chip crypto chain.
推荐
Secure Connected Devices
Security-centric products such as smart locks, payment accessories, and authenticated sensors exploit the LPC55S26's hardware trust anchor. The Physically Unclonable Function (PUF) generates device-unique keys without storing them in flash, AES and SHA accelerators encrypt communications, and the CASPER co-processor offloads asymmetric operations from the 150 MHz Cortex-M33, keeping latency low. The true random number generator supplies entropy for key generation and secure boot. With 256 KB flash, firmware plus crypto libraries fit comfortably, and the NXP secure boot workflow provisions keys before flash locking. This eliminates an external TPM in many designs, reducing PCB area and cost.
推荐
USB High-Speed Peripherals
The integrated USB HS (480 Mbps) controller makes the LPC55S26JBD64E a strong host or device MCU for data-acquisition pods, debug probes, and industrial analyzers. Streaming at high speed requires buffer depth, and the 256 KB SRAM supports multi-packet FIFOs without external memory. The 1.0 Msps 16-bit ADC can feed USB isochronous streams directly, while the DMA engine offloads transfers from the 150 MHz core. Compared with designs that pair a fast MCU with a separate USB bridge chip, this single-chip approach reduces latency and board complexity. FlexComm ports then handle SPI/UART links to sensors or FPGAs under test.
推荐
Motor Control and Power Conversion
Motor-control applications leverage the SCTimer/PWM, which generates complex multi-channel PWM waveforms with hardware-level coordination, plus the 16-bit 1.0 Msamples/sec ADC for current- and voltage-sense sampling synchronized to the PWM cycle. The 150 MHz Cortex-M33 executes field-oriented control loops with headroom, and the analog comparators provide fast overcurrent trip paths independent of software. The PLU can implement custom gating between PWM and fault inputs without CPU intervention. For industrial drives, servo stages, and BLDC pumps, the LPC55S26 combines adequate DSP capability (M33F with FPU) with deterministic peripherals in a single 64-HTQFP package.
推荐
Data Logging with SD Card Storage
The native SDIO controller distinguishes the LPC55S26 from many competing Cortex-M33 MCUs, enabling direct SD-card interfacing without bit-banging on GPIO. Combined with the 256 KB SRAM, the device buffers multi-sector writes from the 1.0 Msps ADC or from FlexComm-connected sensors and flushes them at SD bus speed, sustaining reliable high-rate logging. The SCTimer can timestamp samples in hardware, and the CRC engine accelerates file-system integrity checks. Applications include energy meters, environmental monitors, and vehicle data recorders. The on-chip temperature sensor supports self-diagnostic logging, and secure storage can layer AES encryption over logged files.
推荐
General Embedded Control
For general-purpose embedded control products - HVAC controllers, vending machines, lighting systems, and test fixtures - the LPC55S26JBD64E offers a mainstream balance of performance and integration. The 150 MHz core outpaces legacy 32-bit MCUs while the FlexComm architecture provides up to eight serial ports configurable as UART, SPI, I2C, or I2S, matching heterogeneous peripheral mixes typical of commercial equipment. The PLU lets designers create small custom logic functions, replacing 74xx glue logic and reducing external component count. The 64-HTQFP's 10 x 10 mm footprint and 0.5 mm pitch support hand-solderable prototyping, and family pin compatibility eases future memory upgrades.
推荐
推荐产品汇总
工程参考数据： LPC55S26JBD64E ——对比、设计指导和合规信息。
选型指南
与替代料对比
| 参数 | 本产品 | LPC55S28JBD64E | LPC5526JBD64 | LPC5528JBD64 | LPC55S16JBD64 | LPC55S06JBD64 |
|---|---|---|---|---|---|---|
| Package | 64-HTQFP (10 x 10 mm) | 64-HTQFP (10 x 10 mm) - same | 64-HTQFP (10 x 10 mm) - same | 64-HTQFP (10 x 10 mm) - same | 64-HTQFP (10 x 10 mm) - same | 64-HTQFP (10 x 10 mm) - same |
| Brand | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors |
| Core / Max Frequency | Cortex-M33 / 150 MHz | Cortex-M33 / 150 MHz | Cortex-M33 / 150 MHz | Cortex-M33 / 150 MHz | Cortex-M33 / 150 MHz | Cortex-M33 / 150 MHz |
| Hardware Security (CASPER/PUF/AES/SHA/RNG) | Yes | Yes | No | No | Yes | Yes |
关键差异点
- Hardware security suite at mainstream price （对比 LPC5526JBD64)
- Cost-optimized within the S2x secure family （对比 LPC55S28JBD64E)
- Native SDIO controller （对比 LPC55S16JBD64)
设计说明
The LPC55S26JBD64E requires regulated core and I/O supplies per the NXP power architecture in the LPC55S2x datasheet; follow the recommended decoupling network (bulk plus per-pin 100 nF ceramics placed at each VDD pair). Power-up sequencing between supply rails must match the datasheet order, or internal isolation diodes can conduct unintentionally. Use a low-noise 3.3 V LDO such as an XC6209-class part for clean ADC reference behavior, and add a dedicated LC filter toward VDDA if the 1.0 Msps ADC accuracy matters.
The 64-HTQFP (10 x 10 mm, 0.5 mm pitch) lands on a standard 64-QFP footprint; use a thermal pad-free layout with generous ground pour on both layers. Route the USB HS pair as 90-ohm differential impedance with length matching within 0.5 mm and place 100 nF at each FlexComm supply pin. Keep the SDIO bus under 50 mm and add 33-ohm series resistors if traces are long. Mark pin 1 clearly - the HTQFP uses the chamfered corner convention.
FlexComm pins are multiplexed and default to specific functions at reset; verify the pin function table before committing routes, since two peripherals cannot share a FlexComm instance. Also, security features (PUF/AES) require provisioning the CMPA (Customer Manufacturing Program Area) during production - locking flash before key provisioning permanently disables secure boot. Finally, the MSL 3 rating means the tray must be baked if exposed beyond its 168-hour floor-life before reflow (260 C peak).
合规信息
JESD-609 terminal finish code e3 (tin), peak reflow 260 C, MSL 3 per distributor data (Vyrian). Formal REACH/conflict-minerals declarations available from NXP product page.
