LSM6DSV16XTR - 6-Axis IMU with AI & Qvar | ST | Wearables
料号： LSM6DSV16XTR ✓ 量产中| 数量 | 单价 | 小计 |
|---|---|---|
| 1 | $2.75 | $2.75 |
| 10 | $2.55 | $25.50 |
| 100 | $2.31 | $231.00 |
| 500 | $2.1 | $1,050.00 |
| 1,000 | $1.95 | $1,950.00 |
LSM6DSV16XTR 概述
An IMU (inertial measurement unit) is a motion sensor subsystem that measures linear acceleration and angular rate to track orientation and movement. Within the sensor hierarchy, the IMU sits above discrete accelerometers and gyroscopes, and below complete navigation systems; modern IMUs like the LSM6DSV16XTR add edge-compute features such as a machine learning core (MLC), finite state machines (FSM), and sensor fusion, positioning them as smart sensor hubs for battery-powered devices.
Key features include an accelerometer full scale selectable from +/-2 g to +/-16 g, gyroscope full scale from +/-125 dps to +/-4000 dps, and high ODR up to 7.68 kHz for demanding motion and OIS workloads. The Qvar channel detects quasi-static electric field variations, enabling tap, swipe, and water-touch detection without additional electrodes. ST's embedded MLC and FSM offload the host MCU, classifying gestures and activity while the main processor sleeps.
The architecture integrates an always-on low-power design with autonomous sensor fusion (SFLP) delivering game rotation vector output, plus adaptive self-configuration (ASC) and an auxiliary SPI interface for OIS/EIS camera stabilization in parallel with the main I2C/SPI link.
Typical applications include smartwatches and fitness bands, smartphone camera OIS/EIS stabilization, and hearing aids or earbuds where ultra-low power always-on motion detection extends battery life.
Design-wise, keep the sensor away from vibration sources and respect the exposed pad grounding on the LGA-14 land pattern for mechanical stability; the auxiliary SPI pin mapping should be confirmed against the datasheet during layout.
This page synthesizes distributor pricing, drop-in alternatives, and practical design notes not found in the manufacturer datasheet.
直接替换替代料： LSM6DSV16XTR ——相同封装，引脚兼容。需要 PCB 改动的不同封装料号已排除。
本系列中的变体
可与以下型号直接替换的同系列型号： LSM6DSV16XTR （相同外形与封装尺寸） ——差异在于 Package, Embedded Features, Sensor Type, Accelerometer Full Scale, FIFO.
快速对比工具——选择替代料号进行并排对比：
LSM6DSV32XTR
✅ 直接替换📋 参考替代料（不在目录中）
LSM6DSVTR
✅ 直接替换📋 参考替代料（不在目录中）
LSM6DSOXTR
✅ 直接替换✓ 有现货
$1.58 / 个
查看数据手册 →LSM6DS3TR-C
✅ 直接替换✓ 有现货
$0.875 / 个
查看数据手册 →LSM6DSV16XTR 最大额定值与电气特性
| 传感器类型 | 3-axis accelerometer + 3-axis gyroscope (6-axis IMU) |
| Accelerometer Full Scale | +/-2 g to +/-16 g |
| Gyroscope Full Scale | +/-125 dps to +/-4000 dps |
| Maximum Output Data Rate | 7.68 kHz |
| Interfaces | I2C, SPI, auxiliary SPI (OIS) |
| Embedded Features | Machine Learning Core (MLC), Finite State Machine (FSM), Qvar electrostatic sensor, sensor fusion (SFLP), adaptive self-configuration (ASC) |
| Supply Voltage (Vdd) | 1.71 V to 3.6 V |
| 封装 | LGA-14 (2.5 x 3 mm) |
| 工作温度 | -40C to +85C |
| 安装类型 | Surface Mount |
| RoHS 状态 | Compliant |
LSM6DSV16XTR lga-14 (2.5 x 3 mm) 引脚配置指南
LSM6DSV16XTR（lga-14 (2.5 x 3 mm) 封装）的引脚配置。 引脚编号、功能和连接图在制造商数据手册中定义。请参阅该手册以了解确切的封装尺寸和焊接指南。
暂无详细引脚数据： LSM6DSV16XTR.
请参阅 数据手册 以查看完整引脚配置。
典型应用
LSM6DSV16XTR 适用于 6 应用s: Smartwatches and Fitness Bands, Smartphone Camera OIS/EIS Stabilization, Hearables and Earbuds, Hearing Aids, IoT Asset Tracking and Smart Home, Industrial Condition Monitoring.
Smartwatches and Fitness Bands
The LSM6DSV16XTR fits wearables because its always-on architecture consumes microamp-class current in low-power modes while the embedded machine learning core and finite state machines classify steps, gestures, and activities without waking the host MCU. The +/-16 g accelerometer range captures high-impact activity, and the Qvar electrostatic channel adds tap and swipe detection on the device casing. Sensor fusion outputs a game rotation vector directly, reducing host-side algorithm load. Battery budgeting is the main consideration: at high ODR the current rises, so designs should use the MLC to gate high-rate sampling only when motion events justify it.
推荐
Smartphone Camera OIS/EIS Stabilization
Camera modules benefit from the LSM6DSV16XTR's dedicated auxiliary SPI interface, which streams high-rate gyroscope data to the OIS controller independently of the main I2C/SPI bus used by the application processor. Full-scale gyro options up to +/-4000 dps cover the fast angular rates typical of handheld shake, and 7.68 kHz class output capability supports low-latency stabilization loops. The always-on design keeps OIS responsive without draining the phone battery. Designers should route the auxiliary SPI traces short and direct, and confirm the OIS-specific register set in the datasheet when integrating with lens-actuator driver ICs.
推荐
Hearables and Earbuds
In true wireless earbuds, the LSM6DSV16XTR enables in-ear gesture detection, activity tracking, and adaptive audio features from a package small enough (2.5 x 3 mm LGA-14) for compact acoustic chambers. The machine learning core can distinguish taps from speech-induced jaw movement, and Qvar detects touch without extra buttons, sealing the enclosure for water resistance. Ultra-low power always-on modes preserve the small cell capacity typical of earbuds. Thermal and acoustic placement matter: mount the IMU away from the speaker magnet to avoid magnetic and mechanical interference with the gyro zero-rate output.
推荐
Hearing Aids
Hearing aids need motion context to switch listening programs automatically, and the LSM6DSV16XTR delivers it at the microamp-level average current that coin-cell and zinc-air batteries demand. The FSM can classify walking, running, or conversation postures in hardware, waking the audio DSP only when a program change is warranted. Sensor fusion provides head-orientation data useful for directional microphones. The -40C to +85C operating range covers body-worn conditions comfortably. Layout should prioritize mechanical isolation from the receiver (speaker) vibration to prevent gyro bias pumping at audio frequencies.
推荐
IoT Asset Tracking and Smart Home
Battery-powered trackers and smart home sensors use the LSM6DSV16XTR as an ultra-low-power wake-up source: the FSM detects free-fall, shock, tilt, or motion and only then wakes the wireless SoC to transmit. This event-driven architecture extends battery life from months to years compared with continuous polling. The Qvar channel additionally supports proximity-style interactions on plastic enclosures. The 1.71 V to 3.6 V supply range interfaces directly with lithium coin cells through a small regulator. Firmware teams should use the embedded self-configuration features to adapt thresholds in the field without OTA firmware updates.
推荐
Industrial Condition Monitoring
For predictive maintenance nodes, the LSM6DSV16XTR monitors vibration signatures on pumps, motors, and rotating equipment. The +/-16 g range and high ODR capture bearing-fault frequency bands, while the machine learning core runs anomaly-detection models in-sensor, transmitting only alerts over the network and conserving power in battery- or energy-harvesting-powered nodes. The industrial -40C to +85C rating suits unconditioned environments. Mechanical coupling is the key design factor: stud-mount or adhesive-mount the sensor to the machine surface through a rigid PCB section, and characterize the gyro drift baseline at installation temperature.
推荐
推荐产品汇总
工程参考数据： LSM6DSV16XTR ——对比、设计指导和合规信息。
选型指南
与替代料对比
| 参数 | 本产品 | LSM6DSV32XTR | LSM6DSVTR | LSM6DSOXTR | LSM6DS3TR-C |
|---|---|---|---|---|---|
| Package | LGA-14 (2.5 x 3 mm) | LGA-14 (2.5 x 3 mm) - same | LGA-14 (2.5 x 3 mm) - same | LGA-14 (2.5 x 3 mm) - same | LGA-14 (2.5 x 3 mm) - same |
| Brand | STMicroelectronics | STMicroelectronics | STMicroelectronics | STMicroelectronics | STMicroelectronics |
| Machine Learning Core | Yes | Yes | Yes | Yes | No |
| Qvar Electrostatic Sensor | Yes | Yes | No | No | No |
| Sensor Fusion (SFLP) | Yes | Yes | Yes | No | No |
| Auxiliary SPI (OIS) | Yes | Yes | Yes | Yes | No |
关键差异点
- Qvar electrostatic sensing channel （对比 LSM6DSVTR)
- Extended 4000 dps gyroscope range （对比 LSM6DSOXTR)
- Embedded sensor fusion output （对比 LSM6DS3TR-C)
设计说明
The LGA-14 (2.5 x 3 mm) land pattern must match the ST mechanical drawing exactly; the package side terminals require correctly sized pads to prevent tombstoning during reflow and to give reliable mechanical anchoring on boards subject to shock. Use a non-solder-mask-defined (NSMD) pad geometry and verify stencil aperture design to avoid flux entrapment under the package body. ST's STEVAL-MKI231A evaluation adapter provides a proven reference layout for first-article builds.
Decouple VDD and VDDIO with 100 nF ceramic capacitors placed within 2-3 mm of the pins, plus a bulk 1 uF per supply rail. Since VDDIO can differ from VDD for level shifting, power VDDIO from a clean rail; noise on VDDIO couples directly into the digital interface threshold and can cause I2C glitches. Avoid sharing the IMU supply rail with high-current switching loads without an RC or ferrite filter.
Firmware register maps differ across the LSM6DS family: the LSM6DSV16XTR exposes Qvar, sensor fusion, and ASC registers absent in the LSM6DS3TR-C and LSM6DSOXTR. Code written for older siblings may initialize the LSM6DSV16XTR into an unexpected state. Always re-verify configuration sequences against the LSM6DSV16XTR datasheet register map, and confirm INT1/INT2 multiplexing assignments since interrupt routing options expanded in this generation.
合规信息
RoHS compliant per distributor (PartGenie) listing. REACH, lead-free, halogen-free and conflict-minerals status not stated in provided data.
