M1AFS1500-1FGG484I - 1.5M Gate Fusion Mixed-Signal FPGA | Microchip
料号： M1AFS1500-1FGG484I ✓ 量产中| 数量 | 单价 | 小计 |
|---|---|---|
| 1 | $0 | $0.00 |
| 10 | $0 | $0.00 |
| 100 | $0 | $0.00 |
| 500 | $0 | $0.00 |
| 1,000 | $0 | $0.00 |
M1AFS1500-1FGG484I 概述
A mixed-signal FPGA is a field-programmable gate array that combines digital programmable fabric with analog peripherals such as ADCs, monitors, and PLL-based clock management on the same chip. Unlike SRAM FPGAs, flash-based FPGAs store their configuration in on-chip flash memory, giving them inherent single-chip boot, instant-on behavior, and higher resistance to configuration upset - a key differentiator in the programmable logic hierarchy.
Key features of the M1AFS1500-1FGG484I include large embedded flash memory blocks for configuration and user data, comprehensive on-chip clock generation and management circuitry, the ARM Cortex-M1 processor for embedded control within the fabric, and 223 user I/Os supporting multiple standards. The Fusion fabric provides 38,400 logic cells (per Microchip USA product data for the M1AFS1500 series) with 276,480 bits of flash-based fabric capacity as listed by DigiKey.
Architecturally, the device monolithically integrates configurable analog peripherals (voltage/temperature monitoring via an on-board ADC), CCC clock conditioning circuits, and flash-based look-up-table logic. The M1 prefix denotes Fusion FPGAs that include the ARM Cortex-M1 processor, enabling single-chip embedded designs without an external MCU.
Typical applications include industrial automation control, military/aerospace embedded systems, power-supply supervision and board management, test instrumentation, and motor control - anywhere single-chip analog monitoring plus digital logic reduces BOM count.
Design consideration: flash-based Fusion parts are programmed in-system via JTAG or on-board flash; budget I/O banks and supply rails per the FGG484 footprint early, since migrating between speed grades stays drop-in but changing package (FG484 vs FGG484 ballout) requires PCB review.
This page synthesizes distributor data, same-package drop-in alternatives, and design guidance not found in the manufacturer datasheet.
直接替换替代料： M1AFS1500-1FGG484I ——相同封装，引脚兼容。需要 PCB 改动的不同封装料号已排除。
本系列中的变体
可与以下型号直接替换的同系列型号： M1AFS1500-1FGG484I （相同外形与封装尺寸） ——差异在于 Package, Family, System Gates, Process Technology, Clock Management.
快速对比工具——选择替代料号进行并排对比：
M1AFS1500-2FGG484I
✅ 直接替换✓ 有现货
$201.11 / 个
查看数据手册 →M1AFS1500-FGG484I
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$152.28 / 个
查看数据手册 →M1AFS1500-1FGG484
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联系询价
查看数据手册 →M1AFS1500-1FGG484K
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$1560 / 个
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$1 / 个
查看数据手册 →M1AFS1500-1FG484I
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$402.06 / 个
查看数据手册 →M1AFS1500-1FGG484I 最大额定值与电气特性
| Manufacturer | Microchip Technology (originally Microsemi Corporation) |
| Family | Fusion Mixed-Signal FPGA |
| System Gates | 1500000 gates |
| Logic Cells | 38400 |
| Embedded Processor | ARM Cortex-M1 |
| User I/O | 223 |
| Flash Fabric Bits | 276480 bits |
| Core Supply Voltage | 1.5 V |
| Process Technology | 130 nm flash-based |
| Speed Grade | -1 |
| 封装 | 484-ball Fine-Pitch BGA (FGG484), 1.00 mm pitch |
| Package Dimensions | 23 mm x 23 mm |
| Temperature Grade | Industrial (-40C to +100C, I suffix) |
| 安装类型 | Surface Mount |
| Analog Blocks | Configurable analog (ADC-based system monitoring) |
| Clock Management | On-chip CCC clock conditioning and generation |
| Configuration Memory | On-chip flash (single-chip, instant-on) |
M1AFS1500-1FGG484I 23 mm x 23 mm 引脚配置指南
M1AFS1500-1FGG484I（23 mm x 23 mm 封装）的引脚配置。 该数字 IC 包含 GPIO、通信接口（UART、SPI、I2C）和电源引脚。请参阅制造商数据手册以了解复用引脚功能和配置选项。对嵌入式系统设计和 PCB 布局至关重要。
暂无详细引脚数据： M1AFS1500-1FGG484I.
请参阅 数据手册 以查看完整引脚配置。
典型应用
M1AFS1500-1FGG484I 适用于 6 应用s: Industrial Automation and Motor Control, Board Management and Power Supervision, Military and Aerospace Embedded Systems, Test and Measurement Instrumentation, Secure and Single-Chip Embedded Control, IoT Gateways and Smart Sensor Hubs.
Industrial Automation and Motor Control
The M1AFS1500-1FGG484I fits industrial automation because its 1.5M-gate flash fabric implements multiple PWM channels, quadrature encoders, and fieldbus protocol engines while the embedded ARM Cortex-M1 runs the control loop firmware on one chip. The integrated analog subsystem monitors supply rails and die temperature via the on-chip ADC, supporting failsafe shutdown logic without an external supervisor IC. Placed at the heart of a drive or PLC I/O card, the flash-based fabric boots instantly from on-chip memory - no external configuration device to fail in electrically noisy factory environments. The 223 user I/Os at 1.5V-core with banked I/O standards interface directly to sensors, drivers, and communication transceivers, and the industrial -40C to +100C rating covers cabinet-mounted equipment.
推荐
Board Management and Power Supervision
Fusion's defining feature is monolithic analog monitoring, making the M1AFS1500-1FGG484I a natural board-management controller for servers, telecom shelves, and backplanes. The on-chip ADC and analog multiplexers digitize multiple supply rails and temperature sensors, while the Cortex-M1 executes management firmware (fault logging, sequencing, fan control) and the fabric implements fast hardware comparators and shutdown triggers. Flash-based configuration means the supervisor logic is active within milliseconds of power application - critical when it must sequence other rails. The 484-ball FGG484 provides ample 223 user I/Os for I2C/SMBus fan controllers, LED status, and hot-swap interfaces, consolidating functions that would otherwise need an MCU plus several supervisor ICs.
推荐
Military and Aerospace Embedded Systems
Flash-based Fusion devices are widely used in defense programs because on-chip flash configuration avoids the configuration-readback upset exposure of SRAM FPGAs and eliminates external boot flash, reducing parts count in convection-limited avionics. The M1AFS1500-1FGG484I's 1.5M gates host sensor interfaces, bus bridges (MIL-STD-1553 glue logic, custom serial links), and the ARM Cortex-M1 for command handling, while integrated analog monitors supply health. The industrial -40C to +100C rating covers many airborne and ground-platform environments; for radiation-critical orbits, Microchip's RTAX4000S family is the companion space-grade path. Instant-on behavior from flash also supports time-critical power-up requirements common in munitions and telemetry systems.
推荐
Test and Measurement Instrumentation
Bench and rack instruments benefit from the M1AFS1500-1FGG484I's combination of flexible digital fabric and on-chip analog monitoring. The fabric triggers, captures, and time-stamps high-speed digital events, while the Cortex-M1 handles SCPI command parsing over UART/USB-serial and the integrated ADC tracks internal supply and temperature for self-test reporting. At 1.5M gates, the fabric fits protocol engines (SPI, I2C, JTAG masters), pattern generators, and statistical counters concurrently - a typical logic-analyzer front end. The 484-ball package exposes 223 I/Os for channel cards, and flash configuration means the instrument is functional the instant mains power arrives, avoiding SRAM-FPGA boot delays that users perceive as slow startup.
推荐
Secure and Single-Chip Embedded Control
Because configuration lives in on-chip flash, the M1AFS1500-1FGG484I supports designs where a single-chip, no-external-boot-flash architecture simplifies security review and tamper surface. The Cortex-M1 runs application firmware while the fabric implements custom cryptographic accelerators, secure key-handling state machines, and lockout logic; the analog monitor can detect supply-glitch attacks on the rails it supervises. The 1.5V core on 130nm flash process offers stable, non-volatile operation, and the FPGA fabric can be partially reprogrammed in the field for firmware updates. Typical deployments include network appliance management, licensed-spectrum equipment control, and industrial gateways where cloning resistance and rapid power-up both matter.
推荐
IoT Gateways and Smart Sensor Hubs
The M1AFS1500-1FGG484I serves as the hub in industrial IoT gateways: the Cortex-M1 runs the protocol stack and housekeeping firmware, the fabric implements multiple sensor interfaces (SPI, I2C, UART, custom RF-module links) concurrently with hardware timestamping, and the analog subsystem supervises local supply health. With 1.5M gates there is room for edge-preprocessing datapaths - filters, accumulators, thresholds - that offload the processor before data goes upstream. The flash fabric's instant-on and low configuration overhead suits gateways that must wake, sample, and report quickly on duty-cycled power. The 484-ball FGG484 footprint also allows migration to the smaller M1AFS600 in the same package when BOM cost must drop at scale.
推荐
推荐产品汇总
工程参考数据： M1AFS1500-1FGG484I ——对比、设计指导和合规信息。
选型指南
与替代料对比
| 参数 | 本产品 | M1AFS1500-2FGG484I | M1AFS1500-FGG484I | M1AFS1500-1FGG484 | M1AFS1500-1FG484I |
|---|---|---|---|---|---|
| Package | 484-ball FGG484 BGA (1.00 mm pitch) | 484-ball FGG484 BGA - same | 484-ball FGG484 BGA - same | 484-ball FGG484 BGA - same | 484-ball FG484 BGA - same body, verify ballout |
| Brand | Microchip Technology (Microsemi) | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| System Gates | 1500000 gates | 1500000 gates | 1500000 gates | 1500000 gates | 1500000 gates |
| Speed Grade | -1 | -2 (faster) | Standard (faster) | -1 (same) | -1 (same) |
| User I/O | 223 | 223 | 223 | 223 | 223 |
| Temperature Range | Industrial (-40C to +100C) | Industrial (-40C to +100C) | Industrial (-40C to +100C) | Commercial (0C to +85C) | Industrial (-40C to +100C) |
| Embedded Processor | ARM Cortex-M1 | ARM Cortex-M1 | ARM Cortex-M1 | ARM Cortex-M1 | ARM Cortex-M1 |
| Core Supply Voltage | 1.5 V | 1.5 V | 1.5 V | 1.5 V | 1.5 V |
关键差异点
- Single-chip flash configuration eliminates external boot device （对比 SRAM FPGAs (Xilinx Artix-7 class))
- Integrated analog monitoring subsystem （对比 M1AFS600-1FGG484I (digital-logic focus within same family))
- Embedded ARM Cortex-M1 processor on-chip （对比 M1AFS1500-2FGG484I is faster but same features; vs non-M1 AFS parts)
设计说明
The Fusion 484-ball device requires multiple supply rails (1.5 V core, 2.5 V aux, 3.3 V I/O - confirm exact rail list in the Fusion datasheet power section). Sequence the core rail before or together with I/O per the datasheet power-up specification, and decouple each VDD ball with at least one 0.1 uF ceramic placed within 2 mm of the ball via, plus bulk 10 uF per bank. Estimated: with 223 I/Os lightly loaded at 3.3 V, I/O dynamic current dominates - budget per-bank current using Microchip's Fusion power calculator (Silicon Architect) rather than the datasheet typical figures.
The 484-ball FGG484 BGA at 1.00 mm pitch requires dog-bone or via-in-pad fanout on a minimum 6-layer stack (signal-GND-signal-PWR-signal-signal recommended). Keep the analog monitor inputs (ADC channel pins) routed away from switching-regulator nodes and guard them with ground - the on-chip ADC is used for supply/temperature supervision, and coupled ripple corrupts readings. Place the JTAG programming header within 15 cm of the device with series resistors per Microchip's FlashPro programming guide for reliable in-system programming.
Two frequent mistakes on Fusion designs: (1) treating FGG484 and FG484 parts as interchangeable - the ballout differs between the G and non-G packages on some assigned balls, so always re-verify the ball map and run place-and-route against the correct device file before release; (2) assuming cross-brand FPGA migration is drop-in - it is not, since Fusion's flash configuration and analog blocks are proprietary. Also confirm industrial 'I' grade is required before specifying; commercial-grade variants save cost but are rated only to +85C.
合规信息
Compliance data not present in the provided verified web data. Consult the official Microchip product page or RoHS certificate for the M1AFS1500-1FGG484I before procurement.
