M1AFS1500-FGG676 - 1.5M-Gate Fusion Mixed-Signal FPGA | Microchip
料号： M1AFS1500-FGG676 ✓ 量产中| 数量 | 单价 | 小计 |
|---|---|---|
| 1 | $285 | $285.00 |
| 10 | $265 | $2,650.00 |
| 100 | $242 | $24,200.00 |
| 500 | $220 | $110,000.00 |
| 1,000 | $198 | $198,000.00 |
M1AFS1500-FGG676 概述
A mixed-signal FPGA is a field-programmable gate array that combines digital programmable fabric with analog peripherals such as ADCs, voltage/temperature monitoring, and GPIO with analog capability. In the system hierarchy, the M1AFS1500 sits at the FPGA / programmable logic / system-on-chip level of semiconductor devices, reducing board-level component count by absorbing supervisory, monitoring, and configuration functions that traditionally require separate MCUs and analog ICs.
Key features include flash-based configuration (live at power-up, no external configuration PROM required), 128-bit flash lock with industry-standard AES decryption for IP security, a maximum clock frequency of 350 MHz per distributor-documented specifications, and a wide supply range of 1.425V to 1.575V. The Fusion fabric also supports soft ARM Cortex-M1 or MicroBlade processor implementations within the same device.
Architecturally, the device uses Microsemi flash-based switch technology rather than SRAM cells, giving it instant-on behavior, inherent immunity to configuration readback attacks, and significantly lower static power than comparable SRAM FPGAs. The 676-ball FGG676 package provides sufficient I/O for high-density designs while remaining suitable for reflow soldering in standard surface-mount assembly.
Typical applications include industrial automation and motor drive supervision, power supply monitoring and control, portable instrumentation, aerospace subsystems, and secure embedded control where single-chip integration of analog monitoring and digital logic reduces BOM cost and board area.
A key design consideration is thermal and power budgeting: the 676-ball package requires adequate PCB copper area for heat dissipation, and designers should use Microchip Libero SoC design tools for implementation, since Fusion is supported only in that toolchain.
This page synthesizes distributor pricing, same-package drop-in alternatives, and practical design notes not found in the manufacturer datasheet, with all data verified as of 2026-09-02.
直接替换替代料： M1AFS1500-FGG676 ——相同封装，引脚兼容。需要 PCB 改动的不同封装料号已排除。
本系列中的变体
可与以下型号直接替换的同系列型号： M1AFS1500-FGG676 （相同外形与封装尺寸） ——差异在于 Package, Core Supply Voltage, Family, Process Technology, System Gates.
快速对比工具——选择替代料号进行并排对比：
M1AFS1500-FGG676I
✅ 直接替换✓ 有现货
$89.9 / 个
查看数据手册 →M1AFS1500-1FGG676I
✅ 直接替换✓ 有现货
联系询价
查看数据手册 →M1AFS1500-FGG676 最大额定值与电气特性
| Family | Fusion (M1 Fusion mixed-signal FPGA) |
| Equivalent Gates | 1,500,000 gates |
| Logic Cells | 38,400 |
| User I/O | 252 |
| Max Clock Frequency | 350 MHz |
| Core Supply Voltage | 1.5 V (1.425 V to 1.575 V) |
| Process Technology | 130 nm CMOS |
| Configuration Technology | Flash-based (instant-on, live at power-up) |
| Security | 128-bit flash lock, AES decryption |
| Analog Capability | Configurable analog blocks, voltage/temperature monitoring |
| Soft CPU Support | ARM Cortex-M1, MicroBlade |
| 封装 | 676-ball FBGA (FGG676) |
| 安装类型 | Surface Mount |
| Packaging | Tray |
| Embedded Memory | Large flash memory blocks integrated |
M1AFS1500-FGG676 676-ball fbga (fgg676) 引脚配置指南
M1AFS1500-FGG676（676-ball fbga (fgg676) 封装）的引脚配置。 该数字 IC 包含 GPIO、通信接口（UART、SPI、I2C）和电源引脚。请参阅制造商数据手册以了解复用引脚功能和配置选项。对嵌入式系统设计和 PCB 布局至关重要。
暂无详细引脚数据： M1AFS1500-FGG676.
请参阅 数据手册 以查看完整引脚配置。
典型应用
M1AFS1500-FGG676 适用于 6 应用s: Power Supply Monitoring and Control, Industrial Automation and Motor Drive Supervision, Secure Embedded Control and IP Protection, Portable and Battery-Powered Instrumentation, Aerospace and Defense Subsystems, Single-Chip System Integration / SoC Consolidation.
Power Supply Monitoring and Control
The M1AFS1500-FGG676 fits multi-rail power supervision because the Fusion architecture integrates configurable analog blocks that digitize voltage channels and die temperature on-chip, with 38,400 logic cells available for sequencing state machines and fault logging. Because configuration is flash-based, monitoring is live immediately at power-up with no boot delay - critical for brown-out detection on -48V telecom or 12V industrial rails. Placed as the system supervisor, one 676-FBGA device replaces a monitoring ADC, supervisor IC, and sequencing MCU, while the 128-bit flash lock protects the control IP. The 1.5V core (1.425V-1.575V) simplifies rail sharing with adjacent 1.5V logic.
推荐
Industrial Automation and Motor Drive Supervision
In factory automation and motor drives, the M1AFS1500-FGG676 provides glue logic, sequencing, and condition monitoring in one flash-based device. The 350 MHz-class fabric closes timing for encoder interfaces and PWM supervision, while integrated voltage/temperature monitoring protects drive electronics against over-temperature and rail sag. The 252 user I/Os handle multiple position sensors, communication transceivers, and control signals without external expansion. Its instant-on flash configuration eliminates configuration PROM parts on the drive control board, and the industrial-grade FGG676I variant extends operation to harsh cabinet environments where commercial grades are unreliable.
推荐
Secure Embedded Control and IP Protection
Designs handling proprietary algorithms benefit from the M1AFS1500-FGG676's security architecture: a 128-bit flash lock prevents readback and the industry-leading AES decryption secures programmed configuration data, per the Microsemi Fusion datasheet. Unlike SRAM FPGAs that load bitstreams from external PROMs exposed on the bus, flash configuration resides inside the die, shrinking the attack surface. A soft ARM Cortex-M1 or MicroBlade processor implemented on the 38,400 logic cells runs application firmware locally, so sensitive logic and firmware coexist in one protected device. This suits defense upgrades, licensed equipment, and metering platforms requiring tamper resistance.
推荐
Portable and Battery-Powered Instrumentation
The M1AFS1500-FGG676 suits handheld and portable instruments where its flash-based fabric delivers lower static power than comparable SRAM FPGAs and eliminates configuration-device power-up current. Integrated analog monitoring tracks battery voltage and die temperature without extra components, extending usable battery life through accurate fuel-gauge data available to the internal Cortex-M1 soft core. The 130nm process balances logic density (1.5M gates, 38,400 cells) against leakage, while the 676-ball FGG676 provides 252 I/Os for display, sensor, and communication interfaces in a single programmable device, consolidating board area in compact enclosures.
推荐
Aerospace and Defense Subsystems
Flash-based FPGAs are preferred in aerospace payloads because they are immune to configuration upsets that affect SRAM cells, and the M1AFS1500-FGG676 extends this with instant-on operation for time-critical startup in avionics and satellite electronics. The AES-encrypted, flash-locked configuration satisfies IP-protection requirements for defense programs, and the integrated analog monitoring supports health telemetry of rails and temperature across the subsystem. Designers implement bus interfaces, sequencing, and housekeeping on the 38,400 logic cells, while heritage Libero toolchain support sustains long program lifecycles. Related RTAX4000S radiation-taxed devices cover higher-reliability needs.
推荐
Single-Chip System Integration / SoC Consolidation
The M1AFS1500-FGG676 excels at BOM consolidation: mixed-signal Fusion integrates configurable analog, large flash memory blocks, comprehensive clock generation and management, and flash-based programmable logic in one monolithic device, per Microchip's product page. A soft Cortex-M1 provides embedded control, so one 676-ball package replaces an MCU, monitoring ADC, clock synthesizer, configuration PROM, and mid-density FPGA. The 1.5V core and 252 I/Os interface directly with standard board-level logic. For new designs, Microchip positions PolarFire SoC as the modern successor, but for cost-driven consolidation on mature platforms, Fusion remains a validated, in-production path.
推荐
推荐产品汇总
工程参考数据： M1AFS1500-FGG676 ——对比、设计指导和合规信息。
选型指南
与替代料对比
| 参数 | 本产品 | M1AFS1500-FGG676I | M1AFS1500-1FGG676I |
|---|---|---|---|
| Package | 676-FBGA (FGG676) | 676-FBGA (FGG676) - same | 676-FBGA (FGG676) - same |
| Brand | Microchip Technology (Microsemi) | Microchip Technology (Microsemi) | Microchip Technology (Microsemi) |
| Equivalent Gates | 1,500,000 | 1,500,000 | 1,500,000 |
| Logic Cells | 38,400 | 38,400 | 38,400 |
| User I/O | 252 | 252 | 252 |
| Core Supply Voltage | 1.5 V (1.425-1.575 V) | 1.5 V (1.425-1.575 V) | 1.5 V (1.425-1.575 V) |
| Speed Grade | Standard | Standard | -1 (derated) |
| Temperature Grade | Commercial/standard | Industrial (I) | Industrial (I) |
| Configuration / Security | Flash-based, 128-bit lock, AES | Flash-based, 128-bit lock, AES | Flash-based, 128-bit lock, AES |
关键差异点
- Integrated configurable analog monitoring （对比 Standard digital FPGAs (e.g., A3P600 ProASIC3 family))
- Industrial temperature availability in same footprint （对比 M1AFS1500-FGG676I)
- Instant-on flash configuration with AES security （对比 SRAM-based FPGAs)
设计说明
Power the M1AFS1500-FGG676 core from a regulated 1.5V rail within the 1.425V to 1.575V documented range; a wide-VIN buck such as the LM5164 feeding an LDO or precision 1.5V regulator keeps ripple within tolerance. Because the fabric is flash-based, there is no configuration power-up surge like SRAM FPGAs, but analog block accuracy depends on clean rails - add 10uF bulk plus 0.1uF ceramic decoupling at each VCC domain. Estimated: at a typical 1W core dissipation and a large BGA with solid ground-ball connection, allow for PCB copper spread rather than expecting the package alone to dissipate heat.
The 676-ball fine-pitch FGG676 footprint requires a controlled PCB fabrication process; follow the Microchip Fusion datasheet land-pattern and via-in-pad or dog-bone breakout rules for 1.0mm-class BGA routing. Use sequential lamination or via-in-pad on inner layers to escape the 252 I/Os across at least 6 layers for dense designs. Place 0.1uF ceramics within 2mm of power/ground ball pairs distributed around the die, and tie all analog-block reference balls to a quiet ground region to preserve measurement accuracy of the integrated monitoring channels.
Do not substitute FG676 (standard pitch) parts onto an FGG676 (fine pitch) footprint - the ball pitch differs and the land patterns are mechanically incompatible despite the identical die. Verify speed grade (-1 vs standard) against Libero timing reports before qualifying a drop-in grade change. When using the integrated analog monitoring, calibrate against the datasheet reference conditions; raw ADC channels need offset correction. Finally, confirm lifecycle status in writing for production programs, since Fusion is a mature family and Microchip's successor path is PolarFire.
合规信息
Compliance data not present in provided verified web data; consult Microchip product page environmental documentation.
