M1AFS1500-FGG676 - 1.5M-Gate Fusion Mixed-Signal FPGA | Microchip
MPN: M1AFS1500-FGG676 ✓ Active| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $285 | $285.00 |
| 10 | $265 | $2,650.00 |
| 100 | $242 | $24,200.00 |
| 500 | $220 | $110,000.00 |
| 1,000 | $198 | $198,000.00 |
Drop-in alternatives for M1AFS1500-FGG676 — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
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M1AFS1500-FGG676I
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$89.9 / Unit
View Datasheet →M1AFS1500-1FGG676I
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View Datasheet →M1AFS1500-FGG676 Maximum Ratings & Electrical Characteristics
| Family | Fusion (M1 Fusion mixed-signal FPGA) |
| Equivalent Gates | 1,500,000 gates |
| Logic Cells | 38,400 |
| User I/O | 252 |
| Max Clock Frequency | 350 MHz |
| Core Supply Voltage | 1.5 V (1.425 V to 1.575 V) |
| Process Technology | 130 nm CMOS |
| Configuration Technology | Flash-based (instant-on, live at power-up) |
| Security | 128-bit flash lock, AES decryption |
| Analog Capability | Configurable analog blocks, voltage/temperature monitoring |
| Soft CPU Support | ARM Cortex-M1, MicroBlade |
| Package | 676-ball FBGA (FGG676) |
| Mounting Type | Surface Mount |
| Packaging | Tray |
| Embedded Memory | Large flash memory blocks integrated |
M1AFS1500-FGG676 676-ball fbga (fgg676) Pin Configuration Guide
Complete pinout information for M1AFS1500-FGG676 (676-ball fbga (fgg676) package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for M1AFS1500-FGG676.
Refer to the datasheet for full pin configuration.
Safe Operating Area (SOA) & Thermal Characteristics
No official SOA curve available for this digital IC. Always operate within absolute maximum ratings specified in the datasheet. Ensure adequate cooling and derate as needed.
Typical Applications
M1AFS1500-FGG676 is suitable for 6 applications: Power Supply Monitoring and Control, Industrial Automation and Motor Drive Supervision, Secure Embedded Control and IP Protection, Portable and Battery-Powered Instrumentation, Aerospace and Defense Subsystems, Single-Chip System Integration / SoC Consolidation.
Power Supply Monitoring and Control
The M1AFS1500-FGG676 fits multi-rail power supervision because the Fusion architecture integrates configurable analog blocks that digitize voltage channels and die temperature on-chip, with 38,400 logic cells available for sequencing state machines and fault logging. Because configuration is flash-based, monitoring is live immediately at power-up with no boot delay - critical for brown-out detection on -48V telecom or 12V industrial rails. Placed as the system supervisor, one 676-FBGA device replaces a monitoring ADC, supervisor IC, and sequencing MCU, while the 128-bit flash lock protects the control IP. The 1.5V core (1.425V-1.575V) simplifies rail sharing with adjacent 1.5V logic.
Recommended
Industrial Automation and Motor Drive Supervision
In factory automation and motor drives, the M1AFS1500-FGG676 provides glue logic, sequencing, and condition monitoring in one flash-based device. The 350 MHz-class fabric closes timing for encoder interfaces and PWM supervision, while integrated voltage/temperature monitoring protects drive electronics against over-temperature and rail sag. The 252 user I/Os handle multiple position sensors, communication transceivers, and control signals without external expansion. Its instant-on flash configuration eliminates configuration PROM parts on the drive control board, and the industrial-grade FGG676I variant extends operation to harsh cabinet environments where commercial grades are unreliable.
Recommended
Secure Embedded Control and IP Protection
Designs handling proprietary algorithms benefit from the M1AFS1500-FGG676's security architecture: a 128-bit flash lock prevents readback and the industry-leading AES decryption secures programmed configuration data, per the Microsemi Fusion datasheet. Unlike SRAM FPGAs that load bitstreams from external PROMs exposed on the bus, flash configuration resides inside the die, shrinking the attack surface. A soft ARM Cortex-M1 or MicroBlade processor implemented on the 38,400 logic cells runs application firmware locally, so sensitive logic and firmware coexist in one protected device. This suits defense upgrades, licensed equipment, and metering platforms requiring tamper resistance.
Recommended
Portable and Battery-Powered Instrumentation
The M1AFS1500-FGG676 suits handheld and portable instruments where its flash-based fabric delivers lower static power than comparable SRAM FPGAs and eliminates configuration-device power-up current. Integrated analog monitoring tracks battery voltage and die temperature without extra components, extending usable battery life through accurate fuel-gauge data available to the internal Cortex-M1 soft core. The 130nm process balances logic density (1.5M gates, 38,400 cells) against leakage, while the 676-ball FGG676 provides 252 I/Os for display, sensor, and communication interfaces in a single programmable device, consolidating board area in compact enclosures.
Recommended
Aerospace and Defense Subsystems
Flash-based FPGAs are preferred in aerospace payloads because they are immune to configuration upsets that affect SRAM cells, and the M1AFS1500-FGG676 extends this with instant-on operation for time-critical startup in avionics and satellite electronics. The AES-encrypted, flash-locked configuration satisfies IP-protection requirements for defense programs, and the integrated analog monitoring supports health telemetry of rails and temperature across the subsystem. Designers implement bus interfaces, sequencing, and housekeeping on the 38,400 logic cells, while heritage Libero toolchain support sustains long program lifecycles. Related RTAX4000S radiation-taxed devices cover higher-reliability needs.
Recommended
Single-Chip System Integration / SoC Consolidation
The M1AFS1500-FGG676 excels at BOM consolidation: mixed-signal Fusion integrates configurable analog, large flash memory blocks, comprehensive clock generation and management, and flash-based programmable logic in one monolithic device, per Microchip's product page. A soft Cortex-M1 provides embedded control, so one 676-ball package replaces an MCU, monitoring ADC, clock synthesizer, configuration PROM, and mid-density FPGA. The 1.5V core and 252 I/Os interface directly with standard board-level logic. For new designs, Microchip positions PolarFire SoC as the modern successor, but for cost-driven consolidation on mature platforms, Fusion remains a validated, in-production path.
Recommended
Recommended Products Summary
Engineering reference data for M1AFS1500-FGG676 — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | M1AFS1500-FGG676I | M1AFS1500-1FGG676I |
|---|---|---|---|
| Package | 676-FBGA (FGG676) | 676-FBGA (FGG676) - same | 676-FBGA (FGG676) - same |
| Brand | Microchip Technology (Microsemi) | Microchip Technology (Microsemi) | Microchip Technology (Microsemi) |
| Equivalent Gates | 1,500,000 | 1,500,000 | 1,500,000 |
| Logic Cells | 38,400 | 38,400 | 38,400 |
| User I/O | 252 | 252 | 252 |
| Core Supply Voltage | 1.5 V (1.425-1.575 V) | 1.5 V (1.425-1.575 V) | 1.5 V (1.425-1.575 V) |
| Speed Grade | Standard | Standard | -1 (derated) |
| Temperature Grade | Commercial/standard | Industrial (I) | Industrial (I) |
| Configuration / Security | Flash-based, 128-bit lock, AES | Flash-based, 128-bit lock, AES | Flash-based, 128-bit lock, AES |
Key Differentiators
- Integrated configurable analog monitoring (vs Standard digital FPGAs (e.g., A3P600 ProASIC3 family))
- Industrial temperature availability in same footprint (vs M1AFS1500-FGG676I)
- Instant-on flash configuration with AES security (vs SRAM-based FPGAs)
Design Notes
Power the M1AFS1500-FGG676 core from a regulated 1.5V rail within the 1.425V to 1.575V documented range; a wide-VIN buck such as the LM5164 feeding an LDO or precision 1.5V regulator keeps ripple within tolerance. Because the fabric is flash-based, there is no configuration power-up surge like SRAM FPGAs, but analog block accuracy depends on clean rails - add 10uF bulk plus 0.1uF ceramic decoupling at each VCC domain. Estimated: at a typical 1W core dissipation and a large BGA with solid ground-ball connection, allow for PCB copper spread rather than expecting the package alone to dissipate heat.
The 676-ball fine-pitch FGG676 footprint requires a controlled PCB fabrication process; follow the Microchip Fusion datasheet land-pattern and via-in-pad or dog-bone breakout rules for 1.0mm-class BGA routing. Use sequential lamination or via-in-pad on inner layers to escape the 252 I/Os across at least 6 layers for dense designs. Place 0.1uF ceramics within 2mm of power/ground ball pairs distributed around the die, and tie all analog-block reference balls to a quiet ground region to preserve measurement accuracy of the integrated monitoring channels.
Do not substitute FG676 (standard pitch) parts onto an FGG676 (fine pitch) footprint - the ball pitch differs and the land patterns are mechanically incompatible despite the identical die. Verify speed grade (-1 vs standard) against Libero timing reports before qualifying a drop-in grade change. When using the integrated analog monitoring, calibrate against the datasheet reference conditions; raw ADC channels need offset correction. Finally, confirm lifecycle status in writing for production programs, since Fusion is a mature family and Microchip's successor path is PolarFire.
Compliance Information
Compliance data not present in provided verified web data; consult Microchip product page environmental documentation.
