Microchip Technology

M2GL005-1VF400 - 6K LEs, 169 I/O IGLOO2 FPGA | Microchip

料号: M2GL005-1VF400 ✓ 量产中
400-LFBGA Package
最小起订量: 1 |

M2GL005-1VF400 概述

The Microchip Technology M2GL005-1VF400 is an IGLOO2 low-density field-programmable gate array with 6K logic elements, 169 I/O, and a 400-LFBGA package. It is a programmable semiconductor used to implement bridging, I/O expansion, data conversion, system management, and secure connectivity functions. The -1 suffix identifies the device speed grade, while VF400 denotes its 400-ball package configuration.

An FPGA is a reconfigurable digital integrated circuit whose logic, interconnect, and I/O functions can be programmed after manufacture. Within the semiconductor hierarchy, the M2GL005-1VF400 belongs to the FPGA and CPLD class, using configurable logic blocks, programmable routing resources, memory, and I/O blocks. Compared with fixed-function logic ICs, this architecture allows design changes, field updates, and implementation of multiple control functions in one device.

The device provides approximately 6K logic elements and 169 I/O, making it suitable for low-density bridging, protocol conversion, peripheral interconnection, and embedded control tasks. Its 400-LFBGA package supports a high connection count for designs requiring substantial external signal access. The manufacturer identifies the M2GL005 family as being in production and recommends it for communications, industrial, and general-purpose programmable-logic applications.

The IGLOO2 architecture integrates programmable logic with embedded memory and configurable I/O. Engineers can map counters, state machines, datapaths, communication interfaces, and control functions into a compact device while retaining the flexibility to revise logic through reprogramming. Exact core voltage, memory capacity, supported I/O standards, and operating-temperature limits must be confirmed in the manufacturer datasheet before final schematic and timing closure.

Typical applications include industrial protocol bridges, embedded serial-interface adapters, I/O expansion, platform management logic, and secure-connectivity controllers. It is also appropriate for compact control modules that need parallel logic alongside programmable serial communication. Designs requiring higher logic density or numerous high-speed interfaces should be compared with larger IGLOO2 devices before committing the PCB footprint.

The principal hardware considerations are BGA escape routing, clean power and ground distribution, decoupling, and signal-integrity validation. Because the package exposes 400 balls, use the manufacturer's pin-information guide and package drawings for power, ground, configuration pins, and I/O placement. Preserve the prescribed configuration interface and program the device through a supported toolchain or embedded programming solution.

This page combines package, device-family, application, and replacement context with practical guidance for schematic capture, layout, programming, and migration decisions. It helps engineers distinguish electrically similar M2GL005 variants by package, grade, temperature designation, and qualification rather than treating every similarly named orderable part as a drop-in substitute.

直接替换替代料: M2GL005-1VF400 ——相同封装,引脚兼容。需要 PCB 改动的不同封装料号已排除。

本系列中的变体

可与以下型号直接替换的同系列型号: M2GL005-1VF400 (相同外形与封装尺寸) ——差异在于 Device Type, Package.

Microchip Technology
Device Type: IGLOO2 flash field-programmable gate array
Package: 400-pin VFBGA
对比 M2GL005-1VF400 →

M2GL005-1VF400I

✅ 直接替换
📦 400-LFBGA
Adds the industrial-temperature ordering suffix while retaining the 6K LEs, 169 I/O, -1 speed grade, and 400-LFBGA configuration.

📋 参考替代料(不在目录中)

M2GL005-VF400I

✅ 直接替换
Microchip Technology
📦 400-LFBGA
IGLOO2 flash field-programmable gate array · 6,060 cells · 1.2 V · 169 I/O · 400-pin VFBGA · 400-LFBGA · Surface mount · Embedded flash

联系询价

查看数据手册 →

M2GL005-VFG400I

✅ 直接替换
📦 400-LFBGA
Uses the VFG400 ordering code and I temperature suffix, providing a 400-ball package with the same M2GL005 low-density device family.

📋 参考替代料(不在目录中)

M2GL005S-1VFG400T2

✅ 直接替换
📦 400-LFBGA
Adds the S and T2 order codes to the 400-ball M2GL005 configuration; verify the T2 temperature grade and S-family electrical characteristics before substitution.

📋 参考替代料(不在目录中)

M2GL005-1VFG400

✅ 直接替换 ⚠️ 规格未核验
📦 400-LFBGA
Uses the VFG400 ordering code rather than VF400 while retaining the M2GL005, -1 speed-grade, and 400-ball device configuration.

📋 参考替代料(不在目录中)

M2GL005-1VF400 最大额定值与电气特性

Device Type IGLOO2 low-density field-programmable gate array (FPGA)
Logic Elements 6K logic elements
I/O Count 169 I/O
封装 400-LFBGA
Ball Count 400 balls
Ball Pitch 0.8 mm
Package Body Size 1.51 mm x 1.51 mm
安装类型 Surface mount
Programmable Logic Configurable FPGA logic and routing
RoHS 状态 Lead-free and RoHS compliant
生命周期状态 In production

M2GL005-1VF400 1.51 mm x 1.51 mm 引脚配置指南

M2GL005-1VF400(1.51 mm x 1.51 mm 封装)的引脚配置。 该数字 IC 包含 GPIO、通信接口(UART、SPI、I2C)和电源引脚。请参阅制造商数据手册以了解复用引脚功能和配置选项。对嵌入式系统设计和 PCB 布局至关重要。

M2GL005-1VF400 的 1.51 mm x 1.51 mm 封装引脚图

暂无详细引脚数据: M2GL005-1VF400.

请参阅 数据手册 以查看完整引脚配置。

典型应用

M2GL005-1VF400 适用于 6 应用s: Industrial Protocol Bridging, I/O Expansion and System Management, Secure Connectivity Controllers, Data Conversion Modules, Embedded Communications Equipment, Programmable Logic Consolidation.

🏭

Industrial Protocol Bridging

The M2GL005-1VF400 fits industrial bridges that translate between parallel and serial interfaces because its 6K logic elements can implement protocol state machines, buffering, and control logic while 169 I/O provide broad board-level connectivity. Place the FPGA between host processors and peripheral devices, then use dedicated logic for endian conversion, command framing, status detection, and fault recovery. The 400-LFBGA package supports numerous interface balls but requires careful escape routing and a stable power grid. Validate timing against the specific I/O standard and operating conditions before production release.

🔧

I/O Expansion and System Management

M2GL005-1VF400 is appropriate for I/O expansion and platform-management functions that require programmable behavior rather than fixed wiring. Its 6K logic elements can host counters, status registers, interrupt logic, watchdog functions, and sequencing controls, while 169 I/O allow the device to bridge multiple peripheral buses. Place it near the controlled I/O connectors and use the FPGA for deterministic glue logic between processors and discrete components. Keep configuration access and power sequencing deterministic so the management functions remain stable during reset and power-up sequences.

🌐

Secure Connectivity Controllers

The M2GL005-1VF400 can implement secure-connectivity controllers for communications equipment by combining programmable logic, protocol handling, and status monitoring in one reconfigurable device. The 6K logic-element density suits control planes, authentication-state machines, command filters, and data-path steering without requiring the resources of a larger FPGA. Use 169 I/O for external interfaces and the 400-LFBGA package for high pin availability. Security implementation must add the required key storage, update controls, tamper response, and protocol-specific safeguards rather than relying on the FPGA part number alone.

🖥️

Data Conversion Modules

M2GL005-1VF400 suits compact data-conversion modules that combine parallel interfaces, buffering, timing, and control in a single programmable device. The available 6K logic elements support format conversion, CRC generation, data alignment, and state-machine control, while 169 I/O can connect directly to external memory or parallel buses. Use the FPGA to simplify later format revisions without changing the PCB, provided the existing pin assignment and timing margins remain valid. Validate propagation delay, clock-domain crossings, and I/O drive requirements against the final interface specification.

📡

Embedded Communications Equipment

M2GL005-1VF400 fits embedded communications equipment that needs compact programmable control, protocol adaptation, and system supervision. Its 6K logic elements can implement framing, filtering, flow control, and diagnostics, while 169 I/O support processor and network-device connections. The 400-LFBGA package offers many signal contacts in a small surface-mount footprint, but multilayer routing, via-in-pad construction, and power-plane integrity become important layout considerations. Confirm supported I/O standards and timing performance in the manufacturer documentation for each external interface.

🧩

Programmable Logic Consolidation

M2GL005-1VF400 can consolidate several small fixed functions into one configurable logic device, including counters, timers, state machines, address decoding, and control interlocks. The 6K logic-element density allows implementation changes to be made through reprogramming rather than PCB respins, while the 169 I/O expose enough connections for mixed peripheral functions. Consolidate only after checking routing capacity and timing, because removing separate devices can create timing-density or I/O-bank constraints. Preserve a documented configuration path so the consolidated logic can be updated safely in production and field service.

推荐产品汇总

M2GL005S-1VFG400T2 Related 400-ball IGLOO2 device for protocol-bridge logic 用于: Industrial Protocol Bridging, Data Conversion Modules, Programmable Logic Consolidation M2GL005-1VF400I Industrial-temperature M2GL005 option 用于: Industrial Protocol Bridging, Secure Connectivity Controllers, Embedded Communications Equipment M2GL005-VFG400I Related 400-ball controller for system-management logic 用于: I/O Expansion and System Management, Embedded Communications Equipment M2GL005-VF400I Microchip Technology 用于: I/O Expansion and System Management, Data Conversion Modules M2GL005-1VFG400 Related M2GL005 connectivity-controller option 用于: Secure Connectivity Controllers, Programmable Logic Consolidation
What is the Microchip M2GL005-1VF400?
The Microchip Technology M2GL005-1VF400 is an IGLOO2 low-density FPGA with 6K logic elements, 169 I/O, and a 400-LFBGA package. It is intended for programmable bridging, I/O expansion, data conversion, system management, and secure-connectivity logic. Microchip lists the broader M2GL005 family as in production, and the device's combination of programmable logic and a high-ball-count package supports compact systems requiring numerous external connections.
Where can I download the M2GL005-1VF400 datasheet PDF?
The M2GL005-1VF400 datasheet PDF is available from Microchip through the IGLOO 2 FPGA and SmartFusion 2 SoC FPGA datasheet. The document covers electrical AC and DC specifications for the M2GL005 device family and multiple temperature grades. For package-specific information, use Microchip's IGLOO 2 FPGA Packaging and Pin Descriptions User Guide, which identifies bank assignments, mechanical information, and individual pin descriptions.
Where can I find the M2GL005-1VF400 pinout?
The authoritative M2GL005-1VF400 pinout appears in Microchip's IGLOO 2 FPGA Packaging and Pin Descriptions User Guide, identified as document DS0124 in its PDF title. Use the pin-information tables to locate power, ground, configuration, clock, and user I/O balls for the 400-LFBGA package. The manufacturer product page is the appropriate starting point for linking the target ordering code to the correct package and datasheet resources.
How many logic elements and I/O does M2GL005-1VF400 have?
The M2GL005-1VF400 contains approximately 6K logic elements and provides 169 I/O. These figures identify it as a low-density member of the IGLOO2 family rather than a high-density FPGA. Logic-element capacity helps determine the amount of combinational and sequential logic that can be implemented, while the 169 available I/O support board-level connections and programmable signal interfaces.
What package does the M2GL005-1VF400 use?
The M2GL005-1VF400 is supplied in a 400-LFBGA surface-mount package. Listings for this exact MPN identify the package as 400-LFBGA, with a 0.8 mm ball pitch and a 1.51 mm package body dimension. A 400-ball land pattern requires careful escape routing, so the PCB footprint and ball assignments should be taken directly from Microchip's mechanical package documentation.
Where can I buy M2GL005-1VF400 online?
Use the Request a Quote form on this page to request M2GL005-1VF400 availability, current commercial terms, and the correct orderable configuration. The form is the appropriate channel for an exact-MPN quote and avoids confusion with similarly named M2GL005 variants. Before requesting a shipment, confirm the 400-LFBGA footprint, grade suffix, temperature requirements, and quantity needed for your production schedule.
What is the price of M2GL005-1VF400?
Current pricing for the exact M2GL005-1VF400 should be requested through the Request a Quote form on this page. Commercial pricing can vary with quantity, inventory position, date code, and shipping requirements, so a static price may not represent the final order terms. Include your target quantity and delivery schedule with the request to obtain a current quotation.
What is the lead time for M2GL005-1VF400?
Request the current M2GL005-1VF400 lead time through the Request a Quote form on this page. Lead time depends on order quantity, package configuration, inventory availability, and production scheduling. Microchip identifies the M2GL005 family as being in production, but that status does not establish a delivery commitment for every quantity. A quote request provides the appropriate channel for a current schedule and allocation check.
Is M2GL005-1VF400 in stock?
Current stock status for M2GL005-1VF400 should be confirmed through the Request a Quote form on this page. Inventory can change independently of the manufacturer's in-production lifecycle status, particularly for BGA devices ordered in production quantities. State the required quantity, date-code preference, and delivery target in the request so the exact 400-LFBGA orderable part can be matched to available supply.
What is the best drop-in replacement for M2GL005-1VF400?
The closest drop-in candidates are M2GL005 variants using the same 400-ball package and 6K logic-element device family, but suffix changes can alter temperature grade, packaging, or qualification. Review the ordering-information table in the Microchip datasheet before substituting any candidate. A true drop-in replacement must preserve the footprint, pin functions, power requirements, speed grade, and operating-temperature range, not merely the M2GL005 family name.
Can M2GL005-1VF400I replace M2GL005-1VF400?
M2GL005-1VF400I may be electrically close to M2GL005-1VF400 because the added I suffix identifies an industrial-temperature ordering option, but it is only a drop-in replacement when its package, speed grade, pinout, and electrical limits match the installed design. Confirm the full ordering code and temperature grade in Microchip's device-selection tables. Do not infer identical qualification or lifecycle terms solely from the shared M2GL005-1VF400 base number.
When should I choose M2GL005-1VF400 over another IGLOO2 FPGA?
Choose M2GL005-1VF400 when a design needs roughly 6K logic elements, 169 I/O, and the 400-LFBGA footprint at the -1 speed grade. Consider a larger IGLOO2 member when the design exceeds the available logic or memory resources, and consider another package when 400-ball routing is unnecessary. The choice should follow resource utilization, I/O count, timing closure, thermal requirements, and PCB layout constraints.
Is M2GL005-1VF400 suitable for industrial and communications equipment?
M2GL005-1VF400 is suitable for communications, industrial, bridging, I/O expansion, and system-management designs when its logic, I/O, speed, temperature, and power specifications satisfy the system requirements. Microchip identifies the M2GL005 family as in production and specifically highlights communications and industrial uses. Confirm the exact temperature grade and relevant compliance documentation before releasing a production design.
What are the key specifications of M2GL005-1VF400 that engineers should know?
The key M2GL005-1VF400 specifications are its IGLOO2 low-density FPGA architecture, 6K logic elements, 169 I/O, -1 speed grade, and 400-LFBGA package with a 0.8 mm ball pitch. The 400-ball format supports extensive signal routing but demands careful PCB escape design. Core voltage, embedded-memory capacity, configuration details, I/O standards, and operating-temperature limits should be read from the manufacturer datasheet before design release.
What can replace the M2GL005-1VF400 FPGA?
The nearest replacements are exact-density M2GL005 orderable parts in the 400-ball package, including variants with an industrial-temperature suffix. Their suitability depends on whether the I, T2, F, and related order codes preserve temperature grade, qualification, package, pinout, and electrical characteristics. Cross-brand alternatives require a separate timing, resource, I/O, toolchain, and package review; a similar logic-element count alone does not establish drop-in compatibility.

工程参考数据: M2GL005-1VF400 ——对比、设计指导和合规信息。

选型指南

Choose M2GL005-1VF400 when the design needs an IGLOO2 FPGA with approximately 6K logic elements, 169 I/O, and a 400-LFBGA footprint, particularly for bridging, I/O expansion, system management, and compact communications logic. Choose M2GL005-1VF400I when the board requires the documented industrial-temperature ordering option and the remaining device characteristics match. M2GL005-VF400I and M2GL005-VFG400I are alternatives when their exact speed, temperature, qualification, and ordering characteristics satisfy the installation; review the manufacturer ordering table before substitution. M2GL005S-1VFG400T2 is useful when its S-family electrical characteristics and T2 temperature grade are appropriate. M2GL005-1VFG400 offers another close family option, but a final production decision must confirm footprint, pinout, supply compatibility, timing grade, and configuration support.

与替代料对比

参数 本产品 M2GL005-1VF400I M2GL005-VF400I M2GL005-VFG400I M2GL005S-1VFG400T2 M2GL005-1VFG400
Brand Microchip Technology Microchip Technology Microchip Technology Microchip Technology Microchip Technology Microchip Technology
Package 400-LFBGA 400-LFBGA 400-LFBGA 400-LFBGA 400-LFBGA 400-LFBGA
FPGA Family IGLOO2 IGLOO2 IGLOO2 IGLOO2 IGLOO2 IGLOO2

关键差异点

  • Combines low-density logic with extensive external connectivity (对比 M2GL005S-1VFG400T2)
  • Standard -1 speed-grade ordering (对比 M2GL005-VF400I)
  • Exact-family option with an industrial-temperature alternative (对比 M2GL005-1VF400I)

设计说明

Use the manufacturer's 400-LFBGA land pattern and ball-assignment documentation without translating coordinates between package revisions. The 0.8 mm ball pitch and 400-ball pin count require a multilayer PCB with controlled escape routing, appropriate via geometry, and direct access to power and ground balls. Place decoupling capacitors close to the applicable supply balls and avoid long return paths beneath high-speed or sensitive clock nets.

Assign clocks and high-speed interfaces to suitable I/O banks according to the IGLOO 2 pin-information guide. Route clocks away from switching and routing resources whose transitions could disturb timing margins. Maintain a continuous ground reference beneath high-speed links, use symmetric length matching where source-synchronous interfaces require it, and reserve unobstructed access for programming or configuration signals before finalizing the component placement.

Do not treat all M2GL005 order codes as interchangeable without checking the ordering-information table. The I suffix denotes an industrial-temperature option, while other letter changes can indicate package, qualification, or temperature differences. For a replacement, compare ball assignments, supply requirements, speed grade, temperature limits, configuration method, and supported I/O standards. Also verify that the programmed bitstream remains compatible with the alternate device configuration.

Complete timing and signal-integrity analysis with the final PCB stack-up rather than relying only on device-level timing summaries. Account for trace loss, return-path discontinuities, connector and package parasitics, and intended clock or data rates. If the FPGA implements clock-domain crossing, use the recommended asynchronous transfer method and constrain all related paths. Validate the design with the manufacturer's supported timing-analysis and programming tools.

合规信息

RoHS
Compliant
REACH
Unknown
AEC-Q100
Not Qualified
无铅
Yes
无卤
Unknown
冲突矿物
Unknown

The exact-MPN distributor listing identifies the device as lead-free and RoHS compliant. No automotive qualification, REACH statement, halogen-free declaration, or conflict-minerals statement was identified for this ordering code.

数据核验日期: 2026-11-05 ——数据由 XAIPART 元器件工程团队核验和整理

相关搜索

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相关元器件 & 术语

Microchip Technology M2GL005-1VF400 M2GL005-1VF400I M2GL005-VF400I M2GL005-VFG400I M2GL005S-1VFG400T2 M2GL005-1VFG400 IGLOO2 FPGA CPLD field-programmable gate array programmable logic logic elements 169 I/O 400-LFBGA BGA surface-mount package 0.8 mm ball pitch RoHS lead-free industrial temperature grade industrial communications protocol bridging I/O expansion system management secure connectivity data conversion programmable logic consolidation
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