M2GL005-1VF400 - 6K LEs, 169 I/O IGLOO2 FPGA | Microchip
Référence : M2GL005-1VF400 ✓ ActifM2GL005-1VF400 Présentation
An FPGA is a reconfigurable digital integrated circuit whose logic, interconnect, and I/O functions can be programmed after manufacture. Within the semiconductor hierarchy, the M2GL005-1VF400 belongs to the FPGA and CPLD class, using configurable logic blocks, programmable routing resources, memory, and I/O blocks. Compared with fixed-function logic ICs, this architecture allows design changes, field updates, and implementation of multiple control functions in one device.
The device provides approximately 6K logic elements and 169 I/O, making it suitable for low-density bridging, protocol conversion, peripheral interconnection, and embedded control tasks. Its 400-LFBGA package supports a high connection count for designs requiring substantial external signal access. The manufacturer identifies the M2GL005 family as being in production and recommends it for communications, industrial, and general-purpose programmable-logic applications.
The IGLOO2 architecture integrates programmable logic with embedded memory and configurable I/O. Engineers can map counters, state machines, datapaths, communication interfaces, and control functions into a compact device while retaining the flexibility to revise logic through reprogramming. Exact core voltage, memory capacity, supported I/O standards, and operating-temperature limits must be confirmed in the manufacturer datasheet before final schematic and timing closure.
Typical applications include industrial protocol bridges, embedded serial-interface adapters, I/O expansion, platform management logic, and secure-connectivity controllers. It is also appropriate for compact control modules that need parallel logic alongside programmable serial communication. Designs requiring higher logic density or numerous high-speed interfaces should be compared with larger IGLOO2 devices before committing the PCB footprint.
The principal hardware considerations are BGA escape routing, clean power and ground distribution, decoupling, and signal-integrity validation. Because the package exposes 400 balls, use the manufacturer's pin-information guide and package drawings for power, ground, configuration pins, and I/O placement. Preserve the prescribed configuration interface and program the device through a supported toolchain or embedded programming solution.
This page combines package, device-family, application, and replacement context with practical guidance for schematic capture, layout, programming, and migration decisions. It helps engineers distinguish electrically similar M2GL005 variants by package, grade, temperature designation, and qualification rather than treating every similarly named orderable part as a drop-in substitute.
Alternatives de remplacement direct pour M2GL005-1VF400 — même boîtier, compatible broche à broche. Les références à boîtier différent nécessitant une retouche du PCB sont exclues.
Variantes de cette série
Modèles de la même série directement compatibles avec M2GL005-1VF400 (même facteur de forme et même empreinte) — différant par Device Type, Package.
M2GL005-1VF400I
✅ Remplacement direct📋 Alternative de référence (hors catalogue)
M2GL005-VF400I
✅ Remplacement directContactez-nous pour le prix
Voir la fiche technique →M2GL005-VFG400I
✅ Remplacement direct📋 Alternative de référence (hors catalogue)
M2GL005S-1VFG400T2
✅ Remplacement direct📋 Alternative de référence (hors catalogue)
M2GL005-1VFG400
✅ Remplacement direct ⚠️ Spécifications non vérifiées📋 Alternative de référence (hors catalogue)
M2GL005-1VF400 Valeurs maximales et caractéristiques électriques
| Device Type | IGLOO2 low-density field-programmable gate array (FPGA) |
| Logic Elements | 6K logic elements |
| I/O Count | 169 I/O |
| Boîtier | 400-LFBGA |
| Ball Count | 400 balls |
| Ball Pitch | 0.8 mm |
| Package Body Size | 1.51 mm x 1.51 mm |
| Type de montage | Surface mount |
| Programmable Logic | Configurable FPGA logic and routing |
| Statut RoHS | Lead-free and RoHS compliant |
| Statut du cycle de vie | In production |
Guide de configuration des broches du M2GL005-1VF400 1.51 mm x 1.51 mm
Configuration des broches du M2GL005-1VF400 (boîtier 1.51 mm x 1.51 mm). Ce circuit intégré numérique comprend des GPIO, des interfaces de communication (UART, SPI, I2C) et des broches d'alimentation. Consultez la fiche technique du fabricant pour les fonctions alternatives des broches et les options de configuration. Indispensable pour la conception de systèmes embarqués et la conception de circuits imprimés.
Aucune donnée de brochage détaillée disponible pour M2GL005-1VF400.
Consultez la fiche technique pour la configuration complète des broches.
Applications typiques
M2GL005-1VF400 convient pour 6 applications: Industrial Protocol Bridging, I/O Expansion and System Management, Secure Connectivity Controllers, Data Conversion Modules, Embedded Communications Equipment, Programmable Logic Consolidation.
Industrial Protocol Bridging
The M2GL005-1VF400 fits industrial bridges that translate between parallel and serial interfaces because its 6K logic elements can implement protocol state machines, buffering, and control logic while 169 I/O provide broad board-level connectivity. Place the FPGA between host processors and peripheral devices, then use dedicated logic for endian conversion, command framing, status detection, and fault recovery. The 400-LFBGA package supports numerous interface balls but requires careful escape routing and a stable power grid. Validate timing against the specific I/O standard and operating conditions before production release.
Recommandé
I/O Expansion and System Management
M2GL005-1VF400 is appropriate for I/O expansion and platform-management functions that require programmable behavior rather than fixed wiring. Its 6K logic elements can host counters, status registers, interrupt logic, watchdog functions, and sequencing controls, while 169 I/O allow the device to bridge multiple peripheral buses. Place it near the controlled I/O connectors and use the FPGA for deterministic glue logic between processors and discrete components. Keep configuration access and power sequencing deterministic so the management functions remain stable during reset and power-up sequences.
Recommandé
Secure Connectivity Controllers
The M2GL005-1VF400 can implement secure-connectivity controllers for communications equipment by combining programmable logic, protocol handling, and status monitoring in one reconfigurable device. The 6K logic-element density suits control planes, authentication-state machines, command filters, and data-path steering without requiring the resources of a larger FPGA. Use 169 I/O for external interfaces and the 400-LFBGA package for high pin availability. Security implementation must add the required key storage, update controls, tamper response, and protocol-specific safeguards rather than relying on the FPGA part number alone.
Recommandé
Data Conversion Modules
M2GL005-1VF400 suits compact data-conversion modules that combine parallel interfaces, buffering, timing, and control in a single programmable device. The available 6K logic elements support format conversion, CRC generation, data alignment, and state-machine control, while 169 I/O can connect directly to external memory or parallel buses. Use the FPGA to simplify later format revisions without changing the PCB, provided the existing pin assignment and timing margins remain valid. Validate propagation delay, clock-domain crossings, and I/O drive requirements against the final interface specification.
Recommandé
Embedded Communications Equipment
M2GL005-1VF400 fits embedded communications equipment that needs compact programmable control, protocol adaptation, and system supervision. Its 6K logic elements can implement framing, filtering, flow control, and diagnostics, while 169 I/O support processor and network-device connections. The 400-LFBGA package offers many signal contacts in a small surface-mount footprint, but multilayer routing, via-in-pad construction, and power-plane integrity become important layout considerations. Confirm supported I/O standards and timing performance in the manufacturer documentation for each external interface.
Recommandé
Programmable Logic Consolidation
M2GL005-1VF400 can consolidate several small fixed functions into one configurable logic device, including counters, timers, state machines, address decoding, and control interlocks. The 6K logic-element density allows implementation changes to be made through reprogramming rather than PCB respins, while the 169 I/O expose enough connections for mixed peripheral functions. Consolidate only after checking routing capacity and timing, because removing separate devices can create timing-density or I/O-bank constraints. Preserve a documented configuration path so the consolidated logic can be updated safely in production and field service.
Recommandé
Récapitulatif des produits recommandés
Données de référence d'ingénierie pour M2GL005-1VF400 — comparaison, recommandations de conception et informations de conformité.
Guide de sélection
Comparaison avec les alternatives
| Paramètre | Ce produit | M2GL005-1VF400I | M2GL005-VF400I | M2GL005-VFG400I | M2GL005S-1VFG400T2 | M2GL005-1VFG400 |
|---|---|---|---|---|---|---|
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| Package | 400-LFBGA | 400-LFBGA | 400-LFBGA | 400-LFBGA | 400-LFBGA | 400-LFBGA |
| FPGA Family | IGLOO2 | IGLOO2 | IGLOO2 | IGLOO2 | IGLOO2 | IGLOO2 |
Principaux différenciateurs
- Combines low-density logic with extensive external connectivity (vs M2GL005S-1VFG400T2)
- Standard -1 speed-grade ordering (vs M2GL005-VF400I)
- Exact-family option with an industrial-temperature alternative (vs M2GL005-1VF400I)
Notes de conception
Use the manufacturer's 400-LFBGA land pattern and ball-assignment documentation without translating coordinates between package revisions. The 0.8 mm ball pitch and 400-ball pin count require a multilayer PCB with controlled escape routing, appropriate via geometry, and direct access to power and ground balls. Place decoupling capacitors close to the applicable supply balls and avoid long return paths beneath high-speed or sensitive clock nets.
Assign clocks and high-speed interfaces to suitable I/O banks according to the IGLOO 2 pin-information guide. Route clocks away from switching and routing resources whose transitions could disturb timing margins. Maintain a continuous ground reference beneath high-speed links, use symmetric length matching where source-synchronous interfaces require it, and reserve unobstructed access for programming or configuration signals before finalizing the component placement.
Do not treat all M2GL005 order codes as interchangeable without checking the ordering-information table. The I suffix denotes an industrial-temperature option, while other letter changes can indicate package, qualification, or temperature differences. For a replacement, compare ball assignments, supply requirements, speed grade, temperature limits, configuration method, and supported I/O standards. Also verify that the programmed bitstream remains compatible with the alternate device configuration.
Complete timing and signal-integrity analysis with the final PCB stack-up rather than relying only on device-level timing summaries. Account for trace loss, return-path discontinuities, connector and package parasitics, and intended clock or data rates. If the FPGA implements clock-domain crossing, use the recommended asynchronous transfer method and constrain all related paths. Validate the design with the manufacturer's supported timing-analysis and programming tools.
Informations de conformité
The exact-MPN distributor listing identifies the device as lead-free and RoHS compliant. No automotive qualification, REACH statement, halogen-free declaration, or conflict-minerals statement was identified for this ordering code.
