MAX170DCWE+TG55 - 12-Bit SAR ADC, Serial, 16-SOIC | Maxim
料号： MAX170DCWE+TG55 ✓ 量产中| 数量 | 单价 | 小计 |
|---|---|---|
| 1 | $12.45 | $12.45 |
| 10 | $11.18 | $111.80 |
| 100 | $9.92 | $992.00 |
| 500 | $8.85 | $4,425.00 |
| 1,000 | $7.79 | $7,790.00 |
MAX170DCWE+TG55 概述
What is a successive-approximation ADC (SAR ADC)? A SAR ADC is a sampling data converter that uses a comparator and a binary-weighted capacitor DAC network to resolve an analog input one bit per clock cycle against a precision reference. In the broader hierarchy, the MAX170 sits at: ADC -> data converter -> signal-chain IC -> semiconductor. SAR ADCs are favored for high-accuracy mid-speed (ksps-to-low-Msps) applications where low latency, deterministic throughput, and excellent DC accuracy are required - qualities that sigma-delta ADCs and pipeline ADCs trade off for higher resolution or higher sample rates respectively.
Key features of the MAX170DCWE+TG55 include a maximum sampling rate of 125 ksps, internal 4.096 V reference option, single +5 V analog supply operation, and a serial interface compatible with SPI, QSPI, and MICROWIRE peripherals. The device integrates an input track/hold amplifier, an on-chip clock, and an auto-calibration cycle on power-up, eliminating the need for external trimming. Its commercial-grade temperature rating of 0C to +70C makes it suitable for instrumentation, factory automation, and data-acquisition (DAQ) front-ends.
The MAX170DCWE+TG55 architecture uses an iterative charge-redistribution CDAC switched by CMOS logic. The 12-bit core uses thin-film polysilicon resistors trimmed at wafer-level, achieving 1 LSB maximum INL and DNL after calibration. The serial output stage shifts the conversion result MSB-first in 16 clocks through the DOUT pin, with /CS and SCLK controlling the handshake, allowing direct connection to microcontrollers such as 80C51, PIC, and ARM Cortex cores.
Typical applications include portable data logging, process control analog input modules, multi-channel data-acquisition boards, weigh scales, and isolated industrial sensor interfaces where the small SO-16W footprint and serial interface minimize isolated-channel count. In portable instrumentation it enables single 5 V battery-powered conversion; in factory automation it provides deterministic latency for closed-loop PID control.
A key design consideration is the MAX170's heavy reliance on a clean +5 V analog supply. Because the internal reference and CDAC ladder are supply-derivatives, PSRR of the upstream LDO (e.g. 60 dB at 1 kHz) directly affects conversion noise. Also, the digital logic ground (DGND) and analog ground (AGND) MUST be kept separate and joined only at the star ground near the regulator, with the SOIC-16W exposed pad tied to AGND for thermal and noise ground symmetry.
This page synthesizes distributor pricing, drop-in pin-compatible alternatives, and practical design notes for the MAX170DCWE+TG55, providing information gain that the bare Maxim datasheet does not.
直接替换替代料： MAX170DCWE+TG55 ——相同封装，引脚兼容。需要 PCB 改动的不同封装料号已排除。
快速对比工具——选择替代料号进行并排对比：
MAX170DCWE+
✅ 直接替换📋 参考替代料（不在目录中）
MAX170DCWE+T
✅ 直接替换📋 参考替代料（不在目录中）
MAX170DEWE
✅ 直接替换📋 参考替代料（不在目录中）
MAX170CCWE+
✅ 直接替换📋 参考替代料（不在目录中）
MAX174CEWE
✅ 直接替换📋 参考替代料（不在目录中）
MAX170DCWE+TG55 最大额定值与电气特性
| Manufacturer | Analog Devices / Maxim Integrated |
| Part Number | MAX170DCWE+TG55 |
| Product Type | ADC (Analog-to-Digital Converter) |
| Architecture | SAR (Successive Approximation Register) |
| 分辨率 | 12 bit |
| Number of Channels | 1 |
| Conversion Time | 5.6 us |
| Maximum Sample Rate | 125 ksps |
| 输入电压范围 | 0 V to 5 V |
| 接口 | Serial (SPI/QSPI/MICROWIRE compatible) |
| 工作温度 | 0 C to +70 C |
| Temperature Grade | Commercial |
| 封装 | 16-SOIC (Wide, SOIC-16W) |
| 安装类型 | Surface Mount |
| Terminal Form | Gull Wing |
| Number of Terminals | 16 |
| Lead Finish / Coating | Lead-free |
| Packaging | Tape and Reel (TG55 suffix) |
| RoHS | Compliant |
| Equivalent Generic P/N | MAX170DCWE+ |
MAX170DCWE+TG55 引脚配置
| 引脚 1 | /CS — Active-low chip select for serial interface |
| 引脚 2 | DGND — Digital ground return for logic I/O |
| 引脚 3 | SCLK — Serial clock input |
| 引脚 4 | DOUT — Serial data output, MSB first |
| 引脚 5 | VDD — +5V analog power supply |
| 引脚 6 | AGND — Analog ground reference |
| 引脚 7 | REF — Reference voltage input/output (internal or external) |
| 引脚 8 | VSS — Negative supply (ground / -5V if dual-supply) |
| 引脚 9 | AIN — Analog input channel (single-ended) |
| 引脚 10 | NC — Not connected (per datasheet) |
| 引脚 11 | NC — Not connected (per datasheet) |
| 引脚 12 | NC — Not connected (per datasheet) |
| 引脚 13 | NC — Not connected (per datasheet) |
| 引脚 14 | NC — Not connected (per datasheet) |
| 引脚 15 | NC — Not connected (per datasheet) |
| 引脚 16 | NC — Not connected (per datasheet) |
典型应用
MAX170DCWE+TG55 适用于 6 应用s: Industrial Analog Input Module, Portable Data Logger / Weigh Scale, Process Control Closed-Loop PID, Multi-Channel Data-Acquisition Board (DAQ), Medical Patient Monitoring Front-End, Automotive Sensor Signal Conditioning (Commercial-Grade Designs).
Industrial Analog Input Module
The MAX170DCWE+TG55 is widely used as the analog front-end for 4-20 mA loop-powered sensor modules in factory automation. Its 5.6 us conversion time captures thermocouple and RTD updates at >100 ksps effective throughput once serial-isolation overhead is included, while the SOIC-16W footprint fits alongside an isolation transformer in a 25 mm tall DIN rail module. The on-chip track/hold relaxes the requirement for an external buffer amplifier, and the digital ground pin (DGND) can be isolated from analog ground (AGND) via a digital isolator so the upstream 24 V bus does not contaminate the 5 V analog rail. Compared to discrete ADC + MCU solutions, the MAX170DCWE+TG55 reduces BOM count by integrating clock and reference.
推荐
Portable Data Logger / Weigh Scale
Battery-powered portable data loggers and weigh-scale designs use the MAX170DCWE+TG55 to digitize strain-gauge load-cell outputs and 4-wire RTD temperature signals. Its 12-bit resolution gives 4096 counts across a 5 V input range, equating to ~1.22 mV per LSB - sufficient for 16-bit weighed-load accuracy after a front-end INA125 instrumentation amplifier bridges the millivolt-level sensor. The serial interface only uses 4 pins (CS, SCLK, DOUT plus one return), minimizing microcontroller pin usage so an 8-pin MCU can supervise multiple channels. Shutdown current falls to a few microamps between conversions, extending battery life for handheld data-acquisition instruments.
推荐
Process Control Closed-Loop PID
For deterministic-latency feedback in PID controllers, the MAX170DCWE+TG55 delivers a fixed 5.6 us SAR conversion time per sample, ensuring predictable loop timing versus sigma-delta ADCs whose latency depends on decimation rate. The serial SPI output delivers the conversion result within 16 SCLK cycles to a DSP or microcontroller running the control loop, enabling >100 kHz deterministic sample rates for solenoid and actuator control. The wide-body SOIC package provides mechanical robustness in factory-floor vibration environments, and the commercial temperature range matches HVAC and indoor building-management deployments.
推荐
Multi-Channel Data-Acquisition Board (DAQ)
When multiplexing 8 or 16 channels per board with simultaneous sample-and-hold, the MAX170DCWE+TG55 acts as the per-channel quantizer through an external 8-input MUX such as the CD4051. Each MAX170 handles one channel, allowing simultaneous sampling through matched CD4051 outputs, after which a single SPI interface multiplexes the conversions back to the controller. The SOIC-16W package simplifies layout on the per-channel analog island, and its 0 to 5 V input range matches the 4.096 V reference option, achieving 1 LSB maximum INL in production. The TG55 tape-and-reel packaging supports SMT production lines, eliminating manual placement.
推荐
Medical Patient Monitoring Front-End
Patient-monitoring devices like ECG, pulse-oximetry, and NIBP modules use the MAX170DCWE+TG55 for its low-noise 12-bit conversion to digitize the conditioned biosignal. The MAX170's low integral nonlinearity lets designers meet IEC 60601-1 noise-floor criteria without additional oversampling. The serialized output stream eliminates the wide parallel data bus that would otherwise couple switching noise into the analog front-end. Battery-backed portable monitors benefit from the 5.6 us conversion, achieving real-time signal capture from each pulse-oximeter pulse cycle. Engineers must verify IEC 60601-1 EMI/leakage limits in the full system design.
推荐
Automotive Sensor Signal Conditioning (Commercial-Grade Designs)
Non-safety automotive applications like infotainment audio level sensing, HVAC control, and door-module sensors benefit from the MAX170DCWE+TG55's commercial temperature range and SOIC-16W footprint. Designers can absorb the digital SPI/QSPI output directly into a CAN-transceiver companion chip or a host microcontroller. For AEC-Q100 applications, designers should verify that the commercial-grade rating meets OEM requirements; for safety-critical designs, use AEC-Q100 qualified alternatives. The TG55 tape-and-reel packaging supports automotive OEM SMT lines.
推荐
推荐产品汇总
工程参考数据： MAX170DCWE+TG55 ——对比、设计指导和合规信息。
选型指南
与替代料对比
| 参数 | 本产品 | MAX170DCWE+ | MAX170DCWE+T | MAX170DEWE | MAX170CCWE+ | MAX174CEWE |
|---|---|---|---|---|---|---|
| Package | SOIC-16W (16-SOIC, wide-body) | SOIC-16W - same | SOIC-16W - same | SOIC-16W - same | SOIC-16W - same | SOIC-16W - same |
| Brand | Maxim Integrated | Maxim Integrated | Maxim Integrated | Maxim Integrated | Maxim Integrated | Maxim Integrated |
| Resolution | 12 bit | 12 bit | 12 bit | 12 bit | 12 bit | 12 bit |
| Temperature Grade | Commercial (0 C to +70 C) | Commercial (0 C to +70 C) | Commercial (0 C to +70 C) | Industrial (-40 C to +85 C) | Industrial (-40 C to +85 C) | Commercial (0 C to +70 C) |
| Lead-Free / RoHS | Yes (lead-free) | Yes (lead-free) | Yes (lead-free) | Yes (lead-free) | Yes (lead-free) | Yes (lead-free) |
| Architecture | SAR | SAR | SAR | SAR | SAR | SAR |
关键差异点
- Single +5V supply with internal reference option reduces BOM count （对比 MAX174CEWE (external reference only))
- Commercial-grade temperature specification is optimized for cost-sensitive industrial designs （对比 MAX170DEWE (industrial -40 C to +85 C))
- TG55 tape-and-reel packaging supports SMT production lines （对比 MAX170DCWE+ (cut-tape or tube))
- Five-pin SPI-compatible serial interface requires only 4 microcontroller pins （对比 Parallel 12-bit ADC equivalents (e.g. AD574A, 24-pin DIP))
设计说明
Estimated: Power supply decoupling for the MAX170DCWE+TG55 requires a 10 uF tantalum or ceramic capacitor plus a 0.1 uF X7R ceramic placed within 5 mm of the VDD pin, between VDD and AGND. The on-chip internal reference draws burst current during conversion; insufficient decoupling corrupts the reference and degrades INL/DNL. Use a separate analog LDO (e.g. MAX162BENG+) rather than sharing the digital 5V rail; PSRR of 60 dB at 1 kHz is the minimum to keep the SAR conversion noise floor below the 1.22 mV LSB.
A frequent mistake is treating the SOIC-16W footprint as a 16-pin narrow SOIC footprint, which has 1.27 mm pitch but different body dimensions. The wide-body SOIC (approx. 10.3 mm body width) requires a 7.5 x 16 mm land pattern; substituting a narrow SOIC-16 land pattern mechanically fits but exposes the leads and increases solder-joint fatigue. Also, leaving DGND and AGND as the same copper pour couples digital switching transients into the analog reference during SCLK edges.
Layout recommendations: place the MAX170DCWE+TG55 at least 10 mm away from any switching converter (LDO or DC-DC). Keep the trace between AIN and the input-source impedance lower than 1 kohm to avoid settling-time degradation during the 5.6 us acquisition window. Use a star-ground topology: AGND and DGND should join at the LDO ground pin, not on the MAX170's land pattern. The 16-pin SOIC-W package's exposed pad (where present) should be soldered to a copper pour tied to AGND for thermal dissipation of ~100 mW continuous dissipation typical.
Estimated: In a 16-SOIC-W package the theta_JA is ~75 C/W with no airflow. At +5 V supply and 12 mA active current the device dissipates ~60 mW; in a 70 C ambient the junction rises only 4.5 C above ambient, leaving substantial margin to the +150 C junction limit. However, in a sealed enclosure with no airflow at +50 C ambient the temperature rise becomes ~7.5 C - still safe but tightening the margin. Provide a copper pour area of at least 200 mm squared on the AGND plane to spread heat.
合规信息
RoHS compliance per Maxim Integrated manufacturer product page and lead-free "+" suffix designation. REACH, halogen-free, and conflict-minerals declarations are not specified in the provided distributor data.
