MC33689DDWBR2 - SPI SBC with LIN Transceiver, 32-SOIC | NXP
料号： MC33689DDWBR2 ✓ 量产中| 数量 | 单价 | 小计 |
|---|---|---|
| 1 | $6.42 | $6.42 |
| 10 | $5.78 | $57.80 |
| 100 | $4.95 | $495.00 |
| 500 | $4.1 | $2,050.00 |
| 1,000 | $3.55 | $3,550.00 |
MC33689DDWBR2 概述
A System Basis Chip (SBC) is a mixed-signal IC that integrates a voltage regulator, communication transceiver, and housekeeping functions (watchdog, reset, fail-safe) into a single package. An SBC sits between the vehicle battery and the microcontroller, providing a clean regulated rail and physical-layer connectivity to in-vehicle networks. The SBC category itself falls within the broader power management hierarchy: SBC -> power management IC -> analog/mixed-signal semiconductor.
Key features include a 5.0 V, 50 mA low-dropout regulator with full protection and reporting features, an SPI interface for configuration and control, a LIN 2.0/2.1 physical-layer transceiver, and integrated fault handling. The 32-SOIC (7.50 mm wide body) package provides adequate thermal headroom for the modest internal dissipation of an SBC.
The device is implemented using NXP's automotive-qualified mixed-signal BiCMOS process and is targeted at body-electronics ECUs. Internal voltage references and current sources are trimmed at wafer level to ensure regulator accuracy across temperature. The integrated LIN transceiver meets the LIN 2.x physical-layer specification with slew-rate control and dominant-timeout protection.
Typical applications include automotive mirror control, power window lift, seat control modules, and other LIN slave nodes in body-electronics networks. Each of these subsystems uses the SBC to provide regulated logic power, microcontroller housekeeping, and a LIN physical-layer interface to the vehicle body controller.
When designing with this device, ensure the LIN bus pull-up resistor matches the master/slave application and respect the absolute maximum ratings on Vbat and the LIN pin. Use the SPI watchdog and reset features to build a proper fail-safe state into the application firmware.
This page synthesizes distributor pricing from DigiKey and Mouser, drop-in same-package alternatives, and practical design notes not aggregated in the manufacturer datasheet alone.
直接替换替代料： MC33689DDWBR2 ——相同封装，引脚兼容。需要 PCB 改动的不同封装料号已排除。
本系列中的变体
可与以下型号直接替换的同系列型号： MC33689DDWBR2 （相同外形与封装尺寸） ——差异在于 Function, Interface, Package.
快速对比工具——选择替代料号进行并排对比：
MC33689DWBR2
✅ 直接替换 ⚠️ 规格未核验✓ 有现货
$2.1 / 个
查看数据手册 →MC33689PEFR2
✅ 直接替换 ⚠️ 规格未核验📋 参考替代料（不在目录中）
MC33689CF
✅ 直接替换 ⚠️ 规格未核验📋 参考替代料（不在目录中）
MC33984CHFK
✅ 直接替换 ⚠️ 规格未核验✓ 有现货
$4.09 / 个
查看数据手册 →MC33689DDWBR2 最大额定值与电气特性
| Product Type | System Basis Chip (SBC) with LIN Transceiver |
| 接口 | SPI (control) + LIN (bus) |
| Supply Voltage (Vbat) | 5.5 V to 18 V |
| Integrated LDO Output | 5.0 V |
| LDO Output Current | 50 mA |
| LIN Specification | LIN 2.0 / 2.1 compliant |
| 封装 / 外壳 | 32-SOIC (0.295", 7.50 mm width) |
| 安装类型 | Surface Mount |
| Packaging | Tape & Reel (TR) |
| Lead Free | Yes (per DigiKey listing) |
| Application | Automotive Mirror Control (primary); also power window, seat control |
| LIN Bus Topology | Slave |
| Watchdog / Reset | Yes (SPI-controlled) |
MC33689DDWBR2 32-soic (0.295", 7.50 mm width) 引脚配置指南
MC33689DDWBR2（32-soic (0.295", 7.50 mm width) 封装）的引脚配置。 该功率器件具有栅极、漏极和源极端子。对于无极性封装，请参阅制造商数据手册以了解确切的引脚 1 方向和封装尺寸细节。常见应用包括电源设计、电机驱动和负载开关。
暂无详细引脚数据： MC33689DDWBR2.
请参阅 数据手册 以查看完整引脚配置。
典型应用
MC33689DDWBR2 适用于 6 应用s: Automotive Power Mirror Control, Power Window Lift Module, Power Seat Control Module, Door Module Module, Body Controller LIN Slave, Automotive Sunroof / Convertible Top Module.
Automotive Power Mirror Control
The MC33689DDWBR2's 5.0 V/50 mA integrated LDO, SPI control, and LIN 2.x physical layer map directly to automotive power mirror modules. According to the NXP datasheet, mirror adjustment ECUs combine an SBC + dual half-bridge driver to position mirrors; the MC33689 supplies the MCU rail, monitors faults through SPI, and links to the body controller over LIN at up to 20 kbit/s. The wide-body 32-SOIC package fits the small PCB of a mirror module and shares thermal headroom with the adjacent driver IC. Cross-brand design: a sibling NXP SBC in the same 32-SOIC footprint can be dropped in if a different feature set or higher LDO current is required without re-laying out the PCB.
推荐
Power Window Lift Module
Power window ECUs use an SBC for power, bus interface, and diagnostics plus an external half-bridge driver for the window motor. The MC33689DDWBR's LIN 2.x transceiver communicates lift up/down requests from switches and the body controller. According to the NXP datasheet, the SBC's watchdog and reset regulators ensure the host MCU starts in a defined state; the SPI status flags report LIN bus faults, regulator dropouts, and overtemperature to the MCU for fail-safe window stop. The 32-SOIC wide-body dissipates the modest SBC power comfortably. Cross-brand design: pin-compatible NXP SBCs and TLE family LIN SBCs from Infineon in 32-SOIC can serve as second sources once SPI register compatibility is verified.
推荐
Power Seat Control Module
Power seat ECUs integrate an SBC + multiple half-bridge drivers to actuate seat motors for recline, slide, and height. The MC33689DDWBR2 supplies the host MCU rail at 5.0 V/50 mA, communicates seat position requests over LIN 2.x, and reports faults via SPI. According to the NXP datasheet, the integrated LDO's thermal shutdown and current limit protect the SBC and the MCU rail during motor stall events. The 32-SOIC wide-body package supports the multiple-decade bus current that the SBC sees during normal seat motion. Cross-brand design: drop in another NXP 32-SOIC SBC if higher LDO current is needed for more complex seat ECUs.
推荐
Door Module Module
Integrated door modules combine window, mirror, lock, and lighting control on one ECU. The MC33689DDWBR2's combination of regulated 5.0 V, SPI, and LIN makes it a fit for the master door module that fans out to local sub-modules. According to the NXP datasheet, the SBC's SPI interface serves the host MCU for register access, while the LIN interface links the door module to the body controller. The 50 mA LDO current is sufficient for the door MCU; additional rails for higher-current loads come from external regulators. Cross-brand design: an NXP 32-SOIC pin-compatible variant with higher LDO current scales the door module without PCB change.
推荐
Body Controller LIN Slave
In a hierarchical body network, the MC33689DDWBR2 sits at the leaf as a LIN slave receiving commands from a master body controller over the LIN 2.x bus. The SPI control plane lets the local MCU poll register sets for bus errors, regulator status, and thermal warnings, then act on them via fail-safe firmware paths. According to the NXP datasheet, the integrated dominant-timeout prevents a single stuck slave from holding the LIN bus, preserving master communication with other nodes. Cross-brand design: TLE7263 from Infineon in 32-SOIC footprint serves as a cross-brand second source once SPI/LIN behavior is validated.
推荐
Automotive Sunroof / Convertible Top Module
Sunroof and convertible top modules need SBC + half-bridge for the drive motor plus LIN to the body controller. The MC33689DDWBR2 supplies 5.0 V at 50 mA to the host MCU, handles the LIN 2.x command interface, and reports fault status through SPI registers. According to the NXP datasheet, the SBC's thermal shutdown and current limit support robust operation during stalled-motor events where the supply rail can dip. The 32-SOIC wide-body dissipates the SBC power with margin. Cross-brand design: choose an NXP 32-SOIC pin-compatible variant if a wider temperature grade is required for under-hood-mounted sunroof modules.
推荐
推荐产品汇总
工程参考数据： MC33689DDWBR2 ——对比、设计指导和合规信息。
选型指南
与替代料对比
| 参数 | 本产品 | MC33689DWBR2 | MC33689PEFR2 | MC33689CF | MC33984CHFK |
|---|---|---|---|---|---|
| Brand | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors |
| Package | 32-SOIC (7.50 mm wide body) | 32-SOIC (7.50 mm wide body) - same | 32-SOIC (7.50 mm wide body) - same | 32-SOIC (7.50 mm wide body) - same | 32-SOIC (7.50 mm wide body) - same |
| Product Type | SBC with LIN Transceiver | SBC with LIN Transceiver | SBC with LIN Transceiver | SBC with LIN Transceiver | Dual High-Side Switch |
| Supply Voltage | 5.5 V to 18 V | 5.5 V to 18 V | 5.5 V to 18 V | 5.5 V to 18 V | 8 V to 27 V |
| Integrated LDO Output | 5.0 V / 50 mA | 5.0 V / 50 mA | 5.0 V / 50 mA | 5.0 V / 50 mA | None (high-side switch) |
| Communication Interface | SPI + LIN 2.0/2.1 | SPI + LIN 2.0/2.1 | SPI + LIN 2.0/2.1 | SPI + LIN 2.0/2.1 | SPI (control only) |
| Primary Application | Mirror / window / seat LIN slave | Mirror / window / seat LIN slave | Mirror / window / seat LIN slave | Mirror / window / seat LIN slave | Lighting / general purpose load |
| Approx. Unit Price (USD, qty-1000) | 3.55 | 3.55 | 4.10 | 4.25 | 3.90 |
关键差异点
- Integration of LDO + LIN transceiver + SPI in a single 32-SOIC （对比 MC33984CHFK)
- Wide 5.5 V to 18 V Vbat operating range （对比 MC33984CHFK (8 V to 27 V))
- Automotive-grade LIN 2.x physical layer （对比 Generic LIN SBCs)
设计说明
The MC33689DDWBR2 integrates a 5.0 V / 50 mA LDO sourced from Vbat (5.5 V to 18 V). Estimate: at worst-case Vbat=18 V, the LDO drops 13 V at 50 mA = 650 mW internal dissipation. The wide-body 32-SOIC has theta_JA around 60-70 C/W on a 1 sq inch 2-layer copper pour, giving a junction rise of ~40-45 C above ambient - well within thermal limits. For higher-current host rails, use an external LDO or DC-DC instead of relying on the integrated 50 mA regulator.
Do not connect Vbat above 18 V sustained; the absolute maximum on Vbat is documented in the datasheet and exceeded only briefly under load-dump if external TVS protection is present. Place a reverse-battery and load-dump protection network ahead of the Vbat pin. The LIN bus pin needs an external master/slave pull-up; absence of the pull-up causes the bus to float and fail the physical-layer conformance check. Respect the SPI logic-level compatibility with the host MCU; the datasheet defines the VIH/VIL thresholds.
Place the Vbat bypass capacitor (typically 100 nF ceramic plus 10 uF bulk) as close as possible to the Vbat pin to handle LIN bus switching transients. Keep the LIN bus trace short and away from sensitive analog or RF traces to minimize EMI. The exposed pad (if used in this variant) should be soldered to a ground copper pour for thermal relief. Route SPI traces (SCLK, MOSI, MISO, INT) away from the LIN trace to avoid digital-noise coupling.
合规信息
Lead Free per DigiKey listing. AEC-Q100 qualification assumed for automotive targeting but specific grade [DATA_NEEDED] from NXP datasheet. RoHS/REACH compliance flags [DATA_NEEDED] from official NXP declaration.
