MC33689DWBR2 - SPI System Basis Chip with LIN Transceiver | NXP
料号： MC33689DWBR2 ✓ 量产中| 数量 | 单价 | 小计 |
|---|---|---|
| 1 | $3.92 | $3.92 |
| 10 | $3.52 | $35.20 |
| 100 | $2.95 | $295.00 |
| 500 | $2.45 | $1,225.00 |
| 1,000 | $2.1 | $2,100.00 |
MC33689DWBR2 概述
What is a System Basis Chip (SBC)? An SBC is an automotive-grade mixed-signal IC that consolidates the housekeeping functions normally handled by discrete power, communication, and monitoring components. It sits between the 12V automotive battery, the microcontroller, and the LIN bus, providing a regulated MCU supply, watchdog supervision, fail-safe output drivers, and physical-layer connectivity in a single package. Hierarchically, the MC33689 belongs to the power management IC family > analog/mixed-signal IC > system basis chip > SBC with LIN.
Key features of the MC33689DWBR2 include a wide 5.5V to 18V supply range (with 27V load-dump transient tolerance), an integrated SPI interface for diagnostic and configuration access, dedicated LIN 2.0/2.1/SAE J2602 physical layer compliant transceiver, configurable watchdog window, and reset generation with selectable timing. The wide-body 32-SOIC package provides generous creepage distance and is suitable for automotive PCB assemblies using through-hole or SOIC sockets.
The device is built on NXP's SMARTMOS BCD process technology, integrating analog and digital circuitry on a single die for reliability under harsh automotive environments. Built-in protection includes thermal shutdown, load-dump transient survival, short-circuit limiting on regulated outputs, and reverse-battery protection via external resistor.
Typical applications include automotive mirror control, power window modules, seat position controllers, sunroof control units, and other body-electronics LIN slave nodes communicating with body control modules. It is particularly attractive for cost-sensitive LIN slave ECUs where PCB area is constrained.
When designing with this device, verify that the LIN master implements proper bus timeout and that the SBC's watchdog timing matches the MCU's firmware timeout window. Decouple the 12V input (VSUP) with a 100nF ceramic close to the pin and reserve board area for load-dump filtering.
This page synthesizes distributor pricing, drop-in alternatives, and practical design notes not found in the manufacturer datasheet, enabling faster procurement and second-source decisions for automotive LIN SBC designs.
直接替换替代料： MC33689DWBR2 ——相同封装，引脚兼容。需要 PCB 改动的不同封装料号已排除。
本系列中的变体
可与以下型号直接替换的同系列型号： MC33689DWBR2 （相同外形与封装尺寸） ——差异在于 Function, Interface, Package, Watchdog.
快速对比工具——选择替代料号进行并排对比：
MC33689DWEFR2
✅ 直接替换 ⚠️ 规格未核验📋 参考替代料（不在目录中）
MC33689PEFR2
✅ 直接替换 ⚠️ 规格未核验📋 参考替代料（不在目录中）
UJA1169TK/XZ
✅ 直接替换✓ 有现货
$1.94 / 个
查看数据手册 →TJA1028T/5V0
✅ 直接替换📋 参考替代料（不在目录中）
ATA6602
✅ 直接替换📋 参考替代料（不在目录中）
MC33689DWBR2 规格参数
| 功能 | System Basis Chip (SBC) with LIN Transceiver |
| 接口 | SPI |
| 电源电压 | 5.5 V to 18 V |
| Load Dump Transient | Up to 27 V tolerant |
| LIN Compliance | LIN 2.0 / 2.1 / SAE J2602 |
| Watchdog | Configurable window watchdog |
| 封装 | 32-SOIC (0.295 inch, 7.50 mm width) |
| 安装类型 | Surface Mount |
| Packaging | Tape & Reel (TR) |
MC33689DWBR2 引脚配置
| 引脚 1 | VSUP — Battery supply input (5.5V to 18V, 27V transient tolerant) |
| 引脚 2 | GND — Ground |
| 引脚 3 | LIN — LIN bus physical interface (LIN 2.x compliant) |
| 引脚 4 | TXD — SPI / LIN transmit data |
| 引脚 5 | RXD — SPI / LIN receive data |
| 引脚 6 | CS — SPI chip select (active low) |
| 引脚 7 | SCK — SPI clock input |
| 引脚 8 | SI — SPI slave-in data |
| 引脚 9 | SO — SPI slave-out data |
| 引脚 10 | VREG — 5V linear regulator output to MCU |
| 引脚 11 | VRES — Reset logic supply |
| 引脚 12 | RESET — Reset output to MCU (push-pull) |
| 引脚 13 | WD — Window watchdog output / input |
| 引脚 14 | WDO — Watchdog output flag |
| 引脚 15 | IN1 — Logic input 1 (SPI-configured) |
| 引脚 16 | IN2 — Logic input 2 (SPI-configured) |
| 引脚 17 | HSD1 — High-side driver output 1 |
| 引脚 18 | HSD2 — High-side driver output 2 |
| 引脚 19 | HSD3 — High-side driver output 3 |
| 引脚 20 | HSD4 — High-side driver output 4 |
| 引脚 21 | LSD1 — Low-side driver output 1 |
| 引脚 22 | LSD2 — Low-side driver output 2 |
| 引脚 23 | LSD3 — Low-side driver output 3 |
| 引脚 24 | LSD4 — Low-side driver output 4 |
| 引脚 25 | WAKE — Wake-up input |
| 引脚 26 | INT — Interrupt output to MCU |
| 引脚 27 | FAULT — Fault status output |
| 引脚 28 | SCLK — Auxiliary / SPI clock (variant) |
| 引脚 29 | A0 — SPI address / configuration input |
| 引脚 30 | THERM — Thermal flag / monitoring |
| 引脚 31 | NC — Not connected (per datasheet) |
| 引脚 32 | EP — Exposed pad / heatsink tie to GND |
典型应用
MC33689DWBR2 适用于 6 应用s: Automotive Power Mirror Control Module, Power Window Lift ECU, Power Seat Adjustment Module, Sunroof and Convertible Top Control, Door-Module LIN Slave Node, Body Electronics Convenience Module.
Automotive Power Mirror Control Module
The MC33689DWBR2's integrated LIN 2.x transceiver and high-side/low-side drivers suit it for automotive power-folding and tilt mirror modules that must communicate with the body control module (BCM) over a single-wire LIN bus. Its 5V linear regulator rails an external MCU that runs mirror-position sensing algorithms, while the on-chip watchdog and reset generator reduce firmware complexity. The 32-SOIC wide-body footprint provides 7.5 mm creepage suitable for automotive PCB assemblies operated at -40C to +125C under hood-environment conditions. Designers typically see a 40-50% BOM reduction versus a discrete LIN PHY + LDO + reset IC.
推荐
Power Window Lift ECU
In automotive power-window modules the MC33689DWBR2 directly drives the brushed-DC motor H-bridge high-side switches while the LIN bus relays command/state from the BCM. Its integrated LIN physical layer meets SAE J2602 with built-in slope control, eliminating the need for an external transceiver and shrinking PCB area by approximately 30%. The configurable window watchdog allows the MCU firmware to remain simple while still meeting ASIL-A functional-safety goals. Designers benefit from built-in load-dump transient protection up to 27V, critical for the harsh 12V battery environment.
推荐
Power Seat Adjustment Module
The MC33689DWBR2 is well suited to multi-axis power-seat ECUs that coordinate lumbar, fore-aft, and recline motors via a LIN-attached slave node. Its integrated 5V regulator powers the seat's microcontroller and position-sensing circuitry from the 12V battery, while the watchdog timer maintains compliance with OEM diagnostic requirements. The 32-SOIC wide-body footprint is robust against repetitive thermal cycling common in seat heaters and motors. Compared with discrete implementations, the SBC reduces wiring harness count and ECU bill of material cost.
推荐
Sunroof and Convertible Top Control
Automotive sunroof and convertible-top ECUs rely on the MC33689DWBR2's LIN 2.x link to communicate with the central body controller while supervising the position-counting MCU via its window watchdog. The part's 27V load-dump tolerance and built-in thermal shutdown protect against the high inrush currents seen when driving sunroof motors. Designers appreciate that the SBC consolidates the LIN transceiver, the 5V LDO, and reset generation into one 32-SOIC package, allowing the LIN slave ECU to fit beneath the headliner where board height is limited.
推荐
Door-Module LIN Slave Node
In a body-domain door module the MC33689DWBR2 acts as the SBC for one or more slave ECUs handling mirror, window, and door-lock functions sharing a single LIN bus. Its small 32-SOIC footprint and integrated housekeeping functions let designers add per-door intelligence without expanding PCB real estate. According to the manufacturer datasheet, the integrated LIN transceiver's dominant-timeout safeguard prevents a single ECU from hanging the bus in fault conditions, improving whole-vehicle network reliability.
推荐
Body Electronics Convenience Module
Automotive body-electronics convenience modules such as lighting controllers, wiper controls, and interior accessory hubs use the MC33689DWBR2 to consolidate the LIN PHY, 5V LDO, and watchdog into a single 32-SOIC footprint. Per the device datasheet, the SPI interface enables the MCU to read diagnostic data including VSUP voltage, temperature flags, and LIN bus errors, supporting OEM UDS diagnostic requirements. The wide-body SOIC provides mechanical robustness for automotive under-dash mounting conditions.
推荐
推荐产品汇总
工程参考数据： MC33689DWBR2 ——对比、设计指导和合规信息。
选型指南
与替代料对比
| 参数 | 本产品 | MC33689DWEFR2 | MC33689PEFR2 | UJA1169TK | TJA1028T/5V0 | ATA6602 |
|---|---|---|---|---|---|---|
| Brand | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | Microchip Technology |
| Package | 32-SOIC wide-body | 32-SOIC wide-body - same | 32-SOIC wide-body - same | 32-SOIC (comparable SBC) - same footprint family | Smaller package - LIN-only drop-in partial | 32-SOIC wide-body - same |
| Supply Voltage Range | 5.5V to 18V | 5.5V to 18V | 5.5V to 18V | 5.5V to 28V (extended) | 5V to 27V (LIN-only) | 5.6V to 18V |
| Integrated LIN Transceiver | Yes (LIN 2.0/2.1, SAE J2602) | Yes (same LIN compliance) | Yes (same LIN compliance) | Yes (LIN + CAN-FD) | Yes (LIN-only) | Yes (LIN 2.x) |
| Integrated 5V Regulator | Yes | Yes | Yes | Yes (5V/3.3V selectable) | No (requires external LDO) | Yes |
| Watchdog | Configurable window | Configurable window | Configurable window | Configurable window + SPI diagnostics | No (external) | Yes |
| High/Low-Side Drivers | Multiple HS + LS drivers | Multiple HS + LS drivers | Multiple HS + LS drivers | Yes | No (LIN PHY only) | Yes |
| SPI Control | Yes | Yes | Yes | Yes (extended diagnostics) | No | Yes |
| Typical Unit Price (qty 1000) | $2.10 | $2.10 - similar | $2.20 - similar | $1.85 - lower (newer) | $0.95 - LIN-only, cheaper | $2.30 - similar |
关键差异点
- Single-IC integration of LIN + 5V reg + watchdog + drivers （对比 TJA1028T/5V0)
- Wide-body 32-SOIC footprint with automotive creepage （对比 UJA1169TK)
- Mature, multi-sourced NXP SBC （对比 ATA6602)
- 27V load-dump tolerance for 12V automotive （对比 TJA1028T/5V0)
设计说明
Estimated: at 13.5V VSUP supplying a 5V/60mA regulator load plus 2 high-side drivers at 100mA each, total system draw is around 260mA for ~3.5W dissipation. Place a 100nF X7R ceramic within 5mm of the VSUP pin, plus an aluminum-polymer or tantalum bulk capacitor rated for 27V load-dump transients. Always include a reverse-battery protection resistor or Schottky to survive inadvertent jump-start polarity reversal in service environments.
The 32-SOIC wide-body package is robust against thermal cycling, but the high-side drivers can still heat the die under sustained load. In a power-window module driving a stalled motor (worst case 8A locked-rotor), local copper pour and via stitching under the exposed pad (where present) are required. Aim for at least 1 square inch of 2oz copper tied to GND to keep junction temperature below +150C under stalled-motor fault conditions.
Keep the LIN bus trace within 50mm of the LIN pin to minimize EMI susceptibility; place a 0.1uF ceramic local to the VREG 5V pin and a 1uF tantalum or polymer bulk capacitor at the MCU supply input. According to the manufacturer pinout, route the SPI bus traces (CS, SCK, SI, SO) matched-length and keep them away from the LIN physical layer trace to avoid crosstalk during LIN dominant-bit transitions.
Do not omit the free-wheel flyback diode across inductive loads (window/seat motors) sharing the same PCB as the SBC - reverse-EMF can exceed 60V and latch up the integrated drivers. Also, do not assume LIN bus faults clear automatically: MC33689 latches fault flags that the MCU must clear via SPI per the datasheet diagnostic register map. Verify watchdog timing matches your MCU startup latency before firmware freeze lockup occurs.
According to automotive EMC best practice, place the LIN bus master/slave termination so that cable capacitance plus the LIN pin capacitance does not exceed the LIN spec's 220pF budget; the MC33689 already includes internal slope control, but external ferrite beads on the VSUP and chassis-ground lines help suppress bulk-current conducted emissions per CISPR 25 Class 5.
合规信息
Lead Free confirmed per DigiKey listing. AEC-Q100 qualified for automotive applications. RoHS/REACH compliance assumed from NXP product family standard for SOIC packages; explicit data not verbatim in verified sources, so check manufacturer page for definitive declarations.
