MC34PF4210A0ES - i.MX 8M PMIC, 14-Ch, 56-QFN | NXP
料号： MC34PF4210A0ES ✓ 量产中| 数量 | 单价 | 小计 |
|---|---|---|
| 1 | $9.85 | $9.85 |
| 10 | $8.92 | $89.20 |
| 100 | $7.74 | $774.00 |
| 500 | $6.95 | $3,475.00 |
| 1,000 | $6.18 | $6,180.00 |
MC34PF4210A0ES 概述
A Power Management IC (PMIC) is a highly integrated semiconductor that consolidates multiple voltage regulators, supervision circuitry, sequencing logic, and monitoring ADCs into one package, replacing dozens of discrete components around an applications processor. Within the broader taxonomy, a PMIC belongs to the Power Management category, sitting alongside discrete regulators, supervisors, and battery management ICs. The PF4210 sits at the system-power heart of audio/video platforms, providing all processor rails, peripheral voltages, and I/O supplies from a single battery or 5V input.
Key features include adjustable current limiting on each output, adjustable soft-start, dynamic voltage scaling (DVS) for adaptive processor performance, on-board power-on timing control, and overcurrent protection. Programmed via one-time programmable (OTP) memory, the A0ES variant ships with NXP factory-default settings and supports full I2C control for runtime reconfiguration. The integration of 14 rails plus telemetry reduces BOM count and PCB area while improving power-rail accuracy versus discrete regulator designs.
Architecturally, the PF4210 pairs high-frequency synchronous buck controllers with low-dropout linear post-regulators, allowing low-ripple voltage delivery to sensitive audio and DDR memory planes. The internal 10-bit ADC monitors each rail, die temperature, and input voltage, allowing host software to validate power integrity and respond to thermal or fault events. The pre-programmed OTP memory and reference BSP dramatically reduce NXP i.MX 8M design-in time.
Typical applications include set-top boxes, smart home audio hubs, industrial HMI panels, and i.MX 8M-based single-board computers. The wide input range and configurable sequencing also suit portable medical imaging terminals and similar A/V-rich embedded platforms where board space and design time are tightly constrained.
When designing with this device, follow the reference design closely for input capacitance, layout of the exposed thermal pad, and SW node routing; the OTP defaults assume specific LPDDR4 voltage and i.MX 8M boot sequencing. Designers should validate thermal performance at full 14-rail load under worst-case ambient to keep junction temperature inside the -40C to +105C operating range.
This page synthesizes distributor pricing, drop-in alternatives, and practical design notes from the NXP PF4210 datasheet and field experience, giving engineering teams a faster path to a validated i.MX 8M power tree than wading through 100+ pages of PMIC documentation alone.
直接替换替代料： MC34PF4210A0ES ——相同封装，引脚兼容。需要 PCB 改动的不同封装料号已排除。
本系列中的变体
可与以下型号直接替换的同系列型号： MC34PF4210A0ES （相同外形与封装尺寸） ——差异在于 ADC, Boost Converters, Buck Converters, Package, Target Processor.
快速对比工具——选择替代料号进行并排对比：
MC34PF4210A1ES
✅ 直接替换✓ 有现货
$5.2 / 个
查看数据手册 →MC34PF4210A3ES
✅ 直接替换📋 参考替代料（不在目录中）
MC34PF4210A2ES
✅ 直接替换 ⚠️ 规格未核验📋 参考替代料（不在目录中）
MC34PF4210A0ES 最大额定值与电气特性
| Product Type | Power Management IC (PMIC) |
| 拓扑 | Multi-rail buck + LDO + boost + ADC |
| Number of Output Channels | 14 channels |
| Buck Converters | 4/6 synchronous buck converters |
| LDO Regulators | 7 LDOs |
| Boost Converters | 5 boost outputs |
| ADC | 10-bit integrated ADC for monitoring |
| Configuration Memory | On-chip OTP (one-time programmable), pre-programmed |
| Communication Interface | I2C control |
| Adjustable Current Limiting | Yes, per output |
| 软启动 | Adjustable per channel |
| Dynamic Voltage Scaling (DVS) | Yes |
| Power-On Sequencing | Programmable via OTP and I2C |
| Protection Features | Overcurrent protection, OVP, UVLO, thermal shutdown |
| 工作温度范围 | -40C to +105C |
| 封装 | 56-QFN-EP (8x8 mm) with exposed thermal pad |
| 安装类型 | Surface Mount |
| Target Processor | NXP i.MX 8M family applications processors |
| RoHS Compliance | Compliant (per NXP product page) |
MC34PF4210A0ES 56-qfn-ep (8x8 mm) with exposed thermal pad 引脚配置指南
MC34PF4210A0ES（56-qfn-ep (8x8 mm) with exposed thermal pad 封装）的引脚配置。 该功率器件具有栅极、漏极和源极端子。对于无极性封装，请参阅制造商数据手册以了解确切的引脚 1 方向和封装尺寸细节。常见应用包括电源设计、电机驱动和负载开关。
暂无详细引脚数据： MC34PF4210A0ES.
请参阅 数据手册 以查看完整引脚配置。
典型应用
MC34PF4210A0ES 适用于 6 应用s: i.MX 8M Set-Top Box and Streaming Device, Smart Home Audio Hub and Smart Display, Industrial HMI and Panel PCs, Automotive Infotainment and Telematics (non-AEC-Q100 use), Single-Board Computer and Maker Platform, Portable Medical Imaging Terminal.
i.MX 8M Set-Top Box and Streaming Device
The MC34PF4210A0ES is purpose-built for i.MX 8M set-top box designs, where it powers the quad-core Cortex-A53 core, Cortex-M4 real-time core, GPU, and DDR memory from a single 5V input. Its 4/6 buck converters deliver high-current cores (up to ~2.5A per phase per NXP community guidance), while 7 LDOs feed low-noise analog, USB PHY, and PLL rails. The 10-bit ADC continuously monitors each rail so host firmware can throttle performance on thermal stress. Compared to discrete regulators, the PF4210 cuts BOM count by ~20 parts and dramatically simplifies power sequencing, which is critical when the SoC requires specific rail order for LPDDR4 boot.
推荐
Smart Home Audio Hub and Smart Display
In smart home audio hubs and smart displays, the MC34PF4210A0ES supplies the i.MX 8M SoC plus its microphones, Class-D amplifier, and LCD backlight from a single battery or wall adapter. The 5 boost outputs drive LED backlights and speaker-amplifier rails directly, while the 7 LDOs cleanly feed microphone bias and audio codec analog domains. Built-in dynamic voltage scaling (DVS) lets the device lower core voltage during voice standby, extending battery life in always-listening products. The 56-QFN-EP exposed pad enables compact PCB layouts suitable for slim smart speaker enclosures.
推荐
Industrial HMI and Panel PCs
Industrial HMI panels and panel PCs use the MC34PF4210A0ES to consolidate all i.MX 8M processor rails in a single PMIC, reducing PCB area and improving long-term reliability under -40C to +105C operation. The OTP-programmed power-on sequencing allows deterministic boot for safety-critical HMI software, while the integrated 10-bit ADC reports rail voltages and die temperature to the host for diagnostics. The wide input range and overcurrent protection make the PF4210 well suited to industrial 24V backplane systems with downstream point-of-load conversion. Adjustable current limit enables per-port tuning for USB, sensor, and display loads on the panel.
推荐
Automotive Infotainment and Telematics (non-AEC-Q100 use)
Although the MC34PF4210A0ES is not AEC-Q100 qualified, it is widely used in non-safety automotive infotainment prototypes, aftermarket head units, and telematics prototypes where the i.MX 8M drives display, audio, and connectivity subsystems. The 14 rails cover SoC cores, GPU, CAN transceivers, Wi-Fi/Bluetooth modules, and display backlights from a single 12V automotive battery input through upstream regulation. Dynamic voltage scaling supports fuel-saving modes by lowering processor voltage when the vehicle is parked. Designers must still qualify for AEC-Q100 with the NXP automotive-grade equivalent when targeting production safety-critical ECUs.
推荐
Single-Board Computer and Maker Platform
Single-board computers and i.MX 8M maker platforms integrate the MC34PF4210A0ES because it provides a complete, BSP-supported power tree in a single 56-QFN-EP IC. This allows board designers to focus on peripheral layout instead of sequencing logic, and to ship fully Linux-supported images on day one. The NXP reference BSP includes PMIC driver code, regulators, and thermal zones, drastically shortening time-to-prototype. The 10-bit ADC exposes die temperature and rail telemetry via sysfs, enabling developer monitoring and debugging on the developer kit.
推荐
Portable Medical Imaging Terminal
Portable medical imaging terminals powered by i.MX 8M processors benefit from the MC34PF4210A0ES integration, which condenses the entire power tree into one 56-QFN-EP device to leave board area for batteries and analog front ends. The 5 boost outputs can drive small LCD panels and bias supplies, while the 7 LDOs feed precision analog ASICs for ultrasound or vital-sign capture with low noise. Adjustable soft-start prevents inrush current from tripping hospital-grade isolation, and the integrated OTP guarantees a deterministic boot for IEC 62304 software classification. Operating range up to +105C supports sealed enclosure designs used in clinical environments.
推荐
推荐产品汇总
工程参考数据： MC34PF4210A0ES ——对比、设计指导和合规信息。
选型指南
与替代料对比
| 参数 | 本产品 | MC34PF4210A1ES | MC34PF4210A3ES | MC34PF4210A2ES |
|---|---|---|---|---|
| Brand | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors |
| Package | 56-QFN-EP (8x8 mm) | 56-QFN-EP (8x8 mm) | 56-QFN-EP (8x8 mm) | 56-QFN-EP (8x8 mm) |
| Output Channels | 14 | 14 | 14 | 14 |
| Buck Converters | 4/6 | 4/6 | 4/6 | 4/6 |
| LDOs | 7 | 7 | 7 | 7 |
| Boost Outputs | 5 | 5 | 5 | 5 |
| Integrated ADC | 10-bit | 10-bit | 10-bit | 10-bit |
| OTP Revision | A0 (initial factory defaults) | A1 (updated default voltages) | A3 (latest defaults for newer i.MX 8M) | A2 (intermediate revision) |
| Target Processor | i.MX 8M family | i.MX 8M family | i.MX 8M family | i.MX 8M family |
| Operating Temperature | -40C to +105C | -40C to +105C | -40C to +105C | -40C to +105C |
关键差异点
- Tightest factory OTP defaults for i.MX 8M （对比 MC34PF4210A1ES)
- Latest OTP revision support （对比 MC34PF4210A3ES)
- Single-IC 14-rail integration （对比 Discrete buck + LDO array (no equivalent drop-in))
设计说明
The 56-QFN-EP exposed thermal pad is the primary heat-dissipation path for the MC34PF4210A0ES. Estimated: at full 14-rail load (assume 4 W total dissipation worst case), with a board thermal resistance of ~25 C/W to a 4-layer 2 oz copper pour, the junction rises roughly 100 C above ambient. Provide at least 1 square inch of continuous copper under the exposed pad, with thermal vias on a 1 mm pitch, to keep Tj within the -40C to +105C operating range.
Place input bulk capacitors within 5 mm of the VIN pins and keep the high-current switching loops (SW node) on the top layer with the smallest possible loop area. Use a 4-layer stack with a dedicated ground plane underneath the device. The exposed thermal pad must be soldered to the board with a 0.3 mm via-array pattern; missing thermal vias increase theta_JA by ~30% and risk thermal-shutdown behavior under load.
Do not assume the OTP defaults match your exact i.MX 8M processor revision - if the defaults are wrong, the regulator may overshoot or undershoot core rails during boot and trigger latch-up. Always load the latest NXP reference BSP and re-run the PF4210 OTP verification flow before locking in volume production. Also note that strap-pin states at first power-on determine the OTP bank selected; pull-ups must match the schematic exactly.
Soft-start timing per channel is adjustable via external capacitor on the SS pins or via I2C register; set the core buck soft-start to ~2 ms to avoid inrush on the upstream supply. Use 22 uF X7R ceramic input capacitors on each high-current buck to minimize ripple; insufficient bulk capacitance will trigger the adjustable current-limit and cause the regulator to hiccup during transients.
合规信息
RoHS and lead-free status per NXP product page. Not AEC-Q100 qualified - choose an automotive-grade NXP PMIC for safety-critical ECUs.
