MC68376BGVAB25 - 32-bit CPU32 MCU 25MHz ROMless 160-QFP | NXP
料号： MC68376BGVAB25 ⚠ 最后一次采购| 数量 | 单价 | 小计 |
|---|---|---|
| 1 | $32.5 | $32.50 |
| 10 | $28.4 | $284.00 |
| 100 | $24.2 | $2,420.00 |
| 500 | $20.1 | $10,050.00 |
| 1,000 | $17.5 | $17,500.00 |
MC68376BGVAB25 概述
Background Knowledge: A microcontroller (MCU) is a single-chip computer that integrates a CPU core, memory, and peripherals to control external devices in embedded systems. The MC68376BGVAB25 sits at the high end of the legacy 68k family, occupying the CPU32 core (Motorola's first 32-bit extension of the 68000 instruction set) and serving as the integration point between traditional 683xx peripherals and the more powerful PowerPC ColdFire microcontrollers that succeeded it. Externally, MC68376 / MC68336 MCUs are commonly seen in industrial automation, automotive body controllers, and motor-control subsystems where deterministic 68k-family code reuse is desired.
Key features include 25 MHz operation, ROMless configuration (external program memory required), 7.5K x 8 RAM, 18 I/O lines, external oscillator support, and an integrated CAN (CANSAP) and queued serial module. It is qualified to a wide operating temperature range typical of automotive under-hood environments. The part is supplied in a QFP-160 plastic quad flat package with 0.65 mm pitch.
Technical depth: The CPU32 core implemented in the MC68376 uses a 32-bit internal data path with a 16-/32-bit external bus and executes the M68000 instruction set with additional 32-bit addressing modes. The 25 MHz CPU clock supports ~3 MIPS sustained throughput, sufficient for real-time control loops in industrial drives and body controllers. Integration includes a system integration module (SIM), a 16-bit time processor unit (TPU), and a queued serial multi-channel communication interface.
Typical applications include automotive body controllers, factory automation PLCs, motor drive controllers, and industrial inverter control boards. It is also commonly used in legacy embedded designs that require ROMless external flash for code storage.
Design consideration: Because the device is ROMless, designers must connect an external program memory such as a 27-series EPROM or parallel flash. A minimum bus width of 16 bits is recommended to avoid wait-state penalties at 25 MHz. Active part is mature in distribution channels.
This page synthesizes current distributor pricing, ROMless pin-compatible drop-in alternatives, and practical design notes not found in a single manufacturer datasheet.
直接替换替代料： MC68376BGVAB25 ——相同封装，引脚兼容。需要 PCB 改动的不同封装料号已排除。
本系列中的变体
可与以下型号直接替换的同系列型号： MC68376BGVAB25 （相同外形与封装尺寸） ——差异在于 Core.
快速对比工具——选择替代料号进行并排对比：
SC68376BGVAB25
✅ 直接替换📋 参考替代料（不在目录中）
SC68376BGCAB25
✅ 直接替换📋 参考替代料（不在目录中）
MC68376BACAB20
✅ 直接替换📋 参考替代料（不在目录中）
SC68376BGMAB20
✅ 直接替换📋 参考替代料（不在目录中）
MC68336BGCPN25
✅ 直接替换📋 参考替代料（不在目录中）
MC68376BGVAB25 最大额定值与电气特性
| Core | CPU32 (32-bit, M68000-family) |
| Family | M683xx |
| Operating Frequency | 25 MHz |
| Program Memory | ROMless (external memory required) |
| RAM Size | 7.5K x 8 |
| Number of I/O | 18 |
| Oscillator Type | External |
| 封装 / 外壳 | 160-BQFP (28x28 mm, 0.65 mm pitch) |
| 安装类型 | Surface Mount |
| Peripherals | Queued Serial Module, TPU, CANSAP, SIM |
| 电源电压 | 5 V nominal |
| RoHS 状态 | Non-compliant (legacy QFP) |
| 工作温度 | -40C to +105C (industrial / automotive grade) |
| Lead Free | No (contains lead, SnPb ball finish) |
MC68376BGVAB25 160-bqfp (28x28 mm, 0.65 mm pitch) 引脚配置指南
MC68376BGVAB25（160-bqfp (28x28 mm, 0.65 mm pitch) 封装）的引脚配置。 该数字 IC 包含 GPIO、通信接口（UART、SPI、I2C）和电源引脚。请参阅制造商数据手册以了解复用引脚功能和配置选项。对嵌入式系统设计和 PCB 布局至关重要。
暂无详细引脚数据： MC68376BGVAB25.
请参阅 数据手册 以查看完整引脚配置。
典型应用
MC68376BGVAB25 适用于 7 应用s: Automotive Body Controller, Industrial Motor Drive Controller, Factory Automation PLC, Automotive Engine Management ECU, Industrial Inverter Control Board, Point-of-Sale Terminal Controller, Print Engine / Industrial Printer Controller.
Automotive Body Controller
The MC68376BGVAB25 fits automotive body controllers because its 32-bit CPU32 core combined with the CAN (CANSAP) module and Time Processor Unit (TPU) provides deterministic, multi-PWM control of mirrors, wipers, lighting, and seat actuators without CPU intervention. The 25 MHz clock delivers roughly 3 MIPS which is sufficient for body-control loops at typical 100 Hz rates, and the wide -40C to +105C temperature range handles underhood and cabin environments. The 160-BQFP package exposes 18 dedicated I/O plus multiplexed bus resources, plenty for typical body-controller topologies.
推荐
Industrial Motor Drive Controller
The MC68376BGVAB25 is well-suited to industrial motor drive control loops because the integrated Time Processor Unit (TPU) handles 3-phase PWM generation in hardware, freeing the CPU32 core to execute flux-estimation or field-oriented-control (FOC) algorithms. At 25 MHz / ~3 MIPS the CPU has enough headroom for 16 kHz current loops on small BLDC or induction drives. The 7.5 KB on-chip SRAM fits typical motor-control state machines and the 160-BQFP package gives enough pins for three-phase gate-driver signaling plus encoder feedback.
推荐
Factory Automation PLC
The MC68376BGVAB25 fits discrete and small modular PLC designs in factory automation because its 32-bit CPU32 core runs IEC 61131-3 ladder logic with predictable scan times and the queued serial module links to RS-485 industrial fieldbuses. The 7.5 KB RAM plus ROMless external 27-series EPROM allows 64 KB to 256 KB program storage typical of mid-range PLCs. The 18 dedicated I/O lines are supplemented by bus expansion via the 16/32-bit external memory interface for add-on I/O modules or HMI front panels.
推荐
Automotive Engine Management ECU
The MC68376BGVAB25 has historically been deployed in 1990s-vintage engine management ECUs because the CPU32 core can execute crank-angle-based fuel-injection and ignition-timing algorithms while the TPU offloads camshaft / crankshaft pulse-counting from the CPU. At 25 MHz the device is fast enough for 4-cylinder sequential fuel injection at 50 Hz loop rates, while the -40C to +105C operating range accommodates the engine bay. New engine ECUs should consider MC9S12XEP768CAG or SPC5644AF0MLU2 for active lifecycle support.
推荐
Industrial Inverter Control Board
The MC68376BGVAB25 targets low-cost industrial inverter control designs because its CPU32 core can run V/f or sensorless FOC algorithms up to about 8 kHz switching frequency with 4-kHz current loops. The TPU generates the six PWM channels required for 3-phase IGBT bridges and the queued serial module handles Modbus or simple proprietary RS-485 fieldbuses for supervisory communication. The 160-BQFP package exposes the full 16-bit external bus for connecting additional RAM or flash storage above 1 MB.
推荐
Point-of-Sale Terminal Controller
The MC68376BGVAB25 fits legacy point-of-sale (POS) terminals and EFT-PIN-pad designs because its deterministic 68k execution model and queued serial module provide reliable RS-232 peripheral links to keyboards, displays, and card readers. With 7.5 KB RAM and an external 27-series EPROM, the part offers enough code-storage headroom for legacy POS firmware. For new PCI-PTS-compliant designs consider SPC5602BF2MLL6 or MKL26Z128VMC4 with hardware cryptography accelerators.
推荐
Print Engine / Industrial Printer Controller
The MC68376BGVAB25 is appropriate for industrial label printer and print-engine controller designs because the TPU provides the precise stepper-motor pulse generation required for print-head and paper-feed alignment, while the queued serial module maintains high-speed data links to print-head driver ASICs. Its 25 MHz clock supports 4-axis stepper coordination at print speeds of 300 mm/sec, and the 160-BQFP package exposes two UART channels and one SPI port for typical industrial-printer topologies including Ethernet and USB-bridge daughtercards.
推荐
推荐产品汇总
工程参考数据： MC68376BGVAB25 ——对比、设计指导和合规信息。
选型指南
与替代料对比
| 参数 | 本产品 | SC68376BGVAB25 | SC68376BGCAB25 | MC68376BACAB20 | SC68376BGMAB20 | MC68336BGCPN25 |
|---|---|---|---|---|---|---|
| Brand | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors |
| Package | 160-BQFP (28x28) | 160-BQFP (28x28) - same | 160-BQFP (28x28) - same | 160-BQFP (28x28) - same | 160-BQFP (28x28) - same | 160-BQFP (28x28) - same |
| Core | CPU32 (32-bit) | CPU32 (32-bit) | CPU32 (32-bit) | CPU32 (32-bit) | CPU32 (32-bit) | CPU32 (32-bit) |
| Operating Frequency | 25 MHz | 25 MHz | 25 MHz | 20 MHz | 20 MHz | 25 MHz |
| On-chip RAM | 7.5K x 8 | 7.5K x 8 | 7.5K x 8 | 7.5K x 8 | 7.5K x 8 | 7.5K x 8 |
| Program Memory | ROMless | ROMless | ROMless | ROMless | ROMless | ROMless |
| Integrated TPU (Time Processor Unit) | Yes | Yes | Yes | Yes | Yes | Yes |
| CAN Module | Yes (CANSAP) | Yes (CANSAP) | Yes (CANSAP) | Yes (CANSAP) | Yes (CANSAP) | Yes (CANSAP) |
| Lifecycle Status | Last-Time-Buy | Active (authorized aftermarket) | Active (authorized aftermarket) | Last-Time-Buy | Active (authorized aftermarket) | Last-Time-Buy |
关键差异点
- Same die, opposite lifetime outlook - SC68376 variants are still actively supported through authorized aftermarket brokers （对比 SC68376BGVAB25)
- 25 MHz CPU32 core preserves existing 68k firmware without recompilation （对比 MC68376BACAB20)
- MC68336 family member - identical die, lower pin revision, function-equivalent （对比 MC68336BGCPN25)
设计说明
The MC68376BGVAB25 is a ROMless device and requires an external program memory on the data/address bus. Designers must add a wait-state generator or use slow EPROM (typical 250 ns) to avoid bus contention above 25 MHz. A common pitfall is to source code from a 27C010 EPROM with no wait state at 25 MHz, which causes intermittent instruction-fetch errors on temperature extremes.
Route the 16/32-bit external data bus with matched-length traces of no more than 50 mm to avoid bus-skew errors. Decouple VCC with 0.1 uF ceramic and 10 uF tantalum close to each VDD/VSS pair. The 160-BQFP 0.65 mm pitch requires a 4-layer PCB with 8 mil traces and 8 mil clearances for reliable assembly. Place a guard trace tied to GND between the external bus and the analog TPU inputs to reduce PWM jitter.
Estimated: at 25 MHz CPU throughput the MC68376BGVAB25 core dissipates approximately 600 mW at 5 V typical activity. The 160-BQFP package has thermal resistance theta_JA around 35 C/W on a 4-layer PCB resulting in a 21 C junction-temperature rise above ambient at room temperature. Under hood operation requires the -40 C to +105 C industrial grade and adequate copper-flood underneath the QFP thermal pad region.
合规信息
Original NXP MC68376BGVAB25 uses SnPb solder plating for the 160-BQFP package and is non-compliant with RoHS 6/6 directive. SC-prefix variants may be available with lead-free ball finish on request. Reach compliance per NXP data sheet; AEC-Q100 qualification does not formally apply to NXP's industrial-temperature MC68376 family although the part is used in automotive designs.
