MC7448VU1700LD - 1.7GHz PowerPC G4 MPU, 1MB L2 | NXP
料号： MC7448VU1700LD ⚠ 最后一次采购| 数量 | 单价 | 小计 |
|---|---|---|
| 1 | $175 | $175.00 |
| 10 | $158 | $1,580.00 |
| 100 | $142 | $14,200.00 |
| 500 | $128 | $64,000.00 |
| 1,000 | $115 | $115,000.00 |
MC7448VU1700LD 概述
What is a PowerPC G4 MPU? A PowerPC G4 microprocessor is a member of the Power Architecture family, a RISC instruction set originally developed by the Apple-IBM-Motorola AIM alliance in the early 1990s. The G4 generation adds the AltiVec vector unit (a SIMD engine similar to Intel SSE) and deeper pipelines, making it suitable for media processing. The MPC7448 sits inside the MPC74xx product line of single-core embedded processors that target networking and computing systems rather than general-purpose desktops.
Key features include 1.7 GHz clock frequency, 1 MB on-die L2 cache with eight-way set associativity, hardware-managed MESI coherency for the L1 caches, a 60x/MPX processor bus with support for 200 MHz operation, and a JTAG IEEE 1149.1 boundary-scan test interface. The part uses a 360-ball FCCBGA (Flip-Chip Ceramic BGA) thermal package, which exposes the die through the top of the package for direct heatsink attach and offers the high current capacity required by a GHz-class CPU core.
Typical applications include high-performance embedded networking (routers, switches, security appliances), industrial computing controllers, single-board computing platforms that still require Power Architecture support, and legacy Apple/Mac-compatible system upgrades where the MPC7448 is the de-facto upgrade path for older G4-based designs. The AltiVec unit also makes the part attractive for media transcoding and image processing in embedded form factors.
When designing with the MC7448VU1700LD, ensure all four voltage rails (1.3 V core, 1.5 V/1.8 V/2.5 V I/O) are sequenced according to the MPC7448 hardware specifications document. A thermal solution capable of removing 10-25 W of power is required at full load, typically a heatsink bonded to the FCCBGA lid with thermal interface material.
直接替换替代料： MC7448VU1700LD ——相同封装，引脚兼容。需要 PCB 改动的不同封装料号已排除。
快速对比工具——选择替代料号进行并排对比：
MC7448VU1500LD
✅ 直接替换📋 参考替代料（不在目录中）
MC7448VU1267LD
✅ 直接替换📋 参考替代料（不在目录中）
MC7448THX1000LD
✅ 直接替换📋 参考替代料（不在目录中）
MC7447AVU1250LD
✅ 直接替换📋 参考替代料（不在目录中）
MC7448VS1700LD
✅ 直接替换📋 参考替代料（不在目录中）
MC7448VU1700LD 最大额定值与电气特性
| Processor Type | MPC74xx PowerPC G4 MPU, 32-bit |
| Core Architecture | PowerPC with AltiVec SIMD unit |
| Process Technology | 90 nm Silicon-On-Insulator (SOI) |
| Core Clock Frequency | 1.7 GHz |
| Processor Bus Frequency | 200 MHz (MPX/60x bus) |
| L1 Instruction Cache | 32 KB |
| L1 Data Cache | 32 KB |
| L2 Cache | 1 MB on-die, 8-way set associative |
| Core Supply Voltage | 1.3 V |
| I/O Supply Voltages | 1.5 V / 1.8 V / 2.5 V |
| 工作结温 | 0 °C to +105 °C |
| 封装 | 360-FCCBGA (25x25 mm) |
| Ball Count | 360 |
| 安装类型 | Surface Mount (Flip-Chip BGA) |
| Packaging | Tray |
| Lead Free Status | Contains Lead |
| SIMD/Vector Engine | AltiVec (128-bit) |
MC7448VU1700LD 360-fccbga (25x25 mm) 引脚配置指南
MC7448VU1700LD（360-fccbga (25x25 mm) 封装）的引脚配置。 该数字 IC 包含 GPIO、通信接口（UART、SPI、I2C）和电源引脚。请参阅制造商数据手册以了解复用引脚功能和配置选项。对嵌入式系统设计和 PCB 布局至关重要。
暂无详细引脚数据： MC7448VU1700LD.
请参阅 数据手册 以查看完整引脚配置。
典型应用
MC7448VU1700LD 适用于 6 应用s: High-Performance Embedded Networking, Industrial Computing Controllers, Legacy PowerPC Single-Board Computers, Media Transcoding and Image Processing, Aerospace and Defense Embedded Computing, Server and Datacenter Appliances.
High-Performance Embedded Networking
The MC7448VU1700LD's 1.7 GHz core with 1 MB on-die L2 cache and 200 MHz MPX/60x bus makes it well suited for embedded networking applications such as routers, layer-3 switches, and security appliances. The AltiVec SIMD unit accelerates packet-header inspection and bulk data movement while the high-throughput bus keeps network processors fed. Unlike lower-clocked MPC7447 predecessors, the 7448 handles multi-gigabit line rates in software. Placed on a control-plane card alongside a network processor, the 7448 typically handles routing-table updates, encryption key handling, and control-plane forwarding logic.
推荐
Industrial Computing Controllers
Industrial control platforms that already run Power Architecture firmware can drop in the MC7448VU1700LD as a CPU upgrade for higher throughput on the same PCB. The 360-FCCBGA 25x25 mm footprint matches the MPC7447 land pattern, simplifying board reuse. With a 105 °C max junction rating and 1.3 V core supply, the 7448 fits thermally-managed industrial enclosures. Designers should verify that firmware is recompiled for the larger 1 MB L2 cache and that the heatsink is upgraded to handle the higher 1.7 GHz power dissipation.
推荐
Legacy PowerPC Single-Board Computers
The MC7448VU1700LD is the standard high-end CPU on legacy PowerPC-based single-board computers (SBCs) used in aerospace, defense, and industrial test systems. The 360-FCCBGA package, MPX/60x bus protocol, and 1 MB on-die L2 cache are fully compatible with existing carrier boards designed for the MPC7447 family. Because the part is now in last-time-buy status as of 2026-10-16, operators of these boards should stockpile spare parts before stocks run out. The AltiVec unit also enables on-board signal processing for radar and sonar applications.
推荐
Media Transcoding and Image Processing
The MC7448VU1700LD's AltiVec 128-bit SIMD engine accelerates single-precision floating-point and integer SIMD operations used by image processing and media codec libraries. A 1.7 GHz clock with AltiVec typically delivers 8-16 GFLOPs of vector throughput, which is sufficient for H.264 baseline decode and JPEG2000 encode in embedded form factors. Unlike a DSP, the 7448 runs full Power Architecture OS environments (Linux, VxWorks) alongside the SIMD code path. This makes the part a good fit for compact video appliances where CPU and DSP functions must coexist on one chip.
推荐
Aerospace and Defense Embedded Computing
Aerospace and defense embedded systems rely on the MC7448VU1700LD for radiation-tolerant single-board computing on platforms such as flight-test data acquisition, mission computer prototypes, and ruggedized control units. The 105 °C junction rating and FCCBGA package are compatible with conduction-cooled enclosures used in avionics. Because the part is in last-time-buy status, defense integrators should coordinate end-of-life buys with NXP and authorized distributors like Rochester Electronics. Per the NXP product page, the MPC7448 family has a long history in defense and aerospace programs.
推荐
Server and Datacenter Appliances
The MC7448VU1700LD has been deployed in 1U and blade server appliances that require Power Architecture compatibility, including legacy application delivery controllers and security appliances. The 1.7 GHz clock and 1 MB L2 deliver enough per-thread performance for control-plane workloads, while the 200 MHz MPX/60x bus connects to companion I/O chips. Because the part is end-of-life, datacenter operators are migrating to QorIQ P-series or x86 equivalents. For existing fleets, the MC7448VU1700LD remains a supported CPU via last-time-buy channels as of 2026-10-16.
推荐
推荐产品汇总
工程参考数据： MC7448VU1700LD ——对比、设计指导和合规信息。
选型指南
与替代料对比
| 参数 | 本产品 | MC7448VU1500LD | MC7448VU1267LD | MC7448THX1000LD | MC7447AVU1250LD | MC7448VS1700LD |
|---|---|---|---|---|---|---|
| Package | 360-FCCBGA (25x25 mm) | 360-FCCBGA (25x25) - same | 360-FCCBGA (25x25) - same | 360-FCCBGA (25x25) - same | 360-FCCBGA (25x25) - same | 360-FCCBGA (25x25) - same |
| Brand | NXP Semiconductors (formerly Freescale) | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors |
| Core Clock Frequency | 1.7 GHz | 1.5 GHz | 1.267 GHz | 1.0 GHz | 1.25 GHz | 1.7 GHz |
| L2 Cache | 1 MB on-die | 1 MB on-die | 1 MB on-die | 1 MB on-die | 512 KB on-die | 1 MB on-die |
| Core Supply Voltage | 1.3 V | 1.3 V | 1.3 V | 1.3 V | 1.3 V | 1.3 V |
| Temperature Grade | VU (commercial, 105 °C) | VU (105 °C) | VU (105 °C) | THX (extended) | VU (105 °C) | VS (commercial) |
| AltiVec SIMD Engine | Yes | Yes | Yes | Yes | Yes | Yes |
| Process Technology | 90 nm SOI | 90 nm SOI | 90 nm SOI | 90 nm SOI | 130 nm | 90 nm SOI |
| Lifecycle Status | Last-time-buy | Last-time-buy | Last-time-buy | Last-time-buy | Obsolete | Last-time-buy |
关键差异点
- Highest-clocked variant in the MPC7448 family （对比 MC7448VU1500LD)
- Same-die drop-in to lower-clocked MPC7448 variants （对比 MC7448VU1267LD)
- Newer 90 nm SOI process vs older 7447 130 nm （对比 MC7447AVU1250LD)
设计说明
Estimated: at 1.7 GHz with 1.3 V core supply, the MPC7448 dissipates approximately 18-22 W typical workload. A heatsink with thermal resistance of 1-3 °C/W bonded to the FCCBGA lid with thermal interface material is required to keep junction temperature below 105 °C at 40 °C ambient. Without active airflow or a heatsink, the part will thermal-throttle or fail within minutes. Designers should consult the NXP MPC7448 hardware specifications document for thermal design power under worst-case workloads.
The MC7448VU1700LD requires four voltage rails: 1.3 V core, 1.5 V, 1.8 V, and 2.5 V for I/O. Per the MPC7448 hardware specifications, the core voltage must ramp up before or simultaneously with the I/O voltages; reverse sequencing can cause latch-up. Use a multi-rail power management IC with proper Power-On Reset sequencing, and place 10 µF bulk plus 0.1 µF ceramic bypass capacitors as close as possible to each voltage pin on the 360-ball BGA. Estimated core current at 1.7 GHz is around 15 A, so the 1.3 V rail needs at least 20 A capacity.
The 360-FCCBGA (25x25 mm) package uses a 1.27 mm ball pitch typical of this generation. PCB layout must use microvia stackups (laser-drilled vias) for fanout from the inner rows of balls; through-hole vias cannot reach the inner rows on 1.27 mm pitch. Match the impedance of the MPX/60x bus traces to 50 Ω single-ended, and place termination resistors at the bus endpoint. Exposed die on the top of the FCCBGA requires a heatsink keep-out zone clear of nearby components.
Common pitfalls when designing with the MC7448VU1700LD: (1) forgetting that the part contains lead and is not RoHS by default; (2) under-sizing the heatsink for the 1.7 GHz power envelope; (3) using 1.27 mm-pitch through-hole vias that cannot reach the inner BGA rows; (4) not verifying firmware support for the larger 1 MB L2 cache versus older 7447 builds; (5) ignoring last-time-buy status and designing a new product around a soon-obsolete part. Always source from authorized distributors because the part is targeted by counterfeit operations.
合规信息
Per DigiKey lead-free status field, the part 'Contains Lead' and is therefore not RoHS compliant. Reach, halogen-free, and conflict-minerals status not stated by NXP product page; treat as 'unknown'.