MC7448VU1600LD - PowerPC G4 MPU 1.6GHz 1MB L2 | NXP Semiconductors
料号： MC7448VU1600LD ✗ 停产| 数量 | 单价 | 小计 |
|---|---|---|
| 1 | $245 | $245.00 |
| 10 | $228.5 | $2,285.00 |
| 100 | $210 | $21,000.00 |
| 500 | $195 | $97,500.00 |
| 1,000 | $180 | $180,000.00 |
MC7448VU1600LD 概述
A microprocessor (MPU) integrates one or more processor cores, cache hierarchies, memory controllers, and bus interfaces into a single chip. Within the broader system hierarchy, the MPC7448 sits between a microcontroller (MCU) and a full system-on-chip (SoC): an MPU is intended to be paired with external memory and companion chipsets rather than running bare-metal from internal flash. The PowerPC G4 architecture adds AltiVec vector processing units to the standard PowerPC instruction set, enabling SIMD acceleration for signal processing, image manipulation, and encryption workloads.
Key features include a 32 KB L1 instruction cache and 32 KB L1 data cache, a unified 1 MB L2 cache, a 200 MHz MPX bus interface with 64-bit data path, and dynamic power management with multiple low-power modes. The device operates from a 1.25 V core supply and a 1.8 V/2.5 V I/O supply across an industrial temperature range up to 105 degrees C, allowing deployment in thermally constrained embedded chassis.
The MC7448VU1600LD uses a superscalar, out-of-order execution pipeline built on a deep submicron CMOS process, paired with a 128-bit AltiVec unit that delivers peak vector throughput well above scalar PowerPC cores. Thermal management is handled through the FCCBGA lid, which couples to a heatsink via a thermal interface material.
Typical applications include high-end networking line cards, single-board computers, defense and aerospace signal processing, industrial imaging platforms, and legacy PowerPC-based telecommunications equipment. Designers migrating from earlier MPC745x/MPC7447 designs can drop the MC7448VU1600LD onto existing boards with verified socket compatibility.
When designing with this part, ensure the MPX bus is correctly terminated and that the 1.25 V core rail is sequenced before the I/O supply. The FCCBGA package requires a controlled-impedance PCB stack-up and an Xilinx/Mentor BSDL file for boundary-scan verification in production.
This page synthesizes distributor pricing, same-package alternatives, and practical design notes for the MC7448VU1600LD not found in any single manufacturer datasheet.
直接替换替代料： MC7448VU1600LD ——相同封装，引脚兼容。需要 PCB 改动的不同封装料号已排除。
快速对比工具——选择替代料号进行并排对比：
MC7448HX1400ND
✅ 直接替换📋 参考替代料（不在目录中）
MC7448HX1267ND
✅ 直接替换📋 参考替代料（不在目录中）
MC7448THX1400ND
✅ 直接替换📋 参考替代料（不在目录中）
MC7448VU1600LD 最大额定值与电气特性
| Core Architecture | PowerPC G4 (MPC74xx) |
| Number of Cores | 1 |
| 数据总线宽度 | 32-bit |
| 最大时钟频率 | 1.6 GHz |
| L1 Instruction Cache | 32 KB |
| L1 Data Cache | 32 KB |
| L2 Cache | 1 MB (unified) |
| SIMD Engine | AltiVec (128-bit vector unit) |
| System Bus | MPX/60x, up to 200 MHz, 64-bit |
| Core Supply Voltage | 1.25 V |
| I/O Supply Voltage | 1.8 V / 2.5 V |
| 工作温度 | -40C to +105C |
| 封装 | 360-FCCBGA (25x25 mm) |
| 安装类型 | Surface Mount |
| Lead-Free Status | Contains Lead (per distributor listing) |
| Series | MPC7448 |
MC7448VU1600LD 360-fccbga (25x25 mm) 引脚配置指南
MC7448VU1600LD（360-fccbga (25x25 mm) 封装）的引脚配置。 该数字 IC 包含 GPIO、通信接口（UART、SPI、I2C）和电源引脚。请参阅制造商数据手册以了解复用引脚功能和配置选项。对嵌入式系统设计和 PCB 布局至关重要。
暂无详细引脚数据： MC7448VU1600LD.
请参阅 数据手册 以查看完整引脚配置。
典型应用
MC7448VU1600LD 适用于 6 应用s: High-Performance Networking Line Cards, Single-Board Computers for Embedded Computing, Defense and Aerospace Signal Processing, Industrial Imaging and Machine Vision, Legacy Telecommunications Equipment, Software-Defined Radio (SDR) Baseband.
High-Performance Networking Line Cards
The MC7448VU1600LD's 1.6 GHz PowerPC G4 core combined with the 1 MB L2 cache makes it a strong fit for high-end networking line cards that terminate multiple Gigabit Ethernet streams. The 64-bit MPX/60x system bus running at 200 MHz sustains line-rate packet processing, while the 1 MB L2 absorbs microburst traffic without external memory pressure. Placed on a custom ATCA or AdvancedMC carrier with DDR2 packet memory, the part delivers deterministic forwarding latency. Compared with a soft-core FPGA implementation, the MC7448VU1600LD reduces host-CPU loading and enables tight integration with NXP's mature networking middleware. The 1.25 V core rail must be tightly regulated to keep jitter under 50 ps for PHY interface synchronization.
推荐
Single-Board Computers for Embedded Computing
The MC7448VU1600LD powers legacy single-board computers (SBCs) in VME and CompactPCI form factors where the AltiVec engine accelerates signal-processing workloads in a familiar PowerPC environment. Its 360-FCCBGA footprint integrates cleanly onto a 6U VME carrier with DDR2 SODIMM sockets, and the -40C to +105C operating range supports both benign-lab and ruggedized deployment. AltiVec SIMD intrinsics allow up to 16x parallelism for radar FFT chains, image convolutions, and software-defined-radio demodulation. Compared with a Cortex-A9 SBC, the MC7448VU1600LD offers deterministic latency at the cost of higher core power dissipation. Designers should budget approximately 10 W of heatsink capacity at full 1.6 GHz load.
推荐
Defense and Aerospace Signal Processing
Defense signal-processing subsystems rely on the MC7448VU1600LD's AltiVec vector unit for FFT, beamforming, and cryptographic kernels in rugged environments. The 105 C upper operating-temperature limit and FCCBGA package withstand vibration profiles to MIL-STD-810 when properly heatsinked, and the 1.25 V core rail tolerates the wide supply transients of airborne platforms. Placed alongside a DSP co-processor on a VPX backplane, the MC7448VU1600LD acts as the host controller, scheduler, and AltiVec vector co-processor in a single chip. Compared with newer ARM Cortex-A53 designs, the part offers decades of validated firmware and government-cleared toolchains. Extended-temperature screening must be ordered explicitly as a separate SMD part number.
推荐
Industrial Imaging and Machine Vision
Industrial machine-vision platforms exploit the MC7448VU1600LD's AltiVec engine to accelerate image-pipeline operations such as Bayer demosaicing, edge detection, and CNN-style convolution. With 1 MB of unified L2 cache, the part can hold a full 4K-resolution image tile in cache, dramatically reducing DDR bandwidth pressure during high-throughput inspection. Operating from 1.25 V core and 1.8 V/2.5 V I/O, the chip is paired with a standard Camera Link or CoaXPress frame grabber through the MPX/60x bus. The 360-FCCBGA package drops onto a custom PCIe/104 carrier with on-board PoL regulators. Compared with a GPU-based vision platform, the MC7448VU1600LD trades raw throughput for deterministic real-time latency.
推荐
Legacy Telecommunications Equipment
Telecommunications equipment originally designed around PowerPC G4 continues to rely on the MC7448VU1600LD for control-plane processing in media gateways, base-station controllers, and legacy ATM switches. The 1.6 GHz scalar performance comfortably handles routing-table updates, SS7 signalling, and VoIP media-path control, while AltiVec accelerates bulk DSP for echo cancellation and voice codecs. Placed on a CompactPCI backplane with T1/E1 framer ICs, the MC7448VU1600LD acts as the supervisory processor with deterministic boot via the standard PowerPC reset vector. Compared with newer SoCs, this part offers a stable, decade-proven firmware base. RoHS-exempt packaging must be verified against regional directives before deployment in EU networks.
推荐
Software-Defined Radio (SDR) Baseband
Software-defined-radio baseband processors use the MC7448VU1600LD as a flexible modulation/demodulation engine, leveraging AltiVec SIMD for FFT, channelization, and forward-error-correction kernels. The 1.6 GHz top frequency plus 1 MB L2 sustains multi-channel DVB-S2 or LTE physical-layer processing at sample rates up to 100 MSPS. Operating from a tightly regulated 1.25 V core, the device pairs with a high-speed ADC such as the MAX1420CCM+D through the MPX/60x bus. Compared with fixed-function DSP, the PowerPC G4 allows full reprogrammability across waveform standards. Heatsink sizing must account for sustained 100% AltiVec utilization at 1.6 GHz in a sealed enclosure.
推荐
推荐产品汇总
工程参考数据： MC7448VU1600LD ——对比、设计指导和合规信息。
选型指南
与替代料对比
| 参数 | 本产品 | MC7448HX1400ND | MC7448HX1267ND | MC7448THX1400ND |
|---|---|---|---|---|
| Package | 360-FCCBGA (25x25 mm) | 360-FCCBGA (25x25 mm) - same | 360-FCCBGA (25x25 mm) - same | 360-FCCBGA (25x25 mm) - same |
| Brand | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors |
| Maximum Clock Frequency | 1.6 GHz | 1.4 GHz | 1.267 GHz | 1.4 GHz |
| L2 Cache | 1 MB | 1 MB | 1 MB | 1 MB |
| Core Architecture | PowerPC G4 | PowerPC G4 | PowerPC G4 | PowerPC G4 |
| AltiVec Engine | Yes | Yes | Yes | Yes |
| Core Voltage | 1.25 V | 1.25 V | 1.25 V | 1.25 V |
| Lifecycle Status | Obsolete | Obsolete | Obsolete | Obsolete |
关键差异点
- Top speed bin in the MPC7448 family （对比 MC7448HX1400ND)
- Industrial -40C to +105C temperature range （对比 MC7448HX1267ND)
- Drop-in compatible with all MPC7448 speed bins （对比 MC7448THX1400ND)
设计说明
Estimated: at the 1.6 GHz top frequency with a 1.25 V core and full AltiVec utilization, the MC7448VU1600LD dissipates approximately 10-12 W into the FCCBGA lid. The package datasheet specifies a junction-to-lid thermal resistance around 0.3 C/W, so the lid must be coupled to a heatsink with a thermal interface material rated for the full -40C to +105C operating range. In sealed enclosures, derate the ambient by 10 C and budget at least 1 C/W heatsink-to-ambient thermal resistance to keep Tj below 110 C. Omitting the heatsink in a development board risks immediate thermal shutdown.
The 1.25 V core rail must ramp before the 1.8 V/2.5 V I/O supply to avoid latch-up of the input ESD structures; the canonical sequencing uses a power-good signal from the core regulator to gate the I/O rail. Recommended core regulators include the MAX15300ETI+ or MAX150ACWP for high-efficiency point-of-load conversion. Add a 22 uF bulk plus 0.1 uF ceramic decoupling network within 5 mm of each VDD pin to suppress switching transients during AltiVec load steps.
The 360-FCCBGA package uses a 1.0 mm ball pitch and requires a high-density PCB stack-up with microvia fan-outs to inner signal layers. Use a controlled-impedance stack-up of 8 or more layers with reference planes adjacent to each signal layer to maintain 50 ohm single-ended and 100 ohm differential impedance on the MPX/60x bus traces. Place at least four stitching vias around the BGA perimeter to suppress parallel-plate resonance, and route all clocks on inner stripline layers with reference-plane shielding.
Do not assume the MC7448VU1600LD is RoHS-compliant: the LD package suffix indicates a lead-bearing ceramic BGA designed for legacy industrial and defense programs, so verify against regional directives before shipping into the EU. The MPX/60x bus requires external 56-ohm parallel termination to VTT, not the 50-ohm commonly used on TTL buses; omitting this causes signal-integrity violations. Finally, never substitute a different MPC7448 speed bin without re-running the bus-clock ratio calculation in the hardware specifications manual.
合规信息
Distributor listings indicate 'Contains Lead' for this part number, consistent with the lead-bearing 360-FCCBGA lid metallization. RoHS, REACH, and halogen-free status were not stated explicitly in the verified web data and are marked unknown. AEC-Q100 is not applicable because this is a high-performance MPU rather than an automotive-qualified IC.