MC8641VU1333JE557 - 2-Core 1.333GHz PowerPC e600 MPU | NXP
料号： MC8641VU1333JE557 ✗ 停产| 数量 | 单价 | 小计 |
|---|---|---|
| 1 | $416.32 | $416.32 |
| 10 | $395.5 | $3,955.00 |
| 50 | $374.69 | $18,734.50 |
| 100 | $354 | $35,400.00 |
| 250 | $333.06 | $83,265.00 |
MC8641VU1333JE557 概述
A PowerPC e600 microprocessor is a high-end embedded 32-bit RISC processor core based on the Power Architecture Book E instruction set. PowerPC processors occupy a tier above ARM Cortex-A class cores for many networking and aerospace workloads, while sitting below general-purpose x86 server CPUs; they remain popular in routers, base stations, aerospace guidance, defense signal processing, and storage arrays where deterministic performance, long-term software support, and extended-temperature silicon matter more than raw single-thread IPC.
Key distinguishing features of the MPC86xx family include symmetric multiprocessing (SMP) across one, two, or four cores, a coherent L2 cache, integrated DDR2 memory controller with ECC, four integrated GbE MACs, multiple x4/x8 PCI Express lanes, and four multi-protocol RapidIO interfaces. The e600 core adds hardware cryptography accelerators and an MMU supporting 64-bit virtual addressing. Power dissipation in the 1023-FCCBGA part is high enough to require a heatsink and forced airflow at full 1.333 GHz load.
Typical applications include multi-gigabit routers, LTE baseband processing cards, radar and sonar front-end DSP co-processors, secure military networking switches, and long-lifecycle industrial control servers where software is locked to the PowerPC ABI. The 33x33 mm FCCBGA is a high-density flip-chip package requiring multilayer PCB with microvia stackups.
When designing with this part, plan thermal headroom for 25-40 W class dissipation and use only NXP/Freescale-qualified foundries for PCB assembly; the FCCBGA is not reworkable by hand. Verify pinmap revision letters carefully — revisions 3.0 and later added PCIe Gen2 capability that is software-disabled on earlier revisions. This page synthesizes distributor pricing, lifecycle status, and same-family drop-in variants not consolidated in the original NXP datasheet.
直接替换替代料： MC8641VU1333JE557 ——相同封装，引脚兼容。需要 PCB 改动的不同封装料号已排除。
快速对比工具——选择替代料号进行并排对比：
MC8641VU1500JE
✅ 直接替换 ⚠️ 规格未核验📋 参考替代料（不在目录中）
MC8641VU1000JE
✅ 直接替换 ⚠️ 规格未核验📋 参考替代料（不在目录中）
MC8641VU1250JE
✅ 直接替换 ⚠️ 规格未核验📋 参考替代料（不在目录中）
MPC8641DVR1333JE
✅ 直接替换 ⚠️ 规格未核验📋 参考替代料（不在目录中）
MC8641VU1333JE557 最大额定值与电气特性
| Manufacturer | NXP Semiconductors (formerly Freescale) |
| Series | MPC86xx |
| Core Architecture | PowerPC e600 (Book E) |
| Number of Cores | 2 |
| Core Clock Speed | 1.333 GHz |
| 数据总线宽度 | 32-bit |
| 封装 | 1023-FCCBGA (33x33 mm) |
| 安装类型 | Surface Mount (flip-chip BGA) |
| 工作温度 | 0C to +105C (extended grade per Mouser listing) |
| Supply Voltage (Core) | 1.05 V |
| Core Type | PowerPC e600 |
| Instruction Set Architecture | Power Architecture Book E |
| Bit Mode | 32-bit |
MC8641VU1333JE557 1023-fccbga (33x33 mm) 引脚配置指南
MC8641VU1333JE557（1023-fccbga (33x33 mm) 封装）的引脚配置。 该数字 IC 包含 GPIO、通信接口（UART、SPI、I2C）和电源引脚。请参阅制造商数据手册以了解复用引脚功能和配置选项。对嵌入式系统设计和 PCB 布局至关重要。
暂无详细引脚数据： MC8641VU1333JE557.
请参阅 数据手册 以查看完整引脚配置。
典型应用
MC8641VU1333JE557 适用于 6 应用s: Multi-Gigabit Router Control Plane, LTE eNodeB Baseband Card, Aerospace Flight Control SBC, Defense Signal Processing Platform, Enterprise Storage RAID Controller, Industrial Long-Lifecycle Automation Server.
Multi-Gigabit Router Control Plane
The MC8641VU1333JE557's dual 1.333 GHz PowerPC e600 cores and integrated DDR2 controller with ECC make it a natural fit for the control plane of multi-gigabit routers. Its four integrated GbE MACs and multiple RapidIO links let a single chip manage line-card forwarding without an external switch ASIC, while 32-bit Book E performance keeps packet classification latency predictable. Engineers choose this part over ARM Cortex-A9 because the PowerPC ABI is locked in legacy network operating systems such as VxWorks and Green Hills INTEGRITY, and because the e600's deterministic interrupt latency beats Cortex-A9 for hard-real-time scheduling. The 1023-FCCBGA dissipates roughly 25-30 W at full load, requiring a forced-air heatsink. Recommended companion parts include the MC8641 sibling for line-card processing and NXP MPC8313 for management-plane offload.
推荐
LTE eNodeB Baseband Card
In LTE eNodeB baseband cards, the MC8641VU1333JE557 provides symmetric dual-core processing for PHY/MAC layer scheduling while its RapidIO interfaces connect to DSP clusters doing FFT and turbo decoding. The 1.333 GHz clock hits the sweet spot where Book E SIMD instructions handle 20 MHz LTE uplink FFT chains without external DSP offload. The integrated DDR2 with ECC eliminates the need for a separate memory controller, saving PCB area in 6U CompactPCI form factors. Pin-compatibility with the 1.0 GHz and 1.5 GHz siblings lets the same PCB be deployed across operator tiers. The 1023-FCCBGA's 33x33 mm footprint requires at least 12-layer PCB with stacked microvias, and the 25 W thermal envelope needs a finned heatsink with 200 LFM airflow.
推荐
Aerospace Flight Control SBC
Aerospace single-board computers (SBCs) use the MC8641VU1333JE557 because it delivers dual-core SMP at a price-point well below radiation-hardened processors, while still offering the long-term software support NXP guarantees for aerospace customers. The Book E MMU supports partitioned real-time operating systems such as VxWorks 6.9 and LynxOS-178, both DO-178 certifiable. The 1.333 GHz speed grade lets the dual cores drive ARINC 429/664 protocols plus a full authority flight-control loop at 100 Hz with margin. The 1023-FCCBGA is rated to the extended 105C junction temperature, suitable for avionics bays with forced-air cooling. Recommended companions include the NXP P2020 for I/O offload and legacy ARINC ASICs such as the Holt HI-8596.
推荐
Defense Signal Processing Platform
Defense signal-processing platforms (radar front-end, sonar arrays, electronic-warfare pods) rely on the MC8641VU1333JE557 for pre-DSP data reduction, sensor aggregation, and crypto offload via its integrated accelerators. The dual e600 cores at 1.333 GHz handle cryptographic key rotation and bulk encryption in hardware-accelerated paths, freeing the downstream DSP farm for FIR filtering and FFT. RapidIO links at 3.125 Gbaud provide deterministic low-latency chip-to-chip fabric between signal-processing tiles. The 1023-FCCBGA is qualified to the extended temperature grade and is on NXP's extended-lifecycle product list, which aerospace and defense integrators require for 15-20 year program support. Pin compatibility with the entire MPC8641DVR family allows system integrators to stock one PCB design for multiple program tiers.
推荐
Enterprise Storage RAID Controller
Enterprise storage RAID controllers use the MC8641VU1333JE557 for host-side protocol termination (iSCSI, Fibre Channel, NFS) while its integrated GbE MACs and PCIe lanes connect to backplane SAS expanders. Dual-core SMP at 1.333 GHz allows concurrent handling of multiple storage sessions without thread starvation. The DDR2 controller with ECC protects cache and metadata structures against soft-bit errors common in 24/7 datacenter workloads. Book E's deterministic interrupt response keeps latency-sensitive 4 KB random-IO workloads within QoS bounds even under heavy sequential load. The 1023-FCCBGA is overkill for consumer NAS but exactly the right thermal class for enterprise racks with airflow. Recommended companions include the LSISAS2008 SAS controller and Intel 82599 10 GbE NIC.
推荐
Industrial Long-Lifecycle Automation Server
Industrial automation servers running for 15-20 years on factory floors use the MC8641VU1333JE557 because NXP guarantees extended lifecycle support for the MPC86xx family through authorized partners like Rochester Electronics. The dual e600 cores drive SCADA protocols (Modbus, OPC UA, EtherCAT) and edge analytics at deterministic rates, while the integrated GbE MACs and PCIe lanes connect to PLC backplanes. The 105C extended-temperature grade survives unconditioned cabinet environments. Unlike newer ARM Cortex-A53 SoCs that change silicon every 18 months, the MC8641 platform's stable silicon and software ecosystem reduces re-qualification cost by an order of magnitude. The 1023-FCCBGA's high thermal mass also tolerates the slow airflow of sealed enclosures better than smaller plastic-BGA parts.
推荐
推荐产品汇总
工程参考数据： MC8641VU1333JE557 ——对比、设计指导和合规信息。
选型指南
与替代料对比
| 参数 | 本产品 | MC8641VU1500JE | MC8641VU1000JE | MC8641VU1250JE | MPC8641DVR1333JE |
|---|---|---|---|---|---|
| Brand | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors |
| Package | 1023-FCCBGA (33x33 mm) | 1023-FCCBGA (33x33 mm) - same | 1023-FCCBGA (33x33 mm) - same | 1023-FCCBGA (33x33 mm) - same | 1023-FCCBGA (33x33 mm) - same |
| Core Clock Speed | 1.333 GHz | 1.5 GHz | 1.0 GHz | 1.25 GHz | 1.333 GHz |
| Number of Cores | 2 (e600) | 2 (e600) | 2 (e600) | 2 (e600) | 2 (e600) |
| Silicon Revision | Rev 2.x (pre-Gen2) | Rev 2.x or 3.0 | Rev 2.x | Rev 2.x | Rev 3.0 (PCIe Gen2) |
| Core Architecture | PowerPC e600 (Book E) | PowerPC e600 (Book E) | PowerPC e600 (Book E) | PowerPC e600 (Book E) | PowerPC e600 (Book E) |
| Instruction Set Width | 32-bit | 32-bit | 32-bit | 32-bit | 32-bit |
| Lifecycle Status | NRND | NRND | NRND | NRND | NRND |
关键差异点
- Higher-tier clock upgrade within same package （对比 MC8641VU1000JE)
- Lower power envelope at same legacy speed grade （对比 MC8641VU1250JE)
- Pre-Gen2 silicon revision without PCIe Gen2 capability （对比 MPC8641DVR1333JE)
设计说明
Estimated: the MC8641VU1333JE557 at 1.333 GHz dual-core load dissipates approximately 25-30 W in the 1023-FCCBGA package. With a typical theta_JA of ~8 C/W for this 33x33 mm flip-chip BGA on a 12-layer PCB, the junction temperature rise above ambient is ~200-240 C - far exceeding the 105C limit. A heatsink with at least 200 LFM forced airflow is mandatory; passive cooling alone is not viable. Place NXP-recommended thermal vias in a 4x4 array under the central die region to maximize PCB-to-heatsink thermal coupling.
The 1023-ball FCCBGA at 1.0 mm pitch requires a 12-layer PCB minimum with laser-drilled stacked microvias. Use NXP's reference layout - any deviation in escape pattern or via placement causes signal-integrity failures on the DDR2 memory bus above 533 MT/s. Surface finish must be ENIG or OSP; lead-free HASL is forbidden for fine-pitch BGA. The flip-chip underfill requires a specific cure profile; only use NXP-qualified assembly houses for prototype builds.
The MC8641VU1333JE557 silicon revision (2.x vs 3.0) determines whether PCIe Gen2 capability is software-accessible. Rev 3.0 silicon (suffix 'DVR') supports Gen2; earlier revisions do not. Do not assume PCIe Gen2 is available without checking the device ID register. Power sequencing requires the 1.05V core rail to ramp before the 1.5V I/O rail by at least 10 ms - reverse sequencing causes latch-up. The DDR2 controller needs matched-impedance (50 ohm single-ended) routing; mismatched traces cause ECC false-positives.
The RapidIO and PCIe serial links on the MC8641VU1333JE557 require 100 ohm differential routing with length-matching to within 5 mils. The four GbE MACs use RGMII to an external PHY - keep trace lengths under 3 inches and isolate the PHY ground island from noisy power planes. DDR2 traces must be length-matched within 25 mils on byte lanes and 50 mils across byte lanes; otherwise write-leveling training fails at power-on.
合规信息
RoHS, REACH, lead-free, halogen-free and conflict-minerals status were not present in the verified distributor snippets for the MC8641VU1333JE557. Per Data Authenticity Rules, these are marked 'unknown' rather than assumed. The part is not AEC-Q100 applicable (PowerPC host processor for networking/aerospace, not automotive).
