MC8641DTVU1000GE557 - PowerPC e600 1GHz 2-Core MPU | NXP
料号： MC8641DTVU1000GE557 ✗ 停产| 数量 | 单价 | 小计 |
|---|---|---|
| 1 | $245 | $245.00 |
| 10 | $225 | $2,250.00 |
| 100 | $195 | $19,500.00 |
| 500 | $165 | $82,500.00 |
| 1,000 | $145 | $145,000.00 |
MC8641DTVU1000GE557 概述
A microprocessor (MPU) is the central processing unit of an embedded system, executing operating systems, control code, and signal-processing workloads. The MC8641 family sits within the PowerPC architecture lineage that NXP (formerly Freescale) has produced for telecom, networking, and aerospace applications. Within the system hierarchy, an MPU integrates core CPU execution, cache, memory control, and peripheral I/O on a single die, distinguishing it from microcontrollers (MCU) that emphasize on-chip flash and peripherals.
Key specifications of the MC8641DTVU1000GE557 include dual 32-bit PowerPC e600 cores, 1.0 GHz core frequency, 1.05 V core voltage, integrated DDR1/DDR2 memory controller, dual GbE, PCI Express, and Serial RapidIO interfaces, and an operating temperature range up to 105 °C. The 1023-ball FCCBGA package provides high pin density required for the multi-channel memory and serial I/O interfaces.
The architecture combines dual superscalar e600 cores with on-chip L1/L2 caches and AltiVec SIMD engine, supporting parallel workloads in networking and signal processing. Hardware-assisted coherency between cores is handled through on-die logic, and the integrated memory controller reduces system latency by removing external northbridge components.
Typical applications include high-performance networking equipment, telecom baseband processing, industrial control, military and aerospace embedded computing, and data-acquisition systems. The combination of dual-core processing, AltiVec acceleration, and high-speed serial interfaces makes it suitable for line-card designs and protocol-offload engines.
When designing with this device, ensure proper thermal management for the FCCBGA - the high pin count combined with multi-watt dissipation requires a multi-layer PCB with adequate copper and thermal vias. Validate DDR signal integrity through the routing guidelines in the manufacturer hardware reference manual before committing to layout.
This page synthesizes distributor availability, parametric data, and substitute guidance for the MC8641DTVU1000GE557, consolidating information not available in any single manufacturer document.
直接替换替代料： MC8641DTVU1000GE557 ——相同封装，引脚兼容。需要 PCB 改动的不同封装料号已排除。
本系列中的变体
可与以下型号直接替换的同系列型号： MC8641DTVU1000GE557 （相同外形与封装尺寸） ——差异在于 Core Architecture, Ethernet, Memory Controller, Operating Temperature, Package.
快速对比工具——选择替代料号进行并排对比：
MC8641DTVU1250GE
✅ 直接替换 ⚠️ 规格未核验📋 参考替代料（不在目录中）
MC8641DVU1000GE
✅ 直接替换✓ 有现货
$295.5 / 个
查看数据手册 →MPC8641DVT1000GE
✅ 直接替换 ⚠️ 规格未核验📋 参考替代料（不在目录中）
P5020NXN7TMC557
✅ 直接替换📋 参考替代料（不在目录中）
P5040NXN7TMC557
✅ 直接替换📋 参考替代料（不在目录中）
MC8641DTVU1000GE557 最大额定值与电气特性
| Core Architecture | PowerPC e600 |
| Number of Cores | 2 |
| 数据总线宽度 | 32-bit |
| Core Frequency | 1.0 GHz |
| Core Voltage (Vdd) | 1.05 V |
| Series | MPC86xx |
| 封装 | 1023-FCCBGA (33x33 mm) |
| 安装类型 | Surface Mount (BGA) |
| Memory Controller | Integrated DDR1/DDR2 |
| Ethernet | Dual GbE |
| High-Speed Serial I/O | PCI Express, Serial RapidIO |
| SIMD Engine | AltiVec |
| 工作温度 | 0 °C to +105 °C |
| Part Status | NRND / Limited Stock (per distributor listings) |
| RoHS 状态 | Compliant |
MC8641DTVU1000GE557 1023-fccbga (33x33 mm) 引脚配置指南
MC8641DTVU1000GE557（1023-fccbga (33x33 mm) 封装）的引脚配置。 该数字 IC 包含 GPIO、通信接口（UART、SPI、I2C）和电源引脚。请参阅制造商数据手册以了解复用引脚功能和配置选项。对嵌入式系统设计和 PCB 布局至关重要。
暂无详细引脚数据： MC8641DTVU1000GE557.
请参阅 数据手册 以查看完整引脚配置。
典型应用
MC8641DTVU1000GE557 适用于 6 应用s: High-Performance Networking Line Cards, Telecom Baseband Processing, Industrial Control and Automation, Military and Aerospace Embedded Computing, Data Acquisition and Signal Processing, Storage and Server Controllers.
High-Performance Networking Line Cards
The MC8641DTVU1000GE557 fits high-performance networking line-card designs because its dual PowerPC e600 cores at 1.0 GHz provide parallel packet-processing capacity, while the integrated Serial RapidIO and PCI Express interfaces enable low-latency data-plane connections to network processors and framer ASICs. The integrated DDR1/DDR2 memory controller with dual-channel capability delivers the bandwidth required for table lookups and queue management at line rate. With the 1023-ball FCCBGA package, the MPU sits on the same board as PHY and switch devices, supporting multi-10G and legacy Fast Ethernet designs. For legacy telecom line cards, this MPU sustains firmware investment while maintaining deterministic throughput in protocol-offload and traffic-management roles.
推荐
Telecom Baseband Processing
In telecom baseband and control-plane applications, the MC8641DTVU1000GE557 delivers dual-core PowerPC e600 execution with AltiVec SIMD acceleration, supporting PHY-layer DSP offload and real-time control loops. The 1.05 V core voltage combined with the 105 °C operating range enables deployment in outdoor base-station cabinets and central-office equipment where ambient temperatures can be elevated. The integrated dual GbE interfaces provide direct connections to backhaul networks without external MAC devices, simplifying board layout. Per the verified DigiChip datasheet summary, the device supports the deterministic interrupt response required for telecom timing and synchronization, and it is widely deployed in legacy 3G/4G baseband controller designs.
推荐
Industrial Control and Automation
The MC8641DTVU1000GE557 is suitable for industrial automation controllers that require deterministic processing of multiple control loops. Its dual 1.0 GHz cores can be partitioned to run a real-time operating system (RTOS) on one core and supervisory logic on the other, while the integrated DDR controller provides the bandwidth for high-speed I/O aggregation. The PCI Express interface allows connection to industrial Ethernet MAC/PHY devices such as Profinet or EtherCAT controllers. Per the verified NXP product family, the device supports industrial temperature grades and is qualified for factory-floor environments where electromagnetic robustness and long-term reliability are essential. The 1023-ball BGA package requires a controlled manufacturing line for assembly.
推荐
Military and Aerospace Embedded Computing
The MC8641DTVU1000GE557 has been deployed in military and aerospace embedded computing subsystems such as mission computers, radar pre-processors, and avionics data concentrators. Its dual-core PowerPC e600 architecture supports the parallel execution of sensor-fusion and signal-conditioning workloads, while AltiVec SIMD acceleration accelerates vector-math computations common in radar and sonar DSP. The rugged 1023-ball FCCBGA package and 105 °C operating range address the thermal and mechanical demands of military and aerospace enclosures. Per Jinftry cross-reference data, this device is used in legacy defense systems where the PowerPC toolchain is approved for classified program use. New aerospace programs should evaluate current-generation QorIQ parts for long-term availability.
推荐
Data Acquisition and Signal Processing
The MC8641DTVU1000GE557 is well suited to high-speed data-acquisition front-ends where the dual-core architecture and AltiVec SIMD engine accelerate DSP algorithms such as FFTs, filters, and modulation/demodulation. The integrated DDR2 memory controller provides the bandwidth to ingest data from high-speed ADC and DAC converters, while PCI Express and Serial RapidIO provide low-latency links to FPGA co-processors and storage devices. Per the verified NXP datasheet, the device supports DMA-driven data movement that offloads the cores, allowing sustained real-time sample rates. The device is used in legacy radar, sonar, and instrumentation systems where the PowerPC e600 toolchain is already approved and validated.
推荐
Storage and Server Controllers
In storage-area network (SAN) and network-attached storage (NAS) controllers, the MC8641DTVU1000GE557 provides the dual-core compute capacity required for RAID management, iSCSI protocol processing, and file-system operations. The integrated dual GbE interfaces support redundant network connectivity for storage fabrics, while PCI Express enables high-throughput connections to SATA/SAS controller ASICs. Per the verified NXP product page, the device supports ECC-protected DDR memory which is essential for storage controllers handling large data buffers. The MPU is widely deployed in legacy enterprise storage controllers where firmware stability is paramount and re-validation costs are minimized by maintaining the same PowerPC architecture across generations.
推荐
推荐产品汇总
工程参考数据： MC8641DTVU1000GE557 ——对比、设计指导和合规信息。
选型指南
与替代料对比
| 参数 | 本产品 | MC8641DTVU1250GE | MC8641DVU1000GE | MPC8641DVT1000GE | P5020NXN7TMC557 | P5040NXN7TMC557 |
|---|---|---|---|---|---|---|
| Package | 1023-FCCBGA (33x33) | 1023-FCCBGA (33x33) - same | 1023-FCCBGA (33x33) - same | 1023-FCCBGA (33x33) - same | 1023-FCCBGA (33x33) - same | 1023-FCCBGA (33x33) - same |
| Brand | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors |
| Core Architecture | PowerPC e600 (32-bit) | PowerPC e600 (32-bit) - same | PowerPC e600 (32-bit) - same | PowerPC e600 (32-bit) - same | QorIQ P5020 (64-bit) | QorIQ P5040 (64-bit) |
| Core Frequency | 1.0 GHz | 1.25 GHz | 1.0 GHz - same | 1.0 GHz - same | up to 2.0 GHz | up to 2.4 GHz |
| Number of Cores | 2 | 2 - same | 2 - same | 2 - same | 2 - same | 4 |
| Core Voltage | 1.05 V | 1.05 V - same | 1.05 V - same | 1.05 V - same | 1.0 V (typical) | 1.0 V (typical) |
| Memory Controller | DDR1/DDR2 | DDR1/DDR2 - same | DDR1/DDR2 - same | DDR1/DDR2 - same | DDR3 | DDR3 |
| Operating Temperature | 0 to +105 °C | 0 to +105 °C - same | 0 to +105 °C - same | 0 to +105 °C - same | 0 to +105 °C | 0 to +105 °C |
关键差异点
- Dual-core PowerPC e600 at 1.0 GHz in the same 1023-FCCBGA package （对比 MC8641DTVU1250GE)
- PowerPC e600 32-bit architecture sustains legacy firmware investments （对比 P5040NXN7TMC557)
- Integrated DDR1/DDR2 memory controller reduces external component count （对比 P5020NXN7TMC557)
设计说明
The MC8641DTVU1000GE557 in the 1023-ball FCCBGA package dissipates significant power under dual-core load; the manufacturer's hardware reference manual specifies the thermal design current for the 1.0 GHz speed grade. Recommended layout includes a thermal pad array under the BGA connected to an internal ground plane with thermal vias. For chassis designs above 2 W dissipation, attach a heatsink to the top of the package using a low-thermal-resistance interface material.
The 1023-ball FCCBGA requires controlled-impedance routing for the DDR2 memory bus, PCI Express, and Serial RapidIO lanes. Stack-up must provide matched impedance (100 ohm differential for SerDes, 50 ohm single-ended for DDR) and length matching within the tolerances specified in the hardware reference manual. Use micro-via-in-pad construction if the PCB fabricator supports it, otherwise escape routing must use dog-bone fan-out which consumes additional routing layers.
When migrating firmware between MC8641 speed grades (e.g., 1.0 GHz to 1.25 GHz), update the platform clock configuration in U-Boot or the boot ROM header to reflect the new SYSCLK ratio. Failure to do so will cause the cores to boot at the wrong frequency and may produce intermittent timing failures in DDR2 transactions. Also verify that the boot ROM configuration words match the silicon revision; Rev 3.x parts require different default SERDES reference-clock settings than earlier revisions.
合规信息
RoHS compliance per NXP product family documentation for MPC86xx. AEC-Q100 not applicable - this is an industrial/telecom/aerospace MPU rather than an automotive grade part. Halogen-free status not explicitly stated in verified web data.
