MC9S08GT60CFDE - 8-Bit 40MHz S08 MCU 60KB Flash | NXP
料号： MC9S08GT60CFDE ✗ 停产| 数量 | 单价 | 小计 |
|---|---|---|
| 1 | $14.83 | $14.83 |
| 10 | $13.21 | $132.10 |
| 100 | $11.04 | $1,104.00 |
| 500 | $9.62 | $4,810.00 |
| 1,000 | $8.75 | $8,750.00 |
MC9S08GT60CFDE 概述
An 8-bit microcontroller (MCU) is a single-chip computer that integrates a CPU, program memory (Flash/ROM), data memory (RAM), and I/O peripherals on a single die. The S08 family uses a CISC (Complex Instruction Set Computer) architecture with the HCS08 core, succeeding the legacy HC08 family. Within the broader hierarchy, the S08 sits under: microcontroller -> embedded processor -> semiconductor device. Compared with 32-bit Cortex-M devices, S08 microcontrollers trade raw throughput for cost, deterministic interrupt latency, and ultra-low static power consumption, making them preferred in cost-sensitive, latency-bound, or battery-aware designs.
Key features of the MC9S08GT60CFDE include 60KB on-chip Flash with in-application reprogrammability, 4KB SRAM, an internal clock generator with trimming, multiple timer/PWM modules, an analog-friendly package with an exposed thermal pad, and built-in safety peripherals (LVD, POR, COP watchdog). The 48-pin QFN-EP package exposes enough GPIO (39 pins) for typical human-interface, motor-control, and sensor-hub designs. Industrial-grade operating temperature range (-40C to +85C minimum) makes the part suitable for factory and automotive cabin environments.
Technically, the HCS08 core executes most instructions in 1-2 bus cycles and supports a BDM (Background Debug Mode) interface for in-circuit programming and debug. The on-chip Flash uses an embedded EEPROM-style array with security lock bits to protect intellectual property. The MC9S08GT60CFDE differs from the GT32 variant in memory density (60KB Flash vs 32KB Flash) and from GT16 in scaling — all share the S08 core and the 48-QFN-EP package, enabling family-up firmware reuse.
Typical applications include industrial motor control (small BLDC, stepper drivers), appliance and white-goods human-interface modules, automotive body-electronics accessories, sensor-hub front-ends, and consumer remote controls. The combination of PWM, SCI/SPI, and I2C makes it well-suited as a bridge controller between a sensor network and a higher-level host. In low-power designs, the on-chip peripherals allow the CPU to remain in wait/stop modes while timers and interrupts handle event-driven wakeups.
When designing with the MC9S08GT60CFDE, ensure the exposed thermal pad is soldered to a copper pour of at least 1 square inch to keep junction temperature in spec for continuous high-CPU-load scenarios. Designers should also evaluate the GT32CFDE variant (32KB Flash) for cost reduction if application code is small enough — both share the same 48-QFN-EP footprint, easing PCB reuse.
This page synthesizes parametric data from the NXP/Freescale datasheet family, distributor pricing as of 2026-10-18, and a drop-in alternatives matrix drawn from the NXP S08 family — content not aggregated in any single distributor or manufacturer page.
直接替换替代料： MC9S08GT60CFDE ——相同封装，引脚兼容。需要 PCB 改动的不同封装料号已排除。
本系列中的变体
可与以下型号直接替换的同系列型号： MC9S08GT60CFDE （相同外形与封装尺寸） ——差异在于 Package, RAM Size, Core Processor, Flash Memory, Lifecycle Status.
快速对比工具——选择替代料号进行并排对比：
MC9S08GT32CFDE
✅ 直接替换📋 参考替代料（不在目录中）
MC9S08GT16CFDE
✅ 直接替换 ⚠️ 规格未核验📋 参考替代料（不在目录中）
MC9S08GT60ACFDE
✅ 直接替换✓ 有现货
联系询价
查看数据手册 →MC9S08GT60ACFDER
✅ 直接替换📋 参考替代料（不在目录中）
MC9S08GT8CFDE
✅ 直接替换 ⚠️ 规格未核验📋 参考替代料（不在目录中）
MC9S08GT60CFDE 最大额定值与电气特性
| Core Processor | S08 (HCS08) CISC |
| Core Size | 8-Bit |
| CPU Speed | 40 MHz |
| Program Memory Size | 60 KB (60K x 8) Flash |
| RAM Size | 4 KB (4K x 8) |
| Number of I/O Pins | 39 |
| 封装 | 48-VFQFN Exposed Pad (HVQCCN, 7x7 mm) |
| 电源电压 | 2.5 V / 3.3 V (typical dual-rail) |
| Connectivity | I2C, SCI, SPI |
| Peripherals | LVD, POR, PWM, WDT |
| Program Memory Type | FLASH |
| 安装类型 | Surface Mount |
| RoHS 状态 | Compliant |
| 生命周期状态 | Obsolete (per distributor records) |
MC9S08GT60CFDE 48-vfqfn exposed pad (hvqccn, 7x7 mm) 引脚配置指南
MC9S08GT60CFDE（48-vfqfn exposed pad (hvqccn, 7x7 mm) 封装）的引脚配置。 该数字 IC 包含 GPIO、通信接口（UART、SPI、I2C）和电源引脚。请参阅制造商数据手册以了解复用引脚功能和配置选项。对嵌入式系统设计和 PCB 布局至关重要。
暂无详细引脚数据： MC9S08GT60CFDE.
请参阅 数据手册 以查看完整引脚配置。
典型应用
MC9S08GT60CFDE 适用于 6 应用s: Industrial Motor Control, Appliance Human-Interface Modules, Automotive Body Electronics Accessories, Sensor Hub Front-Ends, Consumer Remote Controls, Industrial Lighting Controllers.
Industrial Motor Control
The MC9S08GT60CFDE fits small industrial motor control (BLDC, stepper, brushed DC) thanks to its 40MHz S08 core, built-in PWM modules, and 39 GPIO. Its on-chip PWM timers can drive complementary FET pairs at 20kHz+ switching with dead-time insertion controlled in firmware, while SCI and SPI connect to higher-level controllers or driver boards. Compared with a discrete analog controller, the MC9S08GT60CFDE adds programmable commutation curves and in-field firmware updates via its Flash array, simplifying end-of-line tuning. For sub-100W motors where a Cortex-M0 would be overkill, this S08 part hits the right cost/deterministic-latency balance.
推荐
Appliance Human-Interface Modules
The MC9S08GT60CFDE serves well in washing-machine, dishwasher, and oven user-interface modules that demand reliable keypad scanning, LED/PWM dimming, and serial communication to a main controller. The 60KB Flash comfortably holds UI state machines, fault logs, and localized strings, while 4KB RAM supports display buffers and key-debounce logic. SCI and I2C connections link to sensor boards and main MCUs without extra glue logic. The exposed thermal pad aids heat dissipation under continuous LED-PWM operation in wall-oven or cooktop displays.
推荐
Automotive Body Electronics Accessories
Inside the vehicle cabin — for non-safety accessories like seat heaters, mirror controllers, or auxiliary lighting — the MC9S08GT60CFDE delivers industrial-grade performance that often meets cabin-temperature requirements. Its PWM, ADC-friendly GPIO, and SPI connectivity interface with motor-driver and LED-driver ICs; SCI links to body-control modules. The 48-QFN-EP package has a small enough footprint to fit compact in-door or mirror-mounted assemblies. For safety-critical loads, migrate to an AEC-Q100-qualified variant such as MC9S08GT60ACFDE in the same footprint.
推荐
Sensor Hub Front-Ends
Bridged between analog sensors and a higher-level processor, the MC9S08GT60CFDE handles I2C/SPI sensor polling, ADC sampling, and pre-processing before passing cleaned data upstream. Its 40MHz core runs lightweight sensor-fusion loops (low-pass filters, calibration tables) within the 60KB Flash budget. The integrated PWM/LVD/WDT peripherals supervise power rails and watchdog health without external ICs. Compared with a bare analog front-end, this S08 design lets engineers ship firmware updates over CAN or SCI for remote diagnostics.
推荐
Consumer Remote Controls
The MC9S08GT60CFDE powers cost-sensitive IR/RF remote controls with low static power consumption, wake-up timers, and 39 GPIO for key-scan matrices and LED indicators. Its small 48-QFN-EP footprint fits slim handheld enclosures, while PWM timers manage LED backlights and IR modulation at 36-40kHz carrier frequencies. The 60KB Flash accommodates multiple protocol tables (NEC, RC5, RC6) and OEM customization. The S08's deterministic interrupt latency ensures robust button-scan debouncing on AAA-battery power for over a year.
推荐
Industrial Lighting Controllers
LED drivers, signage dimmers, and small-form-factor lighting controllers use the MC9S08GT60CFDE for PWM-driven constant-current regulation across multiple channels. The S08's PWM modules support 8-bit and 16-bit resolutions suitable for commercial-lighting fade curves and RGB color mixing. I2C links to digital potentiometers and temperature sensors; SCI delivers DMX-style or proprietary lighting-protocol traffic. The exposed thermal pad maintains junction temperature when driving high-current LED strings from a small regulator headroom.
推荐
推荐产品汇总
工程参考数据： MC9S08GT60CFDE ——对比、设计指导和合规信息。
选型指南
与替代料对比
| 参数 | 本产品 | MC9S08GT32CFDE | MC9S08GT16CFDE | MC9S08GT60ACFDE | MC9S08GT60ACFDER | MC9S08GT8CFDE |
|---|---|---|---|---|---|---|
| Brand | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors |
| Package | 48-QFN-EP (7x7 mm) | 48-QFN-EP (7x7 mm) - same | 48-QFN-EP (7x7 mm) - same | 48-QFN-EP (7x7 mm) - same | 48-QFN-EP (7x7 mm) - same | 48-QFN-EP (7x7 mm) - same |
| Flash Memory | 60 KB | 32 KB | 16 KB | 60 KB | 60 KB | 8 KB |
| RAM Size | 4 KB | 2 KB | 1 KB | 4 KB | 4 KB | 0.5 KB |
| CPU Speed | 40 MHz | 40 MHz | 40 MHz | 40 MHz | 40 MHz | 40 MHz |
| Number of I/O Pins | 39 | 39 | 39 | 39 | 39 | 39 |
| Temperature Grade | Industrial | Industrial | Industrial | Automotive | Automotive | Industrial |
| Lifecycle Status | Obsolete | Active | Active | Active | Active | Active |
关键差异点
- Highest-density Flash in the S08GT 48-QFN-EP family （对比 MC9S08GT32CFDE)
- Industrial temperature grade （对比 MC9S08GT60ACFDE)
- Established 8-bit S08 core maturity （对比 Cortex-M0+ based MCUs)
设计说明
The 48-QFN-EP package relies on the exposed thermal pad soldered to the PCB ground plane for heat dissipation. Estimated: at 40MHz full-load CPU activity (~25mA core current at 2.5V), the device dissipates roughly 62mW; the VQFN-EP typically offers theta_JA of ~30-40 C/W on a 1-square-inch copper pour. Always connect the e-pad to a copper pour of at least 1 square inch to keep junction temperature inside the industrial-grade envelope.
Place 100nF decoupling capacitors as close as possible to each VDD pin and a single 4.7uF bulk capacitor within 10mm of the package. Route BDM (Background Debug Mode) signals (BKGD, RESET) to a programming header with no stub traces. Keep the exposed pad soldered to a continuous ground pour, stitching vias on a 0.5mm grid for thermal and ground integrity.
Do not assume all S08GT variants are interchangeable in firmware: the Flash/RAM boundaries differ (8/16/32/60 KB) and the interrupt-vector remap on cold-boot must match the variant's memory map. Also, the MC9S08GT60CFDE is marked obsolete per distributor records as of 2026-10-18; new designs should migrate to active S08 successors in the same 48-QFN-EP footprint to avoid supply-chain risk. Use only NXP-approved programming tools to keep Flash security-lock bits intact.
合规信息
RoHS compliance inferred from NXP product family declarations. Halogen-free status not explicitly stated in provided data — see NXP datasheet for confirmation. AEC-Q100 not applicable for the C-suffix industrial variant; choose A-suffix variant for automotive.
