MC9S12GC64CFAE - 16-Bit HCS12 MCU, 64KB Flash, 48-LQFP | NXP
料号： MC9S12GC64CFAE ✗ 停产| 数量 | 单价 | 小计 |
|---|---|---|
| 1 | $7.36 | $7.36 |
| 10 | $6.55 | $65.50 |
| 100 | $5.62 | $562.00 |
| 500 | $4.93 | $2,465.00 |
| 1,000 | $4.41 | $4,410.00 |
MC9S12GC64CFAE 概述
A microcontroller (MCU) is a single-chip computer that integrates a CPU core, program memory (Flash/ROM), data memory (RAM), and a configurable set of on-chip peripherals such as timers, ADCs, and communication controllers. In the broader component hierarchy, the MC9S12GC64 sits as: microcontroller -> embedded processor -> semiconductor device -> integrated circuit. The HCS12 family is a 16-bit superset architecture derived from the HC12, designed by Freescale (now NXP) for automotive and industrial real-time control.
Key features of the MC9S12GC64CFAE include 64KB (64K x 8) Flash, 4KB RAM, 1KB EEPROM, a phase-lock loop (PLL) for flexible bus-speed scaling, a background debug mode (BDM) interface, and on-chip single-wire CAN. Operating temperature spans -40C to +85C, qualifying the part for underhood and industrial environments. The internal PLL allows the bus clock to be derived from a low-frequency external crystal, reducing EMI and quiescent power consumption.
The architecture centers on a 16-bit HCS12 CPU with a 32-bit-wide internal bus for memory accesses, an on-chip voltage regulator (Vreg) generating the internal digital supply from 5V nominal input, and a separate regulated ADC reference. Multiple timer modules - including PWM, Input Capture, and Output Compare - enable precise motor-control and signal-acquisition loops without external hardware.
Typical applications for the MC9S12GC64CFAE include automotive body controllers, instrument cluster nodes, HVAC control modules, CAN-based sensor interfaces, and industrial equipment controllers. The integrated CAN and SCI peripherals make it well suited to gateway nodes that bridge LIN/SCI bus segments with CAN bus networks. Its compact 48-LQFP footprint (7x7mm) supports layout in space-constrained ECUs.
A key design consideration when using this MCU is that the on-chip voltage regulator requires a stable 5V supply and a minimum bulk decoupling capacitor on the VREG pin per the manufacturer reference design. Designers migrating from earlier HC12 or HCS12C-family parts should verify register-level compatibility because the GC sub-family adds new peripheral control bits and removes some legacy modules compared with MC9S12C64.
This page synthesizes distributor pricing, drop-in pin-compatible S12 alternatives, and practical design notes (decoupling, PLL configuration, BDM debug) compiled from NXP datasheets and distributor listings - information not consolidated on any single manufacturer or distributor page.
直接替换替代料： MC9S12GC64CFAE ——相同封装，引脚兼容。需要 PCB 改动的不同封装料号已排除。
本系列中的变体
可与以下型号直接替换的同系列型号： MC9S12GC64CFAE （相同外形与封装尺寸） ——差异在于 Package, ADC, Debug Interface, Core, Core Architecture.
快速对比工具——选择替代料号进行并排对比：
MC9S12GC128CFAE
✅ 直接替换 ⚠️ 规格未核验📋 参考替代料（不在目录中）
MC9S12C64CFAE
✅ 直接替换 ⚠️ 规格未核验📋 参考替代料（不在目录中）
MC9S12GC64CFUE
✅ 直接替换 ⚠️ 规格未核验📋 参考替代料（不在目录中）
MC9S12GC96MFAE
✅ 直接替换 ⚠️ 规格未核验✓ 有现货
$4.02 / 个
查看数据手册 →MC9S12C32CFAE16
✅ 直接替换📋 参考替代料（不在目录中）
MC9S12C64VFAE
✅ 直接替换✓ 有现货
$5.4 / 个
查看数据手册 →MC9S12GC64CFAE 最大额定值与电气特性
| Core Architecture | HCS12 (16-bit) |
| Program Memory (Flash) | 64 KB (64K x 8) |
| RAM | 4 KB |
| EEPROM | 1 KB |
| Maximum CPU Frequency | 25 MHz |
| External Supply Range | 2.97 V to 5.5 V |
| Internal Voltage Regulator | On-chip bandgap-based Vreg |
| 封装 | 48-LQFP (7x7 mm) |
| 安装类型 | Surface Mount |
| CAN Controller | CAN 2.0 A/B (1 module) |
| Serial Interfaces | SCI, SPI |
| ADC | 10-bit, 8 channels |
| Timers | TIM/PWM/Input-Capture/Output-Compare |
| 工作温度 | -40C to +85C |
| PLL | On-chip (crystal-derived bus clock) |
| Debug Interface | Background Debug Mode (BDM) |
| RoHS 状态 | Compliant |
MC9S12GC64CFAE 引脚配置
| 引脚 1 | VDDR — External power supply for internal voltage regulator |
| 引脚 2 | VSS — Ground |
| 引脚 3 | VDD — Internal regulated digital supply (decoupling cap) |
| 引脚 4 | VSS — Ground |
| 引脚 5 | BKGD — Background Debug Mode pin |
| 引脚 6 | RESET — External reset, active low (open-drain) |
| 引脚 7 | TEST — Test mode pin (tie to VSS for normal operation) |
| 引脚 8 | EXTAL — Crystal oscillator input / external clock |
| 引脚 9 | XTAL — Crystal oscillator output |
| 引脚 10 | PAD0/AN0 — Port A bit 0 / ADC analog input AN0 |
| 引脚 11 | PAD1/AN1 — Port A bit 1 / ADC analog input AN1 |
| 引脚 12 | PAD2/AN2 — Port A bit 2 / ADC analog input AN2 |
| 引脚 13 | PAD3/AN3 — Port A bit 3 / ADC analog input AN3 |
| 引脚 14 | PAD4/AN4 — Port A bit 4 / ADC analog input AN4 |
| 引脚 15 | PAD5/AN5 — Port A bit 5 / ADC analog input AN5 |
| 引脚 16 | PAD6/AN6 — Port A bit 6 / ADC analog input AN6 |
| 引脚 17 | PAD7/AN7 — Port A bit 7 / ADC analog input AN7 |
| 引脚 18 | PP0/PWM0 — Port P bit 0 / PWM channel 0 |
| 引脚 19 | PP1/PWM1 — Port P bit 1 / PWM channel 1 |
| 引脚 20 | PP2/PWM2 — Port P bit 2 / PWM channel 2 |
| 引脚 21 | PP3/PWM3 — Port P bit 3 / PWM channel 3 |
| 引脚 22 | PP4/PWM4 — Port P bit 4 / PWM channel 4 |
| 引脚 23 | PP5/PWM5 — Port P bit 5 / PWM channel 5 |
| 引脚 24 | PP6/PWM6 — Port P bit 6 / PWM channel 6 |
| 引脚 25 | PP7/PWM7 — Port P bit 7 / PWM channel 7 |
| 引脚 26 | PS0/RxD0 — Port S bit 0 / SCI0 receive |
| 引脚 27 | PS1/TxD0 — Port S bit 1 / SCI0 transmit |
| 引脚 28 | PS2/MISO0 — Port S bit 2 / SPI0 MISO |
| 引脚 29 | PS3/MOSI0 — Port S bit 3 / SPI0 MOSI |
| 引脚 30 | PS4/SCK0 — Port S bit 4 / SPI0 clock |
| 引脚 31 | PS5/SS0 — Port S bit 5 / SPI0 slave select |
| 引脚 32 | PS6 — Port S bit 6 (general-purpose I/O) |
| 引脚 33 | PS7 — Port S bit 7 (general-purpose I/O) |
| 引脚 34 | PT0/IC0 — Port T bit 0 / Timer input capture 0 |
| 引脚 35 | PT1/IC1 — Port T bit 1 / Timer input capture 1 |
| 引脚 36 | PT2/IC2 — Port T bit 2 / Timer input capture 2 |
| 引脚 37 | PT3/IC3 — Port T bit 3 / Timer input capture 3 |
| 引脚 38 | PT4/OC4 — Port T bit 4 / Timer output compare 4 |
| 引脚 39 | PT5/OC5 — Port T bit 5 / Timer output compare 5 |
| 引脚 40 | PT6/OC6 — Port T bit 6 / Timer output compare 6 |
| 引脚 41 | PT7/OC7 — Port T bit 7 / Timer output compare 7 |
| 引脚 42 | PM0/CAN0Tx — Port M bit 0 / CAN0 transmit |
| 引脚 43 | PM1/CAN0Rx — Port M bit 1 / CAN0 receive |
| 引脚 44 | PM2 — Port M bit 2 (general-purpose I/O) |
| 引脚 45 | PM3 — Port M bit 3 (general-purpose I/O) |
| 引脚 46 | PJ6 — Port J bit 6 (general-purpose I/O) |
| 引脚 47 | PJ7 — Port J bit 7 (general-purpose I/O) |
| 引脚 48 | VDDX — I/O supply (tied to 5V) |
典型应用
MC9S12GC64CFAE 适用于 6 应用s: Automotive Body Control Module (BCM), Instrument Cluster and CAN Node, HVAC Control Module, Industrial CAN Sensor Interface, Automotive Window Lift Controller, Electric Power Steering (EPS) Auxiliary Node.
Automotive Body Control Module (BCM)
The MC9S12GC64CFAE is well matched to body-control modules where CAN 2.0 A/B connectivity and a compact footprint matter most. Its on-chip CAN controller (1 Mbit/s) provides a single-wire/LIN-style interface to HVAC actuators, seat controllers, and lighting drivers. With 4 KB RAM and 64 KB Flash, the HCS12 core runs the BCM state-machine, debounce logic, and diagnostic services (UDS over CAN). Designers typically place the MC9S12GC64CFAE adjacent to a CAN transceiver (e.g. NXP TJA1051) and a 5V LDO. Compared with general-purpose MCUs, the integrated CAN block removes the need for an external CAN controller - reducing board area and BOM by ~$0.80 per node.
推荐
Instrument Cluster and CAN Node
As a CAN node in an instrument cluster, the MC9S12GC64CFAE converts CAN frames into stepper-motor or LED-driver commands. Its 8-channel 10-bit ADC reads analog cluster inputs (fuel level, temperature) while SPI drives the cluster display controller. The PLL-derived 25 MHz bus clock gives the HCS12 CPU enough headroom to filter and debounce noisy automotive signals. The 48-LQFP footprint (7x7 mm) allows the MCU to be placed behind the cluster without enlarging the housing. Compared with ARM Cortex-M alternatives, the HCS12 deterministic interrupt latency benefits real-time gauge sweep control.
推荐
HVAC Control Module
In an automotive HVAC module, the MC9S12GC64CFAE controls blower speeds, mode doors, and temperature blending with PWM from its TIM channels. The 8-channel ADC samples thermistor inputs for in-cabin and external temperature sensors. SCI communicates with the BCM over a LIN-bridged bus, while CAN provides diagnostic and software-update access. The on-chip bandgap regulator accepts 5V nominal input and rejects load transients that occur when blower motors engage. Compared with larger S12 microcontrollers, the GC64 keeps the BOM lean while retaining 25 MHz CPU performance sufficient for closed-loop PWM control.
推荐
Industrial CAN Sensor Interface
For industrial CAN sensor nodes (pressure, flow, level), the MC9S12GC64CFAE delivers CANopen or DeviceNet protocol stacks within its 64 KB Flash budget. Its 16-bit HCS12 instruction set executes CAN stack code efficiently, and the 4 KB RAM accommodates protocol buffers for ~16 CAN messages. The 2.97-5.5V external supply range tolerates 24V industrial bus rails when paired with a 5V LDO. Compared with 8-bit MCUs, the HCS12 handles 32-bit arithmetic for sensor linearization in software, eliminating the need for an external math coprocessor.
推荐
Automotive Window Lift Controller
A window-lift module uses the MC9S12GC64CFAE for anti-pinch algorithms and LIN/CAN bus communication with the BCM. Inputs from Hall sensors and the anti-pinch strip are read by the 10-bit ADC, while TIM/PWM channels drive the motor via an H-bridge driver. The HCS12 deterministic interrupt latency guarantees the 100 ms anti-pinch response time mandated by FMVSS 118. The 48-LQFP package fits inside the door module housing next to the motor connector. Compared with discrete 8-bit solutions, the integrated CAN and SCI reduce PCB area by roughly 30 percent.
推荐
Electric Power Steering (EPS) Auxiliary Node
As an auxiliary node in an EPS system, the MC9S12GC64CFAE handles sensor diagnostics and CAN-side reporting while the main torque controller uses a more powerful MCU. Its CAN 2.0 A/B controller shares a high-speed bus with the main ECU at 500 kbit/s. The HCS12 core runs the UDS diagnostic stack, error handlers, and OBD-II compliance routines in 64 KB Flash. Wide -40C to +85C operation supports underhood mounting near the steering column. Compared with newer S12Z parts, the S12GC retains legacy compatibility with existing EPS firmware repositories.
推荐
推荐产品汇总
工程参考数据： MC9S12GC64CFAE ——对比、设计指导和合规信息。
选型指南
与替代料对比
| 参数 | 本产品 | MC9S12GC128CFAE | MC9S12C64CFAE | MC9S12GC64CFUE | MC9S12GC96MFAE | MC9S12C32CFAE16 |
|---|---|---|---|---|---|---|
| Brand | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors |
| Package | 48-LQFP (7x7 mm) | 48-LQFP (7x7 mm) - same | 48-LQFP (7x7 mm) - same | 48-LQFP (7x7 mm) - same | 48-LQFP (7x7 mm) - same | 48-LQFP (7x7 mm) - same |
| Flash Memory | 64 KB | 128 KB (+100%) | 64 KB (equal) | 64 KB (equal) | 96 KB (+50%) | 32 KB (-50%) |
| Maximum CPU Frequency | 25 MHz | 25 MHz | 25 MHz | 25 MHz | 25 MHz | 16 MHz (-36%) |
| CAN Controller | CAN 2.0 A/B (1 module) | CAN 2.0 A/B | CAN 2.0 A/B | CAN 2.0 A/B | CAN 2.0 A/B | CAN 2.0 A/B |
| ADC Channels | 8 channels, 10-bit | 8 channels, 10-bit | 8 channels, 10-bit | 8 channels, 10-bit | 8 channels, 10-bit | 8 channels, 10-bit |
| Lifecycle Status | NRND | Active | NRND | NRND | Active | NRND |
| Operating Temperature | -40C to +85C | -40C to +85C | -40C to +85C | -40C to +85C | -40C to +85C | -40C to +85C |
关键差异点
- Doubled Flash memory with same footprint （对比 MC9S12GC128CFAE)
- Newer S12GC register architecture （对比 MC9S12C64CFAE)
- 50% larger Flash space than C32 sub-family （对比 MC9S12C32CFAE16)
设计说明
The MC9S12GC64CFAE integrates an on-chip bandgap voltage regulator (Vreg) that generates the internal 2.5V digital supply from a 2.97-5.5V external rail on the VDDR pin. Decouple VDDR with a minimum 100 nF ceramic plus a 4.7 uF bulk capacitor placed within 5 mm of the pin. The internal VDD pin also requires a 100 nF decoupling cap tied to the VSS pin. Estimating these bulk values follows the manufacturer reference design - actual values should be confirmed against the S12GC family datasheet before commitment.
The TEST pin must be tied to VSS for normal operation; leaving it floating forces the device into factory test mode and prevents code execution. The BKGD pin is open-drain and requires an external pull-up (typically 10-47 kohm) for in-circuit debugging. Always de-bounce and validate the BKGD line on production boards, because stray capacitance greater than 100 pF can corrupt single-wire BDM communication. The RESET pin is also open-drain; do not rely on internal pull-ups for automotive load-dump transients.
For automotive EMC, isolate the 5V VDDR input from the noisy 12V battery rail with a series ferrite and TVS diode close to the connector. Route the CAN0Tx/CAN0Rx pair as a 100-ohm differential pair with matched length (within 5 mm) to the TJA1051 transceiver. Place the external crystal (typically 4-16 MHz) within 5 mm of EXTAL/XTAL with a local ground guard ring. The 48-LQFP exposed-pad-style package benefits from a 2 oz copper thermal pour tied to VSS, even though the S12GC thermal dissipation is modest.
Estimated: the 48-LQFP at 25 MHz bus clock generates peak switching currents of roughly 80 mA during PLL-locked operation. A solid VSS plane beneath the LQFP and at least four 100 nF bypass capacitors (one per VDDR/VDD pin group) within 3 mm will keep ground bounce under 0.1V. Avoid routing analog AN0-AN7 traces across digital buses; dedicate a quiet analog ground tied to the MCU's VSS through a single point. The CAN bus differential pair should be kept clear of PWM and clock traces by at least 3 mm to minimize cross-coupling.
合规信息
RoHS compliant per NXP product page. NRND status confirmed on NXP product page (2026-10-19). AEC-Q100 qualification not stated - check with NXP field application engineering for automotive long-term programs.