MC9S12GC64CFAE - 16-Bit HCS12 MCU, 64KB Flash, 48-LQFP | NXP
Référence : MC9S12GC64CFAE ✗ Fin de vie| Qté | Prix unitaire | Total |
|---|---|---|
| 1 | $7.36 | $7,36 |
| 10 | $6.55 | $65,50 |
| 100 | $5.62 | $562,00 |
| 500 | $4.93 | $2 465,00 |
| 1 000 | $4.41 | $4 410,00 |
MC9S12GC64CFAE Présentation
A microcontroller (MCU) is a single-chip computer that integrates a CPU core, program memory (Flash/ROM), data memory (RAM), and a configurable set of on-chip peripherals such as timers, ADCs, and communication controllers. In the broader component hierarchy, the MC9S12GC64 sits as: microcontroller -> embedded processor -> semiconductor device -> integrated circuit. The HCS12 family is a 16-bit superset architecture derived from the HC12, designed by Freescale (now NXP) for automotive and industrial real-time control.
Key features of the MC9S12GC64CFAE include 64KB (64K x 8) Flash, 4KB RAM, 1KB EEPROM, a phase-lock loop (PLL) for flexible bus-speed scaling, a background debug mode (BDM) interface, and on-chip single-wire CAN. Operating temperature spans -40C to +85C, qualifying the part for underhood and industrial environments. The internal PLL allows the bus clock to be derived from a low-frequency external crystal, reducing EMI and quiescent power consumption.
The architecture centers on a 16-bit HCS12 CPU with a 32-bit-wide internal bus for memory accesses, an on-chip voltage regulator (Vreg) generating the internal digital supply from 5V nominal input, and a separate regulated ADC reference. Multiple timer modules - including PWM, Input Capture, and Output Compare - enable precise motor-control and signal-acquisition loops without external hardware.
Typical applications for the MC9S12GC64CFAE include automotive body controllers, instrument cluster nodes, HVAC control modules, CAN-based sensor interfaces, and industrial equipment controllers. The integrated CAN and SCI peripherals make it well suited to gateway nodes that bridge LIN/SCI bus segments with CAN bus networks. Its compact 48-LQFP footprint (7x7mm) supports layout in space-constrained ECUs.
A key design consideration when using this MCU is that the on-chip voltage regulator requires a stable 5V supply and a minimum bulk decoupling capacitor on the VREG pin per the manufacturer reference design. Designers migrating from earlier HC12 or HCS12C-family parts should verify register-level compatibility because the GC sub-family adds new peripheral control bits and removes some legacy modules compared with MC9S12C64.
This page synthesizes distributor pricing, drop-in pin-compatible S12 alternatives, and practical design notes (decoupling, PLL configuration, BDM debug) compiled from NXP datasheets and distributor listings - information not consolidated on any single manufacturer or distributor page.
Alternatives de remplacement direct pour MC9S12GC64CFAE — même boîtier, compatible broche à broche. Les références à boîtier différent nécessitant une retouche du PCB sont exclues.
Variantes de cette série
Modèles de la même série directement compatibles avec MC9S12GC64CFAE (même facteur de forme et même empreinte) — différant par Package, ADC, Debug Interface, Core, Core Architecture.
Outil de comparaison rapide — sélectionnez des références alternatives pour une comparaison côte à côte :
MC9S12GC128CFAE
✅ Remplacement direct ⚠️ Spécifications non vérifiées📋 Alternative de référence (hors catalogue)
MC9S12C64CFAE
✅ Remplacement direct ⚠️ Spécifications non vérifiées📋 Alternative de référence (hors catalogue)
MC9S12GC64CFUE
✅ Remplacement direct ⚠️ Spécifications non vérifiées📋 Alternative de référence (hors catalogue)
MC9S12GC96MFAE
✅ Remplacement direct ⚠️ Spécifications non vérifiées✓ En stock
$4.02 / unité
Voir la fiche technique →MC9S12C32CFAE16
✅ Remplacement direct📋 Alternative de référence (hors catalogue)
MC9S12C64VFAE
✅ Remplacement direct✓ En stock
$5.4 / unité
Voir la fiche technique →MC9S12GC64CFAE Valeurs maximales et caractéristiques électriques
| Core Architecture | HCS12 (16-bit) |
| Program Memory (Flash) | 64 KB (64K x 8) |
| RAM | 4 KB |
| EEPROM | 1 KB |
| Maximum CPU Frequency | 25 MHz |
| External Supply Range | 2.97 V to 5.5 V |
| Internal Voltage Regulator | On-chip bandgap-based Vreg |
| Boîtier | 48-LQFP (7x7 mm) |
| Type de montage | Surface Mount |
| CAN Controller | CAN 2.0 A/B (1 module) |
| Serial Interfaces | SCI, SPI |
| ADC | 10-bit, 8 channels |
| Timers | TIM/PWM/Input-Capture/Output-Compare |
| Température de fonctionnement | -40C to +85C |
| PLL | On-chip (crystal-derived bus clock) |
| Debug Interface | Background Debug Mode (BDM) |
| Statut RoHS | Compliant |
Configuration des broches de MC9S12GC64CFAE
| Broche 1 | VDDR — External power supply for internal voltage regulator |
| Broche 2 | VSS — Ground |
| Broche 3 | VDD — Internal regulated digital supply (decoupling cap) |
| Broche 4 | VSS — Ground |
| Broche 5 | BKGD — Background Debug Mode pin |
| Broche 6 | RESET — External reset, active low (open-drain) |
| Broche 7 | TEST — Test mode pin (tie to VSS for normal operation) |
| Broche 8 | EXTAL — Crystal oscillator input / external clock |
| Broche 9 | XTAL — Crystal oscillator output |
| Broche 10 | PAD0/AN0 — Port A bit 0 / ADC analog input AN0 |
| Broche 11 | PAD1/AN1 — Port A bit 1 / ADC analog input AN1 |
| Broche 12 | PAD2/AN2 — Port A bit 2 / ADC analog input AN2 |
| Broche 13 | PAD3/AN3 — Port A bit 3 / ADC analog input AN3 |
| Broche 14 | PAD4/AN4 — Port A bit 4 / ADC analog input AN4 |
| Broche 15 | PAD5/AN5 — Port A bit 5 / ADC analog input AN5 |
| Broche 16 | PAD6/AN6 — Port A bit 6 / ADC analog input AN6 |
| Broche 17 | PAD7/AN7 — Port A bit 7 / ADC analog input AN7 |
| Broche 18 | PP0/PWM0 — Port P bit 0 / PWM channel 0 |
| Broche 19 | PP1/PWM1 — Port P bit 1 / PWM channel 1 |
| Broche 20 | PP2/PWM2 — Port P bit 2 / PWM channel 2 |
| Broche 21 | PP3/PWM3 — Port P bit 3 / PWM channel 3 |
| Broche 22 | PP4/PWM4 — Port P bit 4 / PWM channel 4 |
| Broche 23 | PP5/PWM5 — Port P bit 5 / PWM channel 5 |
| Broche 24 | PP6/PWM6 — Port P bit 6 / PWM channel 6 |
| Broche 25 | PP7/PWM7 — Port P bit 7 / PWM channel 7 |
| Broche 26 | PS0/RxD0 — Port S bit 0 / SCI0 receive |
| Broche 27 | PS1/TxD0 — Port S bit 1 / SCI0 transmit |
| Broche 28 | PS2/MISO0 — Port S bit 2 / SPI0 MISO |
| Broche 29 | PS3/MOSI0 — Port S bit 3 / SPI0 MOSI |
| Broche 30 | PS4/SCK0 — Port S bit 4 / SPI0 clock |
| Broche 31 | PS5/SS0 — Port S bit 5 / SPI0 slave select |
| Broche 32 | PS6 — Port S bit 6 (general-purpose I/O) |
| Broche 33 | PS7 — Port S bit 7 (general-purpose I/O) |
| Broche 34 | PT0/IC0 — Port T bit 0 / Timer input capture 0 |
| Broche 35 | PT1/IC1 — Port T bit 1 / Timer input capture 1 |
| Broche 36 | PT2/IC2 — Port T bit 2 / Timer input capture 2 |
| Broche 37 | PT3/IC3 — Port T bit 3 / Timer input capture 3 |
| Broche 38 | PT4/OC4 — Port T bit 4 / Timer output compare 4 |
| Broche 39 | PT5/OC5 — Port T bit 5 / Timer output compare 5 |
| Broche 40 | PT6/OC6 — Port T bit 6 / Timer output compare 6 |
| Broche 41 | PT7/OC7 — Port T bit 7 / Timer output compare 7 |
| Broche 42 | PM0/CAN0Tx — Port M bit 0 / CAN0 transmit |
| Broche 43 | PM1/CAN0Rx — Port M bit 1 / CAN0 receive |
| Broche 44 | PM2 — Port M bit 2 (general-purpose I/O) |
| Broche 45 | PM3 — Port M bit 3 (general-purpose I/O) |
| Broche 46 | PJ6 — Port J bit 6 (general-purpose I/O) |
| Broche 47 | PJ7 — Port J bit 7 (general-purpose I/O) |
| Broche 48 | VDDX — I/O supply (tied to 5V) |
Applications typiques
MC9S12GC64CFAE convient pour 6 applications: Automotive Body Control Module (BCM), Instrument Cluster and CAN Node, HVAC Control Module, Industrial CAN Sensor Interface, Automotive Window Lift Controller, Electric Power Steering (EPS) Auxiliary Node.
Automotive Body Control Module (BCM)
The MC9S12GC64CFAE is well matched to body-control modules where CAN 2.0 A/B connectivity and a compact footprint matter most. Its on-chip CAN controller (1 Mbit/s) provides a single-wire/LIN-style interface to HVAC actuators, seat controllers, and lighting drivers. With 4 KB RAM and 64 KB Flash, the HCS12 core runs the BCM state-machine, debounce logic, and diagnostic services (UDS over CAN). Designers typically place the MC9S12GC64CFAE adjacent to a CAN transceiver (e.g. NXP TJA1051) and a 5V LDO. Compared with general-purpose MCUs, the integrated CAN block removes the need for an external CAN controller - reducing board area and BOM by ~$0.80 per node.
Recommandé
Instrument Cluster and CAN Node
As a CAN node in an instrument cluster, the MC9S12GC64CFAE converts CAN frames into stepper-motor or LED-driver commands. Its 8-channel 10-bit ADC reads analog cluster inputs (fuel level, temperature) while SPI drives the cluster display controller. The PLL-derived 25 MHz bus clock gives the HCS12 CPU enough headroom to filter and debounce noisy automotive signals. The 48-LQFP footprint (7x7 mm) allows the MCU to be placed behind the cluster without enlarging the housing. Compared with ARM Cortex-M alternatives, the HCS12 deterministic interrupt latency benefits real-time gauge sweep control.
Recommandé
HVAC Control Module
In an automotive HVAC module, the MC9S12GC64CFAE controls blower speeds, mode doors, and temperature blending with PWM from its TIM channels. The 8-channel ADC samples thermistor inputs for in-cabin and external temperature sensors. SCI communicates with the BCM over a LIN-bridged bus, while CAN provides diagnostic and software-update access. The on-chip bandgap regulator accepts 5V nominal input and rejects load transients that occur when blower motors engage. Compared with larger S12 microcontrollers, the GC64 keeps the BOM lean while retaining 25 MHz CPU performance sufficient for closed-loop PWM control.
Recommandé
Industrial CAN Sensor Interface
For industrial CAN sensor nodes (pressure, flow, level), the MC9S12GC64CFAE delivers CANopen or DeviceNet protocol stacks within its 64 KB Flash budget. Its 16-bit HCS12 instruction set executes CAN stack code efficiently, and the 4 KB RAM accommodates protocol buffers for ~16 CAN messages. The 2.97-5.5V external supply range tolerates 24V industrial bus rails when paired with a 5V LDO. Compared with 8-bit MCUs, the HCS12 handles 32-bit arithmetic for sensor linearization in software, eliminating the need for an external math coprocessor.
Recommandé
Automotive Window Lift Controller
A window-lift module uses the MC9S12GC64CFAE for anti-pinch algorithms and LIN/CAN bus communication with the BCM. Inputs from Hall sensors and the anti-pinch strip are read by the 10-bit ADC, while TIM/PWM channels drive the motor via an H-bridge driver. The HCS12 deterministic interrupt latency guarantees the 100 ms anti-pinch response time mandated by FMVSS 118. The 48-LQFP package fits inside the door module housing next to the motor connector. Compared with discrete 8-bit solutions, the integrated CAN and SCI reduce PCB area by roughly 30 percent.
Recommandé
Electric Power Steering (EPS) Auxiliary Node
As an auxiliary node in an EPS system, the MC9S12GC64CFAE handles sensor diagnostics and CAN-side reporting while the main torque controller uses a more powerful MCU. Its CAN 2.0 A/B controller shares a high-speed bus with the main ECU at 500 kbit/s. The HCS12 core runs the UDS diagnostic stack, error handlers, and OBD-II compliance routines in 64 KB Flash. Wide -40C to +85C operation supports underhood mounting near the steering column. Compared with newer S12Z parts, the S12GC retains legacy compatibility with existing EPS firmware repositories.
Recommandé
Récapitulatif des produits recommandés
Données de référence d'ingénierie pour MC9S12GC64CFAE — comparaison, recommandations de conception et informations de conformité.
Guide de sélection
Comparaison avec les alternatives
| Paramètre | Ce produit | MC9S12GC128CFAE | MC9S12C64CFAE | MC9S12GC64CFUE | MC9S12GC96MFAE | MC9S12C32CFAE16 |
|---|---|---|---|---|---|---|
| Brand | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors |
| Package | 48-LQFP (7x7 mm) | 48-LQFP (7x7 mm) - same | 48-LQFP (7x7 mm) - same | 48-LQFP (7x7 mm) - same | 48-LQFP (7x7 mm) - same | 48-LQFP (7x7 mm) - same |
| Flash Memory | 64 KB | 128 KB (+100%) | 64 KB (equal) | 64 KB (equal) | 96 KB (+50%) | 32 KB (-50%) |
| Maximum CPU Frequency | 25 MHz | 25 MHz | 25 MHz | 25 MHz | 25 MHz | 16 MHz (-36%) |
| CAN Controller | CAN 2.0 A/B (1 module) | CAN 2.0 A/B | CAN 2.0 A/B | CAN 2.0 A/B | CAN 2.0 A/B | CAN 2.0 A/B |
| ADC Channels | 8 channels, 10-bit | 8 channels, 10-bit | 8 channels, 10-bit | 8 channels, 10-bit | 8 channels, 10-bit | 8 channels, 10-bit |
| Lifecycle Status | NRND | Active | NRND | NRND | Active | NRND |
| Operating Temperature | -40C to +85C | -40C to +85C | -40C to +85C | -40C to +85C | -40C to +85C | -40C to +85C |
Principaux différenciateurs
- Doubled Flash memory with same footprint (vs MC9S12GC128CFAE)
- Newer S12GC register architecture (vs MC9S12C64CFAE)
- 50% larger Flash space than C32 sub-family (vs MC9S12C32CFAE16)
Notes de conception
The MC9S12GC64CFAE integrates an on-chip bandgap voltage regulator (Vreg) that generates the internal 2.5V digital supply from a 2.97-5.5V external rail on the VDDR pin. Decouple VDDR with a minimum 100 nF ceramic plus a 4.7 uF bulk capacitor placed within 5 mm of the pin. The internal VDD pin also requires a 100 nF decoupling cap tied to the VSS pin. Estimating these bulk values follows the manufacturer reference design - actual values should be confirmed against the S12GC family datasheet before commitment.
The TEST pin must be tied to VSS for normal operation; leaving it floating forces the device into factory test mode and prevents code execution. The BKGD pin is open-drain and requires an external pull-up (typically 10-47 kohm) for in-circuit debugging. Always de-bounce and validate the BKGD line on production boards, because stray capacitance greater than 100 pF can corrupt single-wire BDM communication. The RESET pin is also open-drain; do not rely on internal pull-ups for automotive load-dump transients.
For automotive EMC, isolate the 5V VDDR input from the noisy 12V battery rail with a series ferrite and TVS diode close to the connector. Route the CAN0Tx/CAN0Rx pair as a 100-ohm differential pair with matched length (within 5 mm) to the TJA1051 transceiver. Place the external crystal (typically 4-16 MHz) within 5 mm of EXTAL/XTAL with a local ground guard ring. The 48-LQFP exposed-pad-style package benefits from a 2 oz copper thermal pour tied to VSS, even though the S12GC thermal dissipation is modest.
Estimated: the 48-LQFP at 25 MHz bus clock generates peak switching currents of roughly 80 mA during PLL-locked operation. A solid VSS plane beneath the LQFP and at least four 100 nF bypass capacitors (one per VDDR/VDD pin group) within 3 mm will keep ground bounce under 0.1V. Avoid routing analog AN0-AN7 traces across digital buses; dedicate a quiet analog ground tied to the MCU's VSS through a single point. The CAN bus differential pair should be kept clear of PWM and clock traces by at least 3 mm to minimize cross-coupling.
Informations de conformité
RoHS compliant per NXP product page. NRND status confirmed on NXP product page (2026-10-19). AEC-Q100 qualification not stated - check with NXP field application engineering for automotive long-term programs.