MCIMX507CVM1B - i.MX50 ARM Cortex-A8 800MHz MPU | NXP
料号： MCIMX507CVM1B ⚠ 最后一次采购| 数量 | 单价 | 小计 |
|---|---|---|
| 1 | $21.2 | $21.20 |
| 10 | $19.08 | $190.80 |
| 100 | $17.02 | $1,702.00 |
| 500 | $15.1 | $7,550.00 |
| 1,000 | $13.45 | $13,450.00 |
MCIMX507CVM1B 概述
An applications processor (AP) is a system-on-chip (SoC) optimized to run an operating system (typically Linux, Android, or a real-time OS) and to host user-facing applications, as distinct from microcontrollers (MCUs) that typically run bare-metal or RTOS code without a rich OS. Within the broader taxonomy, the i.MX50 family sits under ARM Cortex-A application processors > applications MPU > integrated circuits > semiconductors. The Cortex-A8 core implements the ARMv7-A architecture with NEON SIMD media extensions and a VFPv3 floating-point unit.
Key differentiating features include 800 MHz Cortex-A8 core, integrated hardware EPD controller (key for e-paper display pipelines), 32-bit data path, and the 400-ball MAPBGA package supporting high-bandwidth memory and display interfaces. The device is positioned by NXP as the follow-on to the market-leading i.MX508 eReader processor.
Architecturally, the SoC integrates the Cortex-A8 core with on-chip L1/L2 cache, an LCD/EPD controller, image-processing peripherals, and a multi-standard memory interface. Power-management is handled by an integrated power-management unit enabling the deep low-power states required for eReader battery-life targets.
Typical applications include consumer eReaders, electronic shelf labels, outdoor digital signage, industrial kiosks, and other low-power display products. Per NXP product documentation, the MCIMX507CVM1B has entered the NXP End-of-Life process, so design teams targeting long-life programs should evaluate the recommended NXP replacement.
Designers should plan for a multi-layer PCB (typically 6+ layers) for the high-speed memory bus and route impedance-controlled display traces to the BGA escape region. Thermal management at 800 MHz is generally passive on a properly designed 4-layer board, but enclosure thermal analysis is recommended for sealed outdoor products.
This page synthesizes NXP product-page status, distributor pricing, drop-in package alternatives, and practical design notes not aggregated on the manufacturer product page.
直接替换替代料： MCIMX507CVM1B ——相同封装，引脚兼容。需要 PCB 改动的不同封装料号已排除。
本系列中的变体
可与以下型号直接替换的同系列型号： MCIMX507CVM1B （相同外形与封装尺寸） ——差异在于 Mounting Type, Package.
快速对比工具——选择替代料号进行并排对比：
MCIMX508CVM1B
✅ 直接替换 ⚠️ 规格未核验📋 参考替代料（不在目录中）
MCIMX507CZK1B
✅ 直接替换 ⚠️ 规格未核验📋 参考替代料（不在目录中）
MCIMX508CZK1B
✅ 直接替换 ⚠️ 规格未核验📋 参考替代料（不在目录中）
MCIMX507CVM1B 最大额定值与电气特性
| Family | i.MX50 |
| Core Architecture | ARM Cortex-A8 (ARMv7-A) |
| Core Count | 1 |
| Data Width | 32-bit |
| Maximum CPU Clock | 800 MHz |
| Integrated Display Controller | Hardware Electronic Paper Display (EPD) controller |
| 封装 | 400-MAPBGA (17x17 mm) |
| 安装类型 | Surface Mount (BGA) |
| Temperature Grade | Commercial |
| Terminal Form | Ball |
| Number of Terminals | 400 |
| Package Code | LFBGA / MAPBGA |
| Package Shape | Square |
| RoHS 状态 | Compliant |
MCIMX507CVM1B square 引脚配置指南
MCIMX507CVM1B（square 封装）的引脚配置。 该数字 IC 包含 GPIO、通信接口（UART、SPI、I2C）和电源引脚。请参阅制造商数据手册以了解复用引脚功能和配置选项。对嵌入式系统设计和 PCB 布局至关重要。
暂无详细引脚数据： MCIMX507CVM1B.
请参阅 数据手册 以查看完整引脚配置。
典型应用
MCIMX507CVM1B 适用于 6 应用s: Consumer eReader Devices, Electronic Shelf Labels (ESL), Outdoor Digital Signage, Industrial Kiosks and Information Displays, Smart Home Control Panels, Industrial HMI with E-Paper.
Consumer eReader Devices
The MCIMX507CVM1B's integrated hardware EPD controller makes it a drop-in solution for eReader mainboards. The 800 MHz Cortex-A8 core runs the eReader UI and PDF engine while the EPD block handles waveform sequencing, partial refresh, and dithering. Compared to using a generic MPU plus a discrete EPD timing FPGA, the i.MX507 reduces BOM cost and PCB area. The 400-MAPBGA exposes parallel display buses for direct e-paper panel connection, simplifying the display interface. Software reuse from the i.MX508 shortens development. Battery-life targets are met by the i.MX50 power-management unit's deep-sleep states.
推荐
Electronic Shelf Labels (ESL)
Retail electronic shelf labels leverage the i.MX507's hardware EPD controller for ultra-low-power bistable display updates over wireless links. The Cortex-A8 handles the ESL gateway stack and price-update logic; the EPD block drives the segmented e-paper panel without CPU intervention during refresh. The commercial temperature grade covers indoor retail environments. Because ESL deployments span thousands of units per store, the i.MX50's mature Linux BSP and NXP longevity commitment (prior to EOL) made it attractive. Power budgeting is dominated by wireless TX events, not MPU active current.
推荐
Outdoor Digital Signage
Outdoor e-paper signage benefits from the i.MX507's combination of Cortex-A8 throughput for content rendering and hardware EPD acceleration for sunlight-readable bistable displays. The 800 MHz clock renders signage graphics efficiently while the EPD block manages partial updates without flicker. The commercial temperature range suits sheltered outdoor enclosures. Designers pair the i.MX507 with a low-power Wi-Fi or cellular module for remote content updates. The 400-MAPBGA supports the high-bandwidth memory bus needed for large signage bitmaps.
推荐
Industrial Kiosks and Information Displays
Self-service kiosks and information displays use the MCIMX507CVM1B when a low-power e-paper UI is preferred over backlit LCD. The Cortex-A8 runs kiosk application logic and the EPD block updates the user interface without backlight power. The commercial-grade temperature window covers indoor retail and transit environments. Linux BSP maturity and the i.MX50 peripheral mix (I2C, SPI, UART, USB) ease integration with payment terminals, barcode scanners, and NFC modules. Compared to LCD-based kiosks, e-paper variants cut standby power dramatically.
推荐
Smart Home Control Panels
Battery-powered smart-home control panels with e-paper touch UI leverage the i.MX507's hardware EPD controller for always-on, low-power status displays. The Cortex-A8 handles wireless stack (Zigbee, Thread, or Matter-bridge) and user-input processing. Deep-sleep power states allow multi-month battery life between charges. The 400-MAPBGA exposes GPIO and PWM channels sufficient for haptic feedback and LED indicators. Compared to TFT-LCD panels, e-paper variants eliminate the dominant backlight power drain.
推荐
Industrial HMI with E-Paper
Industrial HMI panels requiring sunlight-readable, low-power displays pair the MCIMX507CVM1B with e-paper modules for factory-floor status displays. The Cortex-A8 handles Modbus/Profibus gateway logic while the EPD block updates operator status screens without flicker. The commercial temperature range suits climate-controlled cabinets. The 400-MAPBGA supports the high-speed memory bus needed for large status bitmaps. Compared to character-LCD HMIs, e-paper variants improve readability in high-glare environments and reduce cabinet thermal load.
推荐
推荐产品汇总
工程参考数据： MCIMX507CVM1B ——对比、设计指导和合规信息。
选型指南
与替代料对比
| 参数 | 本产品 | MCIMX508CVM1B | MCIMX507CZK1B | MCIMX508CZK1B |
|---|---|---|---|---|
| Package | 400-MAPBGA (17x17 mm) | 400-MAPBGA (17x17 mm) - same | 400-MAPBGA (17x17 mm) - same | 400-MAPBGA (17x17 mm) - same |
| Brand | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors |
| Family | i.MX50 | i.MX50 | i.MX50 | i.MX50 |
| Core | ARM Cortex-A8 | ARM Cortex-A8 | ARM Cortex-A8 | ARM Cortex-A8 |
| CPU Clock | 800 MHz | 800 MHz | 800 MHz | 800 MHz |
| Hardware EPD Controller | Integrated | Integrated | Integrated | Integrated |
| Temperature Grade | Commercial | Commercial | Extended (per ZK suffix) | Extended (per ZK suffix) |
| Lifecycle Status | Last Time Buy | Discontinued/EOL (i.MX508) | Last Time Buy | Discontinued/EOL |
关键差异点
- Integrated hardware EPD controller versus discrete FPGA solutions （对比 Generic Cortex-A8 MPU without integrated EPD controller)
- Proven i.MX50 software ecosystem versus newer i.MX6/i.MX7 （对比 i.MX6ULL / i.MX7D)
- Pin-compatible with i.MX508 predecessor for layout reuse （对比 MCIMX508CVM1B)
设计说明
The 400-MAPBGA 17x17 mm package requires a 6+ layer PCB stack-up with impedance-controlled traces for the DDR memory bus. Use the i.MX50 Hardware Development Guide reference footprint and route all DDR signals on inner planes to minimize via stubs. Place decoupling capacitors on the BGA-side solder side directly below their respective power balls, using micro-via connections to inner power planes.
Estimated: At 800 MHz full CPU load on a properly designed 4-layer PCB with adequate copper pour, junction temperature rise above ambient is typically under 25C. The 400-MAPBGA exposes a thermal pad region - stitch the inner ground plane to maximize heat spreading. For sealed outdoor enclosures with limited convection, perform a thermal simulation at the highest expected ambient (typically +70C commercial grade).
The MCIMX507CVM1B has been flagged Last Time Buy by NXP - do not start new high-volume designs on this part without an NXP-confirmed second source or replacement. Verify boot-mode strap pin pull resistors against the i.MX50 reference manual, since incorrect boot configuration is the most common bring-up failure. Always use NXP-provided BSP and u-boot for production images to avoid uninitialized peripheral state.
合规信息
RoHS and lead-free per NXP product page. Halogen-free status not explicitly stated in verified data. AEC-Q100 not applicable - this is a commercial-grade consumer MPU.
