MCIMX507CVM1B - i.MX50 ARM Cortex-A8 800MHz MPU | NXP
部品番号: MCIMX507CVM1B ⚠ ラストタイムバイ| 数量 | 単価 | 小計 |
|---|---|---|
| 1 | $21.2 | $21.20 |
| 10 | $19.08 | $190.80 |
| 100 | $17.02 | $1,702.00 |
| 500 | $15.1 | $7,550.00 |
| 1,000 | $13.45 | $13,450.00 |
MCIMX507CVM1B 概要
An applications processor (AP) is a system-on-chip (SoC) optimized to run an operating system (typically Linux, Android, or a real-time OS) and to host user-facing applications, as distinct from microcontrollers (MCUs) that typically run bare-metal or RTOS code without a rich OS. Within the broader taxonomy, the i.MX50 family sits under ARM Cortex-A application processors > applications MPU > integrated circuits > semiconductors. The Cortex-A8 core implements the ARMv7-A architecture with NEON SIMD media extensions and a VFPv3 floating-point unit.
Key differentiating features include 800 MHz Cortex-A8 core, integrated hardware EPD controller (key for e-paper display pipelines), 32-bit data path, and the 400-ball MAPBGA package supporting high-bandwidth memory and display interfaces. The device is positioned by NXP as the follow-on to the market-leading i.MX508 eReader processor.
Architecturally, the SoC integrates the Cortex-A8 core with on-chip L1/L2 cache, an LCD/EPD controller, image-processing peripherals, and a multi-standard memory interface. Power-management is handled by an integrated power-management unit enabling the deep low-power states required for eReader battery-life targets.
Typical applications include consumer eReaders, electronic shelf labels, outdoor digital signage, industrial kiosks, and other low-power display products. Per NXP product documentation, the MCIMX507CVM1B has entered the NXP End-of-Life process, so design teams targeting long-life programs should evaluate the recommended NXP replacement.
Designers should plan for a multi-layer PCB (typically 6+ layers) for the high-speed memory bus and route impedance-controlled display traces to the BGA escape region. Thermal management at 800 MHz is generally passive on a properly designed 4-layer board, but enclosure thermal analysis is recommended for sealed outdoor products.
This page synthesizes NXP product-page status, distributor pricing, drop-in package alternatives, and practical design notes not aggregated on the manufacturer product page.
ドロップイン代替品: MCIMX507CVM1B — 同一パッケージでピン互換。PCBの作り直しが必要な異なるパッケージの部品は除外されています。
このシリーズのバリエーション
同一シリーズでドロップイン互換のモデル: MCIMX507CVM1B （同一形状・フットプリント） — 相違点: Mounting Type, Package.
クイック比較ツール — 並列比較する代替部品を選択:
MCIMX508CVM1B
✅ ドロップイン ⚠️ 仕様未検証📋 参考代替品（カタログ未掲載）
MCIMX507CZK1B
✅ ドロップイン ⚠️ 仕様未検証📋 参考代替品（カタログ未掲載）
MCIMX508CZK1B
✅ ドロップイン ⚠️ 仕様未検証📋 参考代替品（カタログ未掲載）
MCIMX507CVM1B 最大定格＆電気的特性
| Family | i.MX50 |
| Core Architecture | ARM Cortex-A8 (ARMv7-A) |
| Core Count | 1 |
| Data Width | 32-bit |
| Maximum CPU Clock | 800 MHz |
| Integrated Display Controller | Hardware Electronic Paper Display (EPD) controller |
| パッケージ | 400-MAPBGA (17x17 mm) |
| 実装タイプ | Surface Mount (BGA) |
| Temperature Grade | Commercial |
| Terminal Form | Ball |
| Number of Terminals | 400 |
| Package Code | LFBGA / MAPBGA |
| Package Shape | Square |
| RoHS ステータス | Compliant |
MCIMX507CVM1B square ピン配置ガイド
MCIMX507CVM1B (square パッケージ) のピン配置。 このデジタルICには、GPIO、通信インターフェース (UART、SPI、I2C)、および電源ピンが含まれています。代替ピン機能と設定オプションについては、メーカーのデータシートを参照してください。組み込みシステム設計とPCBレイアウトに不可欠です。
詳細なピン配置データはありません: MCIMX507CVM1B.
詳細は データシート をご参照ください。
主な用途
MCIMX507CVM1B の用途: 6 件s: Consumer eReader Devices, Electronic Shelf Labels (ESL), Outdoor Digital Signage, Industrial Kiosks and Information Displays, Smart Home Control Panels, Industrial HMI with E-Paper.
Consumer eReader Devices
The MCIMX507CVM1B's integrated hardware EPD controller makes it a drop-in solution for eReader mainboards. The 800 MHz Cortex-A8 core runs the eReader UI and PDF engine while the EPD block handles waveform sequencing, partial refresh, and dithering. Compared to using a generic MPU plus a discrete EPD timing FPGA, the i.MX507 reduces BOM cost and PCB area. The 400-MAPBGA exposes parallel display buses for direct e-paper panel connection, simplifying the display interface. Software reuse from the i.MX508 shortens development. Battery-life targets are met by the i.MX50 power-management unit's deep-sleep states.
おすすめ
Electronic Shelf Labels (ESL)
Retail electronic shelf labels leverage the i.MX507's hardware EPD controller for ultra-low-power bistable display updates over wireless links. The Cortex-A8 handles the ESL gateway stack and price-update logic; the EPD block drives the segmented e-paper panel without CPU intervention during refresh. The commercial temperature grade covers indoor retail environments. Because ESL deployments span thousands of units per store, the i.MX50's mature Linux BSP and NXP longevity commitment (prior to EOL) made it attractive. Power budgeting is dominated by wireless TX events, not MPU active current.
おすすめ
Outdoor Digital Signage
Outdoor e-paper signage benefits from the i.MX507's combination of Cortex-A8 throughput for content rendering and hardware EPD acceleration for sunlight-readable bistable displays. The 800 MHz clock renders signage graphics efficiently while the EPD block manages partial updates without flicker. The commercial temperature range suits sheltered outdoor enclosures. Designers pair the i.MX507 with a low-power Wi-Fi or cellular module for remote content updates. The 400-MAPBGA supports the high-bandwidth memory bus needed for large signage bitmaps.
おすすめ
Industrial Kiosks and Information Displays
Self-service kiosks and information displays use the MCIMX507CVM1B when a low-power e-paper UI is preferred over backlit LCD. The Cortex-A8 runs kiosk application logic and the EPD block updates the user interface without backlight power. The commercial-grade temperature window covers indoor retail and transit environments. Linux BSP maturity and the i.MX50 peripheral mix (I2C, SPI, UART, USB) ease integration with payment terminals, barcode scanners, and NFC modules. Compared to LCD-based kiosks, e-paper variants cut standby power dramatically.
おすすめ
Smart Home Control Panels
Battery-powered smart-home control panels with e-paper touch UI leverage the i.MX507's hardware EPD controller for always-on, low-power status displays. The Cortex-A8 handles wireless stack (Zigbee, Thread, or Matter-bridge) and user-input processing. Deep-sleep power states allow multi-month battery life between charges. The 400-MAPBGA exposes GPIO and PWM channels sufficient for haptic feedback and LED indicators. Compared to TFT-LCD panels, e-paper variants eliminate the dominant backlight power drain.
おすすめ
Industrial HMI with E-Paper
Industrial HMI panels requiring sunlight-readable, low-power displays pair the MCIMX507CVM1B with e-paper modules for factory-floor status displays. The Cortex-A8 handles Modbus/Profibus gateway logic while the EPD block updates operator status screens without flicker. The commercial temperature range suits climate-controlled cabinets. The 400-MAPBGA supports the high-speed memory bus needed for large status bitmaps. Compared to character-LCD HMIs, e-paper variants improve readability in high-glare environments and reduce cabinet thermal load.
おすすめ
おすすめ製品の概要
エンジニアリング参考データ: MCIMX507CVM1B — 比較、設計ガイダンス、コンプライアンス情報。
選定ガイド
代替品との比較
| パラメータ | この製品 | MCIMX508CVM1B | MCIMX507CZK1B | MCIMX508CZK1B |
|---|---|---|---|---|
| Package | 400-MAPBGA (17x17 mm) | 400-MAPBGA (17x17 mm) - same | 400-MAPBGA (17x17 mm) - same | 400-MAPBGA (17x17 mm) - same |
| Brand | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors |
| Family | i.MX50 | i.MX50 | i.MX50 | i.MX50 |
| Core | ARM Cortex-A8 | ARM Cortex-A8 | ARM Cortex-A8 | ARM Cortex-A8 |
| CPU Clock | 800 MHz | 800 MHz | 800 MHz | 800 MHz |
| Hardware EPD Controller | Integrated | Integrated | Integrated | Integrated |
| Temperature Grade | Commercial | Commercial | Extended (per ZK suffix) | Extended (per ZK suffix) |
| Lifecycle Status | Last Time Buy | Discontinued/EOL (i.MX508) | Last Time Buy | Discontinued/EOL |
主な差別化要因
- Integrated hardware EPD controller versus discrete FPGA solutions （vs Generic Cortex-A8 MPU without integrated EPD controller)
- Proven i.MX50 software ecosystem versus newer i.MX6/i.MX7 （vs i.MX6ULL / i.MX7D)
- Pin-compatible with i.MX508 predecessor for layout reuse （vs MCIMX508CVM1B)
設計ノート
The 400-MAPBGA 17x17 mm package requires a 6+ layer PCB stack-up with impedance-controlled traces for the DDR memory bus. Use the i.MX50 Hardware Development Guide reference footprint and route all DDR signals on inner planes to minimize via stubs. Place decoupling capacitors on the BGA-side solder side directly below their respective power balls, using micro-via connections to inner power planes.
Estimated: At 800 MHz full CPU load on a properly designed 4-layer PCB with adequate copper pour, junction temperature rise above ambient is typically under 25C. The 400-MAPBGA exposes a thermal pad region - stitch the inner ground plane to maximize heat spreading. For sealed outdoor enclosures with limited convection, perform a thermal simulation at the highest expected ambient (typically +70C commercial grade).
The MCIMX507CVM1B has been flagged Last Time Buy by NXP - do not start new high-volume designs on this part without an NXP-confirmed second source or replacement. Verify boot-mode strap pin pull resistors against the i.MX50 reference manual, since incorrect boot configuration is the most common bring-up failure. Always use NXP-provided BSP and u-boot for production images to avoid uninitialized peripheral state.
コンプライアンス情報
RoHS and lead-free per NXP product page. Halogen-free status not explicitly stated in verified data. AEC-Q100 not applicable - this is a commercial-grade consumer MPU.
