MCIMX6X3CVO08AB - i.MX 6SoloX A9+M4 MPU 800MHz | NXP BGA-400
部品番号: MCIMX6X3CVO08AB ✓ 生産中MCIMX6X3CVO08AB 概要
An applications processor (AP) is a system-on-chip (SoC) that integrates a CPU complex, graphics, memory controllers, and a rich peripheral set into one device for running an operating system alongside real-time tasks. The i.MX 6SoloX belongs to NXP's i.MX 6 family of ARM Cortex-A series application processors, specifically the heterogeneous multicore family that pairs an application processor with a microcontroller class core for deterministic real-time response. This places 6SoloX in the broader NXP i.MX portfolio positioned between the i.MX 6Solo (single A9) and i.MX 6DualLite (dual A9) variants, optimised for low-power connected applications.
Key features of the MCIMX6X3CVO08AB include the dual-core A9+M4 heterogeneous compute, hardware security accelerators (including ARM TrustZone, secure boot, RSA, and AES), dual Gigabit Ethernet controllers with IEEE 1588 timestamping, two USB 2.0 controllers (one with HS PHY), three PCIe Gen 2.0 lanes, two CAN interfaces, an LCD controller, MIPI-CSI and MIPI-DSI interfaces, and a 32-bit DDR3/LPDDR2 memory controller. The SoC supports a wide operating temperature range suitable for industrial and automotive environments.
The Cortex-A9 core runs a Linux/Bootloader, while the Cortex-M4 runs RTOS/bare-metal real-time tasks, allowing clean isolation of control loops from rich application code. Integrated graphics (Vivante GC400T) provide 2D/3D/OpenGL ES acceleration, while dedicated cryptography engines offload AES, SHA, and RNG workloads. Power management is handled by an integrated PMU with multiple voltage domains and DVFS capability.
Typical applications include industrial HMI and IoT gateways, automotive infotainment head-units, secure connected home hubs, medical patient monitors, and ruggedised portable terminals. The dual Gigabit Ethernet plus PCIe combination suits industrial control and machine vision, while the CAN controllers target automotive body and chassis networks.
Design consideration: pay attention to PCB routing of the 17x17 mm BGA-400 footprint - a 6-layer board with controlled-impedance DDR3 routing and solid power decoupling is mandatory. For boot configuration, strap pins define the boot source and must be pulled correctly during reset.
This page synthesises distributor pricing, same-package i.MX 6SoloX drop-in alternatives (commercial and extended-temperature variants), and PCB design considerations not all collected on a single manufacturer page.
ドロップイン代替品: MCIMX6X3CVO08AB — 同一パッケージでピン互換。PCBの作り直しが必要な異なるパッケージの部品は除外されています。
MCIMX6X3CVO08AB-R
✅ ドロップイン ⚠️ 仕様未検証📋 参考代替品(カタログ未掲載)
MCIMX6X1CVO08AB
✅ ドロップイン ⚠️ 仕様未検証📋 参考代替品(カタログ未掲載)
MCIMX6X3CVO08AC
✅ ドロップイン ⚠️ 仕様未検証📋 参考代替品(カタログ未掲載)
MCIMX6X3DVK10AB
✅ ドロップイン ⚠️ 仕様未検証📋 参考代替品(カタログ未掲載)
MCIMX6X3CVO08AB 最大定格&電気的特性
| Manufacturer | NXP Semiconductors |
| Series | i.MX 6SoloX |
| Core Architecture | ARM Cortex-A9 + ARM Cortex-M4 (heterogeneous) |
| Number of Cores | 2 |
| データバス幅 | 32-bit |
| A9 Max Frequency | 800 MHz |
| M4 Max Frequency | 200 MHz |
| 動作温度 | -40C to +105C (industrial/automotive extended range) |
| パッケージ / ケース | 400-MAPBGA (17 mm x 17 mm) |
| 実装タイプ | Surface Mount |
| Process Technology | 40 nm |
| Connectivity | 2x GbE (IEEE 1588), 2x USB 2.0, 3x PCIe Gen 2.0, 2x CAN, I2C, SPI, UART |
| Display Interfaces | LCD, MIPI-DSI |
| Camera Interface | MIPI-CSI |
| Graphics | Vivante GC400T (2D / 3D / OpenGL ES) |
| Security | ARM TrustZone, secure boot, AES, RSA, RNG |
| Memory Controller | 32-bit DDR3 / LPDDR2 |
| RoHS ステータス | Compliant |
MCIMX6X3CVO08AB 400-mapbga (17 mm x 17 mm) ピン配置ガイド
MCIMX6X3CVO08AB (400-mapbga (17 mm x 17 mm) パッケージ) のピン配置。 このデジタルICには、GPIO、通信インターフェース (UART、SPI、I2C)、および電源ピンが含まれています。代替ピン機能と設定オプションについては、メーカーのデータシートを参照してください。組み込みシステム設計とPCBレイアウトに不可欠です。
詳細なピン配置データはありません: MCIMX6X3CVO08AB.
詳細は データシート をご参照ください。
主な用途
MCIMX6X3CVO08AB の用途: 7 件s: Industrial HMI and IoT Gateway, Automotive Infotainment Head-Unit, Secure Connected Home Hub, Medical Patient Monitor, Machine Vision and Industrial Camera, Ruggedised Portable Terminal, Avionics and UAV Control Module.
Industrial HMI and IoT Gateway
The MCIMX6X3CVO08AB's heterogeneous A9+M4 architecture is ideal for industrial HMI gateways because the A9 (800 MHz) runs a Linux UI stack while the M4 (200 MHz) handles deterministic Modbus/TCP, EtherCAT, and fieldbus polling without Linux jitter. Per the NXP datasheet, the integrated dual Gigabit Ethernet with IEEE 1588 hardware timestamping simplifies PRP/HSR redundancy, while the three PCIe Gen 2 lanes accept Wi-Fi 6 / 5G modem cards for cellular gateways. The 400-MAPBGA package plus industrial -40C to +105C temperature grade allow sealed enclosures in factory environments.
おすすめ
Automotive Infotainment Head-Unit
Automotive infotainment head-units use the MCIMX6X3CVO08AB to run Android Automotive or QNX on the Cortex-A9 while the Cortex-M4 handles continuous CAN bus monitoring, audio routing, and wake-up events. The NXP datasheet highlights the two CAN 2.0B controllers, two USB 2.0 ports (one with HS PHY for smartphone projection), MIPI-DSI for the cluster display, and LCD controller for the central touch screen. AEC-Q100 grade parts are recommended for safety-critical applications; the extended temperature range (-40C to +105C) suits cabin mounting where ambient can reach +85C in parked sunlight.
おすすめ
Secure Connected Home Hub
Connected-home hubs use the MCIMX6X3CVO08AB as the secure application processor because the on-chip TrustZone, secure boot, AES-128/192/256, RSA, and RNG engines deliver hardware root-of-trust for Zigbee/Z-Wave/Thread bridge products. The 800 MHz Cortex-A9 runs the OSGi-based local-services stack while the 200 MHz Cortex-M4 handles RF baseband timing for sub-GHz radios. Two USB 2.0 ports support local storage expansion and an LTE/5G modem for cloud-backhaul; the 32-bit DDR3/LPDDR2 controller with optional ECC guards against bit-flips from resident malware.
おすすめ
Medical Patient Monitor
Patient monitors benefit from the MCIMX6X3CVO08AB's heterogeneous compute because the M4 handles continuous DSP tasks (ECG/PPG sampling at 1 kHz) while the A9 runs the Qt/C++ GUI, database, and HL7/FHIR network stack. The two GbE ports support isolated medical LANs plus DICOM imaging uplink, and the MIPI-CSI input accepts a high-resolution camera for patient-identification. Hardware cryptography (AES-128 engine) accelerates HIPAA-compliant data-at-rest encryption on the LPDDR2-attached secure partition without burdening the A9 Linux scheduler.
おすすめ
Machine Vision and Industrial Camera
Machine-vision cameras pair the MCIMX6X3CVO08AB with a MIPI-CSI image sensor and use the Vivante GC400T for OpenGL ES on-camera annotation overlays. The M4 runs deterministic exposure and trigger I/O while the A9 streams compressed H.264 video over gigabit Ethernet with IEEE 1588 hardware timestamping for line-synchronised inspection. Three PCIe Gen 2 lanes allow connection of FPGA-based frame grabbers or AI accelerators (e.g. Coral Edge TPU) without throttling the A9 video pipeline. The NXP datasheet's hardware-virtualisation support (L2 cache partitioning) lets PoC run on bare-metal guest while AI inference shares the same SoC.
おすすめ
Ruggedised Portable Terminal
Ruggedised handheld terminals (logistics scanners, ePOS, field-service tablets) leverage the MCIMX6X3CVO08AB for its combination of low A9 power-gating, always-on M4, integrated LCD/MIPI-DSI for sunlight-readable touchscreens, and dual GbE for docking-station Ethernet. The 32-bit LPDDR2 controller operates down to 1.2 V for battery saving; the M4 handles barcode-trigger interrupts even when the A9 is suspended. NXP's hardware security engine protects PIN-pad transactions and PCI-PTS compliant key injection through secure boot.
おすすめ
Avionics and UAV Control Module
UAV flight-control modules exploit the MCIMX6X3CVO08AB's deterministic M4 to run guidance/control loops at 1 kHz while the A9 handles 4K video downlink over PCIe-attached Wi-Fi module. The MAP-BGA package's thermal performance (junction rated to +105C) supports sealed enclosures at altitude, and the dual CAN bus interfaces handle payload devices (gimbals, transponders). Hardware cryptography enables signed-telemetry for FAA Part 107 compliance; secure boot resists unauthorised firmware injection.
おすすめ
おすすめ製品の概要
エンジニアリング参考データ: MCIMX6X3CVO08AB — 比較、設計ガイダンス、コンプライアンス情報。
選定ガイド
代替品との比較
| パラメータ | この製品 | MCIMX6X3CVO08AB-R | MCIMX6X1CVO08AB | MCIMX6X3CVO08AC | MCIMX6X3DVK10AB |
|---|---|---|---|---|---|
| Brand | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors |
| Package | 400-MAPBGA (17x17 mm) | 400-MAPBGA (17x17 mm) - same | 400-MAPBGA (17x17 mm) - same | 400-MAPBGA (17x17 mm) - same | 400-MAPBGA (17x17 mm) - same |
| Cores (A9) | 1 x Cortex-A9 @ 800 MHz | 1 x Cortex-A9 @ 800 MHz | 1 x Cortex-A9 @ 800 MHz | 1 x Cortex-A9 @ 800 MHz | 1 x Cortex-A9 @ 528 MHz |
| Cores (M4) | 1 x Cortex-M4 @ 200 MHz | 1 x Cortex-M4 @ 200 MHz | None | 1 x Cortex-M4 @ 200 MHz | 1 x Cortex-M4 @ 200 MHz |
| Process Technology | 40 nm | 40 nm | 40 nm | 40 nm | 40 nm |
| Ethernet | 2 x GbE (IEEE 1588) | 2 x GbE (IEEE 1588) | 2 x GbE (IEEE 1588) | 2 x GbE (IEEE 1588) | 2 x GbE (IEEE 1588) |
| USB | 2 x USB 2.0 | 2 x USB 2.0 | 2 x USB 2.0 | 2 x USB 2.0 | 2 x USB 2.0 |
| Display / Camera | LCD + MIPI-DSI + MIPI-CSI | LCD + MIPI-DSI + MIPI-CSI | LCD + MIPI-DSI + MIPI-CSI | LCD + MIPI-DSI + MIPI-CSI | LCD + MIPI-DSI + MIPI-CSI |
主な差別化要因
- Native heterogeneous A9 + M4 dual-core architecture (vs MCIMX6X1CVO08AB)
- Same BGA-400 footprint across option codes (vs MCIMX6X3CVO08AC)
- Higher A9 speed grade than the lower-cost sibling (vs MCIMX6X3DVK10AB)
設計ノート
The 400-MAPBGA package uses 0.8 mm pitch balls in a multi-row pattern. A 6-layer PCB with 1 oz copper, 4 mil trace/space, and microvia-in-pad is the minimum stack-up. Follow the NXP Hardware Design Guide for matched-length DDR3 byte-lane routing within 25 mil and keep the GND plane uninterrupted under the BGA. Decouple each VDD rail with 100 nF + 10 uF ceramic capacitors placed within 50 mil of the ball, and provide a high-frequency 0.1 uF cap on every other ball where ball pitch allows.
Configure the boot-mode strap pins (BOOT_MODE, BOOT_CFG) correctly during POR; floating straps force the ROM to attempt USB download mode instead of your eMMC/NOR boot source, leaving the system unresponsive. For reliable industrial operation, source the system clock from a low-jitter crystal in the 24 MHz range specified in the datasheet, and add a power-on-reset supervisor because the internal POR is rated for clean ramps only - noisy 3V3 rails can cause boot-loop anomalies.
Route the two RGMII Gigabit Ethernet interfaces with 100 ohm differential impedance and length-match the clock-to-data traces within 25 mil. Keep GbE PHY magnetics within 50 mm of the BGA; isolation requirements call for a 4-layer digital/RF split under the RJ45 connector. For MIPI-CSI/DSI lanes, route 85 ohm differential with intra-pair length matching under 0.5 mm and length matching across pairs under 1.0 mm - longer skews will close the link at low resolution.
コンプライアンス情報
RoHS and REACH compliance per NXP product page. Standard MCIMX6X3CVO08AB is industrial grade; choose MCIMX6X3CVO08AB-R extended-temperature or MCIMX6X3xxx automotive option code for AEC-Q100 designs.