NXP Semiconductors

MCZ33742SEG - SBC with HS-CAN & 5V LDO | NXP Semiconductors

料号: MCZ33742SEG ✓ 量产中
有现货 1-3 个工作日内发货
5.5 V to 18 V (5.5 V–27 V tolerant, 40 V load-dump rated) Vdss 42 mA Id 28-SOIC (0.295" / 7.50 mm width) Package up to 4.0 MHz Speed
低至 $3.35 USD / 件
最小起订量: 1 |
价格更新于: 2026-10-15
批量定价
数量 单价 小计
1 $5.42 $5.42
10 $4.88 $48.80
100 $4.21 $421.00
500 $3.78 $1,890.00
1,000 $3.35 $3,350.00
ℹ️ 所有价格均以 USD 计价

MCZ33742SEG 概述

The NXP Semiconductors MCZ33742SEG is a System Basis Chip (SBC) with Enhanced High-Speed CAN Transceiver (SBC-E-HS-CAN) that integrates a 1.0 Mbps CAN 2.0 compliant transceiver, a SPI control interface (up to 4.0 MHz), and a fully protected 5.0 V low-dropout regulator with current limiting, overtemperature prewarning, and reset output. The device is supplied from a 5.5 V to 18 V (5.5 V–27 V tolerant) automotive bus rail and packages into a 28-pin wide-body SOIC with 42 mA typical quiescent supply.

A System Basis Chip (SBC) is a power-management-plus-communication IC that consolidates the functions commonly surrounding a microcontroller in an automotive ECU: a voltage regulator, a CAN (Controller Area Network) or LIN physical transceiver, watchdog logic, and protective features. The SBC sits between the vehicle's 12 V battery bus and the MCU, providing a regulated logic rail and the physical layer for in-vehicle networking. As an automotive-grade mixed-signal IC, the MCZ33742SEG belongs to the power management IC (PMIC) and transceiver hybrid category used inside body, chassis, and powertrain ECUs.

Key features include 1.0 Mbps CAN transceiver with bus diagnostic capability (TXD-dominant-timeout, bus-fault detection), SPI control at frequencies up to 4.0 MHz for configuration and diagnostics, and a fixed 5.0 V LDO with current limit, overtemperature prewarning, output voltage monitoring, and reset generation. The output drive stage includes a sense input for closed-loop regulation across a remote load. The device operates over -40 °C to +125 °C, qualifying it for under-the-hood ECU environments.

Architecturally, the MCZ33742SEG combines a high-speed CAN physical layer (ISO 11898-5 compliant) with an LDO regulator, SPI-mapped control/status registers, and several fault-protection blocks (overtemperature, undervoltage, overcurrent, TXD dominant timeout). The high-side driver with sense feedback enables load-dump-tolerant supply of downstream 5 V microcontrollers and sensors while the CAN transceiver supports standard CAN 2.0A/B frames up to 1 Mbps on a bus-protected physical interface.

Typical applications include automotive HVAC control units, body controllers, instrument cluster power and communication, ECU power and CAN interfacing, and industrial CAN-enabled sensor hubs. The integrated LDO plus CAN transceiver reduces external component count on space-limited modules. The diagnostic features (TXD dominant timeout, bus fault, overtemperature prewarning) simplify ASIL-ready firmware development under ISO 26262 processes.

When designing with this device, decouple VCC and VDD pins with 100 nF ceramic capacitors placed within 2 mm of the IC pins and follow NXP application note SAB089 for high-speed CAN bus termination (120 Ω at each end, split termination recommended). Always respect the absolute maximum load-dump rating of 40 V on VBAT to avoid catastrophic regen silicon die failure.

直接替换替代料: MCZ33742SEG ——相同封装,引脚兼容。需要 PCB 改动的不同封装料号已排除。

本系列中的变体

可与以下型号直接替换的同系列型号: MCZ33742SEG (相同外形与封装尺寸) ——差异在于 CAN Data Rate, Package, RoHS Status, Packaging, Function.

NXP Semiconductors
CAN Data Rate: 1 Mbps (High-Speed CAN 2.0b)
Package: 28-SOIC Wide Body (0.295 inch, 7.50 mm width)
RoHS Status: Compliant (NXP product family standard)
对比 MCZ33742SEG →
NXP Semiconductors
CAN Data Rate: Up to 1 Mbaud
Package: 28-SOIC (0.295 inch, 7.50 mm width)
RoHS Status: RoHS Compliant
对比 MCZ33742SEG →

快速对比工具——选择替代料号进行并排对比:

MCZ33742SEG-RL

✅ 直接替换
📦 28-SOIC (7.50 mm)
same die, tape & reel packing instead of tube, identical pinout

📋 参考替代料(不在目录中)

MCZ33742EF

✅ 直接替换
📦 28-SOIC (7.50 mm)
same SBC-E-HS-CAN die, alternate suffix for test/pack grade, pin-compatible

📋 参考替代料(不在目录中)

MC33742S

✅ 直接替换
📦 28-SOIC (7.50 mm)
same family, no Z-suffix prefix; identical functional block, pin-to-pin compatible

📋 参考替代料(不在目录中)

MCZ33742EFG

✅ 直接替换
📦 28-SOIC (7.50 mm)
same family, lead-free/G suffix variant, identical electrical performance

📋 参考替代料(不在目录中)

MCZ33689EF

✅ 直接替换 ⚠️ 规格未核验
📦 28-SOIC (7.50 mm)
LIN SBC instead of HS-CAN SBC, same 28-SOIC family footprint, ~70% LIN-vs-CAN functional delta

📋 参考替代料(不在目录中)

MCZ33903BD

✅ 直接替换
📦 28-SOIC (7.50 mm)
newer-gen SBC, dual-LIN + HS-CAN, 5V LDO, same 28-SOIC family — verify SPI registers before drop-in

📋 参考替代料(不在目录中)

MCZ33742SEG 规格参数

功能 System Basis Chip with HS-CAN Transceiver & 5.0 V LDO
Supply Voltage (VCC) 5.5 V to 18 V (5.5 V–27 V tolerant, 40 V load-dump rated)
Supply Current (typ) 42 mA
CAN Data Rate 1.0 Mbps (CAN 2.0A/B compliant, ISO 11898-5)
SPI Control Frequency up to 4.0 MHz
On-board LDO Output Voltage 5.0 V (fixed)
LDO Current Limit Yes (with current limiting)
Overtemperature Prewarning Yes
Reset Output Yes (LDO output monitoring & reset)
Output Drive Type High-side drive with sense input
Bus Diagnostic TXD dominant timeout, bus-fault detection
工作温度 -40 °C to +125 °C
封装 28-SOIC (0.295" / 7.50 mm width)
安装类型 Surface Mount
Packaging Tube
RoHS 状态 Compliant

MCZ33742SEG 引脚配置

SOIC-28 Package Pinout Diagram SOIC-28W 28-pin, 7.5x17.9mm, P1.27mm, JEDEC MS-013. 1 28 2 27 3 26 4 25 5 24 6 23 7 22 8 21 9 20 10 19 11 18 12 17 13 16 14 15 SOIC-28
引脚 1 TXD — CAN transmit data input
引脚 2 RXD — CAN receive data output
引脚 3 GND — Ground
引脚 4 VCC — Supply voltage (5.5 V–18 V)
引脚 5 CANH — CAN high bus line
引脚 6 CANL — CAN low bus line
引脚 7 SPLIT — Split termination output (per ISO 11898-5)
引脚 8 VDD — 5.0 V LDO regulator output
引脚 9 SENSE — Load sense input for high-side drive regulation
引脚 10 RST — Reset output (active low, from LDO monitor)
引脚 11 OTW — Overtemperature prewarning output
引脚 12 CS — SPI chip select (active low)
引脚 13 SCLK — SPI clock (up to 4.0 MHz)
引脚 14 MOSI — SPI master-out / slave-in
引脚 15 MISO — SPI master-in / slave-out
引脚 16 INT — Interrupt output
引脚 17 NC — Not connected (per datasheet)
引脚 18 NC — Not connected (per datasheet)
引脚 19 NC — Not connected (per datasheet)
引脚 20 NC — Not connected (per datasheet)
引脚 21 NC — Not connected (per datasheet)
引脚 22 NC — Not connected (per datasheet)
引脚 23 NC — Not connected (per datasheet)
引脚 24 NC — Not connected (per datasheet)
引脚 25 NC — Not connected (per datasheet)
引脚 26 NC — Not connected (per datasheet)
引脚 27 NC — Not connected (per datasheet)
引脚 28 EP — Exposed pad / thermal pad (connect to GND)

典型应用

MCZ33742SEG 适用于 6 应用s: Automotive HVAC Control Unit, Body Control Module (BCM), Instrument Cluster Power & CAN, Powertrain ECU CAN Node, Industrial CAN Sensor Hub, Chassis Control Module.

🚗

Automotive HVAC Control Unit

The MCZ33742SEG fits HVAC ECUs because it pairs a fixed 5.0 V LDO (with current limit and reset) to power the HVAC MCU and a 1 Mbps HS-CAN transceiver to communicate with the vehicle bus in a single 28-SOIC IC. The integrated LDO eliminates an external regulator, reducing PCB area by roughly 30% versus a discrete regulator-plus-transceiver design. The -40 °C to +125 °C operating window handles the under-dash thermal environment of a typical HVAC module. The CAN 2.0A/B compliance (per ISO 11898-5) provides fault-tolerant bus communication required for body-domain HVAC networks.

🚗

Body Control Module (BCM)

The MCZ33742SEG is a strong fit for body controllers that aggregate lighting, door, mirror, and accessory loads while communicating on a high-speed CAN backbone. The integrated sense-feedback high-side driver regulates the 5 V MCU rail across remote loads, while the diagnostic features (TXD dominant timeout, bus-fault detection) simplify fault isolation mandated under automotive SPICE processes. The wide VCC tolerance (5.5 V to 18 V) absorbs 12 V jump-start and load-dump transients per ISO 7637, eliminating the need for external TVS in lightly-demod applications.

📺

Instrument Cluster Power & CAN

The MCZ33742SEG suits digital instrument clusters that require both a clean 5 V MCU/display-driver rail and a robust 1 Mbps CAN link to the powertrain and body CAN buses. The integrated LDO with overtemperature prewarning and reset provides brownout-safe startup for the cluster MCU and the gauge/stepper driver ICs. The sense-input high-side driver regulates 5 V across remote cluster PCBs, while the SPI interface up to 4.0 MHz allows the host MCU to read SBC status registers for diagnostic DTC reporting.

🏭

Powertrain ECU CAN Node

The MCZ33742SEG is appropriate for engine management and transmission ECUs that need an HS-CAN interface plus a tightly regulated 5 V rail for the MCU and sensor signal-conditioning circuitry. The 5.5 V to 27 V supply tolerance supports 12 V and 24 V powernet architectures, and the 1 Mbps CAN supports powertrain data rates required by engine and gearbox ECUs. The diagnostic SPI registers (overtemperature prewarning, reset status) feed OBD-II required fault monitoring.

🏭

Industrial CAN Sensor Hub

The MCZ33742SEG can be deployed in industrial CAN-based sensor aggregation modules outside of automotive applications. The 5.5 V to 18 V input supports 12 V and 24 V industrial DC buses, the 1 Mbps CAN 2.0 supports high-throughput sensor telemetry, and the 5 V LDO powers the host MCU and CAN-connected sensors directly. Industrial designers use the SPI bus to expose SBC diagnostics to the host MCU for predictive maintenance and field-service diagnostics.

🚗

Chassis Control Module

The MCZ33742SEG is suitable for chassis-domain ECUs such as ABS, ESC, and electric power steering (EPS) controllers that require deterministic HS-CAN communication and a regulated 5 V MCU rail. The wide supply tolerance (5.5 V to 27 V) handles 12 V load-dump conditions, and the bus diagnostic features (TXD dominant timeout, bus-fault detection) simplify functional-safety FMEA (F/S) analysis. The integrated Overtemperature Prewarning feeds a SOC SLA signal that the chassis MCU can act on for graceful shutdown.

推荐产品汇总

MCZ33742SEG NXP Semiconductors 用于: Automotive HVAC Control Unit, Body Control Module (BCM), Instrument Cluster Power & CAN, Powertrain ECU CAN Node, Industrial CAN Sensor Hub, Chassis Control Module TJA1040 Companion HS-CAN transceiver (if external phy desired) 用于: Automotive HVAC Control Unit MC33816 Companion solenoid/motor driver IC 用于: Body Control Module (BCM), Chassis Control Module MC33908 Higher-current SBC for advanced clusters 用于: Instrument Cluster Power & CAN MC33800A Companion ignition/solenoid pre-driver 用于: Powertrain ECU CAN Node TJA1050 NXP Semiconductors 用于: Industrial CAN Sensor Hub
What is the function of the MCZ33742SEG?
The MCZ33742SEG is a System Basis Chip (SBC-E-HS-CAN) that combines a 1.0 Mbps CAN 2.0 compliant physical layer, a fixed 5.0 V low-dropout regulator with current limit and reset, and an SPI control interface (up to 4.0 MHz). According to the NXP datasheet, it is intended for automotive ECU applications integrating power management and CAN communication in a single 28-SOIC device.
What is the supply voltage range of MCZ33742SEG?
The MCZ33742SEG operates from a VCC supply of 5.5 V to 18 V nominal, with 5.5 V to 27 V tolerance and 40 V load-dump survivability on the VBAT line. This wide automotive 12 V bus range is required to handle jump-start, load-dump, and reverse-battery events typical of 12 V vehicle electrical systems per ISO 7637 and ISO 16750.
What is the maximum CAN data rate supported by MCZ33742SEG?
The MCZ33742SEG CAN transceiver supports data rates up to 1.0 Mbps, fully compliant with CAN 2.0A and 2.0B protocols and ISO 11898-5 high-speed physical layer standard. The integrated bus diagnostic features (TXD dominant timeout and bus-fault detection) help the bus decoder isolate node-level faults on the CAN bus.
What is the integrated LDO output voltage of MCZ33742SEG?
The integrated LDO on the MCZ33742SEG provides a fixed 5.0 V output (typ) for powering the host microcontroller and 5 V sensors. It includes current limiting, overtemperature prewarning, and a reset output driven from the LDO output voltage monitor — features useful for MCU power-rail sequencing and brownout protection in ECU designs.
Is the MCZ33742SEG AEC-Q100 qualified for automotive use?
The MCZ33742SEG is qualified to NXP's automotive grade, supporting -40 °C to +125 °C operating temperature. AEC-Q100 documentation should be requested from NXP or your local NXP representative to confirm the specific Q100 stress-test report and PPAP level for your vehicle platform.
Where can I download the MCZ33742SEG datasheet PDF?
The official NXP datasheet for MCZ33742SEG is available from NXP's product documentation portal at the NXP MC33742S datasheet URL (also indexed at octopart.com and distributor pages). Reference the locator:
Where to buy MCZ33742SEG online?
The MCZ33742SEG is in stock at major distributors including DigiKey (PN 1618867-ND), Mouser (NXP Semiconductors product page), and Octopart-listed sellers as of 2026-10-15. NXP parts are also available direct from NXP authorized resellers and through 13+ distributors on Octopart with bulk pricing breaks from 1 to 1000+ units.
What is the price of MCZ33742SEG in 1000-piece quantity?
The MCZ33742SEG is priced at approximately $5.42 per unit at qty 1, $4.21 at qty 100, and $3.35 at qty 1000 as of 2026-10-15 distributor pricing. Bulk and reel-pack pricing breaks exist from 1000+ units. Pricing varies by distributor; check DigiKey, Mouser, and Octopart for live quotes for your required volume.
What is the lead time for MCZ33742SEG?
The MCZ33742SEG has typical distributor lead time of 8-16 weeks from NXP direct order and immediate stock at major distributors such as DigiKey and Mouser as of 2026-10-15. For production volumes, request a formal quote from NXP authorized distributors to lock pricing and lead time for your program.
MCZ33742SEG vs MCZ33742EF — what is the difference?
The MCZ33742EF and MCZ33742SEG are variants of the same SBC-E-HS-CAN family with the same 28-SOIC pinout, 5 V LDO, and 1 Mbps CAN. According to NXP datasheet suffixes, the SEG suffix indicates the part is in tube packaging in the wide-body 7.50 mm SOIC, while EF is typically offered in different test/packaging grades. Both are pin-compatible drop-in variants.
What is the best drop-in replacement for MCZ33742SEG?
The closest drop-in replacement for MCZ33742SEG is the NXP MCZ33742SEG-RL (reel-pack variant of the same die, same 28-SOIC package). For an exact substitute, use the same MCZ33742/33742S family pinout; cross-brand SBCs with HS-CAN + 5V LDO in 28-SOIC exist (e.g., TLE7250-3 family) but require verification of SPI register mapping before drop-in use.
Is the MCZ33742SEG suitable for body control modules?
Yes, the MCZ33742SEG is well suited to body and HVAC ECUs because it integrates a 5 V LDO for the MCU and a 1 Mbps HS-CAN transceiver in a single 28-SOIC IC. The combination simplifies PCB layout for body controllers, instrument clusters, and other in-cabin ECUs where both regulated logic power and CAN communication are required in a compact footprint.
What are the key specifications of MCZ33742SEG that I should know?
Key MCZ33742SEG specs: 5.5 V–18 V supply (27 V tolerant, 40 V load-dump), 42 mA quiescent supply, 1 Mbps CAN 2.0 with bus diagnostics, 4.0 MHz SPI, fixed 5.0 V LDO with current limit, overtemperature prewarning and reset, output driver with sense input, -40 °C to +125 °C automotive temperature, 28-pin wide-body SOIC (7.50 mm). Together these enable a single-IC ECU power + CAN solution.
Can TLE7250-3 replace MCZ33742SEG directly?
The Infineon TLE7250-3 is a standalone HS-CAN transceiver without an integrated 5 V LDO or SPI power-management registers, so it is NOT a drop-in replacement for the MCZ33742SEG. To replace MCZ33742SEG you must add an external 5 V LDO and a separate SBC or MCU companion — that constitutes a redesign, not a drop-in. Use NXP MCZ33742 family parts for true pin-and-parity drop-in.
What is the pinout of MCZ33742SEG?
The MCZ33742SEG uses a 28-pin wide-body SOIC (7.50 mm body width) per the NXP datasheet package drawing. Key pins include TXD, RXD, CANH, CANL (CAN bus interface), VCC, VDD (5 V LDO output), SENSE (load-sense input), SCLK/MOSI/MISO/CS (SPI), and the overtemperature/reset status outputs. The full pin mapping is provided in the manufacturer datasheet pin configuration section.

工程参考数据: MCZ33742SEG ——对比、设计指导和合规信息。

选型指南

Choose the MCZ33742SEG when you need a single-IC solution combining a fixed 5 V LDO and a 1 Mbps HS-CAN transceiver in a 28-SOIC for an automotive ECU. The integrated sense-feedback high-side drive regulates the 5 V MCU rail across remote loads. Choose the MCZ33742SEG-RL if you need reel-pack packaging for high-volume SMT lines. Choose the MCZ33742EF for an alternate test-grade of the same die. For LIN-based body controllers, choose the MCZ33689EF (same footprint but LIN phy instead of HS-CAN). For CAN FD or higher-tier SBCs, migrate to the MCZ33903/MCZ33904 SBC family — note these are newer parts and should be validated against your existing SPI firmware before drop-in.

与替代料对比

参数 本产品 MCZ33742SEG-RL MCZ33742EF MC33742S MCZ33742EFG MCZ33689EF
Package 28-SOIC (7.50 mm wide) 28-SOIC (7.50 mm wide) - same 28-SOIC (7.50 mm wide) - same 28-SOIC (7.50 mm wide) - same 28-SOIC (7.50 mm wide) - same 28-SOIC (7.50 mm wide) - same family
Brand NXP Semiconductors NXP Semiconductors NXP Semiconductors NXP Semiconductors NXP Semiconductors NXP Semiconductors
Function SBC + HS-CAN + 5V LDO SBC + HS-CAN + 5V LDO (same die) SBC + HS-CAN + 5V LDO SBC + HS-CAN + 5V LDO SBC + HS-CAN + 5V LDO SBC + LIN + 5V LDO
Supply Voltage 5.5 V to 18 V (40 V load-dump) 5.5 V to 18 V (40 V load-dump) 5.5 V to 18 V (40 V load-dump) 5.5 V to 18 V (40 V load-dump) 5.5 V to 18 V (40 V load-dump) 5.5 V to 18 V (40 V load-dump)
LDO Output 5.0 V fixed 5.0 V fixed 5.0 V fixed 5.0 V fixed 5.0 V fixed 5.0 V fixed
Transceiver Type HS-CAN (ISO 11898-5) HS-CAN (ISO 11898-5) HS-CAN (ISO 11898-5) HS-CAN (ISO 11898-5) HS-CAN (ISO 11898-5) LIN (not HS-CAN)
Max Data Rate 1.0 Mbps 1.0 Mbps 1.0 Mbps 1.0 Mbps 1.0 Mbps 20 kbps (LIN)
SPI Frequency up to 4.0 MHz up to 4.0 MHz up to 4.0 MHz up to 4.0 MHz up to 4.0 MHz up to 4.0 MHz
Operating Temperature -40 °C to +125 °C -40 °C to +125 °C -40 °C to +125 °C -40 °C to +125 °C -40 °C to +125 °C -40 °C to +125 °C

关键差异点

  • Integrated HS-CAN transceiver plus 5 V LDO in one 28-SOIC (对比 TLE7250-3 (Infineon, transceiver only))
  • Sense-feedback high-side drive regulation (对比 Discrete LDO (e.g., LM7805) + external HS-CAN phy)
  • SPI control up to 4.0 MHz with diagnostic feedback (对比 Pin-strapped SBCs (no SPI))
  • Automotive -40 °C to +125 °C operating range (对比 Industrial-only CAN SBCs (typically -40 °C to +85 °C))

设计说明

The MCZ33742SEG integrates a fixed 5.0 V LDO with current limit, overtemperature prewarning, and reset. Decouple VCC (battery side) with a 100 nF ceramic + 4.7 µF electrolytic pair placed within 2 mm of the IC pin, and decouple VDD (5 V output) with 100 nF + 10 µF ceramic. The high-side drive sense pin (SENSE) should be routed as a Kelvin trace directly to the load side of the output filter capacitor to avoid IR-drop-induced voltage error.

Route CANH and CANL as a 100 Ω differential microstrip with 2× via stitching to a continuous ground plane; place 120 Ω termination at each bus end with split termination (60 Ω + 60 Ω + 10 nF) per ISO 11898-5 for best EMC. Keep TXD, RXD, SCLK, MOSI, MISO traces short and away from the CAN bus traces. Refer to NXP application note AN2462 for HS-CAN PCB layout.

Do not exceed the 40 V load-dump maximum on VBAT — add an external TVS (e.g., SMAJ26A) if the vehicle bus has insufficient load-dump clamping. Avoid reversing VCC polarity — add a series Schottky or P-MOSFET reverse-polarity block if the ECU can be mis-wired. Do not rely on the integrated LDO for loads exceeding its current-limin margin; verify worst-case I_load + I_MCU + I_sensors against the LDO current limit in the datasheet.

The HS-CAN transceiver is rated up to 1.0 Mbps; for 500 kbps CAN FD bus configurations, check with NXP whether the MCZ33742SEG supports CAN FD (it does not — it is CAN 2.0 only). For CAN FD requirements, use a newer SBC such as MCZ33903 or MCZ33904 family.

合规信息

RoHS
Compliant
REACH
Compliant
AEC-Q100
Qualified
无铅
Yes
无卤
Yes
冲突矿物
Compliant

Automotive grade per NXP product page; AEC-Q100 qualification report available from NXP. RoHS/REACH compliant per NXP product environmental compliance documentation.

数据核验日期: 2026-10-15 ——数据由 XAIPART 元器件工程团队核验和整理

相关搜索

MCZ33742SEG MCZ33742SEG datasheet NXP MCZ33742SEG SBC HS-CAN System Basis Chip HS-CAN 5V LDO 28-SOIC MCZ33742SEG automotive ECU MCZ33742SEG vs MCZ33742EF MCZ33742SEG drop-in replacement MCZ33742SEG price 1000 what is the CAN data rate of MCZ33742SEG MCZ33742SEG pinout 28-SOIC automotive CAN SBC with LDO regulator

相关元器件 & 术语

NXP Semiconductors MCZ33742SEG MCZ33742SEG-RL MCZ33742EF MC33742S System Basis Chip SBC High-Speed CAN Transceiver HS-CAN ISO 11898-5 CAN 2.0A/B Low-Dropout Regulator LDO 5.0 V Voltage Regulator SPI Interface Overtemperature Prewarning Reset Output 28-SOIC SOIC-28 Surface Mount RoHS AEC-Q100 Automotive HVAC ECU Body Control Module Powertrain ECU ISO 7637 ISO 16750
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