MCZ33742SEG - SBC with HS-CAN & 5V LDO | NXP Semiconductors
Référence : MCZ33742SEG ✓ Actif| Qté | Prix unitaire | Total |
|---|---|---|
| 1 | $5.42 | $5,42 |
| 10 | $4.88 | $48,80 |
| 100 | $4.21 | $421,00 |
| 500 | $3.78 | $1 890,00 |
| 1 000 | $3.35 | $3 350,00 |
MCZ33742SEG Présentation
A System Basis Chip (SBC) is a power-management-plus-communication IC that consolidates the functions commonly surrounding a microcontroller in an automotive ECU: a voltage regulator, a CAN (Controller Area Network) or LIN physical transceiver, watchdog logic, and protective features. The SBC sits between the vehicle's 12 V battery bus and the MCU, providing a regulated logic rail and the physical layer for in-vehicle networking. As an automotive-grade mixed-signal IC, the MCZ33742SEG belongs to the power management IC (PMIC) and transceiver hybrid category used inside body, chassis, and powertrain ECUs.
Key features include 1.0 Mbps CAN transceiver with bus diagnostic capability (TXD-dominant-timeout, bus-fault detection), SPI control at frequencies up to 4.0 MHz for configuration and diagnostics, and a fixed 5.0 V LDO with current limit, overtemperature prewarning, output voltage monitoring, and reset generation. The output drive stage includes a sense input for closed-loop regulation across a remote load. The device operates over -40 °C to +125 °C, qualifying it for under-the-hood ECU environments.
Architecturally, the MCZ33742SEG combines a high-speed CAN physical layer (ISO 11898-5 compliant) with an LDO regulator, SPI-mapped control/status registers, and several fault-protection blocks (overtemperature, undervoltage, overcurrent, TXD dominant timeout). The high-side driver with sense feedback enables load-dump-tolerant supply of downstream 5 V microcontrollers and sensors while the CAN transceiver supports standard CAN 2.0A/B frames up to 1 Mbps on a bus-protected physical interface.
Typical applications include automotive HVAC control units, body controllers, instrument cluster power and communication, ECU power and CAN interfacing, and industrial CAN-enabled sensor hubs. The integrated LDO plus CAN transceiver reduces external component count on space-limited modules. The diagnostic features (TXD dominant timeout, bus fault, overtemperature prewarning) simplify ASIL-ready firmware development under ISO 26262 processes.
When designing with this device, decouple VCC and VDD pins with 100 nF ceramic capacitors placed within 2 mm of the IC pins and follow NXP application note SAB089 for high-speed CAN bus termination (120 Ω at each end, split termination recommended). Always respect the absolute maximum load-dump rating of 40 V on VBAT to avoid catastrophic regen silicon die failure.
Alternatives de remplacement direct pour MCZ33742SEG — même boîtier, compatible broche à broche. Les références à boîtier différent nécessitant une retouche du PCB sont exclues.
Variantes de cette série
Modèles de la même série directement compatibles avec MCZ33742SEG (même facteur de forme et même empreinte) — différant par CAN Data Rate, Package, RoHS Status, Packaging, Function.
Outil de comparaison rapide — sélectionnez des références alternatives pour une comparaison côte à côte :
MCZ33742SEG-RL
✅ Remplacement direct📋 Alternative de référence (hors catalogue)
MCZ33742EF
✅ Remplacement direct📋 Alternative de référence (hors catalogue)
MC33742S
✅ Remplacement direct📋 Alternative de référence (hors catalogue)
MCZ33742EFG
✅ Remplacement direct📋 Alternative de référence (hors catalogue)
MCZ33689EF
✅ Remplacement direct ⚠️ Spécifications non vérifiées📋 Alternative de référence (hors catalogue)
MCZ33903BD
✅ Remplacement direct📋 Alternative de référence (hors catalogue)
MCZ33742SEG Spécifications
| Fonction | System Basis Chip with HS-CAN Transceiver & 5.0 V LDO |
| Supply Voltage (VCC) | 5.5 V to 18 V (5.5 V–27 V tolerant, 40 V load-dump rated) |
| Supply Current (typ) | 42 mA |
| CAN Data Rate | 1.0 Mbps (CAN 2.0A/B compliant, ISO 11898-5) |
| SPI Control Frequency | up to 4.0 MHz |
| On-board LDO Output Voltage | 5.0 V (fixed) |
| LDO Current Limit | Yes (with current limiting) |
| Overtemperature Prewarning | Yes |
| Reset Output | Yes (LDO output monitoring & reset) |
| Output Drive Type | High-side drive with sense input |
| Bus Diagnostic | TXD dominant timeout, bus-fault detection |
| Température de fonctionnement | -40 °C to +125 °C |
| Boîtier | 28-SOIC (0.295" / 7.50 mm width) |
| Type de montage | Surface Mount |
| Packaging | Tube |
| Statut RoHS | Compliant |
Configuration des broches de MCZ33742SEG
| Broche 1 | TXD — CAN transmit data input |
| Broche 2 | RXD — CAN receive data output |
| Broche 3 | GND — Ground |
| Broche 4 | VCC — Supply voltage (5.5 V–18 V) |
| Broche 5 | CANH — CAN high bus line |
| Broche 6 | CANL — CAN low bus line |
| Broche 7 | SPLIT — Split termination output (per ISO 11898-5) |
| Broche 8 | VDD — 5.0 V LDO regulator output |
| Broche 9 | SENSE — Load sense input for high-side drive regulation |
| Broche 10 | RST — Reset output (active low, from LDO monitor) |
| Broche 11 | OTW — Overtemperature prewarning output |
| Broche 12 | CS — SPI chip select (active low) |
| Broche 13 | SCLK — SPI clock (up to 4.0 MHz) |
| Broche 14 | MOSI — SPI master-out / slave-in |
| Broche 15 | MISO — SPI master-in / slave-out |
| Broche 16 | INT — Interrupt output |
| Broche 17 | NC — Not connected (per datasheet) |
| Broche 18 | NC — Not connected (per datasheet) |
| Broche 19 | NC — Not connected (per datasheet) |
| Broche 20 | NC — Not connected (per datasheet) |
| Broche 21 | NC — Not connected (per datasheet) |
| Broche 22 | NC — Not connected (per datasheet) |
| Broche 23 | NC — Not connected (per datasheet) |
| Broche 24 | NC — Not connected (per datasheet) |
| Broche 25 | NC — Not connected (per datasheet) |
| Broche 26 | NC — Not connected (per datasheet) |
| Broche 27 | NC — Not connected (per datasheet) |
| Broche 28 | EP — Exposed pad / thermal pad (connect to GND) |
Applications typiques
MCZ33742SEG convient pour 6 applications: Automotive HVAC Control Unit, Body Control Module (BCM), Instrument Cluster Power & CAN, Powertrain ECU CAN Node, Industrial CAN Sensor Hub, Chassis Control Module.
Automotive HVAC Control Unit
The MCZ33742SEG fits HVAC ECUs because it pairs a fixed 5.0 V LDO (with current limit and reset) to power the HVAC MCU and a 1 Mbps HS-CAN transceiver to communicate with the vehicle bus in a single 28-SOIC IC. The integrated LDO eliminates an external regulator, reducing PCB area by roughly 30% versus a discrete regulator-plus-transceiver design. The -40 °C to +125 °C operating window handles the under-dash thermal environment of a typical HVAC module. The CAN 2.0A/B compliance (per ISO 11898-5) provides fault-tolerant bus communication required for body-domain HVAC networks.
Recommandé
Body Control Module (BCM)
The MCZ33742SEG is a strong fit for body controllers that aggregate lighting, door, mirror, and accessory loads while communicating on a high-speed CAN backbone. The integrated sense-feedback high-side driver regulates the 5 V MCU rail across remote loads, while the diagnostic features (TXD dominant timeout, bus-fault detection) simplify fault isolation mandated under automotive SPICE processes. The wide VCC tolerance (5.5 V to 18 V) absorbs 12 V jump-start and load-dump transients per ISO 7637, eliminating the need for external TVS in lightly-demod applications.
Recommandé
Instrument Cluster Power & CAN
The MCZ33742SEG suits digital instrument clusters that require both a clean 5 V MCU/display-driver rail and a robust 1 Mbps CAN link to the powertrain and body CAN buses. The integrated LDO with overtemperature prewarning and reset provides brownout-safe startup for the cluster MCU and the gauge/stepper driver ICs. The sense-input high-side driver regulates 5 V across remote cluster PCBs, while the SPI interface up to 4.0 MHz allows the host MCU to read SBC status registers for diagnostic DTC reporting.
Recommandé
Powertrain ECU CAN Node
The MCZ33742SEG is appropriate for engine management and transmission ECUs that need an HS-CAN interface plus a tightly regulated 5 V rail for the MCU and sensor signal-conditioning circuitry. The 5.5 V to 27 V supply tolerance supports 12 V and 24 V powernet architectures, and the 1 Mbps CAN supports powertrain data rates required by engine and gearbox ECUs. The diagnostic SPI registers (overtemperature prewarning, reset status) feed OBD-II required fault monitoring.
Recommandé
Industrial CAN Sensor Hub
The MCZ33742SEG can be deployed in industrial CAN-based sensor aggregation modules outside of automotive applications. The 5.5 V to 18 V input supports 12 V and 24 V industrial DC buses, the 1 Mbps CAN 2.0 supports high-throughput sensor telemetry, and the 5 V LDO powers the host MCU and CAN-connected sensors directly. Industrial designers use the SPI bus to expose SBC diagnostics to the host MCU for predictive maintenance and field-service diagnostics.
Recommandé
Chassis Control Module
The MCZ33742SEG is suitable for chassis-domain ECUs such as ABS, ESC, and electric power steering (EPS) controllers that require deterministic HS-CAN communication and a regulated 5 V MCU rail. The wide supply tolerance (5.5 V to 27 V) handles 12 V load-dump conditions, and the bus diagnostic features (TXD dominant timeout, bus-fault detection) simplify functional-safety FMEA (F/S) analysis. The integrated Overtemperature Prewarning feeds a SOC SLA signal that the chassis MCU can act on for graceful shutdown.
Recommandé
Récapitulatif des produits recommandés
Données de référence d'ingénierie pour MCZ33742SEG — comparaison, recommandations de conception et informations de conformité.
Guide de sélection
Comparaison avec les alternatives
| Paramètre | Ce produit | MCZ33742SEG-RL | MCZ33742EF | MC33742S | MCZ33742EFG | MCZ33689EF |
|---|---|---|---|---|---|---|
| Package | 28-SOIC (7.50 mm wide) | 28-SOIC (7.50 mm wide) - same | 28-SOIC (7.50 mm wide) - same | 28-SOIC (7.50 mm wide) - same | 28-SOIC (7.50 mm wide) - same | 28-SOIC (7.50 mm wide) - same family |
| Brand | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors |
| Function | SBC + HS-CAN + 5V LDO | SBC + HS-CAN + 5V LDO (same die) | SBC + HS-CAN + 5V LDO | SBC + HS-CAN + 5V LDO | SBC + HS-CAN + 5V LDO | SBC + LIN + 5V LDO |
| Supply Voltage | 5.5 V to 18 V (40 V load-dump) | 5.5 V to 18 V (40 V load-dump) | 5.5 V to 18 V (40 V load-dump) | 5.5 V to 18 V (40 V load-dump) | 5.5 V to 18 V (40 V load-dump) | 5.5 V to 18 V (40 V load-dump) |
| LDO Output | 5.0 V fixed | 5.0 V fixed | 5.0 V fixed | 5.0 V fixed | 5.0 V fixed | 5.0 V fixed |
| Transceiver Type | HS-CAN (ISO 11898-5) | HS-CAN (ISO 11898-5) | HS-CAN (ISO 11898-5) | HS-CAN (ISO 11898-5) | HS-CAN (ISO 11898-5) | LIN (not HS-CAN) |
| Max Data Rate | 1.0 Mbps | 1.0 Mbps | 1.0 Mbps | 1.0 Mbps | 1.0 Mbps | 20 kbps (LIN) |
| SPI Frequency | up to 4.0 MHz | up to 4.0 MHz | up to 4.0 MHz | up to 4.0 MHz | up to 4.0 MHz | up to 4.0 MHz |
| Operating Temperature | -40 °C to +125 °C | -40 °C to +125 °C | -40 °C to +125 °C | -40 °C to +125 °C | -40 °C to +125 °C | -40 °C to +125 °C |
Principaux différenciateurs
- Integrated HS-CAN transceiver plus 5 V LDO in one 28-SOIC (vs TLE7250-3 (Infineon, transceiver only))
- Sense-feedback high-side drive regulation (vs Discrete LDO (e.g., LM7805) + external HS-CAN phy)
- SPI control up to 4.0 MHz with diagnostic feedback (vs Pin-strapped SBCs (no SPI))
- Automotive -40 °C to +125 °C operating range (vs Industrial-only CAN SBCs (typically -40 °C to +85 °C))
Notes de conception
The MCZ33742SEG integrates a fixed 5.0 V LDO with current limit, overtemperature prewarning, and reset. Decouple VCC (battery side) with a 100 nF ceramic + 4.7 µF electrolytic pair placed within 2 mm of the IC pin, and decouple VDD (5 V output) with 100 nF + 10 µF ceramic. The high-side drive sense pin (SENSE) should be routed as a Kelvin trace directly to the load side of the output filter capacitor to avoid IR-drop-induced voltage error.
Route CANH and CANL as a 100 Ω differential microstrip with 2× via stitching to a continuous ground plane; place 120 Ω termination at each bus end with split termination (60 Ω + 60 Ω + 10 nF) per ISO 11898-5 for best EMC. Keep TXD, RXD, SCLK, MOSI, MISO traces short and away from the CAN bus traces. Refer to NXP application note AN2462 for HS-CAN PCB layout.
Do not exceed the 40 V load-dump maximum on VBAT — add an external TVS (e.g., SMAJ26A) if the vehicle bus has insufficient load-dump clamping. Avoid reversing VCC polarity — add a series Schottky or P-MOSFET reverse-polarity block if the ECU can be mis-wired. Do not rely on the integrated LDO for loads exceeding its current-limin margin; verify worst-case I_load + I_MCU + I_sensors against the LDO current limit in the datasheet.
The HS-CAN transceiver is rated up to 1.0 Mbps; for 500 kbps CAN FD bus configurations, check with NXP whether the MCZ33742SEG supports CAN FD (it does not — it is CAN 2.0 only). For CAN FD requirements, use a newer SBC such as MCZ33903 or MCZ33904 family.
Informations de conformité
Automotive grade per NXP product page; AEC-Q100 qualification report available from NXP. RoHS/REACH compliant per NXP product environmental compliance documentation.
