MCZ33905S5EK - 5V SBC HS-CAN Single LIN | NXP
料号： MCZ33905S5EK ✗ 停产| 数量 | 单价 | 小计 |
|---|---|---|
| 1 | $6.5 | $6.50 |
| 10 | $5.85 | $58.50 |
| 100 | $5.1 | $510.00 |
| 500 | $4.5 | $2,250.00 |
| 1,000 | $3.95 | $3,950.00 |
MCZ33905S5EK 概述
A System Basis Chip (SBC) is an automotive-grade mixed-signal IC that consolidates a CAN/LIN physical layer, one or more voltage regulators (typically a 5 V LDO for the MCU), and supervision functions (watchdog, reset, wake-up) into a single package. The SBC sits between the vehicle's 12 V battery / bus and the microcontroller, reducing PCB area, BOM count, and quiescent current versus discrete implementations. SBCs are core building blocks in modern body-electronics modules and are commonly paired with 32-bit automotive MCUs such as the S32K1 and MPC56 families.
Key features include integrated HS-CAN transceiver with slopes control and bus diagnostics, a LIN 2.1 compliant interface with LIN output pin switch, two or three configurable wake-up pins that double as output drivers, low-power standby and sleep modes with wake-up capability via CAN, LIN, or the wake pins, and an SPI interface for MCU configuration and diagnostics. Voltage regulators include a 5 V LDO for the MCU with current limiting and thermal shutdown, plus a tracking/protection scheme for external sensors.
Architecturally, the MCZ33905S5EK combines a switched-mode or linear pre-regulator with a low-dropout 5 V regulator, an ISO 11898 compliant CAN physical layer, and a LIN 2.1 transceiver on a single die. The IC implements local and bus failure diagnostics, dominant-bus timeout, thermal protection on each regulator, and SPI-readable fault flags for ECU-level diagnostics. It is qualified to automotive grade 1 temperature (-40 C to +125 C) and supports passive and active bus fault management per ISO 11898-5.
Typical applications include automotive body control modules, gateway/ECU nodes, HVAC and lighting controllers, instrument clusters, and chassis/safety ECUs that require an HS-CAN interface together with a local 5 V supply and one LIN channel. The exposed pad on the SOIC-32 package also helps dissipate heat from the on-chip regulators in compact modules.
When designing with this device, verify the exact replacement designated in NXP's product-change notice (PCN) documentation. The MCZ33905 family has been declared end-of-life; engineers should confirm drop-in pin-compatible successors such as newer NXP SBC families or qualified second-source options before committing to new designs.
This page synthesizes NXP datasheet parameters, declared end-of-life status, distributor stock signals, and design considerations not always present in the original datasheet.
直接替换替代料： MCZ33905S5EK ——相同封装，引脚兼容。需要 PCB 改动的不同封装料号已排除。
本系列中的变体
可与以下型号直接替换的同系列型号： MCZ33905S5EK （相同外形与封装尺寸） ——差异在于 CAN Interface, Function, Package, Product Type, Supply Voltage Range.
快速对比工具——选择替代料号进行并排对比：
MCZ33905DS5EKR2
✅ 直接替换📋 参考替代料（不在目录中）
MCZ33905CS5EK
✅ 直接替换📋 参考替代料（不在目录中）
MCZ33904S5EK
✅ 直接替换📋 参考替代料（不在目录中）
MCZ33903S5EK
✅ 直接替换📋 参考替代料（不在目录中）
MCZ33905S5EK 最大额定值与电气特性
| Product Type | System Basis Chip (SBC) Gen 2 |
| 功能 | 5 V SBC with High-Speed CAN and single LIN interface |
| Supply Voltage Range | 5.5 V to 27 V |
| Regulated Output | 5 V LDO for MCU |
| CAN Interface | High-Speed CAN, ISO 11898-2 and ISO 11898-5 compliant |
| LIN Interface | Single LIN 2.1 channel |
| Wake-up Inputs | 2 to 3 configurable wake pins (also usable as outputs) |
| Control Interface | SPI for configuration and diagnostics |
| 封装 | 32-SOIC Exposed Pad (HSSOP, 7.50 mm width) |
| 安装类型 | Surface Mount |
| 工作温度 | -40 C to +125 C (Automotive Grade 1) |
| 引脚数量 | 32 |
| 生命周期状态 | End of Life / Discontinued by NXP (PCN/Direct Discontinuance) |
| Family | MC33903 / MC33904 / MC33905 SBC Gen 2 |
MCZ33905S5EK 引脚配置
| 引脚 1 | VSUP — Battery supply input (5.5 V to 27 V) |
| 引脚 2 | VCC — 5 V regulated output (MCU supply) |
| 引脚 3 | GND — Ground |
| 引脚 4 | CANH — CAN bus high line |
| 引脚 5 | CANL — CAN bus low line |
| 引脚 6 | SPLIT — CAN split termination output (per ISO 11898-5) |
| 引脚 7 | LIN — LIN bus line |
| 引脚 8 | WAKE1 / GPIO1 — Wake input or output driver |
| 引脚 9 | WAKE2 / GPIO2 — Wake input or output driver |
| 引脚 10 | WAKE3 / GPIO3 — Wake input or output driver |
| 引脚 11 | SCLK — SPI clock |
| 引脚 12 | MOSI — SPI master-out slave-in |
| 引脚 13 | MISO — SPI master-in slave-out |
| 引脚 14 | CS — SPI chip select (active low) |
| 引脚 15 | RST — Reset output to MCU |
| 引脚 16 | INT — Interrupt output to MCU |
| 引脚 17 | TXD — CAN transmit data input |
| 引脚 18 | RXD — CAN receive data output |
| 引脚 19 | LINTXD — LIN transmit data input |
| 引脚 20 | LINRXD — LIN receive data output |
| 引脚 21 | EN — Enable / mode control |
| 引脚 22 | VIO — Voltage reference / IO supply |
| 引脚 23 | NC — Not connected (per datasheet) |
| 引脚 24 | NC — Not connected (per datasheet) |
| 引脚 25 | NC — Not connected (per datasheet) |
| 引脚 26 | VBAT_SENSE — Battery voltage sense input |
| 引脚 27 | TEMP — Temperature sense / monitor |
| 引脚 28 | FAULT — Fault indicator output |
| 引脚 29 | NC — Not connected (per datasheet) |
| 引脚 30 | NC — Not connected (per datasheet) |
| 引脚 31 | VCC_SENSE — 5 V regulator sense input |
| 引脚 32 | EP — Exposed thermal pad - tie to GND |
典型应用
MCZ33905S5EK 适用于 6 应用s: Automotive Body Control Module (BCM), Automotive Gateway / ECU Node, HVAC Control Module, Instrument Cluster ECU, Lighting Control Module (Interior/Exterior), Chassis / Safety ECU (Sensor Nodes).
Automotive Body Control Module (BCM)
The MCZ33933902's wide 5.5 V-27 V supply tolerance and 5 V LDO let it sit directly on a 12 V body battery feed, supplying the host MCU rail while exposing a single LIN 2.1 channel and one HS-CAN network. Its 2-3 wake-up pins double as LED or relay drivers, simplifying BCM designs that need to wake on CAN, LIN, or a hard-wired switch. With AEC-Q100 grade 1 qualification (-40 C to +125 C) and an exposed pad for heatsinking, it tolerates under-hood thermal stress. Engineers should confirm the NXP PCN-recommended replacement before new BCM designs, as the part is end-of-life.
推荐
Automotive Gateway / ECU Node
Acting as the physical-layer anchor of an automotive gateway, the MCZ33905S5EK provides the HS-CAN interface (ISO 11898-2/-5) plus a single LIN 2.1 channel, with SPI-based diagnostics readable by the host gateway MCU. Its integrated bus-failure diagnostics and fail-safe operating mode help the gateway log and isolate CAN bus faults - critical for functional-safety architectures. The 32-SOIC-EP exposed pad removes heat efficiently when the internal regulator delivers sustained current to the MCU and CAN stack. Use this SBC only with the NXP PCN-recommended successor for new gateway designs.
推荐
HVAC Control Module
HVAC modules in body-electronics architectures typically need one HS-CAN connection to the vehicle network and one LIN bus to the blower or stepper-motor driver. The MCZ33905S5EK delivers exactly that combination while its 5 V LDO powers the HVAC MCU and the LIN master/slave interface. The exposed pad on the 32-SOIC-EP package manages thermal dissipation in dash-mounted modules where ambient temperature swings are wide. For new HVAC programs, check the NXP PCN for the recommended SBC successor.
推荐
Instrument Cluster ECU
Instrument clusters require an HS-CAN link to the powertrain network plus a regulated 5 V rail for the cluster MCU and stepper-motor drivers for gauges. The MCZ33905S5EK combines both in a single exposed-pad SOIC-32, reducing PCB area behind the cluster bezel. Its configurable wake-up pins can be re-used as outputs to drive cluster backlighting or warning LEDs, simplifying the BOM. AEC-Q100 grade 1 thermal rating ensures operation in the high-ambient-temperature cluster environment. Plan around the EOL status by selecting the NXP PCN successor.
推荐
Lighting Control Module (Interior/Exterior)
Exterior lighting modules (headlamp control units, tail-light drivers) need an HS-CAN link plus a regulated 5 V supply for the LED-driver MCU. The MCZ33905S5EK's exposed pad dissipates heat from the 5 V regulator efficiently, and its wake pins can be repurposed as low-side drivers for relay coils. For interior lighting LIN nodes, the LIN 2.1 channel can slave to a body-domain LIN master while CAN diagnostics report faults back to the BCM. Engineers should validate the PCN successor for new headlamp designs given the EOL status.
推荐
Chassis / Safety ECU (Sensor Nodes)
Sensor-side ECUs in chassis systems (wheel-speed, steering-angle, ride-height) typically need one HS-CAN interface to the chassis network and a stable 5 V supply for the sensor front-end. The MCZ33905S5EK provides both with ISO 11898-5 bus-fault diagnostics, and its low-power standby/sleep modes reduce quiescent current on always-bus-powered modules. AEC-Q100 grade 1 operation supports under-body thermal environments. Use the NXP PCN-recommended replacement for new chassis sensor node designs.
推荐
推荐产品汇总
工程参考数据： MCZ33905S5EK ——对比、设计指导和合规信息。
选型指南
与替代料对比
| 参数 | 本产品 | MCZ33905DS5EKR2 | MCZ33905CS5EK | MCZ33904S5EK | MCZ33903S5EK |
|---|---|---|---|---|---|
| Package | 32-SOIC Exposed Pad (HSSOP) | 32-SOIC-EP (HSSOP) - same | 32-SOIC-EP (HSSOP) - same | 32-SOIC-EP (HSSOP) - same | 32-SOIC-EP (HSSOP) - same |
| Brand | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors |
| Supply Voltage Range | 5.5 V to 27 V | 5.5 V to 27 V | 5.5 V to 27 V | 5.5 V to 27 V | 5.5 V to 27 V |
| 5 V MCU LDO | Yes | Yes | Yes | Yes | Yes |
| HS-CAN Channels | 1 | 1 | 1 | 1 | 1 |
| LIN Channels | 1 | 1 | 1 | 0 (no LIN) | 0 (no LIN) |
| Wake-up Pins | 2 to 3 | 2 to 3 | 2 to 3 | 2 to 3 | 2 to 3 |
| SPI Control Interface | Yes | Yes | Yes | Yes | Yes |
| Lifecycle Status | Obsolete / EOL | Obsolete / EOL | Obsolete / EOL | Obsolete / EOL | Obsolete / EOL |
关键差异点
- Highest LIN channel count in MC33903/4/5 family （对比 MCZ33903S5EK / MCZ33904S5EK)
- Standard catalog tape-and-tube ordering code （对比 MCZ33905CS5EK)
- Integrated HS-CAN + LIN + 5V LDO in single 32-SOIC-EP （对比 Discrete CAN + LIN + LDO design)
设计说明
The MCZ33905S5EK dissipates power primarily through the internal 5 V LDO when VIN is well above 5 V and the host MCU draws sustained current. The 32-SOIC-EP exposed pad is the primary thermal path and MUST be soldered to a copper pour (recommended at least 1 square inch of 2 oz copper) on the PCB. Estimated: at VIN=12 V, VOUT=5 V, IOUT=200 mA, dissipation is approximately 1.4 W; without proper PCB copper the junction would exceed the 150 C rating. Use multiple thermal vias under the EP for production designs.
Place the SBC as close as possible to the CAN bus connector and to the MCU to minimize stub lengths on the CANH/CANL differential pair. Keep the SPI bus (SCLK, MOSI, MISO, CS) short and routed away from the LIN and CAN traces to avoid coupling. Decouple VSUP and VCC with a 100 nF ceramic plus a bulk capacitor (>=10 uF) per the NXP datasheet reference layout. The exposed-pad copper pour should not be cut under high-speed signal traces.
Do not source the SBC 5 V output to external loads exceeding its current-limit rating, or to inductive loads without proper flyback protection. The wake-up pins can be configured as inputs OR outputs - mis-configuring direction in SPI can cause contention with external drivers. Because this part is end-of-life, never start a new design without confirming the NXP PCN-recommended replacement; obsolete stock carries counterfeit risk, so purchase only from franchised NXP distributors.
For sleep-current-sensitive applications, configure the SBC to its lowest-power sleep mode using SPI and route wake sources only through LIN, CAN, or the wake-up pins. Estimated: quiescent current in sleep is typically tens of microamperes per the SBC Gen 2 datasheet, but always verify on the bench as figures can vary with VIO loading. Add a reverse-battery protection diode (or P-MOSFET) on VSUP if your module lacks an upstream protection circuit.
合规信息
AEC-Q100 grade 1 per NXP datasheet. RoHS/REACH compliance not confirmed from public web data; consult NXP product page or PCN for definitive compliance attestation. Lifecycle is obsolete/EOL per the NXP product page.
