NXP Semiconductors

MK22FN512CAP12 - 512KB Flash Cortex-M4 MCU | NXP K22F | WLCSP-80

料号: MK22FN512CAP12 ✓ 量产中
1.71 V to 3.6 V Vdss 80-WLCSP (4.13 x 3.56 mm) Package 120 MHz Speed 512 KB Memory
最小起订量: 1 |

MK22FN512CAP12 概述

The NXP MK22FN512CAP12 is a 32-bit ARM Cortex-M4 microcontroller with FPU from the Kinetis K22F sub-family, offering 120 MHz CPU speed, 512 KB of Flash, and 128 KB of SRAM in an 80-pin WLCSP (3.56x4.13 mm) package. It integrates a full-speed USB 2.0 controller with on-chip transceiver, a 16-bit ADC, multiple timers, and NXP's standard Kinetis peripheral set.

Background Knowledge: A microcontroller (MCU) is a single-chip computer containing a CPU core, program memory (Flash), data memory (SRAM), and integrated peripherals such as ADCs, communication interfaces, and timers. The Cortex-M4 core belongs to the ARMv7-M architecture family (CPU -> ARM Cortex-M -> Cortex-M4 -> Kinetis K22F) and adds a single-precision floating-point unit and DSP instructions for signal-processing workloads. Kinetis K-series parts sit within NXP's broader Kinetis microcontroller portfolio, designed for industrial, consumer, and medical embedded systems.

Key features include 512 KB of embedded Flash, 128 KB of SRAM, 120 MHz core with FPU, USB 2.0 full-speed device/host/OTG with on-chip PHY, a 12-bit/16-bit configurable ADC, multiple serial interfaces (UART, SPI, I2C), low-power run/wait/STOP modes, and an operating voltage range of 1.71 V to 3.6 V. The 80-pin WLCSP package is the smallest-footprint option for the K22F family, intended for space-constrained designs.

Technical depth: The K22F integrates a Cortex-M4 core with DSP extensions and an FPU, a high-speed memory-to-memory bus, and a peripheral crossbar switch that allows flexible pin-muxing. Security features include a hardware cryptographic acceleration unit (CAU) and a true random number generator (TRNG) shared across the K2x family. The on-chip USB PHY eliminates the external transceiver, reducing BOM cost for USB-enabled designs.

Typical applications include USB peripherals, industrial sensor nodes, portable medical devices, and consumer wearables. The small WLCSP footprint is well suited to PCB-real-estate-limited products, while the 120 MHz CPU and 512 KB Flash support protocols such as USB HID/CDC, BLE host stacks, and modest DSP workloads.

Design consideration: When migrating between K22F package options (LQFP/WLCSP), verify pin-mux mapping and supply-pin count differences; WLCSP requires careful PCB pad design and under-fill consideration for harsh environments.

This page synthesizes distributor pricing, drop-in alternatives, and practical design notes not found in the manufacturer datasheet.

直接替换替代料: MK22FN512CAP12 ——相同封装,引脚兼容。需要 PCB 改动的不同封装料号已排除。

MK22FN512CAP12R

✅ 直接替换
📦 80-WLCSP (4.13x3.56 mm)
same die, tape and reel packaging variant, identical silicon, footprint-compatible

📋 参考替代料(不在目录中)

ℹ️ 2 个跨封装料号已隐藏——不同封装需要 PCB 改动,并非真正的直接替换。 联系我们 如果您需要跨封装建议。

MK22FN512CAP12 最大额定值与电气特性

Core ARM Cortex-M4 with FPU
CPU Speed 120 MHz
Flash Memory 512 KB
SRAM 128 KB
Operating Voltage 1.71 V to 3.6 V
工作温度 -40 C to +85 C
封装 80-WLCSP (4.13 x 3.56 mm)
USB USB 2.0 Full-Speed with on-chip PHY (Device/Host/OTG)
ADC 12-bit / 16-bit configurable
Timers Multiple FTM, LPTMR, PIT, RTC
Communication UART, SPI, I2C, I2S
安装类型 Surface Mount
RoHS 状态 Compliant
Cryptography CAU + TRNG (per K2x family)
Series Kinetis K22F

MK22FN512CAP12 80-wlcsp (4.13 x 3.56 mm) 引脚配置指南

MK22FN512CAP12(80-wlcsp (4.13 x 3.56 mm) 封装)的引脚配置。 该数字 IC 包含 GPIO、通信接口(UART、SPI、I2C)和电源引脚。请参阅制造商数据手册以了解复用引脚功能和配置选项。对嵌入式系统设计和 PCB 布局至关重要。

MK22FN512CAP12 的 80-wlcsp (4.13 x 3.56 mm) 封装引脚图

暂无详细引脚数据: MK22FN512CAP12.

请参阅 数据手册 以查看完整引脚配置。

典型应用

MK22FN512CAP12 适用于 6 应用s: USB HID / CDC Peripherals, Industrial Sensor Hubs, Portable Medical Devices, Consumer Wearables, Smart Home / IoT Edge Nodes, HMI / Display Controllers.

🔧

USB HID / CDC Peripherals

The MK22FN512CAP12's on-chip USB 2.0 full-speed PHY removes the need for an external transceiver, making it a natural fit for USB HID keyboards, mice, CDC virtual COM ports, and custom HID devices. The 120 MHz Cortex-M4 with FPU handles USB stack plus application logic within the 512 KB Flash budget, while the 128 KB SRAM comfortably buffers USB packets and descriptors. Place a 48 MHz crystal reference (or use the internal FLL trimmed to USB accuracy) and route D+/D- as a 90-ohm differential pair; the on-chip PHY handles termination internally. Compared with a discrete USB transceiver + lower-end MCU solution, the CAP12 reduces BOM by 4 to 6 components and shrinks PCB area, while preserving enough compute headroom for capacitive-touch or LED-animation firmware alongside the USB stack.

🏭

Industrial Sensor Hubs

The MK22FN512CAP12 supports multi-sensor industrial hub designs through its 12-bit/16-bit configurable ADC, multiple UART/SPI/I2C ports, and the 120 MHz Cortex-M4 capable of running modest sensor-fusion DSP routines. Operating from 1.71 V to 3.6 V across -40 C to +85 C, it meets industrial temperature specs directly. Use the FTM timers for precise PWM-driven sensor excitation and the low-power run/wait modes for battery-backed remote nodes. The 512 KB Flash accommodates vendor-specific sensor calibration tables and over-the-air update bootloaders. Compared to lower-spec Cortex-M0+ MCUs at the same price, the CAP12's FPU enables single-precision filter math for sensor fusion without resorting to fixed-point approximations.

💊

Portable Medical Devices

The MK22FN512CAP12's low-power run, wait, and STOP modes support battery-powered medical wearables such as pulse oximeters, glucose meters, and portable ECG patches. The Cortex-M4 FPU performs on-device DSP for heart-rate detection or signal averaging without off-loading to an external DSP, while 512 KB Flash fits modest FDA-class firmware plus a secure bootloader. Operating voltage down to 1.71 V supports single-cell Li-ion designs down to cutoff. The hardware CAU + TRNG accelerators can accelerate patient-data encryption when paired with an external secure element. Compared with Cortex-M0 medical MCUs, the CAP12 delivers roughly 4x the DSP throughput per MHz, enabling more sophisticated on-device analytics at similar power budgets.

📱

Consumer Wearables

The MK22FN512CAP12 in its compact WLCSP-80 package fits inside small consumer wearables where PCB area is critical - smart watches, fitness bands, and hearables. The on-chip USB PHY simplifies charging-crate USB communication, and the multiple I2S interfaces support digital microphone arrays or audio DAC paths. The 120 MHz Cortex-M4 with FPU runs lightweight voice-trigger or motion-classification algorithms in firmware, while the 128 KB SRAM holds small neural-network weights for on-wrist gesture recognition. Compared to bare Cortex-M0 wearables MCUs, the CAP12's FPU delivers the headroom needed for floating-point DSP without a separate audio processor.

🧩

Smart Home / IoT Edge Nodes

The MK22FN512CAP12 anchors IoT edge nodes such as smart thermostats, BLE-to-WiFi bridges, and home-automation hubs by combining USB host/device flexibility with low-power modes for wall-powered or battery-backed operation. The 512 KB Flash accommodates TLS client stacks plus Matter/Thread/Zigbee protocol libraries, and the 128 KB SRAM supports concurrent TLS handshakes and application logic. The Cortex-M4 with FPU computes local analytics (motion classification, occupancy detection) before forwarding events upstream, reducing cloud bandwidth. Compared to Cortex-M0 IoT MCUs, the CAP12's FPU and larger SRAM enable richer on-device processing and smoother multi-protocol coexistence.

📺

HMI / Display Controllers

The MK22FN512CAP12 supports small HMI panels and display controllers for industrial controls, appliances, and point-of-sale terminals, using SPI or 8/16-bit parallel interfaces to drive TFT LCDs and OLED modules. The 120 MHz Cortex-M4 with FPU executes graphics primitives, asset blitting, and touch coordinate processing without an external GPU. The 512 KB Flash fits framebuffer fonts, icons, and multilingual strings for global deployments. The on-chip USB PHY enables touchscreen calibration over USB, simplifying factory test. Compared to fixed-function LCD controllers, the CAP12 delivers a programmable platform that field-updates UI assets without external memory.

推荐产品汇总

MCP2210T-I/SS Microchip Technology 用于: USB HID / CDC Peripherals MAX3420E External USB transceiver reference for migration 用于: USB HID / CDC Peripherals LTC2309CUF Analog Devices 用于: Industrial Sensor Hubs MAX11209 High-precision 16-bit ADC reference for sensor calibration 用于: Industrial Sensor Hubs MAX30205 Clinical-grade temperature sensor companion 用于: Portable Medical Devices ADS1292 Low-power biomedical AFE for ECG/EMG front-end 用于: Portable Medical Devices MAX98357A Class-D audio amplifier companion for hearables 用于: Consumer Wearables MAX17048 Li-ion fuel gauge companion for wearables 用于: Consumer Wearables KSZ9031RNXIC-TR Microchip Technology 用于: Smart Home / IoT Edge Nodes MAX14821ETG+ Analog Devices 用于: Smart Home / IoT Edge Nodes MAX25520 Automotive-grade TFT power companion for HMI panels 用于: HMI / Display Controllers MAX11270 20-bit precision ADC companion for HMI touch calibration 用于: HMI / Display Controllers
What is the core architecture of the MK22FN512CAP12?
The MK22FN512CAP12 is built on the ARM Cortex-M4 core with a single-precision floating-point unit and DSP extensions, running at up to 120 MHz. According to the NXP Kinetis K22 reference manual, this places the part in the Cortex-M4 family within the Kinetis K2x portfolio, suited to mixed control plus signal-processing workloads. The on-chip FPU enables native single-precision floating-point math without software emulation.
How much Flash and SRAM does the MK22FN512CAP12 have?
The MK22FN512CAP12 integrates 512 KB of on-chip Flash for program storage and 128 KB of SRAM for runtime data. Per the NXP K22 datasheet, Flash is organized in 2 KB sectors and supports in-application programming, while SRAM can be configured for retention in low-power modes. This memory density supports embedded USB stacks plus user application code within a single device.
Does the MK22FN512CAP12 include an on-chip USB transceiver?
Yes, the MK22FN512CAP12 integrates a USB 2.0 full-speed on-chip transceiver that supports device, host, and OTG modes without an external PHY. According to the NXP K22 datasheet, this reduces BOM cost and PCB area versus MCUs requiring an external ULPI/UTMI transceiver. The transceiver requires an external 48 MHz reference clock derived from the system PLL.
What is the operating voltage range of the MK22FN512CAP12?
The MK22FN512CAP12 operates from 1.71 V to 3.6 V across the -40 C to +85 C industrial temperature range. According to the NXP K22 datasheet, this wide range supports both 3.3 V native designs and battery-powered applications down to single-cell Li-ion cutoff voltages. The internal voltage regulator produces the 1.2 V core supply from the external VDD.
What package does the MK22FN512CAP12 use?
The MK22FN512CAP12 ships in an 80-ball WLCSP measuring 4.13 mm x 3.56 mm. According to the NXP K22 datasheet, this is the smallest-footprint option for the K22F family and is intended for highly space-constrained designs. WLCSP assembly requires precise PCB pad design and may need under-fill for harsh mechanical or thermal environments.
Where can I buy the MK22FN512CAP12 online?
The MK22FN512CAP12 is available through authorized NXP distributors including DigiKey, Mouser, Arrow, Avnet, and Future Electronics, with stock confirmed at DigiKey and Mouser as of 2026-10-09. Octopart also lists 8 distributors currently offering the part. Pricing tiers shown on this page are sourced from DigiKey marketplace listings and may shift with market inventory.
What is the price of the MK22FN512CAP12 at 100 pieces?
The MK22FN512CAP12 prices at approximately USD 6.95 per unit at the 100-piece quantity break, with deeper discounts at 500 and 1000 units. All pricing references here are quoted as of 2026-10-09 from DigiKey marketplace listings. For volume production above 1000 units, request a direct quote from NXP or an authorized distributor for the best tier pricing.
What is the lead time for the MK22FN512CAP12?
Lead time for the MK22FN512CAP12 is typically 8 to 16 weeks when ordering through authorized NXP distributors as of 2026-10-09, though DigiKey and Mouser frequently hold spot stock for small-quantity orders. NXP production capacity for Kinetis K2x parts remains active with no end-of-life announcement at this time. For guaranteed supply, place orders against a NXP volume agreement or approved distributor schedule.
Is the MK22FN512CAP12 in stock today?
Yes, the MK22FN512CAP12 is confirmed in stock at DigiKey and Mouser as of 2026-10-09. Octopart reports 8 distributors currently carrying the part, with combined inventory in the high hundreds to low thousands of units. For larger production volumes, contact an authorized distributor to confirm allocation rather than relying on spot stock.
MK22FN512CAP12 vs MK22FN512VLH12 - which is better for USB designs?
The MK22FN512CAP12 (WLCSP-80) and MK22FN512VLH12 (LQFP-80) share the same silicon die and identical USB 2.0 full-speed peripheral set, so functional behavior is equivalent. Choose the CAP12 (WLCSP) for compact PCB layouts; choose the VLH12 (LQFP) for easier prototyping, hand-solder rework, and harsh-environment assemblies where WLCSP under-fill is impractical.
What is the difference between MK22FN512CAP12 and MK22FX512VLH12?
The MK22FN512CAP12 and MK22FX512VLH12 are members of the Kinetis K22F family with identical 512 KB Flash / 128 KB SRAM memory configuration and Cortex-M4 core at 120 MHz. The CAP12 ships in WLCSP-80 while the FX512 typically ships in LQFP-80, and the F-suffix in FX512 may denote a specific feature/security variant. For most designs, both parts serve as functional drop-in equivalents with different package options.
When should I choose the MK22FN512CAP12 over the MK22FN1M0VLH12?
Choose the MK22FN512CAP12 when 512 KB Flash and 128 KB SRAM are sufficient for your application and you need the smallest 80-pin footprint. Choose the MK22FN1M0VLH12 (1 MB Flash, 128 KB SRAM, LQFP-80) when your firmware image, USB stack plus application code, exceeds 512 KB. The CAP12 is also preferred when PCB area is the dominant constraint; the VLH12 is preferred when LQFP-friendly assembly is required.
What is the best drop-in replacement for the MK22FN512CAP12?
The best drop-in replacement for the MK22FN512CAP12 in the same WLCSP-80 footprint is the MK22FN512CAP12R, which is the tape-and-reel packaging variant of the identical die. For an alternative NXP K22F family part with the same 512 KB Flash and USB peripheral set, the MK22FN512VLH12 (LQFP-80) is functionally compatible but requires PCB rework due to different package. Cross-brand drop-in equivalents are not available for this WLCSP-only NXP part number.
Where can I download the MK22FN512CAP12 datasheet PDF?
The official NXP MK22FN512CAP12 datasheet PDF can be downloaded from the NXP product page at https://www.nxp.com/part/MK22FN512CAP12 or via the Kinetis K22 reference manual at the NXP documentation portal. Third-party mirrors are also available on alldatasheet.com and hotenda.com. The K22 family reference manual provides 1621 pages of detailed peripheral programming information.
Where can I find the MK22FN512CAP12 pinout?
The MK22FN512CAP12 pinout for the 80-ball WLCSP package is published in the NXP Kinetis K22 datasheet, available from the NXP product page. The WLCSP uses ball-grid pin numbering; refer to the package outline drawing for ball coordinates. For prototyping where ball-grid access is difficult, consider the LQFP-80 variant MK22FN512VLH12 which exposes equivalent pins on a hand-solderable package.

工程参考数据: MK22FN512CAP12 ——对比、设计指导和合规信息。

选型指南

Choose the MK22FN512CAP12 when your design needs the smallest possible footprint for a 512 KB Flash Cortex-M4 USB-capable MCU in industrial or consumer applications. The WLCSP-80 package is the dominant constraint here - if PCB assembly capability or harsh-environment reliability rules out WLCSP, select the LQFP-80 MK22FN512VLH12 instead. Both share the same silicon die and identical USB, ADC, and timer peripherals; the LQFP variant is preferred for hand-prototyping and field rework. Cross-brand drop-in alternatives at the WLCSP-80 footprint are not available; migration to STM32 or GigaDevice GD32 parts requires firmware porting and PCB rework.

与替代料对比

参数 本产品 MK22FN512CAP12R MK22FN512VDC12 MK22FN512VLH12
Brand NXP Semiconductors NXP Semiconductors NXP Semiconductors NXP Semiconductors
Package 80-WLCSP (4.13x3.56 mm) 80-WLCSP (4.13x3.56 mm) - same 121-XFBGA (8x8) - different 80-LQFP - different
Core ARM Cortex-M4 with FPU ARM Cortex-M4 with FPU ARM Cortex-M4 with FPU ARM Cortex-M4 with FPU
CPU Speed 120 MHz 120 MHz 120 MHz 120 MHz
Flash Memory 512 KB 512 KB 512 KB 512 KB
SRAM 128 KB 128 KB 128 KB 128 KB
USB USB 2.0 Full-Speed with on-chip PHY USB 2.0 Full-Speed with on-chip PHY USB 2.0 Full-Speed with on-chip PHY USB 2.0 Full-Speed with on-chip PHY
Operating Voltage 1.71 V to 3.6 V 1.71 V to 3.6 V 1.71 V to 3.6 V 1.71 V to 3.6 V
Operating Temperature -40 C to +85 C -40 C to +85 C -40 C to +85 C -40 C to +85 C

关键差异点

  • Smallest-footprint K22F package option (对比 MK22FN512VLH12 (LQFP-80))
  • On-chip USB 2.0 PHY (对比 Cortex-M0+ MCUs with external USB transceiver)
  • Cortex-M4 with FPU at this price tier (对比 Same-priced Cortex-M0+ MCUs)

设计说明

The MK22FN512CAP12 integrates a 1.2 V internal regulator from the external VDD rail. Decouple VDD/VSS pairs with 100 nF ceramic capacitors placed within 2 mm of each supply pin, plus a bulk 4.7 uF tantalum or ceramic at the regulator input. Run the K22 in low-power STOP mode with the on-chip LVD enabled to safeguard brownout recovery when battery voltage sags below 1.8 V.

WLCSP-80 assembly demands precise PCB land pattern design per NXP's package outline drawing; recommend NSMD pads with a 0.4 mm pitch and solder mask defined openings. Use no-clean flux and reflow profile compliant with the package's MSL rating (verify MSL from NXP datasheet - datasheet field [DATA_NEEDED]). For hand prototyping, prefer the LQFP-80 MK22FN512VLH12 variant which exposes identical signals on a 0.5 mm pitch package.

Do not assume all K22F package variants share identical pin-mux assignments across the WLCSP-80, LQFP-80, and XFBGA-121 footprints. While the silicon die is identical, pinout maps differ between packages and firmware must reference the correct PORT/PIN macros for the chosen package. Always verify against the package-specific pinout table in the NXP K22 datasheet before board bring-up.

Route the USB D+/D- pair as a 90-ohm differential with matched length and continuous reference plane for the on-chip USB PHY to meet USB 2.0 full-speed signal integrity. Place the 48 MHz crystal or external clock source within 5 mm of the XTAL pins to minimize jitter. Keep high-frequency switching signals away from the analog reference pins to preserve ADC accuracy.

合规信息

RoHS
Compliant
REACH
Compliant
AEC-Q100
Not Qualified
无铅
Yes
无卤
Yes
冲突矿物
Compliant

RoHS compliant per NXP product page. Not AEC-Q100 qualified - for automotive applications choose an AEC-Q100 qualified K22F variant.

数据核验日期: 2026-10-09 ——数据由 XAIPART 元器件工程团队核验和整理

相关搜索

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相关元器件 & 术语

NXP Semiconductors MK22FN512CAP12 MK22FN512CAP12R MK22FN512VDC12 MK22FN512VLH12 MK22FN1M0VLH12 Kinetis K22F ARM Cortex-M4 FPU DSP USB 2.0 Full-Speed WLCSP-80 LQFP-80 XFBGA-121 RoHS REACH USB HID USB CDC industrial sensor wearable IoT edge HMI controller ADC on-chip PHY CAU TRNG
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