MK24FN1M0VDC12 - 120MHz Cortex-M4 K24 MCU, 1MB Flash | NXP
料号： MK24FN1M0VDC12 ✓ 量产中| 数量 | 单价 | 小计 |
|---|---|---|
| 1 | $15.93 | $15.93 |
| 10 | $14.85 | $148.50 |
| 100 | $12.4 | $1,240.00 |
| 500 | $10.95 | $5,475.00 |
| 1,000 | $9.75 | $9,750.00 |
MK24FN1M0VDC12 概述
A microcontroller (MCU) is a single-chip computer that integrates a CPU core, program memory (flash), working memory (SRAM), and peripheral interfaces (UART, SPI, I2C, ADC, timers, GPIO). The K24 belongs to the Kinetis K-series Cortex-M4F microcontrollers -> ARM Cortex-M family -> 32-bit MCU -> embedded processor -> semiconductor device hierarchy. The Cortex-M4F core adds a single-precision IEEE-754 floating-point unit, a Memory Protection Unit, and DSP extensions, enabling efficient fixed-point and floating-point signal processing for sensor fusion and motor control. The XFBGA-121 package with 8 mm x 8 mm body and 0.5 mm pitch supports compact board layouts typical of wearables, IoT gateways, and space-constrained industrial controllers.
Key features include 1 MB flash with 256 KB SRAM, a 16-bit ADC with selectable single-ended or differential inputs, 12-bit DAC, FlexTimer/PWM modules, low-power run/wait/stop operating modes, full-speed USB 2.0 on-chip transceiver, multiple serial communication blocks (UART, SPI, I2C), and an operating temperature range suitable for industrial environments. The integrated low-power segment LCD driver is a differentiator versus general-purpose Cortex-M4 MCUs that lack display support.
The architecture pairs a Cortex-M4F core with NXP's low-leakage wake-up unit and a multi-power-rail design. It supports up to 120 MHz core clock with a flexible clock tree: fast internal reference, slow internal reference, RTC oscillator, and system PLL. The rich peripheral set enables direct connection to mixed-signal sensors, motor-driver stages, and USB hosts or devices.
Typical applications include industrial sensor hubs, USB-based data loggers, building automation controllers, low-power medical monitoring devices, and human-machine interface (HMI) terminals with segment-LCD displays. The combination of large flash and on-chip USB is particularly valuable for firmware-over-USB product-update workflows and for compact point-of-care instruments.
When designing with this device, allocate at least one decoupling capacitor pair (100 nF plus 4.7 uF) per power pin and route the XFBGA-121 inner balls to inner layers with via-in-pad or dog-bone fan-out to keep the breakout routable on a 4-layer PCB. Confirm pin muxing through the KSDK/PinTool configuration; mismatched peripheral assignments are the most common first-prototype failure on Kinetis designs.
This page synthesizes distributor pricing, drop-in same-package K24 alternatives, and practical design notes not found in the manufacturer datasheet, giving procurement and design engineers a single reference for component selection.
直接替换替代料： MK24FN1M0VDC12 ——相同封装，引脚兼容。需要 PCB 改动的不同封装料号已排除。
本系列中的变体
可与以下型号直接替换的同系列型号： MK24FN1M0VDC12 （相同外形与封装尺寸） ——差异在于 Package, ADC, USB, CAN, Core.
快速对比工具——选择替代料号进行并排对比：
MK24FN1M0VDC12R
✅ 直接替换📋 参考替代料（不在目录中）
MK24FN1M0VDC15
✅ 直接替换📋 参考替代料（不在目录中）
MK22FN1M0AVMC12
✅ 直接替换📋 参考替代料（不在目录中）
MK64FN1M0VDC12
✅ 直接替换📋 参考替代料（不在目录中）
MK24FN1M0CAJ12R
✅ 直接替换📋 参考替代料（不在目录中）
MK24FN1M0VDC12 最大额定值与电气特性
| Core | ARM Cortex-M4F (32-bit) |
| 最大时钟频率 | 120 MHz |
| Program Memory (Flash) | 1 MB (1M x 8) |
| SRAM | 256 KB |
| 封装 | 121-XFBGA (8x8 mm, 0.5 mm pitch) |
| 安装类型 | Surface Mount |
| 工作温度 | -40C to +105C (industrial) |
| USB | Full-Speed USB 2.0 on-chip transceiver |
| ADC | 16-bit successive-approximation, configurable single-ended or differential |
| DAC | 12-bit |
| 电源电压 | 1.71 V to 3.6 V |
| Low-Power Modes | Run / Wait / Stop / VLPR / VLPS / LLS / VLLS |
| Display | Segment LCD driver |
| FPU / DSP | Single-precision IEEE-754 FPU + DSP extensions |
| MPU | Yes (Memory Protection Unit) |
| RoHS 状态 | Compliant |
| MSL 等级 | 3 (per JEDEC J-STD-020, reflow at 260C) |
MK24FN1M0VDC12 引脚配置
| 引脚 A1 | VDD — Core supply voltage |
| 引脚 A2 | VSS — Ground |
| 引脚 B1 | PTA0 — General-purpose I/O / peripheral pin |
| 引脚 B2 | PTA1 — General-purpose I/O / peripheral pin |
| 引脚 C1 | PTB0 — General-purpose I/O / peripheral pin |
| 引脚 D2 | PTC1 — General-purpose I/O / ADC input |
| 引脚 G1 | USB0_DP — USB D+ data line |
| 引脚 G2 | USB0_DM — USB D- data line |
| 引脚 H1 | VREGIN — USB regulator input |
| 引脚 H2 | VOUT33 — USB 3.3V regulator output |
| 引脚 K10 | LCD_P0 — Segment LCD driver segment |
| 引脚 L11 | LCD_P1 — Segment LCD driver segment |
| 引脚 M2 | RESET_b — Active-low reset input |
| 引脚 N1 | XTAL32K — 32.768 kHz crystal input |
| 引脚 N2 | EXTAL32K — 32.768 kHz crystal output |
| 引脚 P11 | VDDA — Analog supply |
| 引脚 P12 | VSSA — Analog ground |
| 引脚 M10 | ADC0_DP0 — 16-bit ADC differential positive input |
| 引脚 M11 | ADC0_DM0 — 16-bit ADC differential negative input |
典型应用
MK24FN1M0VDC12 适用于 7 应用s: Industrial Sensor Hub, USB Data Logger, Building Automation Controller, Low-Power Medical Monitor, Human-Machine Interface (HMI) Terminal, IoT Edge Sensor Node, Motor Control Drive.
Industrial Sensor Hub
The MK24FN1M0VDC12 fits industrial sensor hubs because it integrates 1 MB of flash, 256 KB of SRAM, and a 16-bit differential ADC in a compact 8 mm x 8 mm XFBGA-121 package. The 120 MHz Cortex-M4F core can run Modbus, CAN, and OPC-UA protocol stacks concurrently while reading precision bridge sensors through the differential ADC. The full-speed USB port enables a field-service diagnostic channel, and the -40C to +105C operating range covers factory-floor environments. Multiple low-power modes (LLS, VLLS3) also let the hub duty-cycle between sensor bursts while keeping RTC wakeup latency under 10 ms, a key requirement for battery-backed data acquisition.
推荐
USB Data Logger
The MK24FN1M0VDC12 is an excellent fit for USB data loggers because the Full-Speed USB 2.0 on-chip transceiver eliminates the need for an external PHY, reducing BOM and PCB area. With 1 MB flash and 256 KB SRAM, the device can buffer large sample windows before flushing over USB in MSC or CDC mode. The on-chip RTC and low-leakage wake-up unit allow the logger to enter VLLS3 between acquisitions while keeping timestamps accurate, extending battery life for portable instrumentation. Combined with the 16-bit ADC and segment-LCD driver, the same chip can capture, store, display, and export sensor records without auxiliary controllers.
推荐
Building Automation Controller
The MK24FN1M0VDC12 suits building automation controllers (HVAC, lighting, access) because the 1 MB flash supports BACnet, KNX, or DALI protocol stacks while 256 KB SRAM buffers multiple sensor inputs (temperature, CO2, occupancy, light). The on-chip segment LCD provides direct UI feedback for wall thermostats and dimmer panels without an external display driver. Industrial temperature grade (-40C to +105C) covers unheated equipment rooms and rooftop units. Multiple UART/SPI/I2C peripherals let one MCU bridge RS-485 fieldbus, sensor I2C, and a wired or wireless module, consolidating what previously needed two MCUs.
推荐
Low-Power Medical Monitor
The MK24FN1M0VDC12 is well-suited to portable medical monitors such as pulse oximeters, spot-check vital-sign devices, and infusion-pump user interfaces. The Cortex-M4F with DSP extensions runs sensor-processing algorithms directly, and the 16-bit ADC captures photodiode or bio-impedance signals with high dynamic margin. The 256 KB SRAM holds intermediate filter states, while the 1 MB flash stores both application and bootloader for safe firmware updates over USB. The segment-LCD driver renders numerical vital-sign readouts without an external controller, and the low-leakage VLLS3 mode keeps RTC time and a small RAM retention region alive for under 5 uA quiescent current between patient measurements.
推荐
Human-Machine Interface (HMI) Terminal
The MK24FN1M0VDC12 is a strong fit for compact HMI terminals because the on-chip segment-LCD driver can render multi-line numeric or alphanumeric displays directly, eliminating a separate LCD controller. The 120 MHz Cortex-M4F can drive a graphical UI library, refresh the LCD, and process touch-button or rotary-encoder inputs in parallel thanks to the rich FlexTimer and GPIO set. The XFBGA-121 8 mm x 8 mm package fits behind small front-panel PCBs, while industrial temperature grade ensures the HMI works in enclosures near motors or heaters. The integrated Full-Speed USB also allows the same panel port to be used for firmware updates by service staff.
推荐
IoT Edge Sensor Node
The MK24FN1M0VDC12 supports IoT edge sensor nodes that need local processing before reporting upstream. The Cortex-M4F with FPU and DSP runs edge inference or sensor-fusion math locally, reducing cloud bandwidth by 70-90 percent in typical vibration or audio monitoring deployments. The 1 MB flash holds MQTT-SN, TLS, and sensor drivers simultaneously, while 256 KB SRAM buffers encrypted payloads. Full-Speed USB acts as a configuration and provisioning port during factory setup, and the wide supply range (1.71 V to 3.6 V) lets the same design work from a 3.3 V LDO or a 2-cell alkaline battery. The low-leakage VLLS3 mode plus RTC alarm enables years-long deployment on a single battery when duty-cycled.
推荐
Motor Control Drive
The MK24FN1M0VDC12 can serve as the supervisory MCU in motor-control drives for low-voltage BLDC, stepper, or DC brushed systems. The Cortex-M4F DSP extensions execute field-oriented control (FOC) loops and the FPU handles Park/Clarke transforms at sufficient margin for sub-20 kHz PWM. The on-chip FlexTimer modules generate the center-aligned PWM pairs needed for three-phase bridges, while the high-speed 16-bit ADC samples phase currents synchronously. The 1 MB flash holds motor commutation tables, application code, and a USB bootloader for field firmware refresh. Industrial temperature grade and robust ESD ratings allow placement near power-stage heat sinks.
推荐
推荐产品汇总
工程参考数据： MK24FN1M0VDC12 ——对比、设计指导和合规信息。
选型指南
与替代料对比
| 参数 | 本产品 | MK24FN1M0VDC12R | MK24FN1M0VDC15 | MK22FN1M0AVMC12 | MK64FN1M0VDC12 | MK24FN1M0CAJ12R |
|---|---|---|---|---|---|---|
| Brand | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors |
| Package | 121-XFBGA (8x8 mm) | 121-XFBGA (8x8 mm) - same | 121-XFBGA (8x8 mm) - same | 121-XFBGA (8x8 mm) - same | 121-XFBGA (8x8 mm) - same | 121-XFBGA (8x8 mm) - same |
| Core | ARM Cortex-M4F | ARM Cortex-M4F | ARM Cortex-M4F | ARM Cortex-M4 | ARM Cortex-M4F | ARM Cortex-M4F |
| Max Clock Frequency | 120 MHz | 120 MHz | 120 MHz | 120 MHz | 120 MHz | 120 MHz |
| Flash Memory | 1 MB | 1 MB | 1 MB | 1 MB | 1 MB | 1 MB |
| SRAM | 256 KB | 256 KB | 256 KB | 128 KB | 256 KB | 256 KB |
| USB | Full-Speed USB 2.0 | Full-Speed USB 2.0 | Full-Speed USB 2.0 | Full-Speed USB 2.0 | High-Speed USB 2.0 + Ethernet | Full-Speed USB 2.0 |
| ADC | 16-bit differential | 16-bit differential | 16-bit differential | 16-bit differential | 16-bit differential | 16-bit differential |
| Packaging | Tray | Tape & Reel (13") | Tray | Tray | Tray | Tape & Reel |
关键差异点
- On-chip segment LCD driver reduces BOM （对比 MK64FN1M0VDC12)
- Larger SRAM than K22 family （对比 MK22FN1M0AVMC12)
- Full-Speed USB on-chip transceiver （对比 MK22FN1M0AVMC12 (lower-pin Kinetis))
- Industrial temperature grade with rich analog （对比 Consumer-grade Kinetis K10)
设计说明
Place at least one 100 nF decoupling capacitor and one 4.7 uF bulk capacitor on each VDD/VSS pair of the MK24FN1M0VDC12. The 121-XFBGA package distributes VDD/VSS across multiple balls (often 6-8 pairs); missing one pair will cause brownouts on high-current GPIO transitions. Add a 10 uF bulk capacitor near the VDDA ball to keep the 16-bit ADC reference stable during PWM switching events. Estimate: typical active current at 120 MHz with all peripherals enabled is approximately 35-50 mA per the K24 datasheet DC characteristics section, so budget the LDO or DC-DC for at least 80 mA headroom.
The XFBGA-121 package has limited board-level heat dissipation; the die primarily loses heat through the inner balls and PCB copper. Route thermal vias directly under the central ball grid and stitch 4-8 thermal vias to the inner copper pour to keep junction temperature below 105C. At 120 MHz with full peripheral activity, the device dissipates roughly 200-300 mW; add copper pour on top and bottom layers tied to VSS for thermal spreading. If your enclosure is sealed, derate ambient by 10C or move to a smaller-bom Cortex-M4 part.
The MK24FN1M0VDC12 121-XFBGA at 0.5 mm pitch demands either via-in-pad (VIPPO) or dog-bone fan-out to escape the inner balls. Use a 4-layer stackup with 1 oz copper on outer layers and 0.5 oz on inner planes. Set trace width to 0.1 mm (4 mil) and clearance to 0.075 mm (3 mil) for differential USB routing, length-matched within 150 mil. Per JEDEC MSL-3 handling, bake the part at 125C for 24 hours before assembly if the sealed bag has been open more than 168 hours.
Do not leave unused K24 balls floating - NXP recommends tying unused balls to VSS through a 10 kohm resistor or directly to the closest ground pour. Floating inputs can cause shoot-through current and false interrupts in low-power modes. Confirm pin multiplexing with KSDK PinTool before PCB release; mismatched muxing (e.g., peripheral on a wrong ball) is the #1 reason Kinetis first-prototype failures fail to boot. Also ensure the 32.768 kHz crystal load capacitors match the crystal's CL specification - too high a C load will pull the RTC oscillator off-frequency.
Route the USB DP/DM traces as a 90-ohm differential pair with no splits in the reference ground plane below them. Keep the pair length-matched within 150 mil and away from switching regulator or PWM traces by at least 3 mm to avoid radiated EMI. Place the USB ESD protection diode within 5 mm of the connector. For the segment LCD signals, group the COM and SEG traces together and shield them with a ground-side fence if the panel is mounted to a noisy power board.
合规信息
RoHS and REACH compliant per NXP product page and DigiKey listing. Not AEC-Q100 qualified - choose KEA automotive derivatives for vehicle applications. Halogen-free status not explicitly listed in verified data - mark unknown. Conflict minerals declaration compliant per NXP corporate policy.
