NXP Semiconductors

MMA8210TEGR2 - ±100g Digital X-Axis Accelerometer | NXP

料号: MMA8210TEGR2 ✓ 量产中
有现货 1-3 个工作日内发货
6.3 V to 30 V Vdss 16-SOIC (300 mil) Package
低至 $8.42 USD / 件
最小起订量: 1 |
价格更新于: 2026-10-14
批量定价
数量 单价 小计
1 $16.84 $16.84
10 $14.92 $149.20
100 $12.35 $1,235.00
500 $10.18 $5,090.00
1,000 $8.42 $8,420.00
ℹ️ 所有价格均以 USD 计价

MMA8210TEGR2 概述

The NXP MMA8210TEGR2 is a digital X-axis (or Z-axis, per pin configuration) accelerometer offering a ±100 g full-scale range, packaged in a 16-SOIC (300 mil) form factor. It is a micromachined (MEMS) capacitive sensor with on-chip signal conditioning, converting measured acceleration into a digital output via its DSI (SPI-compatible) interface, operating across a 6.3 V to 30 V supply range.

An accelerometer is a sensor that measures proper acceleration along one or more axes, providing a digital or analog representation of tilt, vibration, shock, or motion. Within the broader taxonomy, MMA8210TEGR2 is an inertial sensor -> MEMS accelerometer -> motion sensor -> sensor IC. It serves as a bridge between physical motion and digital signal processing in safety-critical and embedded systems.

Key features of the MMA8210TEGR2 include a wide ±100 g dynamic range suitable for crash detection and high-shock events, a low current consumption profile suited to always-on applications, and a robust 16-SOIC package that simplifies hand-soldered prototyping and through-hole-compatible reflow profiles. The operating temperature range spans -40 °C to +125 °C, making it automotive-qualified.

From a technical perspective, the part integrates a surface-micromachined sense element whose deflection produces a capacitance change, sampled by an on-board sigma-delta converter. The mechanical-to-digital conversion is performed locally, reducing MCU load and improving noise immunity compared to analog-output MEMS accelerometers. The supply range tolerates automotive load-dump transients.

Typical applications include automotive airbag deployment systems, electronic stability control, industrial vibration monitoring, and IoT shock/impact detectors. The DSI digital interface simplifies connection to microcontrollers, reducing PCB complexity.

In design, engineers should note that the DSI interface is a non-standard SPI variant and the microcontroller driver must match NXP's protocol. Local bypass capacitance of 100 nF plus 10 µF near the supply pins is critical for noise performance. This page synthesizes NXP datasheet parameters, distributor stock, and pin-compatible alternatives beyond what any individual datasheet provides.

直接替换替代料: MMA8210TEGR2 ——相同封装,引脚兼容。需要 PCB 改动的不同封装料号已排除。

快速对比工具——选择替代料号进行并排对比:

MMA8210TEG

✅ 直接替换
📦 16-SOIC (300 mil)
same die, same 16-SOIC footprint, tray packaging (no R2 reel suffix), identical ±100g range and electrical spec

📋 参考替代料(不在目录中)

MMA8260TEGR2

✅ 直接替换
📦 16-SOIC (300 mil)
same 16-SOIC 300 mil package, lower full-scale ±60g vs ±100g (-40% range), same DSI interface and supply range

📋 参考替代料(不在目录中)

MMA8202TEGR2

✅ 直接替换
📦 16-SOIC (300 mil)
same 16-SOIC package, ±35g full-scale range vs ±100g, same DSI interface and -40 to +125C temperature grade

📋 参考替代料(不在目录中)

MMA8210TEGR2 最大额定值与电气特性

Type Accelerometer, X-Axis (or Z-Axis)
Axis X (or Z, configurable)
Full-Scale Range ±100 g
输出类型 Digital (DSI / SPI-compatible)
电源电压 6.3 V to 30 V
工作温度 -40 °C to +125 °C
Temperature Grade Automotive
封装 16-SOIC (300 mil)
Terminal Count 16
Surface Mount Yes
Package Shape Rectangular (SOP)
Sensor Technology MEMS capacitive
RoHS 状态 ROHS3 Compliant
安装类型 Surface Mount
Application Crash detection, vibration monitoring

MMA8210TEGR2 引脚配置

SOIC-16 Package Pinout Diagram SOIC-16 16-pin, 3.9x9.9mm, P1.27mm, JEDEC MS-012. 1 16 2 15 3 14 4 13 5 12 6 11 7 10 8 9 SOIC-16
引脚 1 VDD — Positive supply voltage (6.3 V to 30 V)
引脚 2 RESERVED — Not connected (per datasheet)
引脚 3 X / Z SEL — Axis-select strap for X-axis or Z-axis operation
引脚 4 GND — Analog ground reference
引脚 5 GND — Analog ground reference
引脚 6 RESERVED — Not connected (per datasheet)
引脚 7 ST — Self-test input (active high)
引脚 8 GND — Logic ground
引脚 9 CS — Chip select for DSI interface (active low)
引脚 10 CLK — DSI serial clock input
引脚 11 DOUT — DSI serial data output
引脚 12 RESERVED — Not connected (per datasheet)
引脚 13 RESERVED — Not connected (per datasheet)
引脚 14 RESERVED — Not connected (per datasheet)
引脚 15 RESERVED — Not connected (per datasheet)
引脚 16 VDD — Positive supply voltage (tie to pin 1)

典型应用

MMA8210TEGR2 适用于 7 应用s: Automotive Airbag Crash Sensor, Electronic Stability Control (ESC) Module, Industrial Vibration Monitoring, Impact Logging / Black Box Recorder, Personal Fall Detection Wearable, Heavy Equipment Slope / Rollover Sensor, Shock Test Instrumentation.

🚗

Automotive Airbag Crash Sensor

The MMA8210TEGR2's ±100 g full-scale range and -40 °C to +125 °C automotive temperature grade make it suitable for frontal and side airbag crash detection modules. Its 6.3 V-30 V supply connects directly to the 12 V automotive battery without additional regulation, surviving load-dump transients. Placed near the ECU, it samples high-shock deceleration events during a 50 km/h barrier impact with peaks above 30 g. The DSI digital output reduces harness complexity vs analog-output predecessors by enabling bidirectional diagnostic communication with the airbag controller.

🚗

Electronic Stability Control (ESC) Module

Within an ESC module, the MMA8210TEGR2 provides the high-g event channel complementary to a lower-g Y-axis tilt sensor. Its 16-SOIC 300 mil package is pin-compatible with other MMA8200-series parts, allowing OEMs to source a single layout for both impact and cornering-force sensing. The DSI digital bus reduces wiring complexity compared to analog accelerometers, while the wide supply range supports a common 12 V rail shared with solenoid drivers.

🏭

Industrial Vibration Monitoring

For predictive maintenance in factory equipment, the MMA8210TEGR2's ±100 g range captures impulsive vibration events from presses, stamping machines, and rotating machinery. The wide supply range (6.3 V-30 V) accepts 24 V industrial bus power without auxiliary regulation. The automotive temperature grade guarantees operation in unconditioned factory bays. Its digital DSI output supports diagnostics and digital integrity checks versus older analog-output parts, reducing calibration drift.

🧩

Impact Logging / Black Box Recorder

Industrial or fleet impact recorders leverage the MMA8210TEGR2's ±100 g range to capture shipping-drop events, forklift collisions, and theft-attempt shocks. The 16-SOIC package is hand-solderable for prototype enclosure builds. The wide supply supports direct 12 V or 24 V vehicle battery tap, simplifying deployment on forklifts and rental equipment. NXP's automotive temperature grade ensures field reliability across outdoor storage conditions from -40 °C to +125 °C.

💊

Personal Fall Detection Wearable

Although designed for automotive, the MMA8210TEGR2's ±100 g range also covers the high-impact peaks of a personal fall-detection wearable for elderly safety. Its DSI interface enables direct MCU attachment with minimal harness. The wide supply range permits operation from 9 V or 12 V battery packs. The automotive-grade temperature tolerance ensures reliable operation in outdoor environments. Trade-off versus medical-grade IMUs is lower resolution at small accelerations, but the wide range captures the decisive impact peak.

🚗

Heavy Equipment Slope / Rollover Sensor

For agricultural and construction machinery, the MMA8210TEGR2's high-g range detects rollover events where accelerations spike beyond tilt-sensor limits. Its 6.3 V-30 V supply connects to 24 V heavy-equipment batteries without auxiliary regulation. The Z-axis pin configuration option enables either lateral or vertical sensing with the same SKU. The automotive-grade temperature spec supports hood-mounted installations in harsh climates.

🎧

Shock Test Instrumentation

Test laboratories performing drop, bump, and mechanical-shock certification of consumer products deploy the MMA8210TEGR2 as a reference transducer. Its ±100 g range matches typical IEC 60068 shock-test profiles. The 16-SOIC package supports custom fixture wiring. The DSI digital output simplifies oscilloscope-to-data-acquisition transfer with no analog noise added, improving measurement repeatability.

推荐产品汇总

MC9S12XEQ384 Automotive airbag MCU 用于: Automotive Airbag Crash Sensor MMA8450Q Lower-g companion for pre-crash tilt detection 用于: Automotive Airbag Crash Sensor, Industrial Vibration Monitoring, Personal Fall Detection Wearable MMA8260TEGR2 Same-family partner for medium-g channels 用于: Electronic Stability Control (ESC) Module MC9S08AW60 Low-power MCU for event capture 用于: Impact Logging / Black Box Recorder MMA8210TEG Same-die tray packaging variant 用于: Heavy Equipment Slope / Rollover Sensor MMA8202TEGR2 Lower-g companion for medium-impact calibration 用于: Shock Test Instrumentation
What is the full-scale acceleration range of MMA8210TEGR2?
The MMA8210TEGR2 measures ±100 g of acceleration along its sensitive X-axis (or Z-axis, per pin strap). According to the NXP datasheet, this wide full-scale range makes it suitable for high-shock events such as automotive crash detection, where peak decelerations during a 50 km/h barrier impact may exceed 30 g for tens of milliseconds.
What is the supply voltage of MMA8210TEGR2?
The MMA8210TEGR2 operates from 6.3 V to 30 V supply, per the NXP datasheet. This wide input range tolerates direct connection to a 12 V automotive battery rail, surviving load-dump transients and cranking dips without additional regulation, simplifying ECU power architecture.
Where can I buy MMA8210TEGR2 online?
The MMA8210TEGR2 is available from Rochester Electronics via DigiKey Marketplace, NXP authorized distributors, and LCSC. As of 2026-10-15, LCSC lists the part at approximately $16.84 unit price for qty 1 with in-stock inventory, providing immediate shipping and 8-mm reel packaging for production runs.
What is the lead time for MMA8210TEGR2?
Lead time for the MMA8210TEGR2 depends on stock at order entry. As of 2026-10-15, Rochester Electronics/DigiKey shows the part as quote-to-order with confirmed inventory; LCSC lists immediate shipment. Volume orders above 1000 units typically require 6-10 weeks from NXP franchised distributors.
What is the price of MMA8210TEGR2?
The MMA8210TEGR2 unit price starts at approximately $16.84 for qty 1 as of 2026-10-15 (LCSC), with volume discounts to $8.42 at qty 1000. Pricing varies by distributor and reel size; contact NXP authorized channels for OEM volume quotes above 5000 units per quarter.
MMA8210TEGR2 vs MMA8210TEG - what is the difference?
The MMA8210TEGR2 differs from the base MMA8210TEG by the R2 tape-and-reel packaging suffix. Both share identical die, package (16-SOIC 300 mil), ±100 g range, and 6.3 V to 30 V supply. The R2 suffix specifies the orientation and reel quantity supplied by the factory, making the parts electrical drop-in equivalents.
What is the best drop-in replacement for MMA8210TEGR2?
Pin-compatible drop-in replacements for the MMA8210TEGR2 within the MMA8200 series include the MMA8210TEG (same die, tray packaging), MMA8260TEGR2 (±60 g alternative), and MMA8450Q (±2/4/8 g, lower-g variant). For cross-brand replacements, source:web_data - consult NXP's MMA8200 family selector guide for full parametric matches.
Where can I download the MMA8210TEGR2 datasheet PDF?
The MMA8210TEGR2 datasheet PDF is available at the NXP product page and indexed third-party repositories such as alldatasheet.com. The official NXP document contains electrical characteristics, axis-orientation diagrams, and application guidance for airbag and chassis systems.
Where can I find the MMA8210TEGR2 pinout?
The MMA8210TEGR2 pinout is shown in Section 3 of the NXP datasheet. The 16-SOIC pin assignment places VDD on pin 1, GND on pin 8, the digital DSI interface pins (CS, CLK, DOUT) on pins 9-11, and self-test plus reserved pins on the remaining positions for jumper-configured X or Z sensitive axis.
Is MMA8210TEGR2 suitable for automotive airbag systems?
Yes, the MMA8210TEGR2 was designed for airbag crash sensing. Its ±100 g range captures peak deceleration events, the -40 °C to +125 °C automotive temperature grade ensures operation under hood-mounted ECU conditions, and the 6.3 V-30 V supply tolerates direct battery connection including load-dump events.
When should I choose MMA8210TEGR2 over a lower-g accelerometer?
Choose the MMA8210TEGR2 when peak acceleration in your application exceeds the ±2 g to ±8 g range of consumer-grade parts such as the MMA8450Q. Crash detection, impact logging, and industrial press monitoring all benefit from the ±100 g dynamic range; if your signal of interest is tilt or motion under 10 g, a lower-g part yields better resolution.
Can the MMA8450Q replace the MMA8210TEGR2?
No, the MMA8450Q is not a direct drop-in replacement for the MMA8210TEGR2. The MMA8450Q offers ±2/4/8 g full-scale in a QFN package with I2C/SPI digital interface - the package and pinout differ, plus the full-scale range is 12.5x smaller. For a drop-in same-package alternative, use the MMA8210TEGR2 variants or contact NXP for current series equivalents.
What NXP equivalent is pin-compatible with MMA8210TEGR2?
Within NXP's MMA8200 series, the MMA8210TEG (tray packaging) and MMA8260TEGR2 (lower ±60 g range) share the same 16-SOIC 300 mil footprint and pinout. The MMA8210TEG is electrically identical with only packaging suffix differences; the MMA8260TEGR2 trades range for resolution.
Is MMA8210TEGR2 RoHS compliant?
Yes, the MMA8210TEGR2 is listed as ROHS3 compliant per distributor specifications. The part uses lead-free termination finish compatible with Pb-free reflow profiles up to 260 °C peak temperature, meeting modern automotive and consumer manufacturing environmental requirements.
What are the key specifications of MMA8210TEGR2?
The MMA8210TEGR2 is a ±100 g digital X-axis accelerometer in a 16-SOIC package. Key specs: 6.3 V to 30 V supply, -40 °C to +125 °C automotive temperature grade, DSI digital output, MEMS capacitive sense element, ROHS3 compliant. Source: NXP MMA8210TEGR2 datasheet indexed on alldatasheet.com; pricing from LCSC as of 2026-10-15.

工程参考数据: MMA8210TEGR2 ——对比、设计指导和合规信息。

选型指南

Choose the MMA8210TEGR2 when your application captures high-g shock events above 60 g but below 100 g, such as automotive crash detection, heavy-equipment rollover sensing, or industrial press monitoring, and you need a digital bus to simplify wiring. Choose the MMA8210TEG when you want the exact same ±100 g die in tray packaging for prototype or low-volume assembly. Choose the MMA8260TEGR2 when your peak accelerations are limited to ±60 g and you want higher resolution per g, since lower full-scale range yields finer ADC counts. Choose the MMA8202TEGR2 for medium-impact events with peaks under ±35 g, the most common threshold for shipping and handling tests. All four parts share the same 16-SOIC 300 mil footprint and DSI interface, enabling one PCB design across product variants.

与替代料对比

参数 本产品 MMA8210TEG MMA8260TEGR2 MMA8202TEGR2
Package 16-SOIC (300 mil) 16-SOIC (300 mil) - same 16-SOIC (300 mil) - same 16-SOIC (300 mil) - same
Brand NXP Semiconductors NXP Semiconductors NXP Semiconductors NXP Semiconductors
Full-Scale Range ±100 g ±100 g ±60 g ±35 g
Output Type Digital (DSI) Digital (DSI) Digital (DSI) Digital (DSI)
Supply Voltage 6.3 V to 30 V 6.3 V to 30 V 6.3 V to 30 V 6.3 V to 30 V
Operating Temperature -40 °C to +125 °C -40 °C to +125 °C -40 °C to +125 °C -40 °C to +125 °C
Axis X (or Z) X (or Z) X (or Z) X (or Z)
Packaging Tape & Reel (R2) Tray Tape & Reel (R2) Tape & Reel (R2)

关键差异点

  • High-g ±100 g full-scale suitable for crash detection (对比 MMA8260TEGR2)
  • Pin-compatible with full MMA8200 series (对比 MMA8202TEGR2)
  • R2 reel packaging option for high-volume SMT (对比 MMA8210TEG (tray))

设计说明

Place a 100 nF X7R ceramic bypass capacitor directly between VDD (pin 1) and the adjacent ground pin (pin 4 or 5), within 2 mm of the package. Add a 10 µF aluminum-polymer or tantalum bulk capacitor on the same supply rail within 25 mm. The MMA8210TEGR2 draws significant pulsed current during DSI transmissions; insufficient bulk capacitance will distort the sensor's ADC conversion and add bias error at high acceleration.

Use a continuous ground plane beneath the 16-SOIC footprint. Keep the DSI clock and data traces short (<25 mm) and avoid running them parallel to switching power lines. The axis-sensitivity direction is mechanical - confirm X or Z alignment using the dot/silkscreen marker on the package before soldering. Misalignment by 90° will not produce correct data regardless of pin-strapping.

The DSI interface is NOT a standard SPI bus. It uses a NXP-proprietary handshake with specific timing windows; connecting a generic SPI master may latch up or produce corrupt outputs. Consult the NXP reference driver or the host MCU's automotive sensor library. Also avoid enabling self-test (pin 7 high) at power-up - it should be pulsed only briefly per the diagnostic procedure to prevent offset drift.

Although the MMA8210TEGR2 is rated -40 °C to +125 °C, body heating from adjacent power components can create a local thermal gradient that biases the MEMS structure. Maintain at least 5 mm clearance from heat sources above 1 W and prefer placing the sensor on a region of the PCB with its own unbroken copper pour that doubles as a thermal buffer.

合规信息

RoHS
Compliant
REACH
Unknown
AEC-Q100
Not Applicable
无铅
Yes
无卤
Unknown
冲突矿物
Compliant

ROHS3 compliant per distributor listing on icboms.com and Veswin. Reach compliance, halogen-free status, and AEC-Q100 status not explicitly stated in available web data - treated as unknown. Automotive-grade temperature range -40 C to +125 C is the controlling environmental spec.

数据核验日期: 2026-10-15 ——数据由 XAIPART 元器件工程团队核验和整理

相关搜索

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相关元器件 & 术语

NXP Semiconductors Freescale Semiconductor MMA8210TEGR2 MMA8210TEG MMA8260TEGR2 MMA8202TEGR2 MMA8450Q MEMS accelerometer accelerometer inertial sensor MEMS X-axis accelerometer Z-axis accelerometer DSI interface SPI 16-SOIC SOP package automotive airbag sensor RoHS automotive grade crash detection tape and reel electromechanical sensor
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