MMA8210TEGR2 - ±100g Digital X-Axis Accelerometer | NXP
MPN: MMA8210TEGR2 ✓ Active| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $16.84 | $16.84 |
| 10 | $14.92 | $149.20 |
| 100 | $12.35 | $1,235.00 |
| 500 | $10.18 | $5,090.00 |
| 1,000 | $8.42 | $8,420.00 |
MMA8210TEGR2 Overview
An accelerometer is a sensor that measures proper acceleration along one or more axes, providing a digital or analog representation of tilt, vibration, shock, or motion. Within the broader taxonomy, MMA8210TEGR2 is an inertial sensor -> MEMS accelerometer -> motion sensor -> sensor IC. It serves as a bridge between physical motion and digital signal processing in safety-critical and embedded systems.
Key features of the MMA8210TEGR2 include a wide ±100 g dynamic range suitable for crash detection and high-shock events, a low current consumption profile suited to always-on applications, and a robust 16-SOIC package that simplifies hand-soldered prototyping and through-hole-compatible reflow profiles. The operating temperature range spans -40 °C to +125 °C, making it automotive-qualified.
From a technical perspective, the part integrates a surface-micromachined sense element whose deflection produces a capacitance change, sampled by an on-board sigma-delta converter. The mechanical-to-digital conversion is performed locally, reducing MCU load and improving noise immunity compared to analog-output MEMS accelerometers. The supply range tolerates automotive load-dump transients.
Typical applications include automotive airbag deployment systems, electronic stability control, industrial vibration monitoring, and IoT shock/impact detectors. The DSI digital interface simplifies connection to microcontrollers, reducing PCB complexity.
In design, engineers should note that the DSI interface is a non-standard SPI variant and the microcontroller driver must match NXP's protocol. Local bypass capacitance of 100 nF plus 10 µF near the supply pins is critical for noise performance. This page synthesizes NXP datasheet parameters, distributor stock, and pin-compatible alternatives beyond what any individual datasheet provides.
Drop-in alternatives for MMA8210TEGR2 — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
MMA8210TEG
✅ Drop-In📋 Reference alternative (not in catalog)
MMA8260TEGR2
✅ Drop-In📋 Reference alternative (not in catalog)
MMA8202TEGR2
✅ Drop-In📋 Reference alternative (not in catalog)
MMA8210TEGR2 Maximum Ratings & Electrical Characteristics
| Type | Accelerometer, X-Axis (or Z-Axis) |
| Axis | X (or Z, configurable) |
| Full-Scale Range | ±100 g |
| Output Type | Digital (DSI / SPI-compatible) |
| Supply Voltage | 6.3 V to 30 V |
| Operating Temperature | -40 °C to +125 °C |
| Temperature Grade | Automotive |
| Package | 16-SOIC (300 mil) |
| Terminal Count | 16 |
| Surface Mount | Yes |
| Package Shape | Rectangular (SOP) |
| Sensor Technology | MEMS capacitive |
| RoHS Status | ROHS3 Compliant |
| Mounting Type | Surface Mount |
| Application | Crash detection, vibration monitoring |
MMA8210TEGR2 Pin Configuration
| Pin 1 | VDD — Positive supply voltage (6.3 V to 30 V) |
| Pin 2 | RESERVED — Not connected (per datasheet) |
| Pin 3 | X / Z SEL — Axis-select strap for X-axis or Z-axis operation |
| Pin 4 | GND — Analog ground reference |
| Pin 5 | GND — Analog ground reference |
| Pin 6 | RESERVED — Not connected (per datasheet) |
| Pin 7 | ST — Self-test input (active high) |
| Pin 8 | GND — Logic ground |
| Pin 9 | CS — Chip select for DSI interface (active low) |
| Pin 10 | CLK — DSI serial clock input |
| Pin 11 | DOUT — DSI serial data output |
| Pin 12 | RESERVED — Not connected (per datasheet) |
| Pin 13 | RESERVED — Not connected (per datasheet) |
| Pin 14 | RESERVED — Not connected (per datasheet) |
| Pin 15 | RESERVED — Not connected (per datasheet) |
| Pin 16 | VDD — Positive supply voltage (tie to pin 1) |
Typical Applications
MMA8210TEGR2 is suitable for 7 applications: Automotive Airbag Crash Sensor, Electronic Stability Control (ESC) Module, Industrial Vibration Monitoring, Impact Logging / Black Box Recorder, Personal Fall Detection Wearable, Heavy Equipment Slope / Rollover Sensor, Shock Test Instrumentation.
Automotive Airbag Crash Sensor
The MMA8210TEGR2's ±100 g full-scale range and -40 °C to +125 °C automotive temperature grade make it suitable for frontal and side airbag crash detection modules. Its 6.3 V-30 V supply connects directly to the 12 V automotive battery without additional regulation, surviving load-dump transients. Placed near the ECU, it samples high-shock deceleration events during a 50 km/h barrier impact with peaks above 30 g. The DSI digital output reduces harness complexity vs analog-output predecessors by enabling bidirectional diagnostic communication with the airbag controller.
Recommended
Electronic Stability Control (ESC) Module
Within an ESC module, the MMA8210TEGR2 provides the high-g event channel complementary to a lower-g Y-axis tilt sensor. Its 16-SOIC 300 mil package is pin-compatible with other MMA8200-series parts, allowing OEMs to source a single layout for both impact and cornering-force sensing. The DSI digital bus reduces wiring complexity compared to analog accelerometers, while the wide supply range supports a common 12 V rail shared with solenoid drivers.
Recommended
Industrial Vibration Monitoring
For predictive maintenance in factory equipment, the MMA8210TEGR2's ±100 g range captures impulsive vibration events from presses, stamping machines, and rotating machinery. The wide supply range (6.3 V-30 V) accepts 24 V industrial bus power without auxiliary regulation. The automotive temperature grade guarantees operation in unconditioned factory bays. Its digital DSI output supports diagnostics and digital integrity checks versus older analog-output parts, reducing calibration drift.
Recommended
Impact Logging / Black Box Recorder
Industrial or fleet impact recorders leverage the MMA8210TEGR2's ±100 g range to capture shipping-drop events, forklift collisions, and theft-attempt shocks. The 16-SOIC package is hand-solderable for prototype enclosure builds. The wide supply supports direct 12 V or 24 V vehicle battery tap, simplifying deployment on forklifts and rental equipment. NXP's automotive temperature grade ensures field reliability across outdoor storage conditions from -40 °C to +125 °C.
Recommended
Personal Fall Detection Wearable
Although designed for automotive, the MMA8210TEGR2's ±100 g range also covers the high-impact peaks of a personal fall-detection wearable for elderly safety. Its DSI interface enables direct MCU attachment with minimal harness. The wide supply range permits operation from 9 V or 12 V battery packs. The automotive-grade temperature tolerance ensures reliable operation in outdoor environments. Trade-off versus medical-grade IMUs is lower resolution at small accelerations, but the wide range captures the decisive impact peak.
Recommended
Heavy Equipment Slope / Rollover Sensor
For agricultural and construction machinery, the MMA8210TEGR2's high-g range detects rollover events where accelerations spike beyond tilt-sensor limits. Its 6.3 V-30 V supply connects to 24 V heavy-equipment batteries without auxiliary regulation. The Z-axis pin configuration option enables either lateral or vertical sensing with the same SKU. The automotive-grade temperature spec supports hood-mounted installations in harsh climates.
Recommended
Shock Test Instrumentation
Test laboratories performing drop, bump, and mechanical-shock certification of consumer products deploy the MMA8210TEGR2 as a reference transducer. Its ±100 g range matches typical IEC 60068 shock-test profiles. The 16-SOIC package supports custom fixture wiring. The DSI digital output simplifies oscilloscope-to-data-acquisition transfer with no analog noise added, improving measurement repeatability.
Recommended
Recommended Products Summary
Engineering reference data for MMA8210TEGR2 — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | MMA8210TEG | MMA8260TEGR2 | MMA8202TEGR2 |
|---|---|---|---|---|
| Package | 16-SOIC (300 mil) | 16-SOIC (300 mil) - same | 16-SOIC (300 mil) - same | 16-SOIC (300 mil) - same |
| Brand | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors |
| Full-Scale Range | ±100 g | ±100 g | ±60 g | ±35 g |
| Output Type | Digital (DSI) | Digital (DSI) | Digital (DSI) | Digital (DSI) |
| Supply Voltage | 6.3 V to 30 V | 6.3 V to 30 V | 6.3 V to 30 V | 6.3 V to 30 V |
| Operating Temperature | -40 °C to +125 °C | -40 °C to +125 °C | -40 °C to +125 °C | -40 °C to +125 °C |
| Axis | X (or Z) | X (or Z) | X (or Z) | X (or Z) |
| Packaging | Tape & Reel (R2) | Tray | Tape & Reel (R2) | Tape & Reel (R2) |
Key Differentiators
- High-g ±100 g full-scale suitable for crash detection (vs MMA8260TEGR2)
- Pin-compatible with full MMA8200 series (vs MMA8202TEGR2)
- R2 reel packaging option for high-volume SMT (vs MMA8210TEG (tray))
Design Notes
Place a 100 nF X7R ceramic bypass capacitor directly between VDD (pin 1) and the adjacent ground pin (pin 4 or 5), within 2 mm of the package. Add a 10 µF aluminum-polymer or tantalum bulk capacitor on the same supply rail within 25 mm. The MMA8210TEGR2 draws significant pulsed current during DSI transmissions; insufficient bulk capacitance will distort the sensor's ADC conversion and add bias error at high acceleration.
Use a continuous ground plane beneath the 16-SOIC footprint. Keep the DSI clock and data traces short (<25 mm) and avoid running them parallel to switching power lines. The axis-sensitivity direction is mechanical - confirm X or Z alignment using the dot/silkscreen marker on the package before soldering. Misalignment by 90° will not produce correct data regardless of pin-strapping.
The DSI interface is NOT a standard SPI bus. It uses a NXP-proprietary handshake with specific timing windows; connecting a generic SPI master may latch up or produce corrupt outputs. Consult the NXP reference driver or the host MCU's automotive sensor library. Also avoid enabling self-test (pin 7 high) at power-up - it should be pulsed only briefly per the diagnostic procedure to prevent offset drift.
Although the MMA8210TEGR2 is rated -40 °C to +125 °C, body heating from adjacent power components can create a local thermal gradient that biases the MEMS structure. Maintain at least 5 mm clearance from heat sources above 1 W and prefer placing the sensor on a region of the PCB with its own unbroken copper pour that doubles as a thermal buffer.
Compliance Information
ROHS3 compliant per distributor listing on icboms.com and Veswin. Reach compliance, halogen-free status, and AEC-Q100 status not explicitly stated in available web data - treated as unknown. Automotive-grade temperature range -40 C to +125 C is the controlling environmental spec.
