MPC561CZP40 - 40MHz PowerPC Qorivva MCU, 388-PBGA | NXP
料号： MPC561CZP40 ⚠ 最后一次采购| 数量 | 单价 | 小计 |
|---|---|---|
| 1 | $78.5 | $78.50 |
| 10 | $70.2 | $702.00 |
| 100 | $62.1 | $6,210.00 |
| 250 | $56.4 | $14,100.00 |
| 500 | $51.75 | $25,875.00 |
MPC561CZP40 概述
A Qorivva (MPC5xx) microcontroller is a 32-bit Power-Architecture-based MCU engineered for harsh automotive and industrial environments, providing deterministic real-time control, integrated peripheral subsystems, and flexible memory architectures. It sits within the broader taxonomy of 32-bit microcontrollers -> embedded microcontrollers -> microprocessors and microcontrollers -> integrated circuits -> semiconductors, providing higher computational headroom than 8/16-bit MCUs while integrating peripherals typically left to external logic.
Key features include a 32-bit single-core PowerPC processor at 40 MHz, ROMless memory architecture (program code executed from external memory or internal SRAM), and an operating temperature range of -40C to +85C aligned with automotive Grade-1 environments. The device integrates a sophisticated peripheral pin-multiplexing scheme that allows flexible routing of peripheral signals to physical pins, reducing external glue logic. It also supports on-chip code compression options and configurable memory protection.
The MPC561CZP40 architecture combines a high-performance RISC-style PowerPC integer pipeline with peripheral subsystems including multiple timer processing units (TPU), a queued analog-to-digital converter (QADC), and a system integration unit (SIU) that controls pin multiplexing, external bus, and chip selects. The 388-PBGA package exposes the full external bus interface and the rich peripheral set required for chassis-control ECUs.
Typical applications include automotive body controllers, electronic stability control (ESC) modules, anti-lock braking systems (ABS), powertrain control modules (PCM), and industrial servo/PLC control platforms. Engineers select this part where deterministic 32-bit throughput, automotive temperature tolerance, and abundant peripheral count outweigh the need for on-chip flash memory.
When designing, ensure external bus timing meets the 40 MHz core requirement, leverage the on-chip QADC for high-channel-count sensor acquisition, and verify PCB layout for the 388-PBGA escape - the 27x27 mm substrate typically requires microvia-stackup technology. For cost-sensitive designs without flash, the ROMless nature mandates an external boot memory source.
This page synthesizes distributor pricing, drop-in alternatives, and practical design notes not found in the manufacturer datasheet, helping engineers cross-check sourcing options without redesigning the PCB footprint.
直接替换替代料： MPC561CZP40 ——相同封装，引脚兼容。需要 PCB 改动的不同封装料号已排除。
本系列中的变体
可与以下型号直接替换的同系列型号： MPC561CZP40 （相同外形与封装尺寸） ——差异在于 Core Architecture, Program Memory Type, Code Compression, Operating Temperature, Mounting Type.
快速对比工具——选择替代料号进行并排对比：
MPC562MZP56
✅ 直接替换✓ 有现货
$35.4 / 个
查看数据手册 →MPC561MVR56
✅ 直接替换✓ 有现货
$45.2 / 个
查看数据手册 →MPC566MZP56
✅ 直接替换✓ 有现货
$24.5 / 个
查看数据手册 →MPC563MZP56
✅ 直接替换✓ 有现货
$17.95 / 个
查看数据手册 →SPC561MVR56D
✅ 直接替换📋 参考替代料（不在目录中）
MPC561CZP40 最大额定值与电气特性
| Core Architecture | PowerPC (MPC5xx / Qorivva family) |
| Core Count | Single-core |
| 数据总线宽度 | 32-bit |
| 最大时钟频率 | 40 MHz |
| Program Memory Type | ROMless (no internal Flash) |
| Package Type | 388-PBGA (Plastic Ball Grid Array) |
| Package Dimensions | 27 x 27 mm |
| 工作温度范围 | -40C to +85C |
| Automotive Grade | AEC-Q100 Grade compliant (Automotive) |
| External Bus Interface | Yes (32-bit bus, chip-selects via SIU) |
| ADC Channels | QADC (Queued ADC) - multi-channel |
| Timer Processing Unit | TPU - integrated motion-control timer |
| Peripheral Pin Multiplexing | Yes (SIU-controlled routing) |
| 安装类型 | Surface Mount (BGA) |
| Lead-free / RoHS | Lead-free finish; RoHS compliance varies by date code |
| MSL 等级 | MSL3 (typical for large PBGA) |
MPC561CZP40 27 x 27 mm 引脚配置指南
MPC561CZP40（27 x 27 mm 封装）的引脚配置。 该数字 IC 包含 GPIO、通信接口（UART、SPI、I2C）和电源引脚。请参阅制造商数据手册以了解复用引脚功能和配置选项。对嵌入式系统设计和 PCB 布局至关重要。
暂无详细引脚数据： MPC561CZP40.
请参阅 数据手册 以查看完整引脚配置。
典型应用
MPC561CZP40 适用于 6 应用s: Automotive Body Control Module (BCM), Anti-Lock Braking System (ABS) Module, Electronic Stability Control (ESC) ECU, Powertrain Control Module (PCM) Auxiliary, Industrial Servo Controller, HVAC Control Module for Automotive.
Automotive Body Control Module (BCM)
Why MPC561CZP40 fits Body Control: The MPC561CZP40's 32-bit PowerPC core at 40 MHz delivers sufficient MIPS for door/window/lamp control loops while the integrated SIU (System Integration Unit) supports flexible peripheral pin multiplexing - critical when routing PWM, LIN, and discrete I/O across dense BCM connectors. The 388-PBGA exposes enough GPIO and peripheral channels to handle seat, mirror, and lighting actuators without external expanders. Designers use the QADC for battery-voltage monitoring and the TPU for precision motor PWM. Trade-off vs MPC562MZP56: ROMless means firmware lives in external NOR Flash - select the M-suffix if deterministic boot-from-Flash is required.
推荐
Anti-Lock Braking System (ABS) Module
Why MPC561CZP40 fits ABS: Antilock-braking algorithms require deterministic sub-millisecond wheel-decay control loops, which the MPC561CZP40's 40 MHz PowerPC core delivers consistently. Its QADC samples up to 4 wheel-speed sensors per loop with synchronized triggers, while its TPU outputs precise PWM to the hydraulic valve drivers - eliminating external timer ICs. The -40C/+85C automotive temperature grade covers under-hood environments. Peripheral pin multiplexing lets one BGA package adapt to multiple ABS/OEM variants without board respins. The ROMless architecture suits ABS because the bootloader already loads firmware from external flash.
推荐
Electronic Stability Control (ESC) ECU
Why MPC561CZP40 fits ESC: Electronic Stability Control demands higher MIPS than ABS because torque-vectoring and yaw-rate calculations run alongside base braking control, and the MPC561CZP40's 32-bit PowerPC pipeline at 40 MHz is up to that task for entry/mid-tier ESC platforms. The integrated TPU generates synchronized multi-phase PWM for active-brake intervention, while the SIU drives the high-side/low-side FET gate drivers. The 388-PBGA size maps cleanly onto ESC PCB partitioning with separate analog/digital grounds. Designers add a COSHH watchdog companion for ASIL rating compliance. Consider MPC566MZP56 if yaw-rate computation overruns the 40 MHz budget.
推荐
Powertrain Control Module (PCM) Auxiliary
Why MPC561CZP40 fits Powertrain: As a secondary controller in a distributed PCM architecture, the MPC561CZP40 handles ancillary tasks - transmission shift scheduling, torque-requester networking, and on-board diagnostics - freeing the primary processor for combustion-loop math. The PowerPC integer pipeline runs shift-arbiter state machines efficiently, and the 388-PBGA ball-grid allows analog and digital sections to coexist with isolated ground islands. The QADC reads MAP/MAF sensors and the TPU drives solenoid/PWM actuators. ROMless operation aligns with a bootloader-driven powertrain architecture. For higher-end powertrain co-processors, step to MPC566MZP56.
推荐
Industrial Servo Controller
Why MPC561CZP40 fits Industrial Servo: Servo amplifiers require deterministic 8 kHz+ current-loop control, which the MPC561CZP40's real-time 40 MHz PowerPC core can sustain while reserving interrupt budget for host communications. The TPU produces synchronized 3-phase PWM outputs feeding the inverter stage, and the QADC samples phase currents at sub-microsecond intervals. The -40C/+85C industrial temperature grade supports factory-floor cabinet environments. The 388-PBGA's 1.27 mm ball pitch survives high-vibration mounting. Compared with newer ARM-based MCUs, the Qorivva part remains favored where firmware heritage is already validated on PowerPC toolchains.
推荐
HVAC Control Module for Automotive
Why MPC561CZP40 fits HVAC: Modern automotive climate control integrates multi-zone temperature regulation, blower/PWM actuation, and CAN/LIN communication - all within the MPC561CZP40's capability envelope. The 40 MHz core schedules PID loops for each zone without saturating, while the SIU's pin multiplexing routes LIN bus, NTC thermistor inputs, and blower FET drivers from a single BGA. Peripheral set matches automotive HVAC BOMs that include seat heaters, defrost, and recirculation valves. The ROMless architecture suits HVAC modules that store trim/calibration data externally. Trade-off: consider MPC562MZP56 if on-chip Flash is required for trim parameters.
推荐
推荐产品汇总
工程参考数据： MPC561CZP40 ——对比、设计指导和合规信息。
选型指南
与替代料对比
| 参数 | 本产品 | MPC562MZP56 | MPC561MVR56 | MPC566MZP56 | MPC563MZP56 | SPC561MVR56D |
|---|---|---|---|---|---|---|
| Brand | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors |
| Package | 388-PBGA (27x27 mm) | 388-PBGA (27x27 mm) - same | 388-PBGA (27x27 mm) - same | 388-PBGA (27x27 mm) - same | 388-PBGA (27x27 mm) - same | 388-BGA - same ball count |
| Maximum CPU Frequency | 40 MHz | 56 MHz (+40%) | 56 MHz (+40%) | 56 MHz (+40%) | 56 MHz (+40%) | 56 MHz (+40%) |
| Program Memory | ROMless | Integrated Flash (M-suffix) | ROMless | Integrated Flash (M-suffix) | Integrated Flash (M-suffix) | ROMless |
| Core Architecture | PowerPC MPC5xx (Qorivva) | PowerPC MPC5xx (same) | PowerPC MPC5xx (same) | PowerPC MPC5xx (same) | PowerPC MPC5xx (same) | PowerPC MPC5xx (same) |
| Data Bus Width | 32-bit | 32-bit | 32-bit | 32-bit | 32-bit | 32-bit |
| Operating Temperature | -40C to +85C | -40C to +85C | -40C to +85C | -40C to +85C | -40C to +85C | -40C to +85C |
| Automotive Grade (AEC-Q100) | Yes | Yes | Yes | Yes | Yes | Yes |
| Peripheral Pin Multiplexing | Yes (SIU) | Yes (SIU) | Yes (SIU) | Yes (SIU) | Yes (SIU) | Yes (SIU) |
关键差异点
- ROMless code-execution model with 40 MHz baseline （对比 MPC562MZP56)
- 388-PBGA ball grid unchanged across Qorivva family （对比 MPC566MZP56)
- Peripheral Pin Multiplexing via SIU （对比 MPC563MZP56)
设计说明
Estimated: The 388-PBGA at 1.27 mm pitch on a 27x27 mm substrate requires an HDI PCB stack-up with microvias for inner-layer escape; use 4-6 routing layers with 50-ohm controlled impedance on the external bus. Place bulk-decoupling capacitors on the SAME side as the BGA to minimize inductance, and provide a thermal-via array (>=0.3 mm diameter, 1 mm pitch) under the die-up region per IPC-7092 BGA guidelines. Reserving the outer-layer escape zone for the SIU-controlled bus signals reduces impedance discontinuities.
Do not assume the 'P' suffix in MPC561CZP40 implies Flash - it indicates the ROMless code-execution model, requiring external NOR Flash/EPROM on the bus. Also verify the silicon revision letter against the latest errata document; early MPC561CZP40 silicon had known issues with TPU channel under specific PWM load conditions that were resolved in later revisions. Confirm automotive PPAP/PCN status with NXP/Freescale for new platform design-ins.
Estimated: At typical 40 MHz operation with all peripherals active, the MPC561CZP40 dissipates roughly 1-1.5 W under representative automotive workloads. With 388-PBGA theta_JA of approximately 15-20 C/W on a 4-layer JEDEC-standard test board (estimated using typical PBGA-on-PCB values because the datasheet does not always state theta_JA explicitly), junction-to-ambient rise is 15-30 C - well within the 125 C maximum junction temperature at ambient <=85 C. For higher ambient enclosures, deploy a heatsink spreader or copper-pour block to guarantee thermal margin.
合规信息
AEC-Q100 qualified automotive grade per NXP/Mouser listing (-40C to +85C). RoHS/REACH compliance varies by date code and exact sub-tier because legacy Motorola/Freescale Qorivva production transitioned to NXP - always confirm with the manufacturer's latest material declaration.
