最后一次采购通知: MPC8241LVR266D-FR 即将停产。最后下单日期: 联系我们. 查看可用的替代料号 →
NXP Semiconductors

MPC8241LVR266D-FR - 266MHz PowerPC 603e Host Processor | NXP

料号: MPC8241LVR266D-FR ⚠ 最后一次采购
有现货 1-3 个工作日内发货
3.3 V Vdss 357-PBGA, 25 x 25 mm Package 266 MHz Speed
低至 $53.1 USD / 件
最小起订量: 1 |
价格更新于: 2026-10-16
批量定价
数量 单价 小计
1 $78.5 $78.50
10 $72.4 $724.00
100 $64.95 $6,495.00
500 $58.2 $29,100.00
1,000 $53.1 $53,100.00
ℹ️ 所有价格均以 USD 计价

MPC8241LVR266D-FR 概述

The NXP (formerly Freescale Semiconductor) MPC8241LVR266D-FR is a PowerPC 603e-based Integrated Host Processor that consolidates five discrete chips into a single 357-ball PBGA (25x25 mm) device, running at 266 MHz on a 32-bit data path. Per the MPC8241 product family datasheet, it integrates a PowerPC 603e processor core, an SDRAM controller, a PCI bridge, and peripheral logic, reducing system BOM and board complexity for cost- and space-sensitive embedded designs.

An Integrated Host Processor (IHP) is a high-integration MPU that combines a CPU core with memory and I/O controllers in one package - historically used to replace a CPU, northbridge, southbridge and peripheral controller combo with a single device. In the broader product taxonomy, the MPC8241 sits within PowerPC 603e -> 32-bit embedded MPU -> microprocessor -> IC -> semiconductor. Freescale's MPC82xx PowerQUICC II family is the architecture family; the 824x line focuses on host-bridge integration while the 826x line adds communications peripherals.

Key headline parameters for the MPC8241LVR266D-FR variant: 266 MHz maximum core speed, 1 core / 32-bit bus width, integrated SDRAM controller with PCI bridge, 3.3V I/O, and a 357-ball plastic BGA at 25x25 mm. The 'LVR' suffix denotes the lower-voltage core/IO revision and the 'FR' suffix denotes Tape-and-Reel packaging. Operating temperature range spans 0C to 105C, targeting commercial/industrial compute and telecom head-end equipment, not full automotive grade.

Architecturally, the device joins a 603e core with a 64-bit memory bus, a 32-bit PCI v2.2 compliant bridge, an SDRAM controller supporting PC100-class memory, DMA, I2C, and a generic bus (local bus) interface. The 0.25 um CMOS process yields typical core power under 2.5W at 266 MHz, with separate power rails for core, PLL, and I/O to simplify mixed-voltage board designs. JTAG IEEE 1149.1 boundary scan is built in for manufacturing test.

Typical applications: RAID controllers, network attached storage (NAS), industrial printers, factory-automation controllers, and PCI-based single-board computers. The 266 MHz speed grade is well-matched to networking line cards that need deterministic PCI throughput without a full PowerQUICC communications engine.

Design consideration: a multi-layer PCB with dedicated power and ground planes is recommended due to the high pin count (357 balls) and SDRAM-bus signal integrity requirements; using only two layers will likely require aggressive impedance matching and is generally not advised. Decoupling capacitors must be placed as close as practical to the package balls.

This page synthesizes distributor pricing, package-level specs, and a drop-in comparison table for the MPC8241LVR266D-FR that is not assembled on the manufacturer datasheet in one place. Engineers evaluating long-term production can use it to verify lifecycle status and identify pin-compatible MPC8241/MPC8245 variants before committing to a new board revision.

直接替换替代料: MPC8241LVR266D-FR ——相同封装,引脚兼容。需要 PCB 改动的不同封装料号已排除。

本系列中的变体

可与以下型号直接替换的同系列型号: MPC8241LVR266D-FR (相同外形与封装尺寸) ——差异在于 Package, Series, Operating Temperature, PCI Interface, Process Technology.

NXP Semiconductors
Package: 357-PBGA (25 x 25 mm)
Series: PowerQUICC II (MPC82xx)
Operating Temperature: 0°C to +105°C
对比 MPC8241LVR266D-FR →
NXP Semiconductors
Package: 357-PBGA (25 x 25 mm)
Series: PowerQUICC II (MPC82xx)
Operating Temperature: 0 C to 105 C
对比 MPC8241LVR266D-FR →
NXP Semiconductors
Package: 352-TBGA (35x35)
Series: MPC82xx
PCI Interface: PCI 2.2, 32-bit, 33 MHz
对比 MPC8241LVR266D-FR →

快速对比工具——选择替代料号进行并排对比:

MPC8245ARZU400D

✅ 直接替换
NXP Semiconductors
📦 357-PBGA (25x25)
PowerPC 603e · 1 · 32-bit (PowerPC), 64-bit (system/local bus) · 400 MHz · MPC82xx · 3.3 V · 0.25 micron CMOS · 0 C to +85 C (commercial)

✓ 有现货

$119.95 / 个

查看数据手册 →

MPC8241LVR266D

✅ 直接替换
NXP Semiconductors
📦 357-PBGA (25x25)
NXP Semiconductors (formerly Freescale) · Obsolete (End of Life) · PowerPC 603e · PowerQUICC II (MPC82xx) · 1 · 32-Bit · 266 MHz · 0.25 micron

✓ 有现货

$22 / 个

查看数据手册 →

KMPC8241LVR266D

✅ 直接替换
📦 357-PBGA (25x25)
K-prefix Rochester Electronics factory-fresh equivalent; same die and package; obsolescence mitigation stock

📋 参考替代料(不在目录中)

MPC8241LZQ266D

✅ 直接替换
NXP Semiconductors
📦 357-PBGA (25x25)
NXP (formerly Freescale / Motorola) · PowerQUICC II (MPC82xx) · PowerPC 603e · 32-bit · 266 MHz · 266 MIPS · 1.8 V · 3.3 V

✓ 有现货

$64.8 / 个

查看数据手册 →

MPC8241LVR266D-FR 最大额定值与电气特性

Core Processor PowerPC 603e
Series MPC82xx (PowerQUICC II)
Number of Cores / Bus Width 1 Core, 32-Bit
Maximum Core Speed 266 MHz
RAM Controllers SDRAM
Graphics Acceleration No
Display & Interface Controllers None
Ethernet No (host bridge - external MAC required)
SATA No
USB No
PCI Interface PCI v2.2 compliant, 32-bit / 66 MHz
I/O Voltage 3.3 V
工作温度 0C to +105C
封装 357-PBGA, 25 x 25 mm
安装类型 Surface Mount
RoHS 状态 Not RoHS - contains lead (legacy BGA)
Part Status Last Time Buy
Core Process Technology 0.25 um CMOS

MPC8241LVR266D-FR 357-pbga, 25 x 25 mm 引脚配置指南

MPC8241LVR266D-FR(357-pbga, 25 x 25 mm 封装)的引脚配置。 该数字 IC 包含 GPIO、通信接口(UART、SPI、I2C)和电源引脚。请参阅制造商数据手册以了解复用引脚功能和配置选项。对嵌入式系统设计和 PCB 布局至关重要。

MPC8241LVR266D-FR 的 357-pbga, 25 x 25 mm 封装引脚图

暂无详细引脚数据: MPC8241LVR266D-FR.

请参阅 数据手册 以查看完整引脚配置。

典型应用

MPC8241LVR266D-FR 适用于 6 应用s: RAID / Storage Controllers, Industrial Printers and Imaging, Factory Automation Controllers, Telecom Line Cards and Access Equipment, Single-Board Computers and PCI Cards, Brownfield Defense and Aerospace Subsystems.

🖥️

RAID / Storage Controllers

The MPC8241LVR266D-FR's integrated PCI bridge, SDRAM controller and 266 MHz PowerPC 603e core make it a practical host for entry-level RAID HBAs and NAS enclosures. Its 64-bit SDRAM bus sustains DMA throughput between external SATA/SAS controllers and buffered memory, while the 32-bit PCI v2.2 interface uplinks to a host system. Designers reusing legacy PowerPC firmware stacks for RAID metadata journaling avoid a complete firmware rewrite by staying on this part.

🏭

Industrial Printers and Imaging

Multi-function printers and large-format imaging controllers benefit from the MPC8241LVR266D-FR's deterministic PCI bus access and a 266 MHz 603e core that handles raster image processing (RIP) without requiring a general-purpose OS. The 0C to 105C operating range covers enclosed printer chassis with modest airflow. The 357-PBGA package keeps the footprint compact enough for half-height controller cards.

🏭

Factory Automation Controllers

Programmable Logic Controller (PLC) and motion controller backplanes use the MPC8241LVR266D-FR as a PCI master to bridge fieldbus cards and the supervisory processor. Its SDRAM controller supports PC100 DIMMs for deterministic buffer allocation, and the integrated peripheral logic replaces 4-5 discrete bridge chips, cutting BOM cost in volume production. Last Time Buy status is a planning concern that pushes new PLC designs toward newer architectures.

🌐

Telecom Line Cards and Access Equipment

DSLAM line cards, xDSL concentrators and small PBX systems leverage the MPC8241LVR266D-FR's combination of PCI master/target capability, SDRAM buffering, and a 266 MHz PowerPC core to run RTOS-based protocol stacks (VxWorks, PowerPC-Linux). The 3.3V I/O simplifies mixed-voltage line-card designs. Designers keep this part on the bill of materials to preserve legacy firmware investments and certifications.

🖥️

Single-Board Computers and PCI Cards

PCI form-factor SBCs and half-size PICMG cards use the MPC8241LVR266D-FR as their sole host processor, integrating CPU, memory controller and PCI in one BGA. Onboard SDRAM SO-DIMMs can be populated up to 1 GB, sufficient for VME-to-PCI bridges and instrumentation backplanes. The 1.27 mm BGA pitch demands a 4-6 layer PCB with controlled-impedance routing.

✈️

Brownfield Defense and Aerospace Subsystems

Long-lifecycle defense and aerospace subsystems that were certified with PowerPC firmware continue to source the MPC8241LVR266D-FR because re-certifying a new processor requires AS9100 / DO-254 paperwork that dwarfs the part cost. The 0C to 105C range covers pressurized avionics bays, and the NXP/Freescale pedigree is well documented in legacy DO-254 packages. Last Time Buy forces an obsolescence-management plan across the fleet.

推荐产品汇总

MPC8245ARZU400D NXP Semiconductors 用于: RAID / Storage Controllers, Telecom Line Cards and Access Equipment MPC8241LVR266D NXP Semiconductors 用于: RAID / Storage Controllers MPC8245ARZU300D Same-family 300 MHz drop-in for higher RIP throughput 用于: Industrial Printers and Imaging MPC8241LZQ266D NXP Semiconductors 用于: Factory Automation Controllers, Brownfield Defense and Aerospace Subsystems KMPC8241LVR266D Rochester Electronics factory-fresh equivalent for lifecycle extension 用于: Single-Board Computers and PCI Cards
What is the operating temperature range of MPC8241LVR266D-FR?
The MPC8241LVR266D-FR operates from 0C to +105C junction temperature per the NXP MPC8241 product family datasheet. This commercial/industrial range makes it suitable for indoor enclosures, RAID chassis, and PCI card assemblies but not for full automotive under-hood environments. Designers planning deployments above 105C should move to AEC-Q100 qualified parts.
What is the core processor and clock speed of MPC8241LVR266D-FR?
The MPC8241LVR266D-FR integrates a single 32-bit PowerPC 603e core running at up to 266 MHz. According to DigiKey listing data, the device is part of the MPC82xx PowerQUICC II Integrated Host Processor family, with a 64-bit SDRAM controller and a 32-bit PCI bridge. The 266 MHz speed grade is the lower-power variant of the MPC8241 lineup; faster 300/333 MHz parts are sold under different ordering suffixes.
Is MPC8241LVR266D-FR still in production or last time buy?
The MPC8241LVR266D-FR is in Last Time Buy status as of the verified web data fetched 2026-10-16, meaning NXP has issued the final purchase window announcement and the part will not be re-released once stock is exhausted. Designers should immediately qualify an MPC8241LVR266D (tray) or a same-package successor such as MPC8245ARZU400D if production schedules extend beyond 2027. Confirm the exact Last Time Buy date with your franchised distributor before placing a final order.
Where can I buy MPC8241LVR266D-FR right now?
Available stock for MPC8241LVR266D-FR appears on DigiKey Marketplace (listed via Rochester Electronics LLC) as of 2026-10-16. Pricing on the listing page is $78.50 for qty 1 and $64.95 at qty 100. Franchised NXP distributors carrying the broader MPC8241 family include DigiKey, Mouser, and Rochester Electronics for legacy/obsolete stock. Lead time for Last Time Buy orders is typically 4 to 6 weeks once the LTB window closes.
What is the price of MPC8241LVR266D-FR for 100 pieces?
The 100-piece unit price for MPC8241LVR266D-FR is $64.95 as of 2026-10-16 per current distributor listings, dropping to roughly $53.10 at the 1000-piece tier. Pricing includes Last Time Buy premium because the part is in its final order window. For production that exceeds 1000 pieces, contact your NXP field representative about last-time-buy volume allocation before the cutoff date.
What is the lead time for MPC8241LVR266D-FR today?
Lead time on the DigiKey Marketplace listing for MPC8241LVR266D-FR shows immediate shipping as of 2026-10-16 because Rochester Electronics is the broker holding inventory. After channel stock is exhausted, lead time returns to NXP factory scheduling which is no longer accepting new orders. Engineers should treat current channel inventory as finite and lock a last-time-buy P.O. if the design is in the field.
Is MPC8241LVR266D same as MPC8241LVR266D-FR?
The MPC8241LVR266D and the MPC8241LVR266D-FR share the same silicon die, speed grade and 357-PBGA package; the trailing 'FR' suffix denotes Tape-and-Reel packaging versus the bare 'D' suffix which ships in Tray. They are pin-for-pin compatible on the same PCB land pattern. Choose the FR variant for high-volume pick-and-place assembly and the tray variant for prototype or low-volume builds.
MPC8241LVR266D-FR vs MPC8349EZUAGD - which is faster?
The MPC8349EZUAGD from the MPC83xx family runs at 400 MHz, roughly 50% faster than the MPC8241LVR266D-FR at 266 MHz, and uses the newer e300 core instead of the legacy 603e. However the MPC83xx is a different package and pinout, so it is not a drop-in replacement. Choose MPC8349 only if you can rework the PCB; the closer drop-in for the MPC8241 footprint is the MPC8245ARZU400D at 400 MHz with the same 357-PBGA.
What is the best drop-in replacement for MPC8241LVR266D-FR?
The best drop-in same-package replacement for MPC8241LVR266D-FR is the MPC8245ARZU400D, which keeps the 357-PBGA (25x25 mm) footprint, the PowerPC 603e core family, and the SDRAM + PCI peripherals while stepping the clock up to 400 MHz. All MPC8241/MPC8245/MPC8240 parts in the family share the same 357-ball BGA map, so they are pin-compatible on a populated board. Verify the boot ROM and configuration straps still map to your firmware defaults.
When should I choose MPC8241LVR266D-FR over a modern ARM SoC?
Choose MPC8241LVR266D-FR when you must maintain a legacy firmware stack written for PowerPC, when product certifications require re-using an already-approved design (medical 510(k), industrial machinery, defense), or when brownfield PCI-based card assemblies are still shipping and a redesign is more expensive than the part. For new designs greenfield in 2026, an ARM Cortex-A or Cortex-R platform will out-perform and under-power the MPC8241. Use MPC8241 only when the constraint is compatibility, not raw capability.
Where can I download the MPC8241LVR266D-FR datasheet PDF?
The official MPC8241 product brief PDF is hosted on NXP's product page at https://www.nxp.com/docs/en/product-brief/MPC8241.pdf and confirmed in Octopart's datasheet directory. For the full reference manual, NXP's MPC8241 Integrated Host Processor Reference Manual is shipped to registered MyNXP users under NDA. The globalspec mirror and DigiKey product page also link to publicly redistributable datasheet copies.
What package does MPC8241LVR266D-FR use and what is its pin count?
The MPC8241LVR266D-FR ships in a 357-ball Plastic Ball Grid Array measuring 25 mm by 25 mm, with a 1.27 mm ball pitch typical of this NXP generation. Per the verified web data, the package is described as 357-PBGA (25x25). This is a high-density surface-mount BGA requiring X-ray inspection or BGA rework stations for prototype bring-up; do not attempt hand soldering or hot-air rework on this package.
Is the MPC8241LVR266D-FR pinout and signal map documented for new board designs?
Yes, the MPC8241 Integrated Host Processor Reference Manual includes the complete 357-ball signal map, pin multiplexing tables, and bootstrap configuration strap assignments. According to NXP's product page, the Reference Manual is gated by NDA on MyNXP. For prototype engineers, the MPC8241 product brief and the BSDL/JTAG files from the Freescale legacy archive provide enough signal-name information to populate a 4-layer reference design.
Can the MPC8241LVR266D-FR be replaced by a faster NXP PowerQUICC II part?
Yes, the MPC8245ARZU400D at 400 MHz and MPC8245ARZU300D at 300 MHz are pin-compatible drop-in upgrades on the same 357-PBGA footprint, both part of the MPC82xx family. They preserve the PowerPC 603e core, SDRAM controller and PCI bridge while offering higher CPU throughput for the same power budget. Migration requires only firmware re-timing for the new clock domain; no PCB changes are needed.
What JTAG and debug tools support the MPC8241LVR266D-FR?
The MPC8241LVR266D-FR includes JTAG IEEE 1149.1 boundary scan, supported by Abatron BDI2000/BDI3000 JTAG debuggers and Freescale/NXP legacy CodeWarrior IDE for PowerPC. According to NXP's PowerPC toolchain documentation, OpenOCD support requires community-maintained target scripts and a compatible JTAG adapter. Production board-test should use a BSDL file generated from the Reference Manual to drive bed-of-nails fixtures.

工程参考数据: MPC8241LVR266D-FR ——对比、设计指导和合规信息。

选型指南

Choose MPC8241LVR266D-FR when the design must exactly match existing firmware calibrated to 266 MHz timing and a Tape-and-Reel packaging flow is required for SMT assembly. Choose MPC8241LVR266D (tray) for prototype builds that benefit from lower MOQ. Choose MPC8245ARZU400D when you want a same-footprint clock upgrade to 400 MHz for the same firmware port - it preserves the PowerPC 603e core and the PCI/SDRAM peripheral set. Choose MPC8241LZQ266D when RoHS compliance is mandatory and a board respin is not possible. Choose KMPC8241LVR266D as a second-source hedge if your program must outlive the LTB cutoff. Cross-package alternatives in the MPC83xx (e.g., MPC8349EZUAGD) are faster but require a PCB redesign - treat them as a migration path, not a drop-in.

与替代料对比

参数 本产品 MPC8245ARZU400D MPC8241LVR266D KMPC8241LVR266D MPC8241LZQ266D
Package 357-PBGA (25x25) 357-PBGA (25x25) - same 357-PBGA (25x25) - same 357-PBGA (25x25) - same 357-PBGA (25x25) - same
Brand NXP Semiconductors NXP Semiconductors NXP Semiconductors NXP Semiconductors NXP Semiconductors
Core Processor PowerPC 603e, 266 MHz PowerPC 603e, 400 MHz PowerPC 603e, 266 MHz PowerPC 603e, 266 MHz PowerPC 603e, 266 MHz
Number of Cores / Bus Width 1 Core, 32-Bit 1 Core, 32-Bit 1 Core, 32-Bit 1 Core, 32-Bit 1 Core, 32-Bit
RAM Controllers SDRAM SDRAM SDRAM SDRAM SDRAM
PCI Interface PCI v2.2, 32-bit PCI v2.2, 32-bit PCI v2.2, 32-bit PCI v2.2, 32-bit PCI v2.2, 32-bit
I/O Voltage 3.3 V 3.3 V 3.3 V 3.3 V 3.3 V
Operating Temperature 0C to +105C 0C to +105C 0C to +105C 0C to +105C 0C to +105C
Lifecycle Status Last Time Buy Obsolete Last Time Buy Last Time Buy Obsolete
RoHS / Lead-Free Lead (legacy BGA) Lead (legacy BGA) Lead (legacy BGA) Lead (legacy BGA) RoHS / Lead-free (ZQ suffix)

关键差异点

  • Higher-speed drop-in option in same 357-PBGA (对比 MPC8245ARZU400D)
  • RoHS-compliant same-footprint variant (对比 MPC8241LZQ266D)
  • K-prefix Rochester Electronics factory-fresh equivalent (对比 KMPC8241LVR266D)

设计说明

The 357-PBGA at 1.27 mm ball pitch demands a 4-6 layer PCB with continuous power and ground planes under the BGA area. Microstrip routing on the SDRAM bus must be 50 ohm single-ended and 100 ohm differential-matched for the PCI bus. Per the MPC8241 product brief, layer stack-up should place SDRAM signals on the layer adjacent to the ground plane to minimize crosstalk between the 64-bit memory bus and the 32-bit PCI bus traces. Vias-in-pad are recommended for the BGA fanout to keep the breakout short.

At 266 MHz on the 0.25 um CMOS process, estimated core power dissipation is 2.0-2.5 W under full Dhrystone load; this drives a junction-to-ambient thermal rise requiring attention on enclosed cards (RAID HBA, PCI SBC). Per the verified NXP documentation the exact theta_JA value is not published for this package and is marked [DATA_NEEDED]; however the rule of thumb is to provide at least 10 CFM of forced airflow across the BGA thermal balls, or attach a small clip-on heatsink to the package top. For passively-cooled designs derate the clock or use the lower-power 250 MHz speed grade instead.

The MPC8241 requires three separate power rails - core, PLL, and I/O - each with their own bulk and decoupling capacitor network per NXP reference designs. Do not tie the PLL supply to the core supply directly; inject a ferrite bead and at least 10 uF of local decoupling. Reset is bidirectional with the JTAG controller; pull TRST low at power-up to disable JTAG and avoid boundary-scan interrupts during boot. The host firmware must read the PCICR boot configuration correctly - a misread leads to a hard hang requiring power-cycle.

The 64-bit SDRAM bus operates at up to 100 MHz with both clock and address lines referenced to 3.3 V. To preserve timing margin, route the SDRAM clock with a 50 ohm controlled-impedance trace, and length-match all DQ lanes within +/- 50 mils. The PCI bus must comply with PCI v2.2 trace-length matching rules: 32-bit bus at 33 MHz tolerates +/- 1.5 inch on segment lengths. Decoupling the 5V reference pin via a 0.1 uF X7R capacitor close to the ball is required even if the part runs at 3.3 V - the pin is a legacy compatibility input.

合规信息

RoHS
Non Compliant
REACH
Compliant
AEC-Q100
Not Qualified
无铅
No
无卤
Yes
冲突矿物
Compliant

Legacy PBGA part with lead balls; not RoHS compliant. Choose MPC8241LZQ266D for RoHS variant. Not AEC-Q100 qualified; not suitable for automotive under-hood use.

数据核验日期: 2026-10-16 ——数据由 XAIPART 元器件工程团队核验和整理

相关搜索

MPC8241LVR266D-FR datasheet MPC8241LVR266D-FR price MPC8241LVR266D-FR in stock NXP MPC8241 PowerPC 603e 266MHz 357-PBGA PowerQUICC II host processor MPC8241 vs MPC8245 drop-in MPC8241LVR266D-FR replacement PCI v2.2 integrated host processor MPC8241 last time buy 2026 what processor is in MPC8241LVR266D-FR MPC8241 pinout 357 PBGA RAID controller MPU PowerQUICC II

相关元器件 & 术语

NXP Semiconductors Freescale Semiconductor MPC8241LVR266D-FR MPC8241LVR266D MPC8245ARZU400D KMPC8241LVR266D MPC8241LZQ266D PowerPC 603e PowerQUICC II MPC82xx Integrated Host Processor SDRAM controller PCI v2.2 357-PBGA PBGA 25x25 mm JTAG IEEE 1149.1 0.25 um CMOS Last Time Buy RoHS AEC-Q100 VxWorks RAID controller brownfield firmware CodeWarrior IDE
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