MPC8241LVR266D-FR - 266MHz PowerPC 603e Host Processor | NXP
Référence : MPC8241LVR266D-FR ⚠ Dernier achat| Qté | Prix unitaire | Total |
|---|---|---|
| 1 | $78.5 | $78,50 |
| 10 | $72.4 | $724,00 |
| 100 | $64.95 | $6 495,00 |
| 500 | $58.2 | $29 100,00 |
| 1 000 | $53.1 | $53 100,00 |
MPC8241LVR266D-FR Présentation
An Integrated Host Processor (IHP) is a high-integration MPU that combines a CPU core with memory and I/O controllers in one package - historically used to replace a CPU, northbridge, southbridge and peripheral controller combo with a single device. In the broader product taxonomy, the MPC8241 sits within PowerPC 603e -> 32-bit embedded MPU -> microprocessor -> IC -> semiconductor. Freescale's MPC82xx PowerQUICC II family is the architecture family; the 824x line focuses on host-bridge integration while the 826x line adds communications peripherals.
Key headline parameters for the MPC8241LVR266D-FR variant: 266 MHz maximum core speed, 1 core / 32-bit bus width, integrated SDRAM controller with PCI bridge, 3.3V I/O, and a 357-ball plastic BGA at 25x25 mm. The 'LVR' suffix denotes the lower-voltage core/IO revision and the 'FR' suffix denotes Tape-and-Reel packaging. Operating temperature range spans 0C to 105C, targeting commercial/industrial compute and telecom head-end equipment, not full automotive grade.
Architecturally, the device joins a 603e core with a 64-bit memory bus, a 32-bit PCI v2.2 compliant bridge, an SDRAM controller supporting PC100-class memory, DMA, I2C, and a generic bus (local bus) interface. The 0.25 um CMOS process yields typical core power under 2.5W at 266 MHz, with separate power rails for core, PLL, and I/O to simplify mixed-voltage board designs. JTAG IEEE 1149.1 boundary scan is built in for manufacturing test.
Typical applications: RAID controllers, network attached storage (NAS), industrial printers, factory-automation controllers, and PCI-based single-board computers. The 266 MHz speed grade is well-matched to networking line cards that need deterministic PCI throughput without a full PowerQUICC communications engine.
Design consideration: a multi-layer PCB with dedicated power and ground planes is recommended due to the high pin count (357 balls) and SDRAM-bus signal integrity requirements; using only two layers will likely require aggressive impedance matching and is generally not advised. Decoupling capacitors must be placed as close as practical to the package balls.
This page synthesizes distributor pricing, package-level specs, and a drop-in comparison table for the MPC8241LVR266D-FR that is not assembled on the manufacturer datasheet in one place. Engineers evaluating long-term production can use it to verify lifecycle status and identify pin-compatible MPC8241/MPC8245 variants before committing to a new board revision.
Alternatives de remplacement direct pour MPC8241LVR266D-FR — même boîtier, compatible broche à broche. Les références à boîtier différent nécessitant une retouche du PCB sont exclues.
Variantes de cette série
Modèles de la même série directement compatibles avec MPC8241LVR266D-FR (même facteur de forme et même empreinte) — différant par Package, Series, Operating Temperature, PCI Interface, Process Technology.
Outil de comparaison rapide — sélectionnez des références alternatives pour une comparaison côte à côte :
MPC8245ARZU400D
✅ Remplacement direct✓ En stock
$119.95 / unité
Voir la fiche technique →MPC8241LVR266D
✅ Remplacement direct✓ En stock
$22 / unité
Voir la fiche technique →KMPC8241LVR266D
✅ Remplacement direct📋 Alternative de référence (hors catalogue)
MPC8241LZQ266D
✅ Remplacement direct✓ En stock
$64.8 / unité
Voir la fiche technique →MPC8241LVR266D-FR Valeurs maximales et caractéristiques électriques
| Core Processor | PowerPC 603e |
| Series | MPC82xx (PowerQUICC II) |
| Number of Cores / Bus Width | 1 Core, 32-Bit |
| Maximum Core Speed | 266 MHz |
| RAM Controllers | SDRAM |
| Graphics Acceleration | No |
| Display & Interface Controllers | None |
| Ethernet | No (host bridge - external MAC required) |
| SATA | No |
| USB | No |
| PCI Interface | PCI v2.2 compliant, 32-bit / 66 MHz |
| I/O Voltage | 3.3 V |
| Température de fonctionnement | 0C to +105C |
| Boîtier | 357-PBGA, 25 x 25 mm |
| Type de montage | Surface Mount |
| Statut RoHS | Not RoHS - contains lead (legacy BGA) |
| Part Status | Last Time Buy |
| Core Process Technology | 0.25 um CMOS |
Guide de configuration des broches du MPC8241LVR266D-FR 357-pbga, 25 x 25 mm
Configuration des broches du MPC8241LVR266D-FR (boîtier 357-pbga, 25 x 25 mm). Ce circuit intégré numérique comprend des GPIO, des interfaces de communication (UART, SPI, I2C) et des broches d'alimentation. Consultez la fiche technique du fabricant pour les fonctions alternatives des broches et les options de configuration. Indispensable pour la conception de systèmes embarqués et la conception de circuits imprimés.
Aucune donnée de brochage détaillée disponible pour MPC8241LVR266D-FR.
Consultez la fiche technique pour la configuration complète des broches.
Applications typiques
MPC8241LVR266D-FR convient pour 6 applications: RAID / Storage Controllers, Industrial Printers and Imaging, Factory Automation Controllers, Telecom Line Cards and Access Equipment, Single-Board Computers and PCI Cards, Brownfield Defense and Aerospace Subsystems.
RAID / Storage Controllers
The MPC8241LVR266D-FR's integrated PCI bridge, SDRAM controller and 266 MHz PowerPC 603e core make it a practical host for entry-level RAID HBAs and NAS enclosures. Its 64-bit SDRAM bus sustains DMA throughput between external SATA/SAS controllers and buffered memory, while the 32-bit PCI v2.2 interface uplinks to a host system. Designers reusing legacy PowerPC firmware stacks for RAID metadata journaling avoid a complete firmware rewrite by staying on this part.
Recommandé
Industrial Printers and Imaging
Multi-function printers and large-format imaging controllers benefit from the MPC8241LVR266D-FR's deterministic PCI bus access and a 266 MHz 603e core that handles raster image processing (RIP) without requiring a general-purpose OS. The 0C to 105C operating range covers enclosed printer chassis with modest airflow. The 357-PBGA package keeps the footprint compact enough for half-height controller cards.
Recommandé
Factory Automation Controllers
Programmable Logic Controller (PLC) and motion controller backplanes use the MPC8241LVR266D-FR as a PCI master to bridge fieldbus cards and the supervisory processor. Its SDRAM controller supports PC100 DIMMs for deterministic buffer allocation, and the integrated peripheral logic replaces 4-5 discrete bridge chips, cutting BOM cost in volume production. Last Time Buy status is a planning concern that pushes new PLC designs toward newer architectures.
Recommandé
Telecom Line Cards and Access Equipment
DSLAM line cards, xDSL concentrators and small PBX systems leverage the MPC8241LVR266D-FR's combination of PCI master/target capability, SDRAM buffering, and a 266 MHz PowerPC core to run RTOS-based protocol stacks (VxWorks, PowerPC-Linux). The 3.3V I/O simplifies mixed-voltage line-card designs. Designers keep this part on the bill of materials to preserve legacy firmware investments and certifications.
Recommandé
Single-Board Computers and PCI Cards
PCI form-factor SBCs and half-size PICMG cards use the MPC8241LVR266D-FR as their sole host processor, integrating CPU, memory controller and PCI in one BGA. Onboard SDRAM SO-DIMMs can be populated up to 1 GB, sufficient for VME-to-PCI bridges and instrumentation backplanes. The 1.27 mm BGA pitch demands a 4-6 layer PCB with controlled-impedance routing.
Recommandé
Brownfield Defense and Aerospace Subsystems
Long-lifecycle defense and aerospace subsystems that were certified with PowerPC firmware continue to source the MPC8241LVR266D-FR because re-certifying a new processor requires AS9100 / DO-254 paperwork that dwarfs the part cost. The 0C to 105C range covers pressurized avionics bays, and the NXP/Freescale pedigree is well documented in legacy DO-254 packages. Last Time Buy forces an obsolescence-management plan across the fleet.
Recommandé
Récapitulatif des produits recommandés
Données de référence d'ingénierie pour MPC8241LVR266D-FR — comparaison, recommandations de conception et informations de conformité.
Guide de sélection
Comparaison avec les alternatives
| Paramètre | Ce produit | MPC8245ARZU400D | MPC8241LVR266D | KMPC8241LVR266D | MPC8241LZQ266D |
|---|---|---|---|---|---|
| Package | 357-PBGA (25x25) | 357-PBGA (25x25) - same | 357-PBGA (25x25) - same | 357-PBGA (25x25) - same | 357-PBGA (25x25) - same |
| Brand | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors |
| Core Processor | PowerPC 603e, 266 MHz | PowerPC 603e, 400 MHz | PowerPC 603e, 266 MHz | PowerPC 603e, 266 MHz | PowerPC 603e, 266 MHz |
| Number of Cores / Bus Width | 1 Core, 32-Bit | 1 Core, 32-Bit | 1 Core, 32-Bit | 1 Core, 32-Bit | 1 Core, 32-Bit |
| RAM Controllers | SDRAM | SDRAM | SDRAM | SDRAM | SDRAM |
| PCI Interface | PCI v2.2, 32-bit | PCI v2.2, 32-bit | PCI v2.2, 32-bit | PCI v2.2, 32-bit | PCI v2.2, 32-bit |
| I/O Voltage | 3.3 V | 3.3 V | 3.3 V | 3.3 V | 3.3 V |
| Operating Temperature | 0C to +105C | 0C to +105C | 0C to +105C | 0C to +105C | 0C to +105C |
| Lifecycle Status | Last Time Buy | Obsolete | Last Time Buy | Last Time Buy | Obsolete |
| RoHS / Lead-Free | Lead (legacy BGA) | Lead (legacy BGA) | Lead (legacy BGA) | Lead (legacy BGA) | RoHS / Lead-free (ZQ suffix) |
Principaux différenciateurs
- Higher-speed drop-in option in same 357-PBGA (vs MPC8245ARZU400D)
- RoHS-compliant same-footprint variant (vs MPC8241LZQ266D)
- K-prefix Rochester Electronics factory-fresh equivalent (vs KMPC8241LVR266D)
Notes de conception
The 357-PBGA at 1.27 mm ball pitch demands a 4-6 layer PCB with continuous power and ground planes under the BGA area. Microstrip routing on the SDRAM bus must be 50 ohm single-ended and 100 ohm differential-matched for the PCI bus. Per the MPC8241 product brief, layer stack-up should place SDRAM signals on the layer adjacent to the ground plane to minimize crosstalk between the 64-bit memory bus and the 32-bit PCI bus traces. Vias-in-pad are recommended for the BGA fanout to keep the breakout short.
At 266 MHz on the 0.25 um CMOS process, estimated core power dissipation is 2.0-2.5 W under full Dhrystone load; this drives a junction-to-ambient thermal rise requiring attention on enclosed cards (RAID HBA, PCI SBC). Per the verified NXP documentation the exact theta_JA value is not published for this package and is marked [DATA_NEEDED]; however the rule of thumb is to provide at least 10 CFM of forced airflow across the BGA thermal balls, or attach a small clip-on heatsink to the package top. For passively-cooled designs derate the clock or use the lower-power 250 MHz speed grade instead.
The MPC8241 requires three separate power rails - core, PLL, and I/O - each with their own bulk and decoupling capacitor network per NXP reference designs. Do not tie the PLL supply to the core supply directly; inject a ferrite bead and at least 10 uF of local decoupling. Reset is bidirectional with the JTAG controller; pull TRST low at power-up to disable JTAG and avoid boundary-scan interrupts during boot. The host firmware must read the PCICR boot configuration correctly - a misread leads to a hard hang requiring power-cycle.
The 64-bit SDRAM bus operates at up to 100 MHz with both clock and address lines referenced to 3.3 V. To preserve timing margin, route the SDRAM clock with a 50 ohm controlled-impedance trace, and length-match all DQ lanes within +/- 50 mils. The PCI bus must comply with PCI v2.2 trace-length matching rules: 32-bit bus at 33 MHz tolerates +/- 1.5 inch on segment lengths. Decoupling the 5V reference pin via a 0.1 uF X7R capacitor close to the ball is required even if the part runs at 3.3 V - the pin is a legacy compatibility input.
Informations de conformité
Legacy PBGA part with lead balls; not RoHS compliant. Choose MPC8241LZQ266D for RoHS variant. Not AEC-Q100 qualified; not suitable for automotive under-hood use.
