MPC8266AZUPJDC - PowerPC G2 MPU 300MHz | NXP 480-TBGA
料号： MPC8266AZUPJDC ✓ 量产中| 数量 | 单价 | 小计 |
|---|---|---|
| 1 | $255.63 | $255.63 |
| 10 | $230.07 | $2,300.70 |
| 100 | $204.5 | $20,450.00 |
| 500 | $178.94 | $89,470.00 |
| 1,000 | $153.38 | $153,380.00 |
MPC8266AZUPJDC 概述
A microprocessor (MPU) is an integrated circuit that contains a complete central processing unit, cache, memory management, and external bus logic on a single die. MPUs sit at the top of the embedded processor hierarchy above microcontrollers (MCUs): an MPU typically runs at higher clock rates, uses external DRAM/ROM, and relies on an external MMU, while an MCU integrates flash, RAM, and peripherals on-chip. The MPC82xx family specifically merges a PowerPC core with the CPM (Communications Processor Module), giving designers both a programmable compute engine and a hardware-accelerated communications engine on the same silicon. Within NXP's portfolio, MPC82xx sits between the older MPC8xx and the later MPC83xx/PowerQUICC III families.
Key features of the MPC8266AZUPJDC include a 32-bit PowerPC G2 core, a 300 MHz core clock, integrated CPM with multiple serial controllers (FCCs, SCCs, MCCs), 32-bit address and data buses, and a 480-ball TBGA surface-mount package. The G2 core implements the PowerPC UISA (User Instruction Set Architecture) with hardware multiply/divide and supports both user and supervisor modes. Power management features include doze, nap, sleep, and deep-sleep modes for low-power telecom operation.
The CPM subsystem accelerates ATM, HDLC, Ethernet (10/100), and TDM channels without loading the core, which is the architectural advantage that made the PowerQUICC II family dominant in legacy routers, DSLAMs, base stations, and PBX systems during the early 2000s. The 480-TBGA package exposes the full 32-bit external bus plus dedicated CPM I/O pins, enabling connection to SDRAM, Flash, PCI, and a wide variety of PHY/SERDES devices.
Typical applications for the MPC8266AZUPJDC include enterprise routers, DSLAM line cards, ATM switches, wireless base station controllers, and industrial control platforms that need both deterministic serial handling and a programmable PowerPC host. Designers should pair it with a 60x-compatible SDRAM controller, a 32-bit Flash/ROM bank, and an external PHY for Ethernet or TDM lines.
When designing with this part, pay close attention to the 480-TBGA PCB layout: the 1.27 mm ball pitch requires microvia or via-in-pad technology for reliable assembly, and the thermal pad must be soldered to a sufficiently large ground plane to keep the junction temperature below 105 C in convection-cooled enclosures.
This page synthesizes distributor pricing, drop-in alternatives, and practical design notes not found in the manufacturer datasheet alone.
直接替换替代料： MPC8266AZUPJDC ——相同封装，引脚兼容。需要 PCB 改动的不同封装料号已排除。
本系列中的变体
可与以下型号直接替换的同系列型号： MPC8266AZUPJDC （相同外形与封装尺寸） ——差异在于 Manufacturer, Mounting Type, Operating Temperature, Package, Series.
快速对比工具——选择替代料号进行并排对比：
MPC8260AZUPJDC
✅ 直接替换📋 参考替代料（不在目录中）
MPC8265AZUPJDC
✅ 直接替换✓ 有现货
$172 / 个
查看数据手册 →MPC8275AZUPJDC
✅ 直接替换📋 参考替代料（不在目录中）
MPC8280AZUPJDC
✅ 直接替换📋 参考替代料（不在目录中）
MPC8266AZUPJDC 最大额定值与电气特性
| Manufacturer | NXP USA Inc. |
| Series | MPC82xx (PowerQUICC II) |
| Core Processor | PowerPC G2 |
| Core Count | 1 |
| 数据总线宽度 | 32-Bit |
| Core Clock Speed | 300 MHz |
| 封装 | 480-TBGA (37.5 mm x 37.5 mm) |
| 安装类型 | Surface Mount (BGA) |
| Ball Pitch | 1.27 mm |
| 工作温度 | 0C to +105C |
| Communications Module | CPM (FCC, SCC, MCC, SMC, SPI, I2C) |
| External Bus | 32-bit address / 32-bit data, 60x bus |
| Power Modes | Doze, Nap, Sleep, Deep-Sleep |
| Lead-Free | Yes (ball finish per NXP BGA spec) |
MPC8266AZUPJDC 480-tbga (37.5 mm x 37.5 mm) 引脚配置指南
MPC8266AZUPJDC（480-tbga (37.5 mm x 37.5 mm) 封装）的引脚配置。 该数字 IC 包含 GPIO、通信接口（UART、SPI、I2C）和电源引脚。请参阅制造商数据手册以了解复用引脚功能和配置选项。对嵌入式系统设计和 PCB 布局至关重要。
暂无详细引脚数据： MPC8266AZUPJDC.
请参阅 数据手册 以查看完整引脚配置。
典型应用
MPC8266AZUPJDC 适用于 7 应用s: Enterprise Router Line Card, DSLAM Line Card Controller, Wireless Base Station Controller, Industrial Control Platform, ATM Switch Fabric Controller, PBX and VoIP Gateway, Legacy Network Appliance Sustaining.
Enterprise Router Line Card
The MPC8266AZUPJDC's 300 MHz PowerPC G2 core combined with the on-chip CPM (Communications Processor Module) makes it well suited for enterprise router line cards that must terminate multiple WAN links while forwarding packets. In a typical design, the 32-bit 60x external bus connects to 64 to 128 MB of SDRAM for routing tables, while the FCC ports drive 10/100 Ethernet PHYs and the SCCs handle TDM/E1 links. The CPM offloads HDLC and ATM segmentation so the G2 core can focus on routing, NAT, and ACL processing. Designers can pin-compatible substitute MPC8265 or MPC8260 variants in the same 480-TBGA footprint when cost or power tuning is needed.
推荐
DSLAM Line Card Controller
DSL Access Multiplexer (DSLAM) line cards use the MPC8266AZUPJDC to aggregate ATM or PTM traffic from dozens of subscriber lines into a single uplink. The part's multiple FCCs and SCCs map cleanly to per-subscriber DSL PHY interfaces, while the 300 MHz G2 core handles PPPoE, encapsulation, and traffic shaping. The 480-TBGA package exposes the full 32-bit 60x bus for direct connection to SDRAM and Flash, enabling deterministic boot and high-throughput DMA. Power-down modes (doze/nap/sleep) let DSLAM line cards idle cleanly when subscriber ports are unused, reducing overall chassis power.
推荐
Wireless Base Station Controller
Wireless base station controllers historically relied on the MPC8266AZUPJDC for their combination of PowerPC compute and a robust CPM. The G2 core runs the Layer 2/3 protocol stack (e.g., Abis, lub) while the CPM terminates E1/T1 trunks back to the BSC. At 300 MHz the part delivers sufficient headroom for 2G/3G control-plane processing; for 4G/LTE upgrades, designers typically migrate to QorIQ. The 480-TBGA 37.5 mm x 37.5 mm footprint and 0 to 105 C operating range fit standard BSC shelf hardware with telecom-grade thermal envelopes.
推荐
Industrial Control Platform
The MPC8266AZUPJDC fits industrial control platforms that need deterministic serial handling alongside general-purpose compute. The CPM's SCCs and MCCs drive RS-485, Profibus, or CAN bridges with hardware acceleration, freeing the 300 MHz core for PLC ladder logic, HMI rendering, or SCADA protocol stacks. The 32-bit 60x bus supports SDRAM for runtime data plus a boot Flash for deterministic startup. Industrial designers value the long lifecycle and stable firmware ecosystem of the PowerQUICC II family compared to faster-changing MCU platforms.
推荐
ATM Switch Fabric Controller
ATM switch fabrics of the early 2000s used the MPC8266AZUPJDC as the control-plane processor because its CPM natively terminates AAL1/AAL2/AAL5 segmentation. The part's FCCs connect directly to SAR (Segmentation And Reassembly) ASICs over Utopia Level 2, while the G2 core runs the switch's signalling and management stack. The 480-TBGA package provides enough I/O for both fabric control and uplink Ethernet. Although ATM is now legacy, sustaining designs still require the MPC8266 family for in-field ATM switches at telco central offices.
推荐
PBX and VoIP Gateway
Enterprise PBX systems and VoIP gateways leverage the MPC8266AZUPJDC to bridge TDM (T1/E1) trunks and packet networks. The CPM handles HDLC on TDM trunks while the G2 core runs SIP/H.323 stacks and DSP control. At 300 MHz the part supports hundreds of concurrent VoIP channels when paired with external DSPs. The 480-TBGA 37.5 mm x 37.5 mm package allows the PBX mainboard to fit a single-slot 6U form factor, and the deep-sleep mode lets idle PBX cards draw minimal standby current during off-hours.
推荐
Legacy Network Appliance Sustaining
Many deployed firewalls, IDS/IPS appliances, and VPN concentrators in field service use the MPC8266AZUPJDC. Sustaining-engineering teams standardize on the part because the firmware, bootloader (U-Boot), and Linux BSPs are mature and well understood. The 300 MHz PowerPC G2 core runs embedded Linux distributions and the CPM handles packet classification. Because redesigning these long-lifecycle appliances is rarely justified, the MPC8266AZUPJDC remains in active production to support the installed base through 2030 and beyond.
推荐
推荐产品汇总
工程参考数据： MPC8266AZUPJDC ——对比、设计指导和合规信息。
选型指南
与替代料对比
| 参数 | 本产品 | MPC8260AZUPJDC | MPC8265AZUPJDC | MPC8275AZUPJDC | MPC8280AZUPJDC |
|---|---|---|---|---|---|
| Brand | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors |
| Package | 480-TBGA (37.5x37.5) | 480-TBGA (37.5x37.5) - same | 480-TBGA (37.5x37.5) - same | 480-TBGA (37.5x37.5) - same | 480-TBGA (37.5x37.5) - same |
| Core | PowerPC G2 | PowerPC G2 | PowerPC G2 | PowerPC G2_LE | PowerPC G2 |
| CPM Channels | FCC/SCC/MCC full set | FCC/SCC/MCC full set | FCC/SCC/MCC full set | FCC/SCC/MCC full set | FCC/SCC/MCC full set |
| External Bus Width | 32-bit (60x) | 32-bit (60x) | 32-bit (60x) | 32-bit (60x) | 32-bit (60x) |
| Operating Temperature | 0C to +105C | 0C to +105C | 0C to +105C | 0C to +105C | 0C to +105C |
| Target Application | Networking, telecom, industrial | Networking, telecom, industrial | Networking, telecom, industrial | Networking, telecom, industrial | Networking, telecom, industrial |
关键差异点
- Higher core clock than the MPC8260AZUPJDC （对比 MPC8260AZUPJDC)
- G2 core vs lower-power G2_LE （对比 MPC8275AZUPJDC)
- Mature PowerQUICC II firmware ecosystem （对比 MPC8245LZU300D)
设计说明
The 480-TBGA package has a 1.27 mm ball pitch on a 37.5 mm x 37.5 mm substrate. For reliable assembly, use microvia or via-in-pad PCB technology with ENIG or OSP surface finish. Assign at least one full ground plane directly beneath the BGA and stitch the thermal balls to that plane to keep junction temperature below 105 C in convection-cooled enclosures.
The MPC8266AZUPJDC requires separate core and I/O supply rails, typically 1.8 V core and 3.3 V I/O. Place 10 uF bulk plus 0.1 uF decoupling capacitors within 5 mm of each power ball group. Use a PLL supply filter network as specified in the NXP application note to minimize jitter on the 300 MHz core clock.
Estimated: at 1.8 V core and typical PowerQUICC II activity, the die dissipates roughly 2 to 3 W in active mode. The 480-TBGA thermal resistance is approximately 15 C/W with a properly stitched ground plane, giving a 45 C junction rise above ambient. Ensure chassis airflow keeps ambient below 60 C for telecom-grade reliability margins.
The 32-bit 60x external bus runs at the full 300 MHz core clock divided by bus ratios. Trace length matching of +/- 5 mils on the address and data buses is required; use series damping resistors on clock and strobe lines. Reference NXP AN2322 for the recommended SDRAM topology and termination scheme.
Do not confuse 'AZUPJDC' with 'AZU' or 'I' speed grades - the 'P' suffix indicates a specific CPM revision and the 'JDC' indicates the 480-TBGA package. Always order the exact NXP part number from franchised distributors to avoid counterfeit risk of supply. Verify the JTAG BSDL model against your silicon revision before board bring-up.
合规信息
RoHS and REACH status should be confirmed from the NXP product page; lead-free ball finish is standard for 480-TBGA. AEC-Q100 not applicable - this is an MPU for telecom/industrial, not automotive.
