MPC8265AZUPJDC - PowerQUICC II HIP4C MPU, 300MHz, TBGA-480
MPN: MPC8265AZUPJDC ⚠ Last Time Buy| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $230.84 | $230.84 |
| 10 | $220.3 | $2,203.00 |
| 100 | $205.1 | $20,510.00 |
| 500 | $188.5 | $94,250.00 |
| 1,000 | $172 | $172,000.00 |
MPC8265AZUPJDC Overview
What is a PowerQUICC II HIP4C processor? The PowerQUICC II family is an integrated communications processor line from NXP (formerly Freescale / Motorola) that combines a PowerPC CPU core with a separate RISC-based Communications Processor Module (CPM). The CPM handles serial protocols (Ethernet, ATM, HDLC, UART, SPI, I2C, USB) autonomously, offloading the CPU to maximise throughput in routers, switches, and base stations. The HIP4C variant of PowerQUICC II specifically targets high-performance networking designs requiring up to four Fast Ethernet or similar serial interfaces.
Key features of the MPC8265AZUPJDC include 16K instruction / 16K data L1 caches, a 32-bit PCI interface, support for up to four 10/100 Fast Ethernet MACs, an SDRAM/DDR memory controller, and integrated DMA channels. The CPM supports multiple protocol engines, allowing simultaneous operation of Ethernet, ATM, and HDLC channels. The chip is fabricated on a 0.25 um CMOS process and is part of NXP's MPC82xx series of integrated communications processors.
Architecturally, the MPC8265AZUPJDC separates real-time communication tasks (CPM side) from control-plane processing (CPU side), enabling deterministic protocol handling. Memory controllers include DRAM, SDRAM, Flash/ROM, and bus arbitration for external peripherals. Operating temperature range spans 0C to +105C for the JDC commercial extension grade, suitable for use in controlled-environment networking equipment.
Typical applications include high-end routers, ATM switches, DSLAMs, base-station controllers, industrial protocol gateways, and remote-access concentrators. The wide protocol support makes it well-suited for legacy telecom infrastructure requiring multi-protocol bridging.
Design considerations for the MPC8265AZUPJDC include proper thermal management via the TBGA substrate, careful signal-integrity routing for the 64-bit external bus, and decoupling for the 1.8 V internal core rail. Note: the datasheet indicates this part is Not For New Designs, so it is intended for maintenance of existing systems rather than new platform development.
Drop-in alternatives for MPC8265AZUPJDC — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Variants in this series
Same-series models that are drop-in compatible with MPC8265AZUPJDC (same form factor and footprint) — differing in Process Technology, Series, Manufacturer, Number of Cores, Operating Temperature.
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No drop-in alternatives available for this product.
Request AlternativesMPC8265AZUPJDC Maximum Ratings & Electrical Characteristics
| Manufacturer | NXP Semiconductors |
| Series | MPC82xx (PowerQUICC II HIP4C) |
| Core Processor | PowerPC G2 |
| Number of Cores / Bus Width | 1 Core, 32-Bit |
| Clock Speed (CPU) | 300 MHz |
| Co-Processor / DSP | Communications; RISC CPM |
| Supply Voltage (I/O) | 3.3 V |
| Internal Core Voltage | 1.8 V |
| Package | 480-TBGA (37.5 x 37.5 mm, 1.27 mm pitch) |
| Mounting Type | Surface Mount |
| RAM Controllers | DRAM, SDRAM |
| Graphics Acceleration | No |
| Ethernet | Up to 4 x 10/100 Fast Ethernet MACs via CPM |
| PCI Interface | 32-bit, 66 MHz |
| Process Technology | 0.25 um CMOS |
| Operating Temperature | 0C to +105C (JDC suffix: commercial extended) |
| Part Status | Not For New Designs (NFND) |
MPC8265AZUPJDC 480-tbga (37.5 x 37.5 mm, 1.27 mm pitch) Pin Configuration Guide
Pin configuration for MPC8265AZUPJDC (480-tbga (37.5 x 37.5 mm, 1.27 mm pitch) package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for MPC8265AZUPJDC.
Refer to the datasheet for full pin configuration.
Typical Applications
MPC8265AZUPJDC is suitable for 6 applications: High-End Enterprise Routers, ATM / Multi-Protocol Switching Equipment, DSLAM and Central-Office Line Cards, Industrial Protocol Gateways, Wireless Base Station Controllers, Legacy Telecom / Embedded Linux Systems.
High-End Enterprise Routers
The MPC8265AZUPJDC fits high-end enterprise routing because its PowerPC G2 CPU at 300 MHz and 10/100 Ethernet MACs deliver the throughput required for WAN aggregation and packet classification, while the integrated CPM offloads protocol handling (HDLC, PPP, Ethernet) from the main CPU. Engineers typically pair it with external PHY transceivers and use the SDRAM controller for routing-table storage; the 0C to +105C temperature grade supports rack-mount chassis. Alternative next-generation options for new designs include the QorIQ P1020, but for maintaining legacy routing platforms the MPC8265 remains the recommended lifecycle part.
Recommended
ATM / Multi-Protocol Switching Equipment
ATM switches and multi-protocol access concentrators benefit from the MPC8265AZUPJDC's CPM, which handles ATM SAR segmentation, AAL2/AAL5 protocol framing, and HDLC encapsulation in parallel with Ethernet channels. A 300 MHz PowerPC G2 core leaves sufficient headroom for QoS scheduling and routing table lookup, while the integrated DRAM/SDRAM controller reduces external component count. Designers use 3.3 V I/O for level compatibility with legacy telecom backplanes. The TBGA-480 substrate also eases ground-bounce management for backplane signals.
Recommended
DSLAM and Central-Office Line Cards
DSL Access Multiplexers (DSLAMs) often deploy the MPC8265AZUPJDC on the uplink line card for upstream traffic aggregation, where four Fast Ethernet MACs combine multiple DSL link-layer streams. The CPM processes HDLC framing and ATM AAL5 for the DSL PHY layer, while the PowerPC G2 CPU runs routing and management plane software. Operating temperature to 105C suits the central-office environment, and the 1.8 V internal core keeps power dissipation manageable in dense line-card shelves.
Recommended
Industrial Protocol Gateways
Industrial protocol gateways converting fieldbus (PROFIBUS, CAN, Modbus) to Ethernet benefit from the MPC8265AZUPJDC's parallel serial controllers - the CPM handles serial channels (UART, HDLC, SPI) concurrently with Ethernet MACs, eliminating the need for an external protocol ASIC. The 300 MHz PowerPC G2 core supports custom protocol translation stacks, while the SDRAM controller accommodates buffering during burst traffic. Industrial-temperature operation up to +105C allows deployment near factory automation cabinets.
Recommended
Wireless Base Station Controllers
Base-station controllers in 2G/3G radio access networks leverage the MPC8265AZUPJDC for the Iub / Abis interface, where ATM AAL2 segmentation and HDLC signalling must run deterministically alongside Ethernet backhaul. The CPM handles real-time frame processing, the PowerPC G2 executes L2/L3 control plane code, and the integrated memory controller drives external SDRAM for buffering user-plane data. The 480-TBGA package provides robust thermal dissipation for continuous operation in radio-head shelters.
Recommended
Legacy Telecom / Embedded Linux Systems
Engineers maintaining legacy telecom equipment and embedded Linux platforms often standardise on the MPC8265AZUPJDC because it ships with mature U-Boot firmware and mainline Linux kernel support (architecture arch/ppc). The 300 MHz CPU plus CPM combination offers deterministic real-time performance for telecom stacks, while the 32-bit PCI bus connects to coprocessor ASICs and DSP daughter-cards. For software-defined workloads requiring gigabit wire-speed, designers can migrate to P1020 or P2020 with minimal user-space code changes.
Recommended
Recommended Products Summary
Engineering reference data for MPC8265AZUPJDC — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | MPC8265ACVVMIBC | MPC8270CZUUPEA | MPC8280CVVUPEA |
|---|---|---|---|---|
| Brand | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors |
| Package | TBGA-480 (37.5 x 37.5 mm) | TBGA-408 (different footprint, smaller) | TBGA-480 (compatible footprint family) | TBGA-480 (compatible footprint family) |
| Core Processor | PowerPC G2 | PowerPC G2 | PowerPC G2 | PowerPC G2 |
| CPU Clock Speed | 300 MHz | 266 MHz (-11%) | Up to 450 MHz (+50%) | Up to 450 MHz (+50%) |
| Co-Processor | CPM (RISC) - HIP4C | CPM (RISC) - HIP4C | CPM (RISC) - HiPerMOS7 | CPM (RISC) - HiPerMOS7 |
| Process Technology | 0.25 um CMOS | 0.25 um CMOS | 0.13 um (HiPerMOS7) | 0.13 um (HiPerMOS7) |
| Internal Core Voltage | 1.8 V | 1.8 V | 1.5 V (lower) | 1.5 V (lower) |
| I/O Supply Voltage | 3.3 V | 3.3 V | 3.3 V | 3.3 V |
| Lifecycle Status | Not For New Designs (NFND) | Not For New Designs (NFND) | Mature / last time buy varies | Mature |
Key Differentiators
- Highest CPU clock speed in the HIP4C TBGA-480 family (vs MPC8265ACVVMIBC)
- Mature firmware and toolchain ecosystem (vs MPC8270CZUUPEA / MPC8280CVVUPEA)
- 0.25 um CMOS HIP4C silicon for proven field reliability (vs QorIQ P1020 / Layerscape LS1021)
Design Notes
The TBGA-480 package dissipates heat mainly through the die and bond-wire path to the BGA balls; for full 300 MHz operation with CPM active, provide a minimum of 4 thermal vias under the central die-attach array and connect to an inner copper plane. At 1.8 V core / 3.3 V I/O the device typically draws 1.5 to 2.5 W; deploy 25 CFM airflow in sealed enclosures to keep junction temperature below +105C.
The MPC8265AZUPJDC requires two rails: 3.3 V for I/O and PLL, and a tightly-regulated 1.8 V for the internal core. NXP's reference design uses a TPS755xx LDO for the 1.8 V rail with bulk decoupling on both sides. Place a 100 uF tantalum + 0.1 uF ceramic pair within 25 mm of the VDD pins and 10 uF ceramic + 0.01 uF X7R within 5 mm to control switching transients from the CPM DMA bursts.
Route the 64-bit external data bus with impedance-controlled microstrip (50 ohm single-ended, 100 ohm differential for clock) and length-match the byte lanes to within +/- 25 ps. The address/control bus may use 40 ohm Zo. Place series-termination resistors (33 ohm) at the MPC8265 driver balls for SDRAM signals longer than 50 mm. Keep the PCI bus traces short and isolated from the Ethernet differential pairs to avoid common-mode noise.
Estimated: based on the verified datasheet the JTAG TRST pin must be pulled low at power-up; otherwise the TAP controller can latch in an undefined state and stall boot. Also note that the CPM reset is a separate signal from the core reset - both must be sequenced by the external supervisor to avoid indeterminate CPM state. Designers should not assume code from MPC8250 binaries runs unchanged on MPC8265 HIP4C silicon.
Compliance Information
Compliance status not explicitly listed in the verified web snippets - confirm with NXP product compliance portal before use in RoHS-restricted designs.
