MPC8572EVTARLD - PowerQUICC III MPU, 1.067 GHz, 1023-FCBGA | NXP
料号： MPC8572EVTARLD ✗ 停产| 数量 | 单价 | 小计 |
|---|---|---|
| 1 | $285 | $285.00 |
| 10 | $268.5 | $2,685.00 |
| 100 | $246.2 | $24,620.00 |
| 500 | $224.75 | $112,375.00 |
| 1,000 | $205.4 | $205,400.00 |
MPC8572EVTARLD 概述
An MPU (Microprocessor Unit) is a system-on-chip processor that integrates one or more CPU cores with memory controllers, I/O peripherals, and on-chip accelerators. The MPC8572E is a communications MPU, a hypernym for processors that combine general-purpose compute with hardware offload for networking workloads such as TDM, Ethernet, HDLC, and ATM. It sits within the broader taxonomy: PowerPC e500 core -> PowerQUICC III family -> communications MPU -> microprocessor -> semiconductor device. It uses a Power Architecture instruction set and is built on a 90 nm CMOS process.
Key features include dual e500 cores at 1.067 GHz, DDR2 memory controller with ECC, three 10/100/1000 Ethernet MACs supporting SGMII and RGMII, four TDM interfaces, two PCI Express interfaces, and a Serial RapidIO interface. The 1023-FCBGA package exposes all peripherals while keeping board footprint manageable for line cards, base stations, and enterprise routers.
This IC belongs to NXP's PowerQUICC III family targeting wired and wireless infrastructure. The architecture pairs general-purpose processing with packet and signalling accelerators, allowing simultaneous handling of control-plane and data-plane traffic on a single device. The dual-core topology plus coherent L2 supports symmetric multiprocessing for routing and bridging applications. The 0.09 µm process and 1.067 GHz clock enable deterministic throughput for QoS-sensitive traffic.
Typical applications include multiservice routers, DSLAM line cards, wireless base station controllers, industrial control planes, and enterprise switching platforms. The combination of DDR2/PCIe/RapidIO and TDM/Ethernet MACs makes the device a versatile platform for legacy and next-generation communications equipment.
Designers should validate thermal dissipation at full load because the 1023-FCBGA drives significant heat through the top-side heat spreader; package thermal resistance data should be reviewed against the end system cooling budget before board layout finalization.
This page synthesizes authoritative NXP datasheet extracts, distributor pricing snapshots, and drop-in same-family NXP alternatives to give engineers a faster path to sourcing and second-source qualification than the manufacturer datasheet alone.
直接替换替代料： MPC8572EVTARLD ——相同封装，引脚兼容。需要 PCB 改动的不同封装料号已排除。
本系列中的变体
可与以下型号直接替换的同系列型号： MPC8572EVTARLD （相同外形与封装尺寸） ——差异在于 L1 Cache (per core), L2 Cache, Mounting Type, Process Technology, RoHS Status.
快速对比工具——选择替代料号进行并排对比：
MPC8572EVTARLE
✅ 直接替换📋 参考替代料（不在目录中）
MPC8572ECVTARLD
✅ 直接替换📋 参考替代料（不在目录中）
MPC8572EPVTARLD
✅ 直接替换📋 参考替代料（不在目录中）
MPC8572EVTAULE
✅ 直接替换📋 参考替代料（不在目录中）
MPC8572EPVTARLE
✅ 直接替换📋 参考替代料（不在目录中）
MPC8572EVTARLD 最大额定值与电气特性
| Processor Type | PowerPC e500 MPU, MPC85xx PowerQUICC III |
| Core Count | 2 (dual-core) |
| 数据总线宽度 | 32-bit |
| 最大时钟频率 | 1.067 GHz |
| Operating Voltage | 1.1 V (core); 1.8 V / 2.5 V / 3.3 V (I/O per datasheet listing) |
| Process Technology | 90 nm CMOS |
| L1 Cache (per core) | 32 KB instruction + 32 KB data |
| L2 Cache | 1 MB shared |
| 封装 | 1023-FCBGA (33x33 mm) |
| 安装类型 | Surface Mount (BGA) |
| Memory Controller | DDR2 with ECC |
| Ethernet MACs | Three 10/100/1000 (SGMII/RGMII) |
| PCI Express | 2 interfaces |
| Serial RapidIO | Yes |
| TDM Interfaces | 4 |
| RoHS 状态 | Compliant (Pb-Free per Freescale datasheet) |
MPC8572EVTARLD 1023-fcbga (33x33 mm) 引脚配置指南
MPC8572EVTARLD（1023-fcbga (33x33 mm) 封装）的引脚配置。 该数字 IC 包含 GPIO、通信接口（UART、SPI、I2C）和电源引脚。请参阅制造商数据手册以了解复用引脚功能和配置选项。对嵌入式系统设计和 PCB 布局至关重要。
暂无详细引脚数据： MPC8572EVTARLD.
请参阅 数据手册 以查看完整引脚配置。
典型应用
MPC8572EVTARLD 适用于 6 应用s: Multiservice Router Control Plane, DSLAM / Access Line Card, Wireless Base Station Controller, Industrial Control / Substation Router, Enterprise Edge Switching Platform, Storage Area Network / NAS Controller.
Multiservice Router Control Plane
The MPC8572EVTARLD's dual e500 cores at 1.067 GHz with shared 1 MB L2 cache let it handle simultaneous routing protocol stacks (OSPF, BGP, IS-IS) and forwarding-plane exceptions. The DDR2 controller with ECC protects routing tables in main memory while three Gigabit Ethernet MACs provide native SGMII/RGMII links to switch fabric PHYs without an external MAC. Two PCI Express and Serial RapidIO ports scale the device into modular chassis, satisfying throughput budgets in enterprise multiservice routers.
推荐
DSLAM / Access Line Card
In DSLAM line cards the MPC8572EVTARLD's four TDM interfaces aggregate legacy E1/T1 PCM streams from many subscriber lines, while the DDR2 controller buffers packet payloads during QoS scheduling. The dual-core topology dedicates one e500 to the control plane (SNMP, layer-2/3 termination) and the other to the data plane (shaping, policing, ATM/TDM interworking), giving deterministic service at line rate across thousands of subscribers.
推荐
Wireless Base Station Controller
The MPC8572EVTARLD's combination of two e500 cores, Serial RapidIO, PCI Express, and TDM ports makes it a strong BSC platform: one core runs real-time signalling (SS7, SCTP) while the other handles IP backhaul. The 1.067 GHz core frequency sustains control-plane latency below typical 2G/3G call-setup budgets. Ruggedized base-station enclosure designs can use the extended-temperature MPC8572EPVTARLD variant.
推荐
Industrial Control / Substation Router
Industrial substation routers benefit from the MPC8572EVTARLD's deterministic DDR2 throughput, IEEE 1588 timestamping hooks in the Ethernet MACs, and rugged package that tolerates industrial thermal envelopes when paired with the 'PVTARLD' extended-temperature variant. The dual-core topology separates real-time IEC 61850 GOOSE processing from operator UI / management traffic without compromising packet ordering on the wire.
推荐
Enterprise Edge Switching Platform
Enterprise edge switches use the MPC8572EVTARLD as the management/control CPU behind merchant silicon PHYs and switching ASICs. PCI Express x4 lanes connect to external switch fabrics while the three Gigabit Ethernet MACs provide OOB management and uplinks. DDR2 ECC memory protects management stacks from soft errors, and the dual-core topology isolates the control-plane shell from forwarding-plane exception handling.
推荐
Storage Area Network / NAS Controller
NAS and SAN controllers benefit from the MPC8572EVTARLD's large 1 MB L2, which accelerates the file-system metadata caches frequently used by SMB/CIFS and NFS workloads. Serial RapidIO links connect to RAID controllers, while PCI Express provides expansion to 10 GbE NICs. The 1.067 GHz dual-core topology parallelises metadata staging and packet transmit, sustaining throughput under heavy random-access loads.
推荐
推荐产品汇总
工程参考数据： MPC8572EVTARLD ——对比、设计指导和合规信息。
选型指南
与替代料对比
| 参数 | 本产品 | MPC8572EVTARLE | MPC8572ECVTARLD | MPC8572EPVTARLD | MPC8572EVTAULE | MPC8572EPVTARLE |
|---|---|---|---|---|---|---|
| Brand | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors |
| Package | 1023-FCBGA (33x33 mm) | 1023-FCBGA (33x33 mm) - same | 1023-FCBGA (33x33 mm) - same | 1023-FCBGA (33x33 mm) - same | 1023-FCBGA (33x33 mm) - same | 1023-FCBGA (33x33 mm) - same |
| Core Count | 2 (dual e500) | 2 (dual e500) | 2 (dual e500) | 2 (dual e500) | 2 (dual e500) | 2 (dual e500) |
| Clock Frequency | 1.067 GHz | Lower speed bin (within 20%) | 1.067 GHz | 1.067 GHz | Lower speed bin (within 20%) | Lower speed bin (within 20%) |
| L2 Cache | 1 MB shared | 1 MB shared | 1 MB shared | 1 MB shared | 1 MB shared | 1 MB shared |
| DDR2 Memory Controller | Yes (with ECC) | Yes (with ECC) | Yes (with ECC) | Yes (with ECC) | Yes (with ECC) | Yes (with ECC) |
| Ethernet MACs | 3x GbE (SGMII/RGMII) | 3x GbE (SGMII/RGMII) | 3x GbE (SGMII/RGMII) | 3x GbE (SGMII/RGMII) | 3x GbE (SGMII/RGMII) | 3x GbE (SGMII/RGMII) |
| Temperature Grade | Industrial / extended | Industrial / extended | Commercial | Extended | Industrial / extended | Extended |
| Pin Compatible | Yes (this part) | Yes (drop-in) | Yes (drop-in) | Yes (drop-in) | Yes (drop-in) | Yes (drop-in) |
关键差异点
- True dual-core topology in the 1023-FCBGA package （对比 MPC8536E)
- Shared 1 MB L2 cache versus smaller L2 in single-core family members （对比 MPC8572EVTARLE)
- Pin-compatible across speed bins and temperature grades （对比 MPC8572EPVTARLD)
设计说明
The 1023-FCBGA (33x33 mm) package requires a top-side heat spreader with thermal interface material rated for at least 3 W/K thermal resistance from the spreader to the chassis cold plate. Estimated: at 1.067 GHz dual-core utilisation with the DDR2 controller active, expect 8–12 W of dissipation in continuous operation. Validate package theta_J-A from the NXP hardware specifications document against your enclosure cooling budget before tape-out.
Use a minimum 12-layer PCB with via-in-pad for the 1023-ball BGA escape. Match DDR2 trace lengths within 25 mils and route one differential pair per SERDES lane with 100-ohm differential impedance. The RapidIO and PCI Express lanes are AC-coupled - place the capacitors close to the device-side balls, not the connector side. Apply a continuous reference plane under the BGA to maintain power delivery and reduce SSO noise.
Do not reuse the boot configuration word (cfg_rcw) from a P2020 or Layerscape reference design - the e500 core's reset controller and LAW/PCI mapping are PowerQUICC III-specific. Verify cfg_rcw against the MPC8572E reference manual section covering reset and boot before assembly. Also confirm the DDR2 calibration firmware is re-run for each new board revision, since the e500 memory controller does not retain calibration constants across power cycles.
The Serial RapidIO lanes and PCI Express lanes both require reference clock jitter of at most 1 ps RMS; a low-jitter clock generator is mandatory. Route these clocks over a continuous ground reference, never across plane splits. JEDEC-standard SSO/EMI simulations should be run against the BGA breakout pattern because ball-pitch parasitic inductance can dominate at the 1.067 GHz core frequency.
合规信息
RoHS compliance and Pb-Free status are confirmed in the original Freescale/NXP datasheet. Halogen-free status is not explicitly stated in the verified web data; confirm with the latest NXP material declaration before EU-market deployments.