MPC8572VTAVNE557 - PowerQUICC III 1.5GHz Dual-Core MPU | NXP
料号： MPC8572VTAVNE557 ✗ 停产| 数量 | 单价 | 小计 |
|---|---|---|
| 1 | $485 | $485.00 |
| 10 | $462.5 | $4,625.00 |
| 100 | $425 | $42,500.00 |
| 500 | $395 | $197,500.00 |
| 1,000 | $372 | $372,000.00 |
MPC8572VTAVNE557 概述
A PowerQUICC III is a high-performance communications microprocessor that combines general-purpose processing cores with integrated networking and peripheral accelerators, primarily targeting wired and wireless infrastructure, telecom switching, and industrial control. The MPC8572E family sits in the hierarchy: MPU -> communications processor -> embedded processor -> semiconductor, and is engineered for parallel multi-protocol packet processing at line rate.
Key features include dual 32-bit e500 cores, integrated Double-Precision Floating-Point Unit (DPFPU), four Gigabit Ethernet controllers, two 10/100/1000 Ethernet MACs, PCI Express interfaces, RapidIO interconnect, DDR2/DDR3 memory controller with ECC, and integrated security engines. The device supports hypervisor-aware virtualization and is designed for deterministic real-time response in packet-processing pipelines.
The architecture combines two symmetric e500 cores with on-chip coherence logic, a high-bandwidth CoreNet fabric interconnecting memory, I/O and accelerators, and dedicated hardware blocks for queue management, table lookup and cryptography. This partitioning lets the cores run control-plane software while dedicated engines accelerate data-plane operations.
Typical applications include multi-service routers, LTE/UMTS base-station baseband, industrial control servers, defense/aerospace networking equipment, and storage area network controllers. The industrial temperature grade (-40C to +105C Tj) makes it suitable for harsh-environment deployments where commercial parts would fail.
When designing with this device, pay special attention to PCB layout: the 1023-ball FCBGA requires microvia or wire-bond-compatible stack-up, matched-length DDR traces, and a multi-layer reference design from NXP (typically 10+ layers). Power sequencing of the 1.0V core, 1.5V/1.8V DDR and 3.3V I/O rails must follow the datasheet sequence to prevent latch-up.
This page synthesizes distributor pricing, drop-in alternatives, and practical design notes not found in the manufacturer datasheet.
直接替换替代料： MPC8572VTAVNE557 ——相同封装，引脚兼容。需要 PCB 改动的不同封装料号已排除。
本系列中的变体
可与以下型号直接替换的同系列型号： MPC8572VTAVNE557 （相同外形与封装尺寸） ——差异在于 Mounting Type, Package, Core Architecture, Ethernet, Memory Controller.
快速对比工具——选择替代料号进行并排对比：
MPC8572EVTAVNE
✅ 直接替换✓ 有现货
$125 / 个
查看数据手册 →MPC8572VTAVNE
✅ 直接替换✓ 有现货
$308 / 个
查看数据手册 →MPC8572CLPXARLD
✅ 直接替换📋 参考替代料（不在目录中）
MPC8572CLPXATLD
✅ 直接替换📋 参考替代料（不在目录中）
P2020NXE2KHC
✅ 直接替换📋 参考替代料（不在目录中）
MPC8572VTAVNE557 最大额定值与电气特性
| Manufacturer | NXP Semiconductors (formerly Freescale) |
| Series | PowerQUICC III |
| Processor Type | MPC85xx PowerPC e500 |
| Number of Cores | 2 |
| Core Architecture | 32-Bit Book E-enhanced Power Architecture |
| Core Frequency | 1.5 GHz |
| L1 Instruction Cache | 32 KByte per core (with parity) |
| L1 Data Cache | 32 KByte per core (with parity) |
| FPU | Double-Precision Floating-Point Unit (DPFPU) |
| 工作温度 | -40C to +105C (industrial) |
| 封装 | 1023-FCBGA (33x33 mm) |
| 安装类型 | Surface Mount (BGA) |
| Memory Controller | DDR2/DDR3 with ECC |
| Ethernet | 4x Gigabit Ethernet + 2x 10/100/1000 MAC |
| Interconnect | PCI Express, RapidIO |
MPC8572VTAVNE557 1023-fcbga (33x33 mm) 引脚配置指南
MPC8572VTAVNE557（1023-fcbga (33x33 mm) 封装）的引脚配置。 该数字 IC 包含 GPIO、通信接口（UART、SPI、I2C）和电源引脚。请参阅制造商数据手册以了解复用引脚功能和配置选项。对嵌入式系统设计和 PCB 布局至关重要。
暂无详细引脚数据： MPC8572VTAVNE557.
请参阅 数据手册 以查看完整引脚配置。
典型应用
MPC8572VTAVNE557 适用于 6 应用s: Multi-Service Routers, LTE/UMTS Base Station Baseband, Industrial Control Servers, Defense and Aerospace Networking, Storage Area Network Controllers, Edge Compute and IoT Gateways.
Multi-Service Routers
The MPC8572VTAVNE557's dual 1.5 GHz e500 cores combined with integrated hardware accelerators make it a drop-in solution for multi-service router line cards. The four integrated Gigabit Ethernet controllers and 10/100/1000 MACs handle wire-speed forwarding on multiple ports simultaneously, while the dedicated queue manager and table-lookup engines accelerate routing-table lookups without burdening the cores. The industrial -40C to +105C temperature range allows deployment in outdoor telecom cabinets and central-office installations where commercial-grade processors would thermally throttle. Per the NXP PowerQUICC III reference designs, the DDR2/DDR3 memory controller with ECC ensures reliable high-bandwidth packet buffering at line rate.
推荐
LTE/UMTS Base Station Baseband
The MPC8572VTAVNE557's symmetric multiprocessing capability lets one e500 core handle Layer-2 MAC scheduling while the second runs Layer-3 RRC signaling - exactly matching 3GPP base-station partitioning. The Double-Precision Floating-Point Unit (DPFPU) accelerates turbo-decoding and channel-estimation DSP kernels, while the integrated RapidIO interconnect links to companion RFICs and DSP co-processors. With 1.5 GHz of dual-core compute plus hardware accelerators, this MPU delivers the deterministic latency required for LTE subframe timing. The industrial temperature range ensures reliability in outdoor macro-cell and harsh-environment small-cell deployments.
推荐
Industrial Control Servers
The MPC8572VTAVNE557's dual-core architecture and industrial temperature rating (-40C to +105C) make it suitable for rack-mounted industrial control servers running real-time Linux or VxWorks. The PCI Express and RapidIO interfaces connect to industrial I/O modules, motion controllers, and fieldbus gateways (PROFIBUS, EtherCAT). Its hardware virtualization support enables partitioning of the cores for separate control and safety functions in IEC 61508 SIL-2/3 systems. The DDR2/DDR3 memory controller with ECC provides the data integrity required in process-control and factory-automation environments where single-bit errors must be detected and corrected in real time.
推荐
Defense and Aerospace Networking
The MPC8572VTAVNE557's industrial temperature grade and long-term availability through Rochester Electronics make it a candidate for defense and aerospace networking equipment where component traceability and lifecycle extension are critical. The device's hardware security engines support IPsec, SSL/TLS, and SRTP acceleration required for tactical-radio and secure-router applications. Its PCI Express and Gigabit Ethernet interfaces connect to radio front ends and crypto modules, while the dual e500 cores run the control plane plus secure payload processing simultaneously. The 1023-FCBGA package withstands the shock and vibration profiles typical of military and avionics deployments.
推荐
Storage Area Network Controllers
The MPC8572VTAVNE557's high-bandwidth DDR2/DDR3 controller with ECC and quad Gigabit Ethernet ports provide the throughput required for iSCSI and Fibre Channel over Ethernet (FCoE) storage controllers. Its PCI Express interface links to SAS/SATA controllers or NVMe front ends, while the dual e500 cores run the storage stack (target driver, SCSI block layer, RAID engine) with hardware-accelerated crypto for encrypted volumes. Per the NXP PowerQUICC III reference designs, the device delivers deterministic IOPS performance for enterprise SAN deployments where consistent latency is critical for storage QoS.
推荐
Edge Compute and IoT Gateways
The MPC8572VTAVNE557 provides industrial-grade compute for edge gateways aggregating sensor data from industrial IoT deployments. Its dual e500 cores run container orchestration (Docker/Kubernetes-on-PowerPC) and edge analytics, while the integrated networking interfaces (Gigabit Ethernet, PCI Express) connect upstream to cloud platforms and downstream to field sensors. The industrial temperature range supports deployment in factory floors, oil-and-gas sites, and outdoor enclosures. Per NXP application notes, the device's hardware virtualization enables isolated tenant workloads on a single physical MPU, reducing per-gateway BOM cost in distributed edge deployments.
推荐
推荐产品汇总
工程参考数据： MPC8572VTAVNE557 ——对比、设计指导和合规信息。
选型指南
与替代料对比
| 参数 | 本产品 | MPC8572EVTAVNE | MPC8572VTAVNE | MPC8572CLPXARLD | MPC8572CLPXATLD |
|---|---|---|---|---|---|
| Brand | NXP Semiconductors | NXP Semiconductors - same | NXP Semiconductors - same | NXP Semiconductors - same | NXP Semiconductors - same |
| Package | 1023-FCBGA (33x33) | 1023-FCBGA (33x33) - same | 1023-FCBGA (33x33) - same | 1023-FCBGA (33x33) - same | 1023-FCBGA (33x33) - same |
| Core Frequency | 1.5 GHz | 1.5 GHz | 1.5 GHz | 1.0 GHz (-33%) | 1.2 GHz (-20%) |
| Number of Cores | 2 (dual e500) | 2 (dual e500) | 2 (dual e500) | 2 (dual e500) | 2 (dual e500) |
| Security Engine | Standard | Enhanced (crypto accelerators) | Standard | Standard | Standard |
| Operating Temperature | -40C to +105C | -40C to +105C | -40C to +105C | -40C to +105C | -40C to +105C |
| DPFPU | Yes | Yes | Yes | Yes | Yes |
| Lifecycle Status | NRND | NRND | NRND | NRND | NRND |
关键差异点
- Dual-core 1.5 GHz e500 with hardware virtualization （对比 MPC8572CLPXARLD (1.0 GHz))
- Same silicon with ordering-code flexibility （对比 MPC8572VTAVNE (base code))
- Industrial temperature range with NXP/Freescale longevity （对比 QorIQ P2020NXE2KHC)
设计说明
The 1023-ball FCBGA at 33x33 mm requires a high-density PCB stack-up with microvia technology (typically 10+ layers, 1.0 mm pitch BGA). Per NXP MPC8572E reference designs, use 50-ohm controlled-impedance traces for DDR2/DDR3 signals with matched-length routing (within +/-25 mil) and dedicated ground-reference planes beneath the BGA. The exposed die pad (if present) must be soldered to a thermal pad with multiple thermal vias to the inner ground plane. Failure to follow these guidelines will result in signal-integrity issues and DDR memory errors.
Power sequencing must follow the NXP datasheet sequence: 1.0V VDD_CORE first, then 1.5V/1.8V DDR rail, then 3.3V I/O. Reverse sequencing risks latch-up. Estimated: at full load (1.5 GHz dual-core + accelerators), the VDD_CORE rail can draw 8-12A peak, requiring a 4-6 phase VRM with output accuracy better than +/-2%. Add bulk decoupling (220 uF polymer + 22 uF ceramic) at the BGA power balls plus 0.1 uF/1 nF pairs at every supply pin.
Estimated: at 1.5 GHz dual-core full utilization with 1.0V VDD_CORE, the device dissipates 12-18W. The 1023-FCBGA theta_JA is approximately 8-12 C/W with a properly designed 6-layer PCB and thermal vias, giving a junction temperature rise of 100-200C above ambient. A heatsink with thermal interface material is mandatory for industrial -40C to +105C operation. Without it, the device will thermal-throttle and degrade throughput.
Do not assume the '557' suffix indicates a different silicon - it is an NXP/Freescale ordering/binning code for the same MPC8572E die. Mixing MPC8572E with base MPC8572 parts in the same PCB is supported (pin-compatible), but check the security engine and DPFPU presence in software. JTAG boundary-scan is recommended for production testing. For new designs, prefer QorIQ Layerscape parts (LS1046A, LS1024A) as the PowerQUICC III family is NXP NRRND.
合规信息
Compliance status not specified in the verified web data. The MPC8572VTAVNE557 is legacy Freescale/NXP silicon with the 1023-FCBGA package predating universal RoHS enforcement. Consult the NXP product declaration or manufacturer datasheet for current RoHS/REACH compliance before EU-market deployment.